M362434 五、新型說明： 【新型所屬之技術領域】 本新型係有關於-種影賴取裝置的元件，尤指—種影像感 模組。 心“ 【先前技術】 參照圖1 ’為習知-種影像感測模組的剖視圖。該影像感測模 組包括-電路板10、與電路板10電連接的一影像感測晶片％、、 一承座28，以及設置在承座28上的一平板玻璃3〇。 該承座28呈底部開口的蓋狀，其頂面上開設有一窗口 29，平 板玻璃30設置在該窗口 29内。承座28的側壁底面如—膠合劑 26勒接在電路板10上’從而在電路板1〇躲座28之間形成封^ 的内部空間’使得影像感測晶片2〇位於其中，達到密封防塵的目 t光線通過對躺光學祕後，透過平板_ 3㈣達影像感測 阳片20。 這種影像感測模組的缺陷在於：在承座28與電路板ι〇之 膠後需要進行烘烤’歸合劑26凝固。在洪烤的過程中，膠^ 6會釋放出大量的揮發性氣體’使得電路板1〇與承座u之^ 閉的内部空f·受熱和膨脹效應而產生_，造成已經精準靠 =暫時固定的承座28會偏離預定的位置，因而無法達到對應的光 子糸統與影像感測晶片2〇的中心精準對位元的目的。、 有鑒於此，已有影像感測模組做出了改進。參照圖2 二種經改進後的影像感測模組的剖視圖。該影像感測模电包括一 :路板40、一影像感測晶片42、一_ 48 ’以及—平板破 與圖1類似之處不再贅述。 璃 在承座48的頂面上預先設置有一排氣孔65。在承座招與電 M362434 路板40之間點膠’並對膠合劑46進行烘烤時，膠合劑46散發到 内部空間的氣體可通過排氣孔65排到外界，而不會產生内壓，可 達到精準對位元的目的。在膠合劑46乾燥後，可採用υγ膠或者 其他密封㈣將職孔65 _，避免灰塵從排氣孔&進入。 讀影像感·_可改善定位精度，但是排氣孔&位於承 座48的頂面，會影響到影像感測模組的外觀。將承座48與電路 板4〇連接後’必須增加後續的工作程序將排氣孔65封住，增加 了、、且衣的獅程度。並且，該排氣孔65為直孔，在承座仙與電 _路板4〇連接後、排氣孔65被封閉之前，灰塵很容易因重力飄落 =象f權_部’對拍攝的影像造成影響。因此這種影像感 測板組對組裝無塵㈣要求很高，增加了生產成本。 【新型内容】 作茲之創作目的在於針對現有技術中影像感測模組組裝工 稷雜、在組裝中灰塵易因重力而進人的缺陷，提供一 影像感序，瞻舰繼力輯人的機率之 >片，ΐϋίίίΪ敗组在構造上包括一電路板；—影像感測晶 詨側電路板上，以及一承座，具有一頂板及複數個侧板， ^路2 = Γ由膠合劑黏結於該電路板上，從而在該承座與該 ί ίΐΓ 内腔；另外，在該側板關設置有—承座平面 t該承座平面部與該電路板之_成與該内腔相連通的 一 第二狹路ί上則形成一第二狹缝’該第二狭縫的一端與該 弟狹縫連通，另一端則與外界相通。 設置具有以下有益效果：將排氣結構 &厘，、電路板之間，使内腔的氣體可順利排到外界。由於 構設置的位置比較隱蔽’不會對外觀造成影響，在組裝過 王可減少灰塵因重力飄落到内部的機率。第一狹縫及第二狹 4 M362434 缝的尺寸都非常狹窄，在點膠後，可根據需要，選擇是否將第二 狹缝封閉’因此在部分場合可減少組裝工作程序。 【實施方式】 如圖3和圖4所示，在本新型的第一實施例中，一影像感測模 組100包括-電路板101、連接於電路板101上的一影像感測晶片 102 承座’以及設置在承座103上的一平板玻璃丨〇4。其 中，影像感測晶片102可以是例如電荷耦合器件（Chargec〇upled DeVlce ’簡稱CCD)或者互補金屬氧化物半導體 _ Metal Oxide Semiconductor，簡稱 CMOS)。該平板玻璃丨〇4 可以 是例如，紅外線濾光片。 承座103呈底部開口的蓋狀，具有一頂板職及四侧板 103b，並扣置於電路板ιοί上。在承座的頂板上設置有 一窗口 103c，該窗口 l〇3c呈台階形，並帶有一台階面1〇3d。平 板玻璃1〇4的底面承靠於台階面103(1上，藉此定位，並藉由點膠 固定。光線通過對應影像擷取設備的光學系統後，透過平板玻璃 104而到達影像感測晶片1〇2。 籲 參照圖5,在兩個侧板l〇3b的相鄰處設置有一承座平面部 1〇8，其數量可以是如圖所示的兩個，位於承座1〇3相對的兩個角 上，也可以疋二個或者四個。該承座平面部1⑽位於倒板1的b的 内側，第一端從頂板103a延伸，第二端與侧板1〇3b的底面平齊， 或者南度稍低於側板103b的底面。在如圖所示的實施例中，承座 平面部108大致呈四分之一的圓柱形，兩侧與相鄰的側板連 接。在承座平面部108的第二端上設置有一定位柱1〇5，該定位柱 105的延伸方向垂直於承座1〇3的頂板i〇3a。 回到圖4，在電路板101上設置有一孔1〇6，定位柱1〇5可與 對應的孔106配合，使承座103相對於電路板101定位，從而在 M362434 承座103與電路板101之間形成—内腔ι〇7，影像感測晶片 即位於該内腔1〇7中。 ' 組I時’在侧板嶋的底面點朦，並加熱使-膠合劑111凝 .固，從而使承座103與電路板101連接固定。由於侧板咖 面與電路板ωι之間有膠合劑m，承座平面部舰與電路板肋 之間瓜成-第-狹縫109 ’該第—狹縫1〇9沿水平方向並與内腔 1〇7相通:並且’定位柱1〇5靠近影像感測晶片撤的—側與孔 106之間形成一第二狹縫11〇,而遠離影像感測晶片搬的一側與 •孔106緊密配合。該第二狹缝110可以沿垂直方向，-端與第2 109相通’另一端與外界相通。這可藉由設置孔咖的結構 來實現。參照圖3，孔106靠近影像感測晶片搬的一側截面為擴 ^的-部分’而遠離影像感測晶片搬的一纖面為圓的一部分。 =位柱105與之配合後，會在靠近影像感測晶# 1〇2 _一側形成 =二狹缝no。為了讓灰塵不易進入，承座平面部1〇8的第二端可 设，成請形，越靠近峨，越狹窄；同理，孔1Q6靠近影像感 貝J曰曰片102的一侧可以是尺寸不同的台階形，越靠近外界，二 • 狹缝110越寬。 一 九也可採用其他的方式形成第一狹缝109及第二狹縫11〇。例 如，承座平面部1〇8的高度可稍高於倒板1〇3b的底面：黏接後貼 置於電路板101，但在其上設置與内腔1〇7相通的水平狹槽（圖未 不）。同理，孔106可為圓孔，定位柱105與之緊密配合，但定位 柱105上5又置有垂直狹槽（圖未示），該垂直狹槽一端與第一狹缝 109相通，另一端與外界相通，以便内腔1〇7内的氣體順利排出。 為了讓灰塵不易進入，水平狹槽可設置為台階形，越靠近内腔， 越狹乍，垂直狹槽也可設置成台階形，越靠近外界越寬。 第一狹缝109與第二狹缝110可使得内腔1〇7内的氣體排出， 6 M362434 並且，由於這種彎折的結構，灰塵不易進入。 在點膠過程中，可藉由控制膠合劑m的用量，來避免過多的 .膠合劑ill流到第一狹缝109處，造成堵塞。參關5，也可在承 座平面部108與側板職的底爾目鄰接處，設置一麟阻播槽 112。膠合劑111過多時，溢出的膠合劑會流到溢膠阻擔槽中， 而不會流到第-狹缝1〇9處。在膠合劑lu乾燥後’可根據不同 的要求，選擇採用密封膠將孔1〇6封閉。 如圖6所示，在本新型的第二實施例中，—影像感測模組2〇〇 Φ 包括一電路板20卜連接於電路板201上的-影像感測晶片搬、 -承座203 ’以及設置在承座2〇3上的一平板玻璃2〇4。與第一實 施例類似之處不再贅述。 ' 在該實施例中，在兩個側板2〇3b的相鄰處，也設置有一承座 平面部208。該承座平面部208位於側板2〇3b的内側，第一端從 頂板203a延伸’第二端與侧板2〇3b的底面平齊，或者高度稍低 於側板203b的底面。在如圖所示的實施例中，承座平面部2〇8大 致呈四分之一的圓柱形，兩侧與相鄰的側板2〇3b連接，第一實施 0 例令的定位柱105被省略。 在電路板201的對應位置上設置有一細孔2〇6。該細孔2〇6可 以是電路板201 的電'鍍穿孔，其内表面錢銅。當在承座2〇3的 側板203b的底面點膠，使承座2〇3相對於電路板2〇1定位並在兩 者之間形成一内腔207時’細孔206正對承座平面部208。 組裝時’在側板203b的底面點膠，並加熱使一膠合劑211凝 固，從而使承座203與電路板2〇1連接固定。由於側板2〇3b的底 面與電路板201之間有踢合劑211，承座平面部208與電路板201 之間形成一第一狭缝209，該第一狹縫209沿水平方向並與内腔 207相通。細孔206形成一第二狹縫，該第二狹縫可以沿垂直方 M362434 • 向，―糕與第一狭縫209相通，另一端與外界相通。在如圖所示 ‘的實施例中，細孔206是狭窄的直孔。 為了讓灰塵不易進入，承座平面部208的第二端可設置成台階 形’越靠近内腔，越狹窄；同理，細孔206也可以由尺寸不同的 幾段組成，越靠近内腔207，越狹窄，越靠近外界，越寬闊。 與第一實施例類似，也可採用其他的方式形成第一狹縫2〇9。 例如，承座平面部208的南度可稍高於側板2〇3b的底面，黏接後 貼置於電路板201 ’但在其上設置與内腔2〇7相通的水平狭槽（圖 • 未，）。細孔206與該狹槽連通。為了讓灰塵不易進入，水平狹槽 可設置為台階形，越靠近内腔，越狹窄。 第-狹缝209與第二狹缝可使得内腔2〇7 _氣體排出，並 且，由於這種彎折的結構，灰塵不易進入。 在點膠過程中’可通過控制膠合劑211的用量，來避免過多的 膠合劑211流到第-狹縫2〇9處，造成堵塞。參照圖7，也可在承 座平面部與側板施的底面相鄰接處，設置—溢膠阻撞槽 2膠5知彳211過多日$ ’溢出的膠合劑會流到溢膠阻擋槽si〗中， 鲁*不會流到第-狹縫2〇9處。在膠合劑Mj乾燥後，可根據不同 的要求，選擇採用密封膠將細孔2〇6封閉。 本貫周新型的影像感墙棘排氣結構設置在承座盘心七 _ ^間，仙腔的氣體可順利制外界，保證承座與電路板 疋位精度。由於排氣結構設置的位置比較隱蔽，不 二狹Γ尺寸都非常狹窄，在點膠後，可根據需要， 選擇疋否㈣二狹縫测，因此在部分場合可減少組紅作程序。 惟以上該者々’僅為本新型之較佳實施例而已，當不能以此限定 4型實施之細，即大驗本糊申請專職新型說明内 M362434 :所作之簡單鱗效變化與修飾，皆仍屬本新型專利涵蓋之範圍 【圖式簡單說明】 - 圖1是習知影像感測模組的剖視圖； 圖2是習知經改進後的影像感測模組的剖視圖； 圖3是本新型第一實施例影像感測模組的分解示意圖； 圖4疋本新型第一實施例影像感測模組的剖視圖； 圖5是本新型第一實施例影像感測模組中承座的結構示意 • 圖; 圖6是本新型第二實施例影像感測模組的剖視圖； 圖7是本新型第二實施例影像感測模I且中承座的結構示意 圖。 【主要元件符號說明】 107、 207 内腔 108、 208承座平面部 109、 209 第一狹縫 110 第二狹缝 111、 211 膠合劑 112、 212溢膠阻擔塊 206 細孔 100'200影像感測模組 101 ' 201電路板 102、202影像感測晶片 鲁 103、203 承座 103a、203a 頂板 103b、203b 侧板 103c 窗口 103d台階面 104、204平板玻璃 105 定位柱 106 孔M362434 V. New description: [New technical field] This new type is related to the components of the film-receiving device, especially the image sensing module. [Prior Art] Referring to Figure 1 is a cross-sectional view of a conventional image sensing module. The image sensing module includes a circuit board 10, an image sensing chip that is electrically connected to the circuit board 10, and A socket 28, and a flat glass 3〇 disposed on the socket 28. The socket 28 has a lid shape with a bottom opening, and a window 29 is formed on the top surface thereof, and the flat glass 30 is disposed in the window 29. The bottom surface of the side wall of the seat 28, such as the glue 26, is attached to the circuit board 10 to form an internal space between the circuit board 1 and the occlusion seat 28, so that the image sensing chip 2 is located therein to achieve a sealed dustproof After the optical light is passed through the lie, the image is sensed through the flat plate _ 3 (four). The defect of the image sensing module is that it needs to be baked after the socket 28 and the circuit board are glued. The hydrating agent 26 is solidified. During the process of flooding, the glue 6 will release a large amount of volatile gas, which causes the internal vacancies of the circuit board 1 and the socket u to be heated and expanded. The seat 28 that has been accurately fixed = temporarily fixed will deviate from the predetermined position, because However, the purpose of the corresponding center of the photonic system and the image sensing chip 2 can not be achieved. In view of this, the existing image sensing module has been improved. Referring to Figure 2, two improved A cross-sectional view of the image sensing module. The image sensing module includes: a road board 40, an image sensing chip 42, a _48', and a flat plate broken similar to that of Fig. 1. The glass is in the bearing. A vent hole 65 is preliminarily provided on the top surface of the 48. When the seat is coated with the electric M362434 road plate 40, and the adhesive 46 is baked, the gas which the adhesive agent 46 emits into the internal space can pass through the row. The air hole 65 is discharged to the outside without generating internal pressure, so as to achieve the purpose of precise alignment. After the glue 46 is dried, the 孔γ glue or other seal (4) can be used to remove the hole 65 _ to avoid dust from the vent hole. & Enter. Reading image sense _ can improve the positioning accuracy, but the venting hole & located on the top surface of the socket 48, will affect the appearance of the image sensing module. After the socket 48 is connected to the circuit board 4 'The follow-up work procedure must be added to seal the vent 65, which increases, The degree of the lion of the garment. Moreover, the vent hole 65 is a straight hole, and the dust is easily dropped by gravity after the socket is connected to the electric slab 4 、 and the vent hole 65 is closed. 'The image is affected. Therefore, the image sensing board set has high requirements for assembly dust-free (4), which increases the production cost. [New content] The purpose of the creation is to assemble the image sensing module in the prior art. The work is complicated, the dust is easy to enter due to gravity in the assembly, and provides an image sense. The probability of the ship's succession is </ br>, and the 组 ί ί Ϊ 在 在 在 在 在 在 在 ; ; ; ; ; — — — — — — — — The measuring chip side circuit board, and a socket having a top plate and a plurality of side plates, ^ 2 = Γ glued to the circuit board by the glue, thereby in the socket and the ΐΓ ΐΓ lumen; a second slit is formed on the side plate, and the second flat portion is formed on the second narrow path ί of the circuit board and the inner cavity. One end of the slit communicates with the slit of the younger brother, and the other end communicates with the outside. The setting has the following beneficial effects: the exhaust structure & PCT, between the boards, so that the gas in the inner chamber can be smoothly discharged to the outside. Since the position of the structure is relatively concealed, it does not affect the appearance, and the assembly can reduce the chance of dust falling into the interior due to gravity. The first slit and the second slit 4 M362434 are very narrow in size. After dispensing, the second slit can be closed as needed. Therefore, the assembly work procedure can be reduced in some cases. [Embodiment] As shown in FIG. 3 and FIG. 4, in the first embodiment of the present invention, an image sensing module 100 includes a circuit board 101 and an image sensing chip 102 connected to the circuit board 101. a seat 'and a flat glass crucible 4 disposed on the socket 103. The image sensing wafer 102 may be, for example, a charge coupled device (CCD) or a complementary metal oxide semiconductor (Metal Oxide Semiconductor, CMOS for short). The flat glass crucible 4 may be, for example, an infrared filter. The socket 103 has a lid shape with a bottom opening, a top plate member and four side plates 103b, and is fastened to the circuit board ιοί. A window 103c is provided on the top plate of the socket, and the window l3c is stepped and has a stepped surface 1〇3d. The bottom surface of the flat glass 1〇4 bears against the step surface 103 (1), thereby being positioned and fixed by dispensing. The light passes through the optical system corresponding to the image capturing device, and then passes through the flat glass 104 to reach the image sensing wafer. 1 〇 2. Referring to Figure 5, a seating plane portion 1 〇 8 is provided adjacent to the two side panels 10 〇 3b, the number of which may be two as shown, located at the socket 1 〇 3 The two corners may also be two or four. The socket flat portion 1 (10) is located inside the b of the inverted plate 1, the first end extends from the top plate 103a, and the second end is flat with the bottom surface of the side plate 1〇3b. Qi, or slightly lower than the bottom surface of the side panel 103b. In the embodiment shown, the socket flat portion 108 is substantially a quarter of a cylindrical shape, and the sides are connected to the adjacent side panels. A positioning post 1〇5 is disposed on the second end of the flat portion 108, and the positioning post 105 extends perpendicularly to the top plate i〇3a of the socket 1〇3. Referring back to FIG. 4, a hole 1 is disposed on the circuit board 101. 〇6, the positioning post 1〇5 can cooperate with the corresponding hole 106 to position the socket 103 relative to the circuit board 101, thereby bearing the M362434 A cavity 103 is formed between the socket 103 and the circuit board 101, and the image sensing wafer is located in the inner cavity 1〇7. When the group I is at the bottom surface of the side plate, it is heated and the glue is glued. 111 condensing and solidifying, so that the socket 103 is fixedly connected to the circuit board 101. Since there is a glue m between the side panel coffee surface and the circuit board ωι, the socket plane portion and the circuit board rib are formed together - the first narrow Slot 109' the first slit 1 〇 9 is in the horizontal direction and communicates with the inner cavity 1 〇 7: and the 'positioning post 1 〇 5 close to the image sensing wafer is removed - a second slit is formed between the side and the hole 106 11〇, while the side away from the image sensing wafer is closely matched with the hole 106. The second slit 110 can be in the vertical direction, the end is in communication with the 2nd 109, and the other end is in communication with the outside. This can be set by The structure of the hole coffee is realized. Referring to FIG. 3, a section of the hole 106 close to the image sensing wafer is a portion of the expanded portion and a fiber surface moved away from the image sensing wafer is a part of a circle. When it is matched with it, it will form = two slits no on the side close to the image sensing crystal #1〇2 _. In order to make dust difficult to enter, the seat flat portion 1 The second end of the 8 can be set to be shaped, the closer it is to the cymbal, the narrower it is. Similarly, the side of the hole 1Q6 close to the image sensation J 曰曰 102 can be a stepped shape of different sizes, the closer to the outside, the second The wider the slit 110. The first slit 109 and the second slit 11〇 may be formed in other manners. For example, the height of the socket flat portion 1〇8 may be slightly higher than the bottom surface of the inverted plate 1〇3b. After being bonded, it is placed on the circuit board 101, but a horizontal slot communicating with the inner cavity 1〇7 is disposed thereon. (In the same way, the hole 106 may be a circular hole, and the positioning post 105 is closely matched thereto. However, the positioning post 105 is further provided with a vertical slot (not shown), and one end of the vertical slot communicates with the first slit 109, and the other end communicates with the outside, so that the gas in the inner cavity 1〇7 is smoothly discharged. In order to make dust difficult to enter, the horizontal slot can be set to a step shape, the closer to the inner cavity, the narrower the vertical slot, the vertical slot can also be set to a step shape, the wider the closer to the outside. The first slit 109 and the second slit 110 allow the gas in the inner chamber 1〇7 to be discharged, 6 M362434 and, due to such a bent structure, dust is not easily entered. In the dispensing process, excessive glue ill can be prevented from flowing to the first slit 109 by controlling the amount of the binder m to cause clogging. In the reference 5, a lining slot 112 may be disposed adjacent to the base of the seat plane 108 and the side of the side panel. When the amount of the adhesive 111 is excessive, the overflowing adhesive flows into the overflow resisting groove without flowing to the first slit 1〇9. After the glue lu is dried, the pores 1〇6 can be closed by a sealant according to different requirements. As shown in FIG. 6, in the second embodiment of the present invention, the image sensing module 2〇〇Φ includes a circuit board 20 connected to the circuit board 201, and the image sensing wafer is moved. 'And a flat glass 2〇4 placed on the base 2〇3. Similarities to the first embodiment will not be described again. In this embodiment, a seat flat portion 208 is also provided adjacent to the two side plates 2〇3b. The socket flat portion 208 is located inside the side plate 2〇3b, and the first end extends from the top plate 203a. The second end is flush with the bottom surface of the side plate 2〇3b, or the height is slightly lower than the bottom surface of the side plate 203b. In the embodiment shown in the figure, the seat flat portion 2〇8 is substantially in a quarter cylindrical shape, and the two sides are connected to the adjacent side plates 2〇3b, and the positioning post 105 of the first embodiment is replaced by Omitted. A fine hole 2〇6 is provided at a corresponding position of the circuit board 201. The pinhole 2〇6 may be an electrical 'plated perforation of the circuit board 201, and the inner surface thereof is copper. When the bottom surface of the side plate 203b of the socket 2〇3 is dispensed, the socket 2〇3 is positioned relative to the circuit board 2〇1 and a cavity 207 is formed therebetween, the thin hole 206 faces the bearing plane. Part 208. At the time of assembly, the bottom surface of the side plate 203b is dispensed, and heating causes a glue 211 to be solidified, thereby fixing the holder 203 to the circuit board 2〇1. Since there is a kicking agent 211 between the bottom surface of the side plate 2〇3b and the circuit board 201, a first slit 209 is formed between the socket flat portion 208 and the circuit board 201, and the first slit 209 is horizontally aligned with the inner cavity. 207 communicates. The pores 206 form a second slit which can be along the vertical side M362434, the cake is in communication with the first slit 209, and the other end is in communication with the outside. In the embodiment as shown in the figure, the fine hole 206 is a narrow straight hole. In order to prevent dust from entering, the second end of the seat flat portion 208 can be arranged in a stepped shape as the closer to the inner cavity, the narrower; similarly, the fine holes 206 can also be composed of several segments of different sizes, and the closer to the inner cavity 207 The narrower it is, the closer it is to the outside world, the wider it is. Similar to the first embodiment, the first slits 2〇9 may be formed in other manners. For example, the south of the seat flat portion 208 may be slightly higher than the bottom surface of the side plate 2〇3b, and then adhered to the circuit board 201' but with a horizontal slot communicating with the inner cavity 2〇7 (Fig. not,). The pore 206 is in communication with the slot. In order to prevent dust from entering, the horizontal slot can be set to a step shape, and the closer it is to the inner cavity, the narrower it is. The first slit 209 and the second slit allow the inner chamber 2〇7 to be exhausted, and due to such a bent structure, dust is not easily entered. By controlling the amount of the binder 211 during the dispensing process, excessive glue 211 is prevented from flowing to the first slit 2〇9, causing clogging. Referring to FIG. 7 , it is also possible to arrange the overflowing groove 2 glue on the plane of the bearing plane and the bottom surface of the side plate, and the adhesive will flow to the glue blocking groove si. In the 〗, Lu * will not flow to the second slit 2〇9. After the glue Mj is dried, the pores 2〇6 can be closed by using a sealant according to different requirements. The new image-sensing wall spine exhaust structure of this week is set in the seat core seven _ ^, the gas of the fairy cavity can be smoothly made outside, ensuring the accuracy of the socket and the circuit board. Since the position of the exhaust structure is relatively concealed, the narrow and narrow dimensions are very narrow. After dispensing, the 狭缝N (4) and two slits can be selected according to the need, so the red grouping procedure can be reduced in some occasions. However, the above is only a preferred embodiment of the present invention. When it is not possible to limit the implementation of the type 4, that is, the application of the full-scale new description of the M362434: simple scale effect changes and modifications, The present invention is still in the scope of the present invention. [FIG. 1 is a cross-sectional view of a conventional image sensing module; FIG. 2 is a cross-sectional view of a conventional image sensing module; FIG. FIG. 4 is a cross-sectional view of the image sensing module of the first embodiment of the present invention; FIG. 5 is a schematic structural view of the socket of the image sensing module of the first embodiment of the present invention; Figure 6 is a cross-sectional view of the image sensing module of the second embodiment of the present invention; Figure 7 is a schematic view showing the structure of the image sensing module I and the center socket of the second embodiment of the present invention. [Main component symbol description] 107, 207 inner cavity 108, 208 bearing flat portion 109, 209 first slit 110 second slit 111, 211 adhesive 112, 212 overflow resist block 206 fine hole 100'200 image Sensing module 101' 201 circuit board 102, 202 image sensing wafer 103, 203 socket 103a, 203a top plate 103b, 203b side plate 103c window 103d step surface 104, 204 flat glass 105 positioning post 106 hole