M368516 五、新型說明： 【新型所屬之技術領域】 . 本創作係關於一種定位環（retaining ring)，特別是關於一種晶 , 圓研磨定位環。 【先前技術】 目别的半導體製程中，為避免黃光製程於對焦時發生失 焦的現象，平坦化製程已成為晶圓製造時不可或缺的步 Φ 驟。於深次微米甚至奈米的世代中，化學機械研磨（ChemicalM368516 V. New description: [New technical field] The present invention is about a retaining ring, especially for a crystal and round grinding positioning ring. [Prior Art] In the semiconductor manufacturing process, in order to avoid the phenomenon that the yellow light process is out of focus during focusing, the planarization process has become an indispensable step in wafer fabrication. Chemical deep grinding in chemical generations of deep submicron or even nanometers (Chemical)
Mechanical Polishing，CMP)技術已逐漸取代傳統的回蝕 (etching back)或旋塗式玻璃（Spin_〇n Glass，SOG)披覆，而 成為半導體平坦化製程的_主流。 現今的化學機械研磨機台大多是利用一研磨頭 (polishing head)挟持一晶圓以進行研磨，各研磨頭具有一 環繞於該晶圓外圍之定位環，用以限制該晶圓，以避免該 晶圓於研磨時滑出該研磨頭而造成毁損。 ® 各廠商所製作之化學機械研磨定位環並不完全相同，因 而產生多種變化及形狀。此時若定位環之結構複雜，易累 積塵污或易於碰撞，而減低定位環之壽命。 【新型内容】 本創作提供一種晶圓研磨定位環，藉由增加膠環之設 計，其類似於研磨環側壁延伸出一凸緣，故可阻擋研磨液 飛濺造成的髒污，且某程度防止空氣中之灰塵落下。另外， 膠環亦可視為緩衝材，可進一步防止研磨環之碰損。 3 M368516 广據作一實施例之晶圓研磨定位環，其包含一研磨 ¥及膠¥。該研磨環包含沿該研磨環之徑向等角度排列 之複數個溝槽。該膠職卡連接於該研磨環之外^側 壁’且凸出於該研磨環侧壁。 實施例中，該膠環包含_端喪卡於該研磨環之侧壁之 水平延伸部、-連接於㈣平延㈣U折部及連接於該 彎折部之擋端。 【實施方式】 以下詳細討論本創作目前較佳實施例的製作和使用。不 過’應當理解’本創作提供許多彳應用的裝i，其可在各 種各樣的具體情況下實施。該討論的具 製作和制該創作的《方式，並《限制本㈣^月圍了。 圖1係本創作第-實施例之晶圓研磨定位環之立體示意 圖二圖2係將圖i之晶圓研磨定位環上、下翻轉後之立體 示意圖。晶圓研磨定位環10係由研磨環u及膠環12組成。 研磨環11包含沿該研磨環U之徑向約呈等角度排列之複 數個溝槽13。研磨時具有溝槽13之研磨環"表面係接觸 研磨塾以進行研磨，即溝槽13之開口係朝下，此時研磨時 之研磨液可藉由溝槽13進入定位環10所限制之範圍中供 晶圓研磨之用或排出。 圖3係圖2所示之晶圓研磨定位環之上視圖，圖4則為 圖3中沿1-1剖面線之剖視圖。圖5則為圖4中區域A之 放大圖。膠環12連接於該研磨環u之外圍，且膠環12係 凸出於該研磨環U的側壁。參照圖5，膠環12係利用嵌卡 M368516 的方式固定研磨環u側壁中，其結合 原理主要係製作凹槽3〇於 要黏膠。敌卡之 略小於膠環12連接部位之尺十m中該凹槽30之開口 利用較大外2 因膠環12係彈性體，可 利用較大外力而直接塞人凹槽3G，產 rm 1 * 队卜双禾。 2ΐ=Γ:結構而言係包含水平延伸部2"折部 壁=伸 = 接於該水平延伸部2〇。擋端22連接於Mechanical Polishing (CMP) technology has gradually replaced the traditional etching back or spin-on glass (SOG) coating, and has become the mainstream of the semiconductor flattening process. Most of today's chemical mechanical polishing machines use a polishing head to hold a wafer for polishing. Each polishing head has a positioning ring surrounding the periphery of the wafer to limit the wafer to avoid the The wafer slides out of the polishing head during grinding to cause damage. ® The chemical mechanical grinding positioning rings produced by various manufacturers are not identical, resulting in a variety of variations and shapes. At this time, if the structure of the positioning ring is complicated, it is easy to accumulate dust or easily collide, and the life of the positioning ring is reduced. [New content] This creation provides a wafer grinding positioning ring. By adding a rubber ring design, it extends a flange similar to the side wall of the grinding ring, so it can block the dirt caused by the splash of the slurry and prevent the air to some extent. The dust in it falls. In addition, the rubber ring can also be regarded as a cushioning material, which can further prevent the abrasion of the grinding ring. 3 M368516 is widely used as a wafer grinding positioning ring of an embodiment, which comprises a grinding material and a rubber ¥. The grinding ring includes a plurality of grooves arranged at equal angular intervals along the radial direction of the grinding ring. The glue card is attached to the side wall of the grinding ring and protrudes from the side wall of the grinding ring. In an embodiment, the rubber ring includes a horizontal extension extending from the side wall of the grinding ring, and is connected to the (four) flat (four) U-fold and a stop end connected to the bent portion. [Embodiment] The making and using of the presently preferred embodiment of the present invention are discussed in detail below. However, it should be understood that this creation provides a number of applications, which can be implemented in a wide variety of specific situations. The discussion has the method of making and making the creation, and the restriction of this (four) ^ month. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the wafer grinding positioning ring of the first embodiment of the present invention. Fig. 2 is a perspective view showing the wafer grinding positioning ring of Fig. i rotated up and down. The wafer grinding positioning ring 10 is composed of a grinding ring u and a rubber ring 12. The grinding ring 11 includes a plurality of grooves 13 arranged at approximately equal angles in the radial direction of the grinding ring U. The grinding ring having the groove 13 during grinding is in contact with the grinding burr for grinding, that is, the opening of the groove 13 is directed downward, and the polishing liquid at the time of grinding can be restricted by the groove 13 entering the positioning ring 10. For the grinding or discharge of wafers in the range. 3 is a top view of the wafer grinding positioning ring shown in FIG. 2, and FIG. 4 is a cross-sectional view taken along line 1-1 of FIG. Fig. 5 is an enlarged view of a region A in Fig. 4. A rubber ring 12 is attached to the periphery of the grinding ring u, and the rubber ring 12 protrudes from the side wall of the grinding ring U. Referring to Fig. 5, the rubber ring 12 is fixed in the side wall of the grinding ring u by means of the card M368516, and the bonding principle is mainly to make the groove 3 to be glued. The enemy card is slightly smaller than the joint of the rubber ring 12, and the opening of the groove 30 utilizes a larger outer 2 due to the rubber ring 12-series elastic body, and can directly insert the groove 3G by using a large external force, producing rm 1 * Team Bu Shuanghe. 2ΐ=Γ: In terms of structure, it includes a horizontal extension 2" a fold wall = extension = connected to the horizontal extension 2〇. Stop end 22 is connected to
。水平延伸部2〇離該溝槽"所在之表面較擋 端22離該溝槽13所在之表面為近。 研磨環U可選自具耐磨及耐腐飯特性之聚苯標硫 (Polyphenylene Sulfide ， ρρς、 w J ' 聚鍵謎甲酮 (P〇iyether-etherketon , PEEK)或半晶狀熱塑聚醋 (Semi-crystalineTherm〇plasticp〇lyester)等聚合物材質。膠 環12可選用矽膠或橡膠等彈性體材質。 藉由膠環12之設計，其類似於研磨環11侧壁延伸出一 凸緣’故可阻擋研磨液飛賤，且某程度防止空氣中之灰塵 落下。另外，該撞端22之剖面似圓形且面積較大，可視為 緩衝材，可進一步防止研磨環u之碰損。 本創作之技術内容及技術特點已揭示如上，然而熟悉本 項技術之人士仍可能基於本創作之教示及揭示而作種種不 者離本創作精神之替換及修飾。因此，本創作之保護範圍 應不限於實施例所揭示者，而應包括各種不背離本創作之 替換及修飾，並為以下之申請專利範圍所涵蓋。 【圖式簡單說明】 M368516 圖1及圖2顯示本創作一實施例之晶圓研磨定位環之立 體示意圖； 圖3顯示本創作一實施例之晶圓研磨定位環之上視圖； 圖4顯示圖3中沿1 -1剖面線之剖面圖；以及 圖5顯不圖4中A區域之放大圖。 【主要元件符號說明】 10 晶圓研磨定位環. The horizontal extension 2 is spaced from the surface of the groove " the end 22 is closer to the surface on which the groove 13 is located. The grinding ring U can be selected from Polyphenylene Sulfide (PrIyether-etherketon, PEEK) or semi-crystalline thermoplastic polyacetate with wear-resistant and anti-soil properties. (Semi-crystalineTherm〇plasticp〇lyester) and other polymer materials. The rubber ring 12 can be made of elastomer such as silicone or rubber. By the design of the rubber ring 12, it is similar to the flange of the grinding ring 11 to extend a flange. The slurry can be blocked from flying, and the dust in the air is prevented from falling to some extent. In addition, the cross section of the collision end 22 is circular and has a large area, and can be regarded as a cushioning material, which can further prevent the grinding ring u from being damaged. The technical content and technical features have been disclosed above, but those skilled in the art may still make various substitutions and modifications based on the teachings and disclosures of this creation. Therefore, the scope of protection of this creation should not be limited. The disclosures of the embodiments include various alternatives and modifications that do not depart from the present invention, and are covered by the following patent application. [Simple description of the drawings] M368516 Figures 1 and 2 show the creation of a real 3 is a top view of a wafer grinding positioning ring; FIG. 3 is a top view of a wafer grinding positioning ring according to an embodiment of the present invention; FIG. 4 is a sectional view taken along line 1-1 of FIG. 3; Figure 4 is an enlarged view of the A area. [Main component symbol description] 10 Wafer grinding positioning ring
11 研磨環 12 膠環 13 溝槽 20 水平延伸部 21 彎折部 22 擋端 30 凹槽11 Grinding ring 12 Rubber ring 13 Groove 20 Horizontal extension 21 Bending part 22 Stop end 30 Groove