五、新型說明： 【新型所屬之技術領域】 種 可提是有關於一種測試裝置’且特別是有關於 J钕升測試品質之測試裝置。 【先前技術】 的步驟產ί在出貨之前均需要經過檢驗測試 確保產σσ的品質。舉例來說，银/古工V. New type of description: [Technical field to which the new type belongs] It can be mentioned that there is a test device' and in particular a test device for the quality of the J-liter test. [Prior Art] The steps of production are subject to inspection and testing before shipment to ensure the quality of σσ. For example, silver/old work
=用通用序列匯排流（UniversaiSedaiB 接的外接式射頻裝置，在進B:: ^ 置插八測試的裝置。再者’進行測試： 了要徒手按㈣縣置，使得射職置上的訊 了 …貝1Μ裝置上的訊號接點接觸，以便進行測試。”、1 頭損:而同: = = „射頻裝置的接 試兩面都設置有射頻元件的產=費=:以其是測 元件，大大增加了 ，以測試第二面的測頻 ^ 〇 °式所耗費的時間。另外，由於车社 產。D上的接觸面積有限， ' 抬 時，會讓產品受力不均=頻袭置以進行測試 種徒手按壓產品來進^今易導致產品損壞。再者，此 置上的訊號接點心式，亦很容易發生射頻裝 象，容—Lr造上:產== 【新型内容】 M377593 因此，本新型之一實施例是在提供一種測試裝置，至 少包括一固定板、一滑執、一連接件、一承載台、一訊號 接點、一連接線、—扣組件以及一壓板。滑執位於固定 板上。連接件位於滑執的一端的固定板上，用以耦接於一 待測元件之一對接件。承載台滑設於滑軌上，並且具有一 容置槽，用以容置待測元件。訊號接點位於容置槽内，當 待測元件容置於容置槽内時，訊號接點係接觸於待測元件 之一第一訊號接頭以進行量測。連接線連接訊號接點以傳 輸訊號。卡扣組件設置於承載台的一側。壓板樞接於卡扣 組件對側之承載台上。當壓板相對於承載台位於一閉合位 置時，卡扣組件卡扣壓板。 依據本新型另一實施例，測試裝置更包含一頂出件， 藉由一轉軸嵌設於容置槽底部的一狹缝中。頂出件包含一 按壓部及一推頂部。按壓部透出承載台的側壁之外，推頂 部位於頂出件之另端。當按壓該按壓部時，推頂端自狹缝 凸出容置槽底部以使待測元件脫出容置槽。 依據本新型又一實施例，承載台更包含多個定位梢， 設置於容置槽内底面上。此些定位梢分別對應待測元件之 多個定位孔而設置。 依據本新型再一實施例，待測元件之第一訊號接頭為 一射頻接頭，連接線之另端係連接於一射頻檢測單元，以 傳輸訊號至射頻檢測單元。 依照本新型之測試裝置，利用壓板及承載台夾置待測 元件，可以提升待測元件上的對接件與固定板上之連接件 耦接時的穩定性，並且使待測元件之第一訊號接頭可以穩 4 M377593 固地接觸於固定板之訊號接點，提升測試品質。再者，僅 需更換對應於待測元件之承載台，即可對於不同的待測元 件進行測試，提高測試裝置的應用彈性。 【實施方式】 依照本新型/實施例之測試裝置，用以測試一待測元 件，其係利用壓板及承載台穩固夾置待測元件來進行測 試。請同時參照第1A及1B圖，其分別繪示依照本新型一 實施例之一種測試裝置之不同視角的立體圖。測試裝置1〇〇 主要包括一固定板丨3〇、一承載台150及一壓板170。承載 台150經由位於固定板130上的一滑軌131滑設於固定板 130上。承載台150之一側設置有一卡扣組件159，且承載 台150具有一容置槽155，用來容置待測元件200。滑轨 131 —端的固定板130上設置有一連接件133,用以耦接於 待測元件200之/對接件230。壓板170係樞接於卡扣組 件159對側的承載台150上。 在操作本實施例之測試裝置1〇〇時，首先將待測元件 200設置於容置槽155内，接著下壓壓板170，使壓板170 相對於承載台150位於一閉合位置。請參照第2圖，其繪 示第1A圖之壓板位於閉合位置時的立體圖。當壓板170 位於閉合位置時，壓板170及承載台150係夾住待測元件 200 〇 更詳盡地來說’磨板包含一手柄179，其係位於 壓板170對應於卡扣組件159之一側。當壓板no位於閉 合位置時，卡扣組件159卡扣手柄179，以穩固地固定壓 5 M377593 板170。於一實施例中，卡扣組件159係可利用兩個彈性 滾珠159a來夾扣圓形斷面的手柄179。本實施例中，壓板 170係為一平板狀結構，當壓板170相對於承載台150位 於閉合位置，使手柄179扣合於卡扣組件159時，壓板170 及承載台150分別接觸於待測元件200之兩相對表面，以 將待測元件200夾置於兩者之間。此時壓板170係均勻地 施力按壓於待測元件200，避免徒手按壓待測元件200造 成施力不均，導致待測元件200受損的問題。 請同時參照第3圖及第4圖，第3圖繪示第1圖之承 載台的上視圖，第4圖繪示第2圖之壓板、待測元件及承 載台的剖面圖。承載台150包含一訊號接點153，位於容 置槽155内，當待測元件200容置於容置槽155時，訊號 接點153係接觸於待測元件200之一第一訊號接頭211。 於一實施例中，容置槽155具有大致上與待測元件200相 同的形狀，以容置待測元件200。 另外，承載台150更可包含多個定位梢157，如第3 圖所示。定位梢157係設置於容置槽155内底面上，且對 應待測元件200之多個定位孔而設置。當待測元件200容 置於容置槽155内時，此些定位梢157分別對應穿接於待 測元件200之定位孔，以將待測元件200定位於承載台150 上。藉由容置槽155的形狀以及定位梢157的設計，可以 快速且準確地達成待測元件200於承載台150上的定位， 讓待測元件200上的第一訊號接頭211可以確實接觸於容 置槽155内的訊號接點153。 本實施例中，待測元件200更包括一第二訊號接頭 6 M377593 212。第-訊號接頭211及第二訊號接頭2i2分別位於待測 兀件2〇0相對的兩個表面上，如f 4圖所示。當壓板170 位於閉口位置時’待測元件2〇〇之第二訊號接頭係暴 露於壓板17G外’以便同時經由第—訊號接頭2ιι及第二 訊號接頭212進行測試。 貫際應用上’待測元件2〇〇之兩相對表面分別設置有 厂個以上的射頻元件’且第一訊號接頭2ιι及第二訊號接 頭212 /刀別可為一射頻接頭。測試裝置100更包含-連接 線190 ’其兩相對端中的一端係穿過承載台連接於訊 號接點153、’則專輸訊號。連接線19〇之另外一端係連接 至-射頻檢測單元（未顯示於圖中），藉以經由第一訊號接 頭2U對待測元件進行測試。當訊號接點153磨損或 氧化發生賴不良時，僅需自承載台⑼拉 進行更換即可。此外，第二訊號接頭扣可同時連接 至相同或不同的射頻檢測單元’以同時經由第一訊 211及第二訊號接頭212測試待測元件。 儿 在操作本實_之_裝置· _，當 2〇〇至容置槽155，並且卡扣壓㈣於閉合位置：= 下來係沿滑執131移動承載台15〇，以將承载台⑼移動 至固定板no上之-測試位置（第1A& m圖中所繪示之 承載台150係位於測試位置）。當容置有待測元件細曰 載台15G位於測試位置時，待測元件·的對 耦接於固定板130上的連接件133。 t川你 本實施例中，滑執131係為—直線形滑執，承载二⑼ 在固定板130上沿著滑執131進行直線移動。實際應：上， MJ//593 承載台150沿滑執131之一 及對接件230 # ^ , 向係平订於連接件133 丁较忏dU的—耦接方向。 載台—第—#叙古Α η田谷置有待測兀件2〇〇之承 接件230赫雜志i 移動離開测試位置時，對 =230係脫離連接件133。當承載台15〇沿第一 J : 2°3〇 2反向移動回測試位置時，連接件133復*對接件 230輕接。如此-來，藉由承载台15〇相對二定:= 沿著平行於耦接方向的移動， 板130 時不會發生彎拼而；確保插技待測元件200 曰七生弓折·壞連接件⑶或對接件23〇的問題。 传二Li來說’固定板130上更設置有-主板刚，盆 連接件i33位於滑執131之同端。主板14〇係電性連 ^連Ϊ件133 ’用以經_接之連接件133及對接件230 傳輸峨至待測元件200。連接件133可例如是一通用序 列匯流排（Universal Seriai Bus，刪）之母接頭或公接頭， 而對接件230係為對應之-通用序列匯流排之公接頭或母 ，碩。然而，本實施例中連接主板14〇及待測元件2〇〇之 介面並不限制於通用序列匯流排介面，其他使用在電腦系 統中用來連接周邊元件的擴充介面，例如mEE 1394介面 及e-SATA介面，均可應用於此。 進行待測元件200的測試時，主板14〇係將測試訊號 經由通用序列匯流排介面之連接件丨33及對接件23〇傳遞 至待測元件200，並由第一訊號接頭211及第二訊號接頭 212分別連接至相同或不同的射頻檢測單元。 本實施例之固定板130係樞接於一底座11()，如第1A 及1B圖所示’固定板130、承載台15〇、壓板n〇及夾置 之待測元件200同時相對於底座11〇翻轉。另外，承載台 M377593 150具有—内凹口 ’當待測元件200容置於容置槽155内 柃，邙刀之待測元件2〇〇係凸出於内凹口。經由固定板13〇 相對於底座110翻轉’使用者可在進行測試時，由不同角 度觀察待測元件200之上表面及下表面，以及第一訊號接 頭211與訊號接點153的接觸狀況。 /測忒心畢後，使用者可沿第一移動方向D1移動容置 有待測元件200之承载台15〇離開測試位置，使對接件23〇 脫離連接件133。接著利用承載台ι5〇中的一頂出件ι6〇 自谷置槽155頂出待測元件2〇〇。請參照第4圖，頂出件 160係經由一轉軸嵌設於容置槽155底部之一狹縫中。頂 出件160包含一按壓部160a及一推頂部160b，按壓部160a 透出承載台150的侧壁之外，推頂部16〇b位於頂出件16〇 之另端。 >吻同日寸參照第5A圖及第5B圖，其分別繪示按壓頂出 件前後承載台的部分剖面圖。頂出件之轉軸位於按壓 =16〇a及_部祕之間，使得按壓部職及推頂部= Use the universal serial sink (Universal SedaiB connected external RF device, in the B:: ^ inserted eight test device. In addition, 'test: to press the (4) county, so that the shot on the post The signal contact on the device is tested for the test.", 1 head loss: and the same: = = „The RF device is equipped with RF components on both sides. = is the component , greatly increased, to test the second side of the frequency measurement ^ 〇 ° type of time spent. In addition, due to the car company. The contact area on D is limited, 'lifting, will make the product uneven force = frequency attack It is easy to cause damage to the product. It is easy to generate RF image, and it is easy to generate RF image. Capacity-Lr is made: Production == [New content] M377593 Accordingly, an embodiment of the present invention provides a test apparatus including at least one fixing plate, a sliding handle, a connecting member, a carrying platform, a signal contact, a connecting wire, a buckle assembly, and a pressure plate. The slipper is located on the fixed plate. The connector is located in the slippery The fixing plate at one end is coupled to one of the components to be tested. The carrier is slidably disposed on the sliding rail and has a receiving slot for accommodating the component to be tested. In the slot, when the component to be tested is received in the receiving slot, the signal contact contacts the first signal connector of the component to be tested for measurement. The cable connects the signal contact to transmit the signal. The pressure plate is pivotally connected to the loading platform on the opposite side of the buckle assembly. When the pressure plate is in a closed position relative to the loading platform, the buckle assembly buckles the pressure plate. According to another embodiment of the present invention, the test The device further comprises a top piece, which is embedded in a slit at the bottom of the receiving groove by a rotating shaft. The ejector member comprises a pressing portion and a pushing top portion. The pressing portion penetrates the side wall of the carrying platform, pushing the top portion When the pressing portion is pressed, the pushing end protrudes from the slit to the bottom of the receiving groove to disengage the device to be tested from the receiving groove. According to another embodiment of the present invention, the carrying platform further includes The positioning tips are disposed on the bottom surface of the receiving groove. According to another embodiment of the present invention, the first signal connector of the device to be tested is a radio frequency connector, and the other end of the connection line is connected to a radio frequency detecting unit. The transmission signal is transmitted to the radio frequency detecting unit. According to the testing device of the present invention, the device to be tested is clamped by the pressing plate and the loading table, and the stability of the connecting member on the component to be tested and the connecting member on the fixing plate can be improved, and The first signal connector of the device to be tested can be stably connected to the signal contact of the fixed board by 4 M377593 to improve the test quality. Furthermore, only the carrier corresponding to the component to be tested needs to be replaced, and the different test pieces can be tested. The component is tested to improve the application flexibility of the test device. [Embodiment] A test device according to the present invention/embodiment is used to test a component to be tested, which is tested by using a pressure plate and a carrier to firmly sandwich the device to be tested. Referring to FIGS. 1A and 1B, respectively, perspective views of different perspectives of a test apparatus according to an embodiment of the present invention are shown. The test device 1A mainly includes a fixed plate 丨3〇, a carrying table 150 and a pressing plate 170. The carrier 150 is slidably disposed on the fixed plate 130 via a slide rail 131 located on the fixed plate 130. A latching assembly 159 is disposed on one side of the carrying platform 150, and the receiving base 150 has a receiving slot 155 for receiving the component to be tested 200. A connecting member 133 is disposed on the fixing plate 130 at the end of the sliding rail 131 for coupling to the abutting member 230 of the component to be tested 200. The pressure plate 170 is pivotally connected to the carrier 150 on the opposite side of the buckle assembly 159. When the test apparatus 1 of the present embodiment is operated, the device under test 200 is first placed in the accommodating groove 155, and then the platen 170 is pressed down so that the platen 170 is in a closed position relative to the stage 150. Referring to Figure 2, a perspective view of the pressure plate of Figure 1A in the closed position is shown. When the pressure plate 170 is in the closed position, the pressure plate 170 and the loading table 150 clamp the member to be tested 200. More specifically, the grinding plate includes a handle 179 which is located on the side of the pressure plate 170 corresponding to the buckle assembly 159. When the platen no is in the closed position, the snap assembly 159 snaps the handle 179 to securely hold the press 5 M377593 plate 170. In one embodiment, the snap assembly 159 can utilize two resilient balls 159a to clip the handle 179 of circular cross-section. In this embodiment, the pressure plate 170 is a flat structure. When the pressure plate 170 is in the closed position relative to the loading platform 150, and the handle 179 is fastened to the buckle assembly 159, the pressure plate 170 and the loading platform 150 respectively contact the component to be tested. Two opposite surfaces of 200 are placed between the two components 200 to be tested. At this time, the pressing plate 170 is evenly pressed against the element to be tested 200, and the uneven pressing force is caused by the hand pressing the element to be tested 200, resulting in a problem that the element to be tested 200 is damaged. Please refer to FIG. 3 and FIG. 4 at the same time. FIG. 3 is a top view of the loading platform of FIG. 1, and FIG. 4 is a cross-sectional view of the pressure plate, the component to be tested and the loading platform of FIG. The carrier 150 includes a signal contact 153 located in the receiving slot 155. When the device under test 200 is received in the receiving slot 155, the signal contact 153 contacts the first signal connector 211 of the component to be tested 200. In one embodiment, the receiving groove 155 has substantially the same shape as the element to be tested 200 to accommodate the device under test 200. In addition, the carrier 150 may further include a plurality of positioning tips 157, as shown in FIG. The positioning pin 157 is disposed on the inner bottom surface of the accommodating groove 155 and is disposed corresponding to the plurality of positioning holes of the element to be tested 200. When the component to be tested 200 is placed in the accommodating groove 155, the positioning pins 157 respectively pass through the positioning holes of the device to be tested 200 to position the device under test 200 on the carrier 150. By the shape of the receiving slot 155 and the design of the positioning tip 157, the positioning of the device under test 200 on the carrying platform 150 can be quickly and accurately achieved, so that the first signal connector 211 on the device under test 200 can be surely contacted. The signal contact 153 in the slot 155 is placed. In this embodiment, the device under test 200 further includes a second signal connector 6 M377593 212. The first signal connector 211 and the second signal connector 2i2 are respectively located on opposite surfaces of the member to be tested 2〇0, as shown in FIG. When the pressure plate 170 is in the closed position, the second signal connector of the device under test 2 is exposed outside the pressure plate 17G for simultaneous testing via the first signal connector 2 and the second signal connector 212. In the continuous application, the opposite surfaces of the device 2 to be tested are respectively provided with more than one RF element, and the first signal connector 2 and the second signal connector 212 can be an RF connector. The test apparatus 100 further includes a connecting line 190' having one end of the opposite ends connected to the signal contact 153, 'passing the signal through the carrying station. The other end of the connecting line 19 is connected to a radio frequency detecting unit (not shown) for testing the component to be tested via the first signal connector 2U. When the signal contact 153 is worn or the oxidation occurs poorly, it only needs to be pulled from the carrying table (9) for replacement. In addition, the second signal connector can be simultaneously connected to the same or different RF detecting unit ′ to simultaneously test the device to be tested via the first signal 211 and the second signal connector 212. In the operation of the device _ device _, when 2 〇〇 to the receiving slot 155, and the buckle pressure (four) in the closed position: = down the sliding carriage 131 to move the carrying platform 15 〇 to move the carrying platform (9) to The test position on the fixed plate no (the stage 150 shown in the 1A & m figure is located at the test position). When the component to be tested is accommodated and the stage 15G is in the test position, the pair of the device to be tested is coupled to the connector 133 on the fixed plate 130. In this embodiment, the slipper 131 is a linear slide, and the load bearing two (9) is linearly moved along the slide 131 on the fixed plate 130. Actually, the MJ//593 carrying platform 150 is disposed along one of the sliding handles 131 and the docking member 230 #^, and the direction of the connecting member 133 is smaller than that of the connecting member 133. The stage - the first - # 叙古Α η Tian Gu is placed with the to-be-tested piece 2 〇〇 of the support piece 230 赫 magazine i moved away from the test position, the pair =230 is disconnected from the connector 133. When the carrying table 15 is moved back to the test position in the reverse direction along the first J: 2° 3 〇 2, the connecting member 133 is re-attached to the docking member 230. In this way, by the carrier 15 〇 relatively fixed: = along the movement parallel to the coupling direction, the plate 130 will not bend; and ensure that the plug-in component to be tested 200 曰 seven bows and bad connectors (3) or the problem of the docking piece 23〇. According to the second Li, the fixing plate 130 is further provided with a main plate, and the basin connecting member i33 is located at the same end of the sliding plate 131. The motherboard 14 is electrically connected to the device under test 200 by the connector 133 and the connector 230. The connector 133 can be, for example, a female connector or a male connector of a Universal Seriai Bus, and the connector 230 is a male connector or a female connector of a corresponding universal bus. However, in this embodiment, the interface between the motherboard 14 and the device under test 2 is not limited to the universal serial bus interface, and other expansion interfaces used in the computer system for connecting peripheral components, such as the mEE 1394 interface and e - SATA interface can be applied to this. When the test component 200 is tested, the main board 14 transmits the test signal to the device under test 200 via the connector 丨33 and the interface 23 of the universal serial bus interface, and the first signal connector 211 and the second signal are transmitted. The connectors 212 are respectively connected to the same or different radio frequency detecting units. The fixing plate 130 of the embodiment is pivotally connected to a base 11 (), as shown in FIGS. 1A and 1B, the fixing plate 130, the loading table 15〇, the pressing plate n〇, and the sandwiched component to be tested 200 are simultaneously opposite to the base. 11〇 flip. In addition, the carrying platform M377593 150 has an inner recess ′ when the component to be tested 200 is accommodated in the accommodating groove 155, and the component 2 to be tested of the trowel protrudes from the inner recess. The user can flip through the fixing plate 13 相对 relative to the base 110. The user can observe the upper surface and the lower surface of the device under test 200 and the contact state of the first signal connector 211 and the signal contact 153 from different angles when performing the test. After the measurement is completed, the user can move the receiving table 15 accommodating the device to be tested 200 in the first moving direction D1 away from the test position, and the abutting member 23 脱离 is disengaged from the connecting member 133. Then, the component to be tested 2 顶 is ejected from the valley slot 155 by using a top ejection member ι6 承载 in the carrying table ι5 〇〇. Referring to Fig. 4, the ejector member 160 is embedded in a slit in the bottom of the accommodating groove 155 via a rotating shaft. The ejector member 160 includes a pressing portion 160a and a pushing top portion 160b. The pressing portion 160a is exposed outside the side wall of the carrying platform 150, and the pushing top portion 16b is located at the other end of the ejector member 16'. > Kissing the same day refers to the 5A and 5B drawings, which respectively show a partial cross-sectional view of the loading platform before and after pressing the ejection member. The axis of the ejection member is located between the pressing =16〇a and the _ secret, so that the pressing part and the pushing top
u ilrT經由轉轴進行擺動。當按塵按壓部160a時，推 頂部160b自狹縫凸屮交番M 脫出容置槽155。底部，以使待測元件鹰 測試的效率外二二:〇自承载台150取出，除可提升 待測元件200產^曲f取出待測元件的過程中讓 r… 相、甚至斷裂損壞的現象。 台穩固地施=試裝置’利用壓板及承载 穩定性，並⑼帛 M提麵接件及料件耗接的 弟-《接頭與訊號接㈣接觸穩定性， 9 M377593 提升測試品質。此外，藉由壓板係均勻地施力於待測元件， 可避免徒手按壓導致待測元件受損的問題。再者，藉由暴 露於壓板外之第二訊號接頭，可同時經由位於待測元件兩 相對表面上的第一訊號接頭及第二訊號接頭進行測試，提 升測試效率。另外，藉由更換承載台，可使測試裝置適用 於不同的待測元件，可提高測試裝置的應用彈性。 雖然本新型已以實施例揭露如上，然其並非用以限定 本新型，任何熟習此技藝者，在不脫離本新型之精神和範 圍内，當可作各種之更動與潤飾，因此本新型之保護範圍 當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本新型之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之說明如下： 第1A圖繪示依照本新型一實施例之一種測試裝置之 一視角的立體圖。 第1B圖繪示依照本新型一實施例之一種測試裝置之 另一視角的立體圖。 第2圖繪示第1A圖之壓板位於閉合位置時的立體圖。 第3圖繪示第1圖之承載台的上視圖。 第4圖繪示第2圖之壓板、待測元件及承載台的剖面 圖。 第5A圖繪示按壓頂出件前承載台的部分剖面圖。 第5B圖繪示按壓頂出件後承載台的部分剖面圖。 10 M377593 【主要元件符號說明】 100 :測試裝置 160 ： 110 :底座 160a 130 :固定板 160b 131 :滑轨 170 ： 133 :連接件 179 ： 150 :承載台 190 ： 153 :訊號接點 200 ： 155 :容置槽 211 ： 157 :定位梢 ， 212 ： 159 :卡扣組件 230 ： 159a :彈性滾珠 D1 ·· 頂出件 :按壓部 :推頂部 壓板 手柄 連接線 待測元件 第一訊號接頭 第二訊號接頭 對接件 第一移動方向u ilrT swings through the shaft. When the dust pressing portion 160a is pressed, the pushing top portion 160b is disengaged from the accommodating groove 155 from the slit knurling portion M. The bottom, in order to make the efficiency of the component to be tested eagle test 2: 〇 taken out from the carrying platform 150, in addition to improving the phenomenon that the component to be tested 200 is taken out and the component to be tested is taken out, so that r... phase or even broken damage . The platform is firmly applied to the test device's using the pressure plate and bearing stability, and (9) 帛 M lifting surface joints and material parts are used for the connection - "joint and signal connection (four) contact stability, 9 M377593 to improve test quality. In addition, by uniformly applying a force to the element to be tested by the platen system, the problem of damage to the element to be tested by hand pressing can be avoided. Furthermore, by using the second signal connector exposed outside the pressure plate, the first signal connector and the second signal connector on the opposite surfaces of the device to be tested can be tested at the same time to improve the test efficiency. In addition, by replacing the carrier, the test device can be applied to different components to be tested, and the application flexibility of the test device can be improved. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Any one skilled in the art can make various changes and retouchings without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious, the description of the drawings is as follows: FIG. 1A illustrates a test according to an embodiment of the present invention. A perspective view of one of the devices' perspectives. Fig. 1B is a perspective view showing another perspective of a test apparatus according to an embodiment of the present invention. Fig. 2 is a perspective view showing the pressure plate of Fig. 1A in a closed position. Figure 3 is a top view of the carrier of Figure 1. Fig. 4 is a cross-sectional view showing the pressure plate, the member to be tested, and the stage of Fig. 2; Fig. 5A is a partial cross-sectional view showing the front stage of the pressing ejector. Figure 5B is a partial cross-sectional view showing the stage after pressing the ejection member. 10 M377593 [Description of main component symbols] 100: Test device 160: 110: Base 160a 130: Fixing plate 160b 131: Slide rail 170: 133: Connector 179: 150: Carrier 190: 153: Signal contact 200: 155: Locating groove 211 : 157 : Locating tip, 212 : 159 : Snap fitting 230 : 159a : Elastic ball D1 · · Ejecting member: Pressing part: Pushing the top platen handle connecting wire Test component first signal connector Second signal connector The first moving direction of the docking piece
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