TWM390634U - Flexible circuit board - Google Patents

Flexible circuit board

Info

Publication number
TWM390634U
TWM390634U TW099203303U TW99203303U TWM390634U TW M390634 U TWM390634 U TW M390634U TW 099203303 U TW099203303 U TW 099203303U TW 99203303 U TW99203303 U TW 99203303U TW M390634 U TWM390634 U TW M390634U
Authority
TW
Taiwan
Prior art keywords
circuit patterns
region
sprocket
disposed
circuit board
Prior art date
Application number
TW099203303U
Other languages
English (en)
Inventor
Kai-Chi Yang
Yao-Te Tsai
Tung-Yang Chen
Original Assignee
Himax Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Himax Tech Ltd filed Critical Himax Tech Ltd
Priority to TW099203303U priority Critical patent/TWM390634U/zh
Publication of TWM390634U publication Critical patent/TWM390634U/zh

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
TW099203303U 2010-02-12 2010-02-12 Flexible circuit board TWM390634U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW099203303U TWM390634U (en) 2010-02-12 2010-02-12 Flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099203303U TWM390634U (en) 2010-02-12 2010-02-12 Flexible circuit board

Publications (1)

Publication Number Publication Date
TWM390634U true TWM390634U (en) 2010-10-11

Family

ID=60590628

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099203303U TWM390634U (en) 2010-02-12 2010-02-12 Flexible circuit board

Country Status (1)

Country Link
TW (1) TWM390634U (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI463155B (zh) * 2012-12-24 2014-12-01 Novatek Microelectronics Corp 具有薄膜覆晶封裝的電子裝置
TWI510150B (zh) * 2014-05-30 2015-11-21 Chipmos Technologies Inc 可撓性線路載板
TWI641106B (zh) * 2016-12-15 2018-11-11 Chipmos Technologies Inc. 晶片封裝基板與晶片封裝結構
TWI708527B (zh) * 2018-11-23 2020-10-21 友達光電股份有限公司 電路板
CN113301709A (zh) * 2020-02-24 2021-08-24 颀邦科技股份有限公司 线路板

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI463155B (zh) * 2012-12-24 2014-12-01 Novatek Microelectronics Corp 具有薄膜覆晶封裝的電子裝置
US9400310B2 (en) 2012-12-24 2016-07-26 Novatek Microelectronics Corp. Electronic device with chip-on-film package
TWI510150B (zh) * 2014-05-30 2015-11-21 Chipmos Technologies Inc 可撓性線路載板
CN105323947A (zh) * 2014-05-30 2016-02-10 南茂科技股份有限公司 可挠性线路载板
CN105323947B (zh) * 2014-05-30 2018-05-22 南茂科技股份有限公司 可挠性线路载板
TWI641106B (zh) * 2016-12-15 2018-11-11 Chipmos Technologies Inc. 晶片封裝基板與晶片封裝結構
TWI708527B (zh) * 2018-11-23 2020-10-21 友達光電股份有限公司 電路板
CN113301709A (zh) * 2020-02-24 2021-08-24 颀邦科技股份有限公司 线路板

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Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model