五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係有關於一種均溫板，尤指一種具有複合式支撐 結構的均溫板。 【先前技術】 [0002] 本創作主張國内優先權之基礎案係為民國99年5月18曰所 提出之新型申請案，其申請案號為第99209249號，據此 作為本創作優先權之基礎，在此先予敘明。 [0003] 隨著科技的日新月異，電子元件的功率與效能曰益提升 ，連帶地在操作時也產生更多的熱量;倘若些熱量未 能及時散逸出去而累積於該電子元件的内部，將會導致 該電子元件的溫度升高且影響其效能，甚至嚴重者將導 致該電子元件故障損壞。所以，業界一直不斷地研發各 種散熱裝置以解決電子元件的問題，均溫板就是一種很 常見的散熱裝置。 ' [0004] 均溫板（vapor chamber)主要包括一扁狀密閉殼體、成 型於該扁狀密閉殼體内的一毛細組織、及填注在該扁狀 密閉殼體内的一工作流體；扁狀密閉殼體具有一吸熱面 及與該吸熱面相反的一放熱面，吸熱面接觸二電子發熱 元件，藉由均溫板内的工作流體之汽液相變化而將電子 發熱元件所產生的熱量從吸熱面傳遞至放熱面。 [0005] 近年來，電子產品曰益傾向薄型化，所以均溫板的厚度 也必須隨之縮減；然而，由於均溫板的厚度縮減，所以 其扁狀密閉殼體的厚度也必須隨之縮減，如此一來，導 表單编號A0101 第3頁/共19頁 M393970 致整個均溫板的強度不足，當均溫板内欲抽成真空時， 外界的大氣壓力往往會施加一股壓力於均溫板上而導致 均溫板的凹陷；在另一情形下，均温板中貼附電子發熱 元件的該部位，經常因為電子發熱元件對均溫板的殼體 所施加的正向擠壓力而在該處形成凹陷。 [0006] 因此，已知有在均溫板内部設置支撐結構，其抵靠均溫 板内壁的上下表面，以增加均溫板的抗壓強度而保護均 溫板免於因外界壓力而凹陷；倘若支撐結構的面積與體 積過小，則無法達到理想的支撐效果；倘若支撐結構的 面積與體積過大，則又可能會妨礙工作流體的汽液相循 環，進而降低均溫板的導熱效果。 [0007] 另一方面，當均溫板實際使用時，由於内部的工作流體 受熱而產生汽化，工作流體的蒸氣體積比液態的工作流 體更大，均溫板内的體積膨脹與蒸汽壓力會使一部份的 均溫板殼體膨脹鼓起，如此一來，使均溫板的表面變得 不平整。所以，在致力於均溫板的薄型化過程期間，兼 顧抗壓強度與抗膨脹強度也是很重要的一項課題。 [0008] 因此，如何解決上述之問題點，即成為本創作人所改良 之目標。 【新型内容】 [0009] 本創作之一目的，在於提供一種具有複合式支撐結構的 均溫板，其能夠同時增加抗壓與抗膨脹強度，且不會妨 礙工作流體的汽液相循環而降低傳熱效率。 [0010] 為了達成上述之目的，本創作係提供一種具有複合式支 表單編號A0101 第4頁/共19頁 M393970 撐結構的均溫板，包括：一扁狀密閉殼體；一毛細組織 ，佈設在該扁狀密閉殼體的内壁面上；一工作流體，填 注在該扁狀密閉殼體的内部；以及一複合式支撐結構， 裝設於該扁狀密閉殼體内且包含一波浪狀支撐架及至少 一支撐柱。 [0011] 相較於先前技術，本創作具有以下功效： [0012] 根據本創作，由於波浪狀支撐架係用以支撐該扁狀密閉 殼體的上、下内壁面，所以波浪狀支撐架可以增加均溫 板的抗壓強度，致使均溫板不會因為電子發熱元件的正 向擠壓力或抽真空過程產生殼體凹陷。 [0013] 另外，由於波浪狀支撐架中具有供該工作流體通過的複 數間隔通道，所以波浪狀支撐架並不會妨礙工作流體的 汽液相循環，也不會影響均溫板的傳熱效果。 [0014] 1 由於本創作的複合式支撐結構另外設有至少一支撐柱， 該至少一支撐柱的二端分別與該扁狀密閉殼體或該毛細 組織相互連接，所以能夠防止扁狀密閉殼體膨脹鼓起， 因而增加均溫板的抗膨脹強度。 B 【實施方式】 [0015] 有關本創作之詳細說明及技術内容，將配合圖式說明如 下，然而所附圖式僅作為說明用途，並非用於侷限本創 作。 [0016] 請參考第一圖至第六圖，本創作係提供一種具有複合式 支撐結構的均溫板1(以下簡稱為均溫板1)，用以提供一 電子發熱元件（未顯示）的導散熱。 表單編號A0101 第5頁/共19頁 M393970 [00Π]從第六圖的剖面圖可以清楚看出，均溫板1的結構組成包 括：一扁狀密閉殼體10、佈設在扁狀密閉殼體1〇的内壁 面上的一毛細組織20、填注在扁狀密閉殼體1〇内部的一 工作流體30(虛線所示）' 及裝設於扁狀密閉殼體内的 一複合式支撐結構40。 [〇〇18]扁狀密閉殼體10為具有良好導熱性的金屬材料製成，毛 細組織20可以為金屬粉末燒結或金屬網狀物所製成，其 内部具有大量細小孔洞以產生毛細作用；毛細組織2 〇佈 設在扁狀密閉殼體1 〇的内壁面上，而工作流體3〇則填注 於扁狀密閉殼體10的内部；藉由工作流體3〇在扁狀密閉 殼體10内的汽液相循環變化，均溫板〗可最:將電子發熱元 件（未顯示）所產生的熱量持續地傳遞出去。 [0019]在第一圖所示的實施例中，均溫板丨的扁狀密閉殼體1〇具 有一待密封側11 ’用以在毛細組織2〇及複合式支撐結構 40置入扁狀密閉殼體1〇内之後密封整個扁狀密閉殼體j 〇 ，並經由扁狀密閉殼體1 〇 一側凸伸的一填充除氣管1 2灌 注所需之工作流體3〇至扁狀密閉殼體1〇内後，對該扁狀 密閉殼體10内部抽真空，最後再密封此填充除氣管12 ^ [0〇2〇]在本創作的實施例中，複合式支撐結構4〇係容置於扁狀 密閉殼體11内部且包括一波浪狀支撐架4〗及至少一支撐 柱42(第一圖顯示有七個）；波浪狀支撐架41係用以支撐 扁狀密閉殼體1〇的上、下内壁面，波浪狀支撐架41的主 要作用在於產生足夠的支撐強度，以保護扁狀密閉殼體 1〇免於受電子發熱元件的正向擠壓力或外界的大氣壓力 之影響而凹陷變形。 第6頁/共19頁 表單編號A0101 [0021]M393970V. New description: [New technology field] [0001] This creation is about a temperature equalizing plate, especially a temperature equalizing plate with a composite supporting structure. [Prior Art] [0002] This creation claims that the basic case of domestic priority is a new application filed by May 18, 1999. The application number is No. 99209249, which is used as the priority of this creation. The foundation is hereby stated first. [0003] With the rapid development of technology, the power and efficiency of electronic components have increased, and more heat is generated in operation. If some heat is not dissipated in time and accumulates inside the electronic component, it will This causes the temperature of the electronic component to rise and affect its performance, and even severely, the electronic component may be damaged. Therefore, the industry has been continually developing various heat sinks to solve the problems of electronic components. The uniform temperature plate is a very common heat sink. [0004] A vapor chamber mainly includes a flat closed casing, a capillary structure formed in the flat closed casing, and a working fluid filled in the flat sealed casing; The flat sealed casing has a heat absorbing surface and a heat releasing surface opposite to the heat absorbing surface, and the heat absorbing surface contacts the two electronic heating elements, and the electronic heating element is generated by the vapor-liquid phase change of the working fluid in the temperature equalizing plate Heat is transferred from the heat absorbing surface to the heat releasing surface. [0005] In recent years, the benefits of electronic products tend to be thinner, so the thickness of the uniform temperature plate must also be reduced; however, since the thickness of the uniform temperature plate is reduced, the thickness of the flat closed casing must also be reduced. As a result, the guide form number A0101 page 3 / 19 pages M393970 caused the strength of the whole temperature plate to be insufficient. When the temperature plate is to be vacuumed, the external atmospheric pressure tends to exert a pressure on the outside. The temperature plate causes the depression of the uniform temperature plate; in another case, the portion of the temperature equalization plate to which the electronic heating element is attached is often caused by the positive pressing force exerted by the electronic heating element on the casing of the uniform temperature plate. A depression is formed there. [0006] Therefore, it is known to provide a support structure inside the temperature equalizing plate, which abuts against the upper and lower surfaces of the inner wall of the temperature equalizing plate to increase the compressive strength of the temperature equalizing plate and protect the temperature equalizing plate from being recessed by external pressure; If the area and volume of the support structure are too small, the ideal support effect cannot be achieved; if the area and volume of the support structure are too large, the vapor-liquid phase circulation of the working fluid may be hindered, thereby reducing the heat conduction effect of the uniform temperature plate. [0007] On the other hand, when the temperature equalizing plate is actually used, since the internal working fluid is vaporized by heat, the working fluid has a larger vapor volume than the liquid working fluid, and the volume expansion and vapor pressure in the uniform temperature plate will cause A portion of the temperature equalizing plate housing expands and bulges, so that the surface of the temperature equalizing plate becomes uneven. Therefore, it is also an important issue to focus on the compressive strength and the expansion resistance during the thinning process of the uniform temperature plate. [0008] Therefore, how to solve the above problems is the goal of improvement by the present creator. [New content] [0009] One of the aims of the present invention is to provide a temperature equalizing plate having a composite supporting structure, which can simultaneously increase the compressive and anti-expansion strength without hindering the vapor-liquid phase circulation of the working fluid. Heat transfer efficiency. [0010] In order to achieve the above object, the present invention provides a temperature equalizing plate having a composite branch form number A0101, page 4/19, M393970 support structure, including: a flat closed casing; a capillary structure, layout a working fluid is filled in the inner wall surface of the flat sealed casing; and a composite supporting structure is installed in the flat sealed casing and includes a wave shape a support frame and at least one support column. [0011] Compared with the prior art, the present invention has the following effects: [0012] According to the present invention, since the undulating support frame is used to support the upper and lower inner wall surfaces of the flat closed casing, the wavy support frame can be Increasing the compressive strength of the temperature equalizing plate causes the temperature equalizing plate to not cause the housing depression due to the positive pressing force or the vacuuming process of the electronic heating element. [0013] In addition, since the wave-shaped support frame has a plurality of spaced passages through which the working fluid passes, the wave-shaped support frame does not hinder the vapor-liquid phase circulation of the working fluid, and does not affect the heat transfer effect of the uniform temperature plate. . [0014] 1 The composite support structure of the present invention is additionally provided with at least one support column, and the two ends of the at least one support column are respectively connected with the flat closed casing or the capillary structure, so that the flat closed shell can be prevented. The body expands and bulges, thereby increasing the expansion resistance of the uniform temperature plate. [Embodiment] [0015] The detailed description and technical contents of the present invention will be described below with reference to the drawings, but the drawings are for illustrative purposes only and are not intended to limit the present invention. [0016] Please refer to the first to sixth figures. The present invention provides a temperature equalizing plate 1 (hereinafter referred to as a temperature equalizing plate 1) having a composite supporting structure for providing an electronic heating element (not shown). Guide heat dissipation. Form No. A0101 Page 5 of 19 M393970 [00Π] It can be clearly seen from the cross-sectional view of the sixth figure that the structural composition of the temperature equalizing plate 1 includes: a flat closed casing 10, which is laid in a flat closed casing a capillary structure 20 on the inner wall surface of the crucible, a working fluid 30 (shown by a broken line) filled in the inside of the flat closed casing 1 and a composite supporting structure installed in the flat closed casing 40. [〇〇18] The flat closed casing 10 is made of a metal material having good thermal conductivity, and the capillary structure 20 may be made of a metal powder sintered or a metal mesh having a large number of fine holes therein to cause capillary action; The capillary structure 2 is disposed on the inner wall surface of the flat closed casing 1 , and the working fluid 3 is filled in the interior of the flat sealed casing 10; the working fluid 3 is placed in the flat closed casing 10 The vapor-liquid phase cyclic change, the average temperature plate can be the most: the heat generated by the electronic heating element (not shown) is continuously transmitted. [0019] In the embodiment shown in the first figure, the flat sealed casing 1 of the uniform temperature plate has a side to be sealed 11' for being placed flat in the capillary structure 2 and the composite support structure 40. After sealing the inside of the sealed casing 1 , the entire flat closed casing j 密封 is sealed, and the required working fluid 3 灌注 is poured into the flat closed casing through a filling degassing pipe 12 protruding from the side of the flat closed casing 1 . After the inside of the body 1 , the inside of the flat sealed casing 10 is evacuated, and finally the filled degassing pipe 12 ^ [0〇2〇] is sealed. In the embodiment of the present invention, the composite supporting structure 4 is accommodated. The inside of the flat closed casing 11 includes a wavy support frame 4 and at least one support column 42 (the first figure shows seven); the undulating support frame 41 is for supporting the flat closed casing 1 The upper and lower inner wall surfaces, the main function of the undulating support frame 41 is to generate sufficient supporting strength to protect the flat closed casing 1 from the positive pressing force of the electronic heating element or the external atmospheric pressure. Deformation of the depression. Page 6 of 19 Form No. A0101 [0021] M393970
[0022] [0023] 波浪狀支撐架41包含至少二側板411及連接於該二側板 411間之複數波浪片412，該波浪片412係由複數波峯段 4121及複數波谷段4122所構設而成，且任二相鄰該波浪 片412之該波峯段4121係彼此錯位配置，相對地該波谷段 4122亦彼此錯位配置，而任二相鄰該波浪片412係間隔設 置並形成有一間隔通道4123 ;其中，該等波峯段4121係 高出該側板411頂面，而該等波谷段4122則低於該側板 411底面。 如第四圖所示，支撐柱42的二端分別與毛細組織20相互 連接以防止扁狀密閉殼體10膨脹鼓起。更明確地說，支 撐柱42為金屬製成的板片且具有任何適當形狀（如第一圖 所示的圓形、方形、矩形、或長橢圓形等），支撐柱42設 置於鄰近均溫板1的扁狀密閉殼體10的四角及遠離波浪狀 支撐架41的位置上；透過選自高溫熱融、燒結、焊接及 錫銲之任一方式使支撐柱42的二端與毛細組織20相互連 接在一起，藉此方式，即使均溫板1内的工作流體30因受 熱而汽化膨脹時，因為支撐柱42與毛細組織20相互連接 ，所以能防止扁狀密閉殼體1 0膨脹鼓起而增加均溫板1的 抗膨脹強度。 參考第四圖及第五圖，可以利用一治具（未顯示）將扁狀 密閉殼體10的上表面對應置入支撐柱42的位置擠壓而分 別形成一凹陷槽13，藉此對該處附近的扁狀密閉殼體10 施加一預負載，而進一步增加均溫板1的抗膨脹強度。 參考第七圖，其顯示本創作的第二實施例，本實施例與 第一實施例之差異在於：先燒結扁狀密閉殼體10之下内 表單編號A0101 第7頁/共19頁 [0024] M393970 [0025] [0026] [0027] [0028] 有以下功效 壁所塗敷的毛細組織20，然後置入支撐柱42，最後再填 入並燒結扁狀密閉殼體10之上内壁所塗敷的毛細組織2〇 ，所以支撐柱42的上端直接抵靠扁狀密封殼體的上内壁 ’且毛細組織2 0經熱融後與支標柱4 2相互連接；換句話 說，支撐柱42的二端分別與扁狀密閉殼體1〇的上内壁面 及該毛細組織2 0相互連接° 參考第八圖，其顯示本創作的第三實施例，本實施例與 先前實施例之差異在於：先置入支撐柱42 ,再填入並燒 結扁狀密閉殼體10之上、下内壁所塗敷的毛細組織2〇， 所以支撑柱42的一端分別與扁狀密封殼體的上、下内 壁面相互連接’且毛細組織2〇:經藥融^與支撐柱42的側 緣相互連接。 參考第九圖，其顯示本創作的第四實施例，本實施例與 先前實施狀差異在於：波•支料㈣乎占據扁狀 密閉殼體Π)的内部空間’而切倾係設置於波浪狀支 撐架41的-開口 43内’如同先前的實施例，支標柱仏可 以與扁狀密閉殼體1G或毛細組織_互連接，聽祕 能夠防止扁狀密閉殼體1Q膨脹鼓起而增加均溫板丨的抗膨 脹強度。 根據本創作，由於波浪狀主 撐架41係用以支撐該扁狀密 閉殼體10的上、下内壁面，^ 所以波浪狀支撐架41可以湾 加均溫板1的抗壓強度，致彳走仏 句溫板1不會因為電子發敎 元件的正向擠壓力或抽直办％ ^ <過程產生殼體凹陷。 表單編號Α0101 » 0 8頁/共19頁 M393970 [0029] 另外，由於波浪狀支撐架41中具有供該工作流體30通過 的複數間隔通道4123，所以波浪狀支撐架41並不會妨礙 工作流體30的汽液相循環，也不會影響均溫板1的傳熱效 果0 [0030] 由於本創作的複合式支撐結構40另外設有至少一支撐柱 42，該至少一支撐柱42的二端分別與扁狀密閉殼體10或 該毛細組織20相互連接，所以能夠防止扁狀密閉殼體10 膨脹鼓起，因而增加均溫板1的抗膨脹強度。 [0031] 綜上所述，當知本創作已具有產業利用性、新穎性與進 步性，又本創作之構造亦未曾見於同類產品及公開使用 ，完全符合新型專利申請要件，羑依專利法提出申請。[0023] The undulating support frame 41 includes at least two side plates 411 and a plurality of wave plates 412 connected between the two side plates 411. The wave plates 412 are formed by a plurality of peak segments 4121 and a plurality of trough segments 4122. And any two adjacent wave segments 412 of the wave plate 412 are arranged offset from each other, and the trough segments 4122 are also arranged offset from each other, and any two adjacent wave plates 412 are spaced apart and formed with a spacing channel 4123; The peak segments 4121 are higher than the top surface of the side plate 411, and the valley portions 4122 are lower than the bottom surface of the side plate 411. As shown in the fourth figure, the two ends of the support post 42 are respectively connected to the capillary structure 20 to prevent the flat closed casing 10 from expanding and bulging. More specifically, the support post 42 is a sheet made of metal and has any suitable shape (such as a circular, square, rectangular, or elliptical shape as shown in the first figure), and the support post 42 is disposed adjacent to the isothermal temperature. The four corners of the flat sealed casing 10 of the panel 1 and the position away from the undulating support frame 41; the two ends of the support column 42 and the capillary structure are transmitted through any one selected from the group consisting of high temperature hot melting, sintering, welding and soldering. 20 are connected to each other, by which, even if the working fluid 30 in the temperature equalizing plate 1 is vaporized and expanded by heat, since the support column 42 and the capillary structure 20 are connected to each other, the flat sealed casing 10 can be prevented from expanding the drum The anti-expansion strength of the temperature equalizing plate 1 is increased. Referring to the fourth and fifth figures, a jig (not shown) may be used to press the upper surface of the flat sealed casing 10 correspondingly into the position of the support post 42 to form a recessed groove 13 respectively. A flat seal 10 near the vicinity exerts a preload to further increase the expansion resistance of the temperature equalization plate 1. Referring to the seventh figure, which shows a second embodiment of the present creation, the difference between this embodiment and the first embodiment is that the first flat-shaped sealed casing 10 is first sintered under the form number A0101. Page 7 of 19 [0024 [0028] [0028] [0028] The capillary structure 20 coated with the following effect wall is then placed in the support column 42, and finally filled and sintered on the inner wall of the flat closed casing 10 The applied capillary structure is 2〇, so the upper end of the support column 42 directly abuts against the upper inner wall of the flat sealed casing and the capillary structure 20 is thermally coupled to the branch column 42; in other words, the support column 42 The two ends are respectively connected to the upper inner wall surface of the flat closed casing 1 and the capillary structure 20. Referring to the eighth figure, a third embodiment of the present invention is shown. The difference between the present embodiment and the previous embodiment is: The support column 42 is first placed, and then the capillary structure 2 涂敷 applied on the upper inner wall and the lower inner wall of the flat closed casing 10 is filled and sintered, so that one end of the support column 42 and the upper and lower sides of the flat sealing case are respectively The walls are connected to each other' and the capillary structure is 2: the side edge of the support column 42 Interconnect. Referring to the ninth figure, which shows a fourth embodiment of the present invention, the difference between the present embodiment and the previous embodiment is that the wave material (four) occupies the inner space of the flat closed casing ') and the slanting system is set on the wave. In the opening 43 of the support frame 41, as in the previous embodiment, the support post can be interconnected with the flat closed casing 1G or the capillary structure, and the hearing can prevent the flat closed casing 1Q from expanding and bulging. The anti-expansion strength of the warm plate. According to the present invention, since the undulating main support 41 is for supporting the upper and lower inner wall surfaces of the flat closed casing 10, the undulating support frame 41 can be used for the compressive strength of the uniform temperature plate 1 of the bay. Walking the stencil 1 does not cause the housing depression due to the positive squeezing force of the electronic hairpin component or the straightening process. Form No. 1010101 » 0 8 pages / Total 19 pages M393970 [0029] In addition, since the undulating support frame 41 has a plurality of spaced passages 4123 through which the working fluid 30 passes, the undulating support frame 41 does not interfere with the working fluid 30. The vapor-liquid phase circulation does not affect the heat transfer effect of the uniform temperature plate 1 [0030] Since the composite support structure 40 of the present invention is additionally provided with at least one support column 42, the two ends of the at least one support column 42 respectively Since the flat sealed casing 10 or the capillary structure 20 is connected to each other, it is possible to prevent the flat closed casing 10 from expanding and bulging, thereby increasing the expansion resistance of the temperature equalizing plate 1. [0031] In summary, when the knowledge creation has industrial utilization, novelty and progress, and the structure of the creation has not been seen in similar products and public use, fully comply with the requirements of the new patent application, according to the patent law Application.
[0032] [0033] [0034] [0035] [0036] [0037] [0038] [0039] 【圖式簡單說明】 第一圖係本創作第一實施例之分解立體圖。 第二圖係本創作第一實施例之組合立體圖。 第三圖係本創作第一實施例之組合刮面圖，其中扁狀密 閉殼體的表面尚未被壓凹而抵靠支撐柱。 第四圖係本創作第一實施例之組合剖面圖 閉殼體的表面已被壓凹而抵靠支撐柱。 第五圖係本創作第一實施例之立體透視圖 第六圖係本創作第一實施例之組合刮面圖 第七圖係本創作第二實施例之組合剖面圖 第八圖係本創作第三實施例之組合剖面圖 ，其中扁狀密 〇 〇 表單編號A0101 第9頁/共19頁 M393970 [0040] 第九圖係本創作第四實施例之組合剖面圖。 【主要元件符號說明】 [0041] 1均溫板 [0042] 10扁狀密閉殼體 [0043] 11待密封侧 [0044] 12填充除氣管 [0045] 1 3凹陷槽 [0046] 20毛細組織 [0047] 3 0工作流體 [0048] 40複合式支撐結構 [0049] 41波浪狀支撐架 [0050] 411側板 [0051] 412波浪片 [0052] 4121波峯段 [0053] 4122波谷段 [0054] 4123間隔通道 [0055] 42支撐柱 [0056] 43缺槽 表單編號A0101 第10頁/共19頁[0036] [0039] [0039] [Brief Description of the Drawings] The first drawing is an exploded perspective view of the first embodiment of the present creation. The second drawing is a combined perspective view of the first embodiment of the present creation. The third drawing is a combined scraping view of the first embodiment of the present invention in which the surface of the flat closed casing has not been embossed against the support column. The fourth drawing is a sectional view of the combination of the first embodiment of the present invention. The surface of the closed casing has been recessed against the support column. The fifth drawing is a perspective view of the first embodiment of the present invention. The sixth drawing is a combination of the first embodiment of the present invention. The seventh drawing of the second embodiment of the present invention is a sectional view of the second embodiment. A sectional view of a combination of the three embodiments, wherein the flat shape number A0101, page 9 / 19 pages, M393970 [0040] The ninth drawing is a combined sectional view of the fourth embodiment of the present creation. [Main component symbol description] [0041] 1 uniform temperature plate [0042] 10 flat closed casing [0043] 11 to be sealed side [0044] 12 filled degassing tube [0045] 1 3 depressed groove [0046] 20 capillary structure [ 0047] 3 0 working fluid [0048] 40 composite support structure [0049] 41 wavy support [0050] 411 side plate [0051] 412 wave plate [0052] 4121 peak segment [0053] 4122 trough segment [0054] 4123 interval Channel [0055] 42 Support Column [0056] 43 Missing Form Number A0101 Page 10 of 19