五 、新型說明： 【新型所屬之技術領域】 本創作關於一種具有抑制非語音頻帶訊號的電容式麥克 風結構’尤指-種可有效降低料干擾的微型麥克風結構。 【先前技術】 隨著通訊技術成熟與通訊產品應用多元化，使得麥克風應 用範圍越來越狀’祿極式電轉克風為現今域的收音元 件’該麥克風主要係由-帽蓋卜—具有場效電晶體的電路板 2、-導電環3、-駐極體4、-金屬材f所製之振動膜5、一 絕緣墊圈6以及-絕緣環7所組成（如第i圖所示）；該外殼 底部係設有至少-導音孔H，用來接收外界音波、且該帽蓋i 内部依序容納有振動膜5、絕緣墊圈6、絕緣環7、駐極體4、 導電環3以及電路板2，其中該電路板2固定在帽蓋】開口端 該導電環3係設於電路板2與駐極體4間，該導電環3二端分 別抵住電路板2及駐極體4 ’令電路板2與駐極體4間可保持 良好的電性狀恶’此外’導電環3外侧係套有—絕緣環7，防 止該導電環3與帽蓋1意、外導通產生短路；而該絕緣墊圈6係 »又置在駐極體4與振動膜5間，令振動膜5與駐極體4持續保 持絕緣狀態。 透過上述結構，當該振動膜5受到外界聲音訊號作用時， 該膜5會&音波的振動改變其與駐極體4的間距，使兩者間之 正負電荷產生感應，改變電容量並透過該導電環3傳導至電路 3 M394657 板2，經電路板上之電路放大並輸出為交流電之電壓信號而完 成聲電轉換。 由於該振動膜5十分敏銳可感受到12hz〜20Khz的頻率， 不論疋低頻或是咼頻的聲音訊號皆可輕矣感應產生振動，但， 人們日常語音訊號溝通的頻率範圍均300hz〜3Kiiz範圍，且大 多數的語音訊號都集中在500HZ〜1KHZ間，故，500HZ〜1KHZ範 圍内之音頻係定義為語音頻帶，若聲音訊號超出該語音頻帶範 圍，則可能會影響到通話品質而被視為噪音，導致通話品質嚴 重降低，如：風切聲，由於風切聲的頻率非常低，僅僅只有數 十赫茲而已，十分容易干擾到語音頻帶内的語音訊號，導致受 話者聽覺上有失真感甚至有噪音感。 為此，如何有效地且主動地抑制振動膜對於低頻聲音訊號 之振動幅度乃為本創作所鐵研的課題。 【新型内容】 緣疋，本創作主要目的在提供一種具有抑制非語音頻帶訊 號的電谷式麥克風結構’係透過改變聲波對振細作用的方式 來達到抑辦語音解縣音訊號，更詳純說：係在該帽蓋 V曰孔處縣音峨區分為主縣波喊及減振聲波訊 號’該主振聲波訊號係直接作用在該振動膜正面，並令振動膜 振動來產生聲電轉換，該減振聲波訊號係透過導引而作用在該 振動膜背面，本創作係包含： 一具有容置㈣黯，該容置腔底部設有至少—與料部空間 4 相通的導音孔； —具有場效電晶體的電路板，係設在該容置腔内部，· i動臈，係設在該容置動部’與該等導音孔相對應，· —駐極體’係設讀電触躲絲_，並將板與振動 膜間區隔為前腔室及後腔室，且該駐極體係與該振動膜為保 持絕緣，其另端係與該電路板保持電性連接； 本創作之主要特徵在於： 該振動膜係與該帽蓋底部間增設有至少—區隔裝置，該 區隔裝置之下表面與該帽蓋底部區隔至少一與該導音孔相 通的第1空腔’負責形成並導引該主振聲波訊號作用在該振 動膜正面，而該區隔裝置、駐極體分別與該帽蓋内側壁間係 設有互相對應的槽部而形成第2缝，用來形成並導引該減 振聲波訊號，使減振訊號進入後腔室作用在鎌動背面，以 達到降低該振動膜低頻的振幅衰減低頻訊號的目的。 b依據前述之主要特徵，其中該駐極體外圍另套有一絕緣 衣使該駐極體與該帽蓋間保持絕緣，而該駐極體上係設有 —導電環’用來與電路板電性連接。 依據前述之主要特徵，其中該帽蓋容置腔底部、絕緣環 =電每係分設有彼此對應且互為摘的槽部，其三者之槽 部係組成-第2空腔，用來形成並導引減振聲波至後腔室而 作用在該振動膜背面。 依據則述之主要特徵，其中該電路板係設有一據波元 M394657 件，該驗元件係與電路叛上之接地端同時並聯在電路板之 輸出端，§南頻訊號通過該電路板之場效電晶體而輸出對應 訊號％ ’該凝TG件係視為短路，而將訊號導通至接地端， 從而產生高頻訊號抑制作用。 【實施方式】 據上（之目的’啟舉較佳實施例並配合圖式力17以說明本 創作所採用之技術手段及其功效。 -月參閱第2至3圖’第2圖為本創作具有抑制非語音頻帶 訊號的電容式麥克風結構之立體分解圖。第3圖為本創作具有 抑制非語音鮮訊號的電容式麥克風結構之組合結構剖面示 意圖。 如該等圖所示，本創作提供一種具有抑制非語音頻帶訊號 的電谷式麥克風結構，該麥克風結構至少係包含：—帽蓋1〇、 一具有場效電晶體 21 (FET，Field Effect Transistor)的電 路板20、一振動膜（Diaphragm) 30以及至少一駐極體 (Electret)40;其中，該帽蓋1〇内部係設有一容置腔u，該 腔底部係設有與外輕附目通的導音孔101，該容置腔u係 依序裝設有振動膜30、駐極體40以及電路板20 (如第2圖所 不）；其中，該駐極體40係將電路板20與振動膜3〇間係區隔 ^前腔室301及後腔室3〇2 (如第3圖所示），振動膜3〇與駐 極體40間係定義為前腔室3(U，該駐極體40與電路板2〇間 係疋義為後腔室3的，該前腔室301主要提供該振動膜3〇振 6 動上間，使該振動膜30透過振動來改變其與駐極體的間 距產生兒谷置變化’該駐極體4〇表面係設有多個氣孔4的， 用來平衡該前腔室301及該後腔室3〇2氣壓，該駐極體4〇外 圍另套有-絕緣環41，令該駐極體4G與該帽蓋Μ間保持絕 緣狀態，該駐極體40上端係設有一導電環42，負責與該電路 板10電性連接；本創作主要特點在於：該帽蓋1〇之導音孔 1 〇1處係將聲音峨.s區分為主振聲波職S1及減振聲波訊 唬S2 ’該主振聲波訊號幻直接作用在該振動膜正面，令 該振動膜30振動來產生聲電轉換作用，而該減振聲波兕訊號 係作用在振細3〇背面產生—反個力，降低振動膜加振幅 以衰減低頻訊號，詳細說明如下： 明參’ 4 ® ’第4圖為本創作具有抑辦語音頻帶訊號 的電容式麥克風結構之主振聲波路徑示意圖。 明再次參卿3圖及® 4 ®，本創作係在該振動臈3〇及 該帽蓋10底部間增設有一區隔裝置5〇 (如第3圖所示），區 隔裝置50下表面係設有圓槽部5丨，該圓槽部η中心係設有 一導孔52，該導孔52係與該振動膜3〇相對應，該區隔裝置 50的圓槽部51係與該帽蓋1〇底部形成第1空腔500，作為形 成並‘引主振聲舰號S1的路彳f’使該錄聲波靖^可作 用在該振動膜30正面；因此，當聲波訊號s進入導音孔1〇1 ^大。P分聲波訊號S (尤其是中頻及高頻聲波訊號）會進入 第1空腔500而形成主振聲波訊號S1，經圓槽部51之導孔兕 M394657 導引集中作用在該振動膜3〇正面（如第4圖所示），使該振動 膜30產生振動。 6月參閱第5圖，第5圖為本創作具有抑制非語音頻帶訊號 的電容式麥克風結構之之減振聲波路徑示意圖。 °月再次參閱第2圖、第3圖及第5圖所示，本創作係在該 帽蓋10容置腔11底部、絕緣環41及導電環42之彼此對應處 刀5又至少一有彼此對應且互為相通的槽部111、4Π、421，其 者槽4 111、411、421之内部空間係組成至少一第2空腔 獅（如第3圖所示）’負責導引該減振聲波S2至後腔室302 並集中作駐鎌細30 f®，至於設置在帽錢容置腔 11底部、絕緣環41及導電環42上之槽部數量以及設置位置， 於本創作中並不加以侷限；因此，當聲波訊號s進入導音孔 101時’部分的聲波訊號（低頻聲波訊號）會進入第2空腔棚 而形成減振聲波訊號S2 ’經第2空腔400導引並集中作用在 該振動膜30背面，達到對振動膜30減振的目的（如第5圖所 示）。 此外’上述之說明主要用來抑制低頻訊號，本創作亦可 在該電路板係設有-遽波元件（圖中未示），用來抑制高頻訊 號’該渡波元件係與電路板上之接地端同時並聯在電路板之 出，當高頻訊號通過該電路板之場效電晶體而輪㈣庫❹ 時，該纽元件侧該高_號而視為短路，轉觀號導： 至接地端產生高頻訊號抑制作用。 ^ 8 j創作已H上i4#紐具_撕更詳細·，惟本創作並 ^限定於上述所舉例之實補，凡在本創作所揭示之技術思想 範圍内可對該等結構作各種變化及修飾，該等變化及修飾仍 屬本創作之範圍。 【圖式簡單說明】 第1圖昔知電容式麥克風結構示意圖。 第2圖為本創作具有_非語音鮮減的電容絲克風結 構之立體分解圖。 第3圖為本創作具有抑制非語音頻帶訊號的電容式麥克風結 構之組合結構剖面示意圖。 第4圖為本創作具有抑制非語音頻帶訊號的電容式麥克風結 構之主振聲波路徑示意圖。 第5圖為本創作具有抑制非語音頻帶訊號的電容式麥克風結 構之之減振聲波路徑示意圖。 【主要元件符號說明】 帽蓋 ！ 電路板 導電環 挺極體 振動膜 絶緣塾圈 絶緣環 2 67 7 9 M394657V. New description: [New technical field] This creation is about a miniature microphone structure with a signal that suppresses non-speech frequency bands, especially a miniature microphone structure that can effectively reduce material interference. [Prior Art] With the maturity of communication technology and the diversification of application of communication products, the application range of microphones is becoming more and more. The 'Rotor-type electric rotator is the radio component of today's domain'. The microphone is mainly composed of - caps. The circuit board 2, the conductive ring 3, the electret 4, the vibrating film 5 made of the metal material f, the insulating gasket 6 and the insulating ring 7 are formed (as shown in Fig. i); The bottom of the casing is provided with at least a sound guiding hole H for receiving external sound waves, and the inside of the cap i sequentially houses the vibrating membrane 5, the insulating gasket 6, the insulating ring 7, the electret 4, the conductive ring 3, and The circuit board 2, wherein the circuit board 2 is fixed at the open end of the cap, the conductive ring 3 is disposed between the circuit board 2 and the electret 4, and the two ends of the conductive ring 3 respectively abut the circuit board 2 and the electret 4 'The circuit board 2 and the electret 4 can maintain a good electrical property. 'In addition, the outer side of the conductive ring 3 is provided with an insulating ring 7 to prevent the conductive ring 3 from being electrically connected to the cap 1 to cause a short circuit; The insulating gasket 6 is further disposed between the electret 4 and the vibrating membrane 5, so that the vibrating membrane 5 and the electret 4 are continuously maintained. Edge state. Through the above structure, when the diaphragm 5 is subjected to an external sound signal, the film 5 changes the distance between the diaphragm and the electret 4, causing the positive and negative charges between the two to induce, changing the capacitance and transmitting The conductive ring 3 is conducted to the circuit 3 M394657 board 2, and is amplified by a circuit on the circuit board and output as a voltage signal of the alternating current to complete the acoustic-electric conversion. Since the vibrating membrane 5 is very sensitive, the frequency of 12hz~20Khz can be felt, and the sound signals of the low frequency or the chirp frequency can be induced to generate vibration. However, the frequency range of daily voice signal communication is 300hz~3Kiiz range. Most of the voice signals are concentrated between 500HZ and 1KHZ. Therefore, the audio system in the range of 500HZ to 1KHZ is defined as the voice band. If the voice signal exceeds the voice band, it may affect the call quality and be regarded as noise. As a result, the quality of the call is seriously degraded, such as: wind cut, because the frequency of the wind cut is very low, only only tens of Hertz, it is very easy to interfere with the voice signal in the voice band, resulting in a sense of distortion in the listener or even Noise sense. For this reason, how to effectively and actively suppress the vibration amplitude of the diaphragm for the low-frequency sound signal is a subject of the research institute. [New content] The main purpose of this creation is to provide an electric valley microphone structure with a signal that suppresses non-speech frequency bands. By changing the effect of sound waves on the vibration, it is possible to suppress the voice signal of the county. Said: in the cap V hole in the county, the sound of the county is divided into the main county wave shouting and damping the sound wave signal 'the main vibration sound wave signal directly acts on the front of the diaphragm, and the vibration film vibrates to produce the sound and electricity conversion The vibration-damping acoustic wave signal acts on the back surface of the vibrating membrane through guiding. The present invention comprises: a housing (four), the bottom of the receiving cavity is provided with at least a sound guiding hole communicating with the material space 4; - a circuit board having a field effect transistor is disposed inside the accommodating cavity, and is disposed in the accommodating portion 'corresponding to the sound guiding holes, · - electret' Reading the electric touch _, and separating the plate from the diaphragm into a front chamber and a rear chamber, and the electret system is insulated from the diaphragm, and the other end is electrically connected to the circuit board The main feature of this creation is: the diaphragm and the At least a partitioning device is disposed between the bottom of the cap, and a lower surface of the partitioning device is separated from the bottom of the cap by at least one first cavity communicating with the sound guiding hole to form and guide the main vibrating signal Acting on the front surface of the vibrating membrane, the partitioning device and the electret respectively have mutually corresponding groove portions between the inner wall of the cap and forming a second slit for forming and guiding the vibration-damping sound wave signal. The damping signal is input into the back chamber to act on the back side of the swing to achieve the purpose of reducing the amplitude of the low frequency of the diaphragm to attenuate the low frequency signal. According to the above main features, the outer periphery of the electret is additionally provided with an insulating cloth to keep the electret from being insulated from the cap, and the electret is provided with a conductive ring for electrically connecting to the circuit board. Sexual connection. According to the main features of the foregoing, the bottom of the cap accommodating chamber, the insulating ring=the electric yoke are respectively provided with groove portions corresponding to each other and picking each other, and the groove portions of the three are composed of a second cavity for A vibration-damping sound wave is formed and guided to the rear chamber to act on the back surface of the diaphragm. According to the main features of the description, the circuit board is provided with a data element M394657, and the verification component is connected in parallel with the ground end of the circuit revolt at the output end of the circuit board, and the south frequency signal passes through the circuit board. The effect transistor outputs the corresponding signal %'. The condensed TG device is regarded as a short circuit, and the signal is turned on to the ground terminal, thereby generating high-frequency signal suppression. [Embodiment] According to the above purpose, the preferred embodiment is combined with the graphic force 17 to illustrate the technical means and functions of the present invention. - See the figures 2 to 3 for the month. An exploded perspective view of a condenser microphone structure having a signal line for suppressing non-speech bands. Fig. 3 is a schematic cross-sectional view showing a combined structure of a condenser microphone structure for suppressing non-speech signals. As shown in the figures, the present invention provides a The electric valley microphone structure has a non-speech band signal, and the microphone structure comprises at least: a cap 1 , a circuit board 20 having a field effect transistor (FET), and a diaphragm (Diaphragm) And an at least one electret 40; wherein the cap 1 is internally provided with a receiving cavity u, and the bottom of the cavity is provided with a sound guiding hole 101 which is attached to the outside, and the receiving hole is received. The cavity u is sequentially provided with a vibrating membrane 30, an electret 40, and a circuit board 20 (as shown in FIG. 2); wherein the electret 40 separates the circuit board 20 from the diaphragm 3 ^The front chamber 301 and the rear chamber 3〇2 (as shown in Figure 3) As shown, the diaphragm 3 〇 and the electret 40 are defined as a front chamber 3 (U, the electret 40 and the circuit board 2 are defined as the rear chamber 3, the front chamber 301 The vibrating membrane 3 is mainly provided between the vibrating membranes 3, and the vibrating membrane 30 is vibrated to change the distance between the diaphragm and the electret to generate a change in the valley. The surface of the electret 4 is provided with a plurality of pores 4 For balancing the front chamber 301 and the rear chamber 3〇2 air pressure, the electret 4〇 is additionally provided with an insulating ring 41 to keep the electret 4G and the cap 绝缘 insulative state. The upper end of the electret 40 is provided with a conductive ring 42 for electrically connecting to the circuit board 10; the main feature of the present invention is that the sound hole 〇1 of the cap 1 is divided into sound 峨.s The main vibration sound wave S1 and the vibration reduction sound wave signal S2 'the main vibration sound wave signal directly acts on the front surface of the vibration film, causing the vibration film 30 to vibrate to generate an acoustic-electric conversion effect, and the vibration-damping sound wave signal is applied to The vibration of the back of the 3 产生 produces a counter-force, reducing the vibration film plus amplitude to attenuate the low-frequency signal, as detailed below: Mingshen ' 4 ® ' Figure 4 This creation has a schematic diagram of the main vibrating path of a condenser microphone structure that suppresses the voice band signal. The Ming dynasty 3 and the ® 4 ® add a zone between the vibrating 臈3〇 and the bottom of the cap 10. The partitioning device 5〇 (as shown in FIG. 3), the lower surface of the partitioning device 50 is provided with a circular groove portion 5丨, and a center of the circular groove portion η is provided with a guiding hole 52, and the guiding hole 52 is connected to the diaphragm Correspondingly, the circular groove portion 51 of the partitioning device 50 forms a first cavity 500 with the bottom portion of the cap 1 , and the sound wave is formed as a path f' which forms and induces the main sounding ship number S1. Jing ^ can act on the front side of the diaphragm 30; therefore, when the acoustic signal s enters the sound hole 1 〇 1 ^ large. The P-sound wave signal S (especially the intermediate frequency and high-frequency sound wave signals) enters the first cavity 500 to form the main vibration sound wave signal S1, and is guided by the guide hole 兕 M394657 of the circular groove portion 51 to concentrate on the vibration film 3 The front side (as shown in Fig. 4) causes the diaphragm 30 to vibrate. See Figure 5 in June. Figure 5 is a schematic diagram of the vibration-damping acoustic path of a condenser microphone structure with a non-speech band signal. Referring again to FIG. 2, FIG. 3 and FIG. 5, the present invention is at the bottom of the cap 10 receiving cavity 11, the insulating ring 41 and the conductive ring 42 correspond to each other at least one another. Corresponding and mutually communicating groove portions 111, 4Π, 421, the inner spaces of the grooves 4 111, 411, 421 forming at least one second cavity lion (as shown in FIG. 3) are responsible for guiding the vibration reduction The sound wave S2 is transferred to the rear chamber 302 and concentrated as the fine 30 f®. As for the number of grooves and the position of the groove provided on the bottom of the cap money receiving cavity 11, the insulating ring 41 and the conductive ring 42, it is not in this creation. Therefore, when the acoustic signal s enters the sound guiding hole 101, part of the acoustic signal (low frequency acoustic wave signal) enters the second cavity to form the vibration-damping acoustic wave signal S2', which is guided and concentrated by the second cavity 400. Acting on the back surface of the vibrating membrane 30, the vibration damping membrane 30 is damped (as shown in Fig. 5). In addition, the above description is mainly used to suppress low-frequency signals. The present invention can also be provided with a chopper component (not shown) on the circuit board for suppressing high-frequency signals 'the wave-wave component system and the circuit board. The grounding terminal is simultaneously connected in parallel to the circuit board. When the high frequency signal passes through the field effect transistor of the circuit board and the wheel (4) is stored, the high component side of the button component is regarded as a short circuit. The terminal generates high frequency signal suppression. ^ 8 j creation has been on the i4# button _ tear more detailed, but this creation and ^ limited to the above examples of the actual complement, where the scope of the technical ideas revealed in this creation can make various changes to the structure And modifications, such changes and modifications are still within the scope of this creation. [Simple description of the diagram] Fig. 1 shows a schematic diagram of the structure of a condenser microphone. The second figure is an exploded view of the capacitor wire structure with _ non-speech reduction. Fig. 3 is a schematic cross-sectional view showing the combined structure of a condenser microphone structure having a signal for suppressing non-speech bands. Fig. 4 is a schematic diagram showing the main vibration sound wave path of a condenser microphone structure having a signal for suppressing non-speech bands. Fig. 5 is a schematic diagram showing the path of the vibration-damping acoustic wave of the condenser microphone structure with the suppression of the non-speech band signal. [Main component symbol description] Cap! Circuit Board Conductive Rings Tall Body Vibrating Film Insulation Ring Insulation Ring 2 67 7 9 M394657
帽蓋 10 導音孔 101 容置腔 11 槽部 111 電路板 20 場效電晶體 21 振動膜 30 前腔室 301 後腔室 302 駐極體 40 第2空腔 400 氣孔 401 絕緣環 41 槽部 411 導電環 42 槽部 421 區隔裝置 50 第1空腔 500 圓槽部 51 導孔 52 聲波訊號 S 主振聲波訊號 S1 10 M394657 減振聲波訊號 導音孔Cap 10 Sound-guiding hole 101 accommodating cavity 11 Slot portion 111 Circuit board 20 Field effect transistor 21 Vibration film 30 Front chamber 301 Rear chamber 302 Electret 40 Second cavity 400 Air hole 401 Insulation ring 41 Slot portion 411 Conductor ring 42 groove portion 421 compartment device 50 first cavity 500 circular groove portion 51 guide hole 52 acoustic wave signal S main vibration sound wave signal S1 10 M394657 vibration reduction sound wave signal sound hole