M367367 五、新型說明： 【新型所屬之技術領域】 本新型涉及一種電子裝置，特別涉及一種風扇固定裝 置。 【先前技術】 隨著電子通訊產業的蓬勃發展，電子元件的運行速度 越來越快，高頻高速處理器不斷推出，但是高頻高速運行 使電子元件產生的熱量也隨之迅速增加，進一步使電子裝 置内部溫度越來越高。為了能夠及時、快速排出電子元件 所產生的熱量，通常使用風扇輔助散熱並加快電子裝置内 部的空氣流通。傳統的風扇透過螺絲直接固定於電子裝置 的殼體中。然而這種固定方式增加了風扇組裝和拆卸上的 不便。 【新型内容】 有鑒於此，需提供一種風扇組裝方便的電子裝置。 本新型一種電子裝置，包括殼體和風扇。殼體包括複 數側壁和複數卡扣部，該等卡扣部凸設於其中一側壁的内 表面。每一卡扣部包括卡鉤和緩衝部，該緩衝部具有彈性。 風扇安裝於該等卡扣部，其包括框架。框架包括複數安裝 孔，該等安裝孔分佈於該框架的四周並與該等卡扣部—— 對應。其中，組裝後，該等卡鉤分別扣住該等安裝孔的孔 緣，該等缓衝部位於風扇和該其中一側壁之間。 M367367 本新^•之風扇直接固定於該等十扣部上，在安裝和拆 卸k私中均不需要額外的操作工具’從而簡化了作業流 程’降低了成本。 【實施方式】 清參閱圖1和圖2,揭示了本新蜜的電子裝置1〇〇。電 子裒置包括殼體10和風扇30。在本實施方式中，電 〇〇 ~τ以為電腦、機頂盒、飼服器等，但不局限於 此。 双體ίο用於容納電子元件（未圖示），如電路板、中央 器等，其包括複數侧壁12和收容空間14。 =由該等側壁12圍成，用於容納該等電子元件。 知方切，殼體1G大料長方體。 ，體10還包括複數卡扣部ιδ和複數散熱孔1S，該等 扣。[5 16分只丨丨你1 φ _ ' 散熱孔 ’、—則楚12的闪表面凸出並位於該等 扇30的四周。該等散熱孔18園成的圖形的面積與風 施方該其中"~側壁12的投影的面積大致相等。在本實 中二、中’該等散熱孔18 ®成〆個圓。在其它實施方式 ，遠等散熱孔18圍成長方形或其它多邊形。 和，货等卡扣部16與殼體U -體成型，其包括卡鉤162 成^衝部164。在本實施方武中，言襄等卡扣部16透過射出 罜的方式與殼體12 —體戍型。卡鉤I62的末端設有倒鉤 166 °緩衝部164大致呈L型，其與卡鉤I62垂直相連。在 M367367 其它實施方式中，缓衝部164可以為C型，其與卡鉤162 彎曲相連。換而言之，每一緩衝部164呈彎折型，即每一 緩衝部164至少有一部分不與該其中一側壁12相連，從而 每一緩衝部164具有較好的彈性。 風扇30用於散發電子元件產生的熱量並增加電子裝 置100内部的空氣流通，其包括框架32。框架32用於將 風扇30固定於殼體10中，其設有出風口 34和複數安裝孔 36。出風口 34位於框架32的底部並與該等散熱孔18對 應。該等安裝孔36分佈於框架32的四周，並分別與該等 卡扣部16——對應。在本實施方式中，框架32大致為方 形，該等安裝孔36分佈於框架32的四個角落。 組裝時，該等卡鉤162分別穿過該等安裝孔36直到該 等倒鉤166分別鉤住該等安裝孔36的孔緣，如此，風扇 30便固定於該等卡扣部16。此時，該等緩衝部164位於該 風扇30和該其中一側壁12之間，即風扇30不與該其中一 側壁12直接接觸。拆卸時，只需將該等倒鉤166分別脫離 該等安裝孔36的孔緣，便可將風扇30從該等卡扣部16中 取出。換而言之，在風扇30的安裝和拆卸過程中，均不需 要額外的操作工具，從而簡化了作業流程，降低了成本。 因該等緩衝部164具有彈性，且風扇30不與該其中一 側壁12直接接觸，從而增力π 了風扇30與該其中一側壁12 之間的緩衝效果，減少了噪音產生的可能性。 M367367 本新型雖以較佳實施例揭露如上，然其並非用以限定 本新型。惟，任何熟悉此項技藝者，在不脫離本新型之精 神和範圍内，當可做稍許更動與潤飾，因此本新型之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1係本新'型之電子裝置之立體分解圖。 圖2係圖1之電子裝置之立體組裝圖。 【主要元件符號說明】 電子裝置 100 殼體 10 側壁 12 收容空間 14 卡扣部 16 卡鉤 162 缓衝部 164 倒鉤 166 散熱孔 18 風扇 30 框架 32 出風口 34 安裝孔 36M367367 V. New description: [New technical field] The present invention relates to an electronic device, and more particularly to a fan fixing device. [Prior Art] With the rapid development of the electronic communication industry, electronic components are running faster and faster, and high-frequency high-speed processors are being introduced. However, the high-frequency and high-speed operation causes the heat generated by electronic components to increase rapidly, further enabling The internal temperature of the electronic device is getting higher and higher. In order to be able to discharge the heat generated by the electronic components in a timely and rapid manner, a fan is usually used to assist in heat dissipation and to accelerate the air circulation inside the electronic device. The conventional fan is directly fixed to the housing of the electronic device through a screw. However, this fixing method increases the inconvenience of assembly and disassembly of the fan. [New content] In view of this, it is necessary to provide an electronic device with convenient fan assembly. The invention relates to an electronic device comprising a casing and a fan. The housing includes a plurality of side walls and a plurality of latching portions that protrude from the inner surface of one of the side walls. Each of the fastening portions includes a hook and a buffer portion, and the buffer portion has elasticity. A fan is mounted to the snap portions and includes a frame. The frame includes a plurality of mounting holes distributed around the frame and corresponding to the snap portions. Wherein, after assembly, the hooks respectively engage the hole edges of the mounting holes, and the buffer portions are located between the fan and one of the side walls. M367367 The fan of this new ^• is directly fixed to these ten buckles, and no additional operating tools are required in the installation and disassembly of the k-simplified operation process, which reduces the cost. [Embodiment] Referring to FIG. 1 and FIG. 2, the present electronic device is disclosed. The electronic device includes a housing 10 and a fan 30. In the present embodiment, the electric 〇〇 ~ τ is a computer, a set top box, a feeding machine, etc., but is not limited thereto. The dual body ίο is for accommodating electronic components (not shown) such as a circuit board, a center, etc., and includes a plurality of side walls 12 and a receiving space 14. = enclosed by the side walls 12 for accommodating the electronic components. Knowing that the shell is cut, the shell 1G is an elbow. The body 10 further includes a plurality of snap portions ιδ and a plurality of heat dissipation holes 1S, the buckles. [5 16 points only 1 1 φ _ ' 散热器 。 ', then the flash surface of the Chu 12 protrudes and is located around the fans 30. The area of the pattern formed by the heat dissipation holes 18 is substantially equal to the area of the projection of the side wall 12 of the wind. In the second, middle, the heat dissipation holes 18 are formed into a circle. In other embodiments, the remote vents 18 enclose a rectangle or other polygon. The buckle portion 16 and the housing U are integrally formed, and the hook portion 162 is formed into a punching portion 164. In the present embodiment, the buckle portion 16 such as the cymbal is inserted into the housing 12 so as to pass through the housing. The end of the hook I62 is provided with a barb. The buffer portion 164 is substantially L-shaped and is vertically connected to the hook I62. In other embodiments of M367367, the cushioning portion 164 may be of the C-shape that is curvedly coupled to the hook 162. In other words, each of the buffer portions 164 is of a bent type, that is, at least a portion of each of the buffer portions 164 is not connected to the one side wall 12, so that each of the buffer portions 164 has better elasticity. The fan 30 is for dissipating heat generated by the electronic components and increasing the air circulation inside the electronic device 100, which includes the frame 32. The frame 32 is for fixing the fan 30 in the housing 10, and is provided with an air outlet 34 and a plurality of mounting holes 36. The air outlets 34 are located at the bottom of the frame 32 and correspond to the heat dissipation holes 18. The mounting holes 36 are distributed around the frame 32 and correspond to the snap portions 16 respectively. In the present embodiment, the frame 32 is substantially square, and the mounting holes 36 are distributed at the four corners of the frame 32. When assembled, the hooks 162 pass through the mounting holes 36 until the barbs 166 respectively hook the edge of the mounting holes 36, so that the fan 30 is fixed to the latching portions 16. At this time, the buffer portions 164 are located between the fan 30 and one of the side walls 12, that is, the fan 30 is not in direct contact with the one of the side walls 12. When disassembling, the fan 30 can be removed from the hook portions 16 by simply removing the barbs 166 from the edge of the mounting holes 36. In other words, no additional operating tools are required during the installation and removal of the fan 30, which simplifies the operation and reduces the cost. Since the buffer portions 164 have elasticity, and the fan 30 does not directly contact the one of the side walls 12, the force is increased by π between the fan 30 and the one of the side walls 12, reducing the possibility of noise generation. M367367 The present invention is disclosed above in the preferred embodiment, but it is not intended to limit the present invention. However, any person skilled in the art will be able to make minor changes and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this new type is subject to the definition of the scope of the patent application. [Simple description of the diagram] Figure 1 is an exploded perspective view of the new electronic device. 2 is an assembled, isometric view of the electronic device of FIG. 1. [Description of main components] Electronic device 100 Housing 10 Side wall 12 Housing space 14 Buckle 16 Hook 162 Buffer 164 Barbs 166 Cooling holes 18 Fan 30 Frame 32 Air outlet 34 Mounting holes 36