M364211 —五、新型說明： - 【新型所屬之技術領域】 本創作有關於一種接觸式功能測試 要，過轉接板上的探針及導電布電性連接電路板，曰曰片^ 在量測過程中出現接觸不穩固或高頻損失。’以（免 【先前技術】 隨著電子產業的蓬勃發展久 片亦不斷推陆山# Γ 不同型式或功能的晶 不同的晶片盥相對庫之兩玖钇μΑΑ η又汁者必須將 曰w R 對應 板的電路進行連接，並進行 :==試，最後再由測試的結果進-步對新開發的 片進仃修正，以完成晶片的開發流程。 - 4:曰1，，為習用功能職裝置的剖面示意圖。 对m 測試的過程中，主要是透過功能測 進對曰片=二ΐ電路板21之間的連接，藉此以 拓古二ΐ 功能測試。功能測試裝置10主要包 15，=触11，錄轉接板11上設置有-晶片容置區 可將:曰=?的大小及形狀皆與晶片23相近，藉此 、曰日片23放置在晶片容置區15内部。 晶片容置㊄15内設置有複數個穿孔17，並於各個 因二内：放置伸縮探針13。其中穿孔17貫穿轉接板U， 縮探針13放置在穿孔Π内部時，伸縮探針13 ?弟—端點131將會露出在晶片容置區15内，而其第二 如2 133則會露出在轉接板u外部，如第2圖所示。 3 M364211 當晶片23放置在晶片容置區15内部時，晶片2 的接腳231將會與伸縮探針13的第一端點i3i接觸。而 功能測試裝置10放置在電路板21上時，露出在轉接 ㈣外部的伸縮探針13將會與電路板21上的電路接觸， 糟此晶片23將會透過伸縮探針13連接電路板21。 伸縮探針13内部設置有彈簧因而具有伸縮的特性， '例如伸縮探们3的第一端.點131及第二端點133在受到 •外力的作用後，將會縮回伸縮探針13㈣，反之在外力 ，，，後，第-端點131及第二端點} 33將會由伸縮探針卫3 二出。因此當晶片23放入晶片容置區15内，並將功能測 试裝置10放在電路板21後，伸縮探針13的第一端點 及第二端點13將分別與晶片23及電路板21上的電路 觸，藉此以完成晶片23與電路板21之間的電性連接， 可進一步對晶片2 3的功能進行測試。 '' 然而對每個伸縮探針13而言，會因為其内部彈簧的 淨力不同，而造成各個伸縮探針13的第—端點i3i >二端點133的彈力出現差異。換言之，各個伸縮探針η 的第一端點131及第二端點133與晶片23及電路板耵 接觸力將會有所不同，使得在量測的過程中伸縮探針 與晶片23及/或電路板21的接觸容易出現不穩固 墓 、定的情形，並對高頻訊號的測試效果造成影響。 思 【新型内容】 本創作之主要目的，在於提供—種接觸式功㈣_ 4 M364211 片相設置有複數個探針，探針的-端-曰 片相連接，另—透過導電布連接電 此將可避免探針與晶片及/或電路板 的=’藉 穩固的情形。 牡里馮日卞出現接觸不 置，之次要目的，在於提供—種接觸式功能測試裝 ，、中探針的一端為爪部，且探針透過爪部盥晶片上 =相連接，藉此將可以提高探針與晶片之接腳連接的穩 •本創作之又〆目的，在於提供一種接觸式功能測試裝 置，其中探針透過導電布電性連接電路板上的電路，由於 導電布具有可形變的特性，使得探針在量測時可穩定的連 接導電布，而有利於提高探針與電路板之間電性連接的稳 定性。 本創作之又〆目的，在於提供一種接觸式功能測試裝 置’其中轉接板上设置有至少一連接孔’電路板上則設置 有相對應的固定孔，並可以連接單元穿過連接孔連接電路 •板上的固定孔，藉此以完成接觸式功能測試裝置與電路板 <間的連接。 本創作之又/目的，在於提供一種接觸式功能測試裝 置，其中轉接板上設置有至少一定位單元，電路板上則設 薏有相對應的定仪孔，並有利於進行接觸式功能測試裝置 ‘與電路板之間的定位。 本創作之又/目的，在於提供一種接觸式功能測試裝 4，其中晶片容礬區用以容置晶片，且該晶片容置區的側 5 M364211 - 邊以傾斜的方式設置，藉此可將晶片引導至晶片容置區的 第二開口，並自然與晶片容置區内部的探針相連接。 本創作之又一目的，在於提供一種接觸式功能測試裝 置，其中探針以一體成型的方式設置且不具伸縮的特性， 在使用時各個探針會以相同的力道與晶片相連接，且在長 時間的使用後各個探針的衰退程度亦相同。 • 為達成上述目的，本創作提供一種接觸式功能測試裝 -置，主要包括有：一轉接板，包括有一第一表面及一第二 ❿表面；一晶片容置區，設置於轉接板的第一表面，並用以 容置一晶片；複數個穿孔，設置於轉接板的晶片容置區 内，並貫穿轉接板；複數個探針，分別設置於穿孔内；及 一導電布，設置於轉接板的第二表面，並電性連接探針。 【實施方式】 請參閱第3 A圖至第3 C圖，分別為本創作接觸式功 能測試裝置一較佳實施例之立體示意圖、剖面圖及部份構 鲁造剖面示意圖。如圖所示，接觸式功能測試裝置30包括 有一轉接板31，轉接板31包括有一第一表面311及一第 二表面313,其中第一表面311上設置有一晶片容置區 35，並於晶片容置區35内設置有複數個穿孔37，且穿孔 ' 37貫穿該轉接板31，如第3A圖及第3B圖所示。 * 各個穿孔37内設置有相對的探針33，其中各個探針 33包括有一爪部331及一頂部333,在設置時可將探針33 由轉接板31的第二表面313插入穿孔37，使得探針33的 6 M364211 - 爪部331存在於晶片容置區35内部。此外探針33之頂部 333的截面積略大於穿孔37的截面積，因此當探針33穿 過穿孔37時，探針33的頂部333將會外露在轉接板31 的第二表面313，並以完成探針33的設置，如第3 B圖及 第3 C圖所示。 轉接板31的第二表面313設置有一導電布39，並使 .得探針33的頂部333與導電布39接觸，一般而言導電布 .39内會分布有複數條導電線，例如金線，藉此與導電布 肇39接觸之探針33的頂部333將可以透過導電布39内的導 電線電性連接電路板41上的電路。 轉接板31上的晶片容置區35用以容置晶片43,在將 晶片4 3放入晶片容置區3 5後’晶片4 3上的接腳4 31將 會與探針33接觸，例如可以探針33的爪部331對晶片43 的接腳431進行固定，而有利於提高探針33與晶片43之 間連接的穩固。此外轉接板31之穿孔37及探針33的數 量與晶片43之接腳.431的數置相同’並依據晶片43之接 鲁腳431的數量進行調整。 晶片43在放入晶片容置區35後會傳遞一作用力給探 針33，並經由探針33將作用力傳送至導電布39。導電布 39在承受外力作用後會產生部分的形變，並使得探針33 •的頂部333些微的陷入導電布39内，藉此探針33將可與 -導電布39穩固的連接。藉由探針33及導電布39的使用， 將可有效的提高量測時晶片43與電路板41之間接觸的穩 固，同時可避免在量測過程中造成高頻訊號的損失。 7 幾測的過程中主要是將轉接板31 $第二表面313 ^路板41上，並使得導電布39與電路板41上的 t 略趣触 t從付守电邛⑽興電路板41上纪 且驽％挺轉接板31上可選擇設置有至少—連接孔32， 面313孔32由轉接板31的第一表面3Π延伸至第二表 定孔“Γ電祕41上則設置有至少一固定孔411，且固 此將π、的°又置位置相對應於連接孔32的設置位置，萨 4ΐι上以—連接單元34穿過連接孔32並固定在固定子〔 的連技’以完成接觸式魏賴裝置30與電路板41之間 為-螺孔例接早^ 34可為一螺絲，而固定孔411則 實於心將螺絲進行旋轉以固定在螺孔上。在本創作 個角：i要:四個連接孔32分別設置在轉接板31的四 角洛位置，並以四個連接單元34穿過這四個連接孔％。 此外’為了降低晶片43與晶片容置區35對位 亚使得晶片43得以順勢進入晶片容置區35内，曰片 邊355可以傾斜的方式設置，例如晶“ 包括有一第一開口 351及一第二開口 353,其中第 ,-開口 351位於連接板31 #第—表面3ιι上 一開口 351大於第二開口咖，藉此在將晶片43放入晶片弟 谷置ΐ 35時’晶片f將會順著晶片容置區35的側邊355 ，入苐二開π 353’藉此晶片43上的接聊431將可 與探針33的爪部331連接，如第3 B圖所示。 、 習用構造中主要是透過伸縮探針（13)本身所具有的 伸細特性，來完成伸縮探針⑽與晶片⑽及/或電路 (21)之間的緊密連接，但對每—個伸縮探針⑽來說，其 8 M364211 =具有，回復力的大小會因為内部彈簧的不同而有所差 、 、、二過長B守間的使用後，每一 的衰減情形亦會有所Μ、任 ㈣Π3力力 及高頻訊號的損失。$而各易造成量測時的不穩定 件，並㈣所述之探針33是—個結構單純的構 .田令成型的方式製作。在經過長時間的使 此二广叫針33的磨損或衰減的程度會十分接近，因 ·:==可以持續對晶片43的各個接腳⑽予 ’並可/二丨士接力道，而有利於提高量測時的穩定度， 並可減少1測時高頻訊號的損失。 請㈣第㈣，林創作朗式功_螺置又 她例之立體示意圖。請配合參 觸式功能測試裝置50包括有赫t3 Α圖及第3 Β圖，接 包括有—轉接板31，並於棘接拓Ή 的第二表面313上設置有—容膽轉接板31 Μ容置導電布39。容置空間55^=^亥容置空間 拖士夕，空^ ρ^又置有稷數個穿孔37， 參^之穿孔37將會由晶片容置區3 »55。在將探針33放入穿 申至合置工間 將會存在晶片容置區35内，而^針時针33的爪部331 在宠罟命μ π如 探針33的頂部333則會存 在谷置空間55内’並可與導電布39接觸。 各置空間55與導電布3q且女、匕 導電布39放入容置空間55 ^何:狀，在將 接板31的第二表面313 ^ =布39將會與轉 接觸式功能測試裝i50與電路板面，而有利於將 接觸式功能測試裝置50與電 。此外為了方便 板61之間對位步驟的進 9 M364211 13 伸縮探針 131 第一端點 .133 第二端點 15 晶片容置區 17 穿孔 21 電路板 23 晶片 231 接腳 30 接觸式功能測試裝置 31 轉接板 311 第一表面 313 第二表面 32 連接孔 33 探針 '331 爪部 333 頂部 •34 連接單元 35 晶片容置區 351 第一開口 353 第二開口 355 侧邊 37 穿孔 39 導電布 41 電路板 411 固定孔 43 晶片 431 接腳 50 接觸式功能測試裝置 55 容置空間 • 58 定位單元 61 電路板 613 定位孔 11M364211 — V. New description: - [New technical field] This creation is about a contact type functional test. The probe on the adapter board and the conductive cloth are connected to the circuit board. Unstable contact or high frequency loss during the process. 'With (previous technology) With the booming development of the electronics industry, the long-term film is also constantly pushing Lushan # Γ Different types or functions of crystals different wafers 盥 relative library of two 玖钇 μ 又 汁 必须 必须 必须 R R The circuit of the corresponding board is connected, and: == test, and finally the result of the test is further stepped on the newly developed film to complete the development process of the chip. - 4: 曰 1, for the function of the function Schematic diagram of the cross-section of the device. During the test of m, the connection between the cymbal=second cymbal board 21 is mainly through the function measurement, thereby taking the functional test of the topographical function. = Touch 11, the recording board 11 is provided with a wafer receiving area which can be similar in size and shape to the wafer 23, whereby the sheet 23 is placed inside the wafer housing area 15. A plurality of perforations 17 are disposed in the housing 5, and in each of the two factors: the telescopic probe 13 is placed. The perforation 17 penetrates the adapter plate U, and the constricted probe 13 is placed inside the perforated crucible, the telescopic probe 13 - the end point 131 will be exposed in the wafer receiving area 15, and its second 2 133 will be exposed outside the interposer u as shown in Fig. 2. 3 M364211 When the wafer 23 is placed inside the wafer housing area 15, the pin 231 of the wafer 2 will be the first with the telescopic probe 13. The end point i3i is in contact. When the functional test device 10 is placed on the circuit board 21, the telescopic probe 13 exposed outside the switch (4) will be in contact with the circuit on the circuit board 21, and the wafer 23 will pass through the telescopic probe. 13 is connected to the circuit board 21. The telescopic probe 13 is internally provided with a spring and thus has a telescopic characteristic, 'for example, the first end of the telescopic probe 3, the point 131 and the second end point 133 will be contracted after being subjected to an external force. Retracting the probe 13 (4), and vice versa, the external end, and then the first end point 131 and the second end point 33 will be output by the telescopic probe. Therefore, when the wafer 23 is placed in the wafer receiving area 15, After the functional test device 10 is placed on the circuit board 21, the first end point and the second end point 13 of the telescopic probe 13 will be respectively touched with the circuit on the wafer 23 and the circuit board 21, thereby completing the wafer 23 and The electrical connection between the boards 21 can further test the function of the wafer 23. '' However for each In the case of the contraction probe 13, the elastic force of the first end point i3i > the two end points 133 of the respective telescopic probes 13 may be different due to the difference in the net force of the internal springs. In other words, the respective telescopic probes η The contact force between the one end 131 and the second end 133 and the wafer 23 and the circuit board will be different, so that the contact between the telescopic probe and the wafer 23 and/or the circuit board 21 is likely to be unstable during the measurement. Tomb, fixed situation, and influence on the test effect of high-frequency signal. Thinking [new content] The main purpose of this creation is to provide a kind of contact work (4) _ 4 M364211 The film phase is provided with a plurality of probes, probes The end-battery is connected, and the other is connected through the conductive cloth. This will avoid the situation where the probe and the chip and/or the board are secured. The second purpose of the 里 冯 卞 卞 , , , , , , , , , , , , , , 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡 牡The invention can improve the stability of the connection between the probe and the chip. The present invention aims to provide a contact type functional test device in which the probe is electrically connected to the circuit board through the conductive cloth, and the conductive cloth has a deformable shape. The characteristics of the probe enable stable connection of the conductive cloth during measurement, and the stability of the electrical connection between the probe and the circuit board is improved. A further object of the present invention is to provide a contact type functional test device in which at least one connecting hole is disposed on an adapter plate. A corresponding fixing hole is disposed on the circuit board, and the connecting unit can be connected through the connecting hole to connect the circuit. • A fixing hole on the board to complete the connection between the contact function test device and the board. The purpose of the present invention is to provide a contact type functional test device, wherein at least one positioning unit is disposed on the adapter plate, and a corresponding calibration hole is disposed on the circuit board, and the contact function test is facilitated. Positioning between the device' and the board. The purpose of the present invention is to provide a contact type functional test device 4 in which a wafer accommodating area is used for accommodating a wafer, and a side 5 M364211 - side of the wafer accommodating area is disposed in an inclined manner, whereby The wafer is guided to the second opening of the wafer receiving area and is naturally connected to the probe inside the wafer receiving area. Another object of the present invention is to provide a contact type functional testing device in which the probes are integrally formed and have no telescopic characteristics, and in use, each probe is connected to the wafer with the same force, and is long. The degree of decline of each probe is also the same after the use of time. In order to achieve the above object, the present invention provides a contact type functional test device, which mainly comprises: an adapter plate including a first surface and a second surface; a wafer receiving area disposed on the adapter plate a first surface for receiving a wafer; a plurality of perforations disposed in the wafer receiving area of the interposer and extending through the interposer; a plurality of probes respectively disposed in the perforations; and a conductive cloth, The second surface of the adapter plate is disposed and electrically connected to the probe. [Embodiment] Please refer to FIGS. 3A to 3C, which are respectively a perspective view, a cross-sectional view and a partial cross-sectional schematic view of a preferred embodiment of the inventive contact type functional testing device. As shown in the figure, the contact function test device 30 includes an adapter plate 31. The adapter plate 31 includes a first surface 311 and a second surface 313. The first surface 311 is provided with a chip receiving area 35, and A plurality of through holes 37 are provided in the wafer receiving area 35, and the through holes '37 are penetrated through the adapter plate 31 as shown in FIGS. 3A and 3B. * Each of the perforations 37 is provided with an opposite probe 33, wherein each of the probes 33 includes a claw portion 331 and a top portion 333, and the probe 33 can be inserted into the through hole 37 from the second surface 313 of the adapter plate 31 when disposed. The 6 M364211 - claw portion 331 of the probe 33 is caused to exist inside the wafer housing portion 35. In addition, the cross-sectional area of the top 333 of the probe 33 is slightly larger than the cross-sectional area of the through hole 37, so when the probe 33 passes through the through hole 37, the top 333 of the probe 33 will be exposed on the second surface 313 of the adapter plate 31, and To complete the setting of the probe 33, as shown in Figures 3B and 3C. The second surface 313 of the adapter plate 31 is provided with a conductive cloth 39, and the top 333 of the probe 33 is brought into contact with the conductive cloth 39. Generally, a plurality of conductive lines, such as gold wires, are distributed in the conductive cloth. Thereby, the top 333 of the probe 33 which is in contact with the conductive cloth 39 will be electrically connected to the circuit on the circuit board 41 through the conductive wires in the conductive cloth 39. The wafer receiving area 35 on the adapter plate 31 is for accommodating the wafer 43. After the wafer 43 is placed in the wafer receiving area 35, the pins 4 31 on the wafer 4 3 will be in contact with the probe 33. For example, the claw 331 of the probe 33 can fix the pin 431 of the wafer 43 to improve the stability of the connection between the probe 33 and the wafer 43. Further, the number of the through holes 37 and the probes 33 of the interposer 31 is the same as the number of the pins 431 of the wafer 43' and is adjusted in accordance with the number of the legs 431 of the wafer 43. The wafer 43 transmits a force to the probe 33 after being placed in the wafer receiving area 35, and transmits the force to the conductive cloth 39 via the probe 33. The conductive cloth 39 undergoes partial deformation after being subjected to an external force, and causes the top 333 of the probe 33 to be slightly trapped in the conductive cloth 39, whereby the probe 33 will be firmly connected to the conductive cloth 39. By using the probe 33 and the conductive cloth 39, the contact between the wafer 43 and the circuit board 41 during measurement can be effectively improved, and the loss of high frequency signals during the measurement process can be avoided. 7 In the course of several measurements, the adapter plate 31 is mainly disposed on the second surface 313 of the circuit board 41, and the conductive cloth 39 and the t on the circuit board 41 are slightly touched from the power supply (10) circuit board 41. The upper plate and the top plate 31 may optionally be provided with at least a connecting hole 32, and the surface 313 hole 32 extends from the first surface 3 of the adapter plate 31 to the second metering hole. There is at least one fixing hole 411, and the position of π is correspondingly set to the position of the connecting hole 32, and the connection unit 34 passes through the connecting hole 32 and is fixed to the fixing body. 'To complete the contact between the Wei Lai device 30 and the circuit board 41 - the screw hole is connected to the early ^ 34 can be a screw, and the fixing hole 411 is used to rotate the screw to fix the screw hole. Create a corner: i wants: four connection holes 32 are respectively disposed at the four corners of the adapter plate 31, and pass through the four connection holes by four connection units 34. In addition, in order to reduce the wafer 43 and the wafer. The region 35 is aligned to allow the wafer 43 to enter the wafer receiving region 35, and the edge 355 can be tilted, for example The first opening 351 and the second opening 353 are included, wherein the first opening 351 is located on the connecting plate 31 #第surface 3, and an opening 351 is larger than the second opening coffee, thereby placing the wafer 43 into the wafer valley When placed at 35 o'clock, the wafer f will follow the side 355 of the wafer receiving area 35, and the opening π 353' will be connected to the claw 331 of the probe 33, such as the 331 of the probe 33. Figure 3B shows. In the conventional structure, the tight connection between the telescopic probe (10) and the wafer (10) and/or the circuit (21) is mainly achieved through the stretch characteristic of the telescopic probe (13) itself, but for each telescopic probe For the needle (10), its 8 M364211 = has, the magnitude of the restoring force will be different due to the difference of the internal spring, and the use of the second over-length B defensive will also be awkward. (4) Loss of 3 force and high frequency signal. Each of them is easy to cause unstable parts during measurement, and (4) the probe 33 is a structurally simple structure. After a long period of time, the degree of wear or attenuation of the second wide needle 33 will be very close, because ·: == can continue to the respective pins (10) of the wafer 43 to 'can and two gentleman relays, and favorable It can improve the stability during measurement and reduce the loss of high frequency signal during 1 measurement. Please (4) (4), Lin's creation of the Lang style work _ screw and her example of the three-dimensional diagram. Please cooperate with the touch function test device 50 to include a tt3 及 diagram and a third , diagram, and include an adapter plate 31, and a second adapter plate on the second surface 313 of the spine extension. 31 Place the conductive cloth 39.容 容 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 55 The placement of the probe 33 into the splicing station will be present in the wafer receiving area 35, and the claw portion 331 of the needle hour hand 33 will exist at the top 333 of the probe 33, such as the top 333 of the probe 33. The valley space 55 is 'in contact with the conductive cloth 39. Each of the spaces 55 and the conductive cloth 3q and the female and 匕 conductive cloth 39 are placed in the accommodating space 55^:, in the second surface 313 of the connecting plate 31, the cloth 39 will be connected with the rotary contact function test device i50. With the circuit board surface, it is advantageous to electrically connect the contact type functional test device 50. In addition, in order to facilitate the alignment step between the boards 61, M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M 31 Adapter plate 311 First surface 313 Second surface 32 Connection hole 33 Probe '331 Claw 333 Top • 34 Connection unit 35 Wafer accommodating area 351 First opening 353 Second opening 355 Side 37 Perforation 39 Conductive cloth 41 Circuit board 411 fixing hole 43 wafer 431 pin 50 contact type functional test device 55 accommodating space • 58 positioning unit 61 circuit board 613 positioning hole 11