M360445 五、新型說明： 【新型所屬之技術領域】 本創作涉及-縣麵結構，尤指—種可供純級封裝產 品置入之承載盤結構。 【先前技術】 -般生活週遭所接_電子產品，其⑽騎使關大量 的半導體，而「晶圓」也就是該半導體的重要材料。由晶圓廠 將已完成加工製作成的〗c晶圓，送至轉體封裝測試廠，完 成測試、切割和封裝’而成為—顆顆的半導體，並提供予3 c 或電子廠等客戶使用於製造各式電子產品。 請參閱第一圖所示，而1C晶圓在完成測試、切割和封裝 的同時’必敏關承載盤i 0，該承魅i 〇上設有複數個 框座1 0 1 ’而每-框座i 〇丄内可置入一顆[c晶圓，框座 101周邊設有數個定位用的凸柱10 2。而該種承載盤i 〇 由於每★匡座1 〇 1都是各自獨立成型於承載盤1 〇上，在承 載盤10射出成型的過程容易造成不I率的提昇，仙在於該 框座1〇1周邊較精細的凸柱4〇2的不易成型。此外，工c 晶圓在置人該框座1 Q 1時，容易關邊間隔設置之凸柱jL 〇 2造成IC晶圓取放時卡角或產生傾放的不良情形。再者，早 ^ 圓在切割之^ ’為了防塵、防刮，其表面會S黏上—層保 4膠膜，並將晶圓切割成無數個小片體後置人承载盤1〇 ,送 到半導體封衰測試廢，為了透光性而必須將I C晶圓上的保護 .M360445 — 膠膜撕離，由於該種承载盤1 0之框座i i結構導致！ C晶 回上的保護膠膜須一片—片的撕離，不但會增加工時同時也大 幅降低產能。 —於疋便有業者將上述承龍進—步的改良，如第二圖所 T喊縣餘2Q之難周圍絲封赋結構，可 :框座2Q 1喊置人1 ^圓後，再以-保娜膜覆蓋於所 有框座2 〇 1之表面。雖然此種結構已針對前述第一圖之承載 # 盤10結構進行改良，且克服了原有保護膠膜須-片片撕離的 作業模式。但仍有其弊端須進一步的改進，原因在於該種承載 盤2 0由於框座2 Q 1⑸周為賴式結構，丨€晶_由設備 植入框座2 〇 1内時，係由設備的取放裝置吸取1。晶圓的表 面’再將其吹人框座2 Q 1内，此時設備所產生之氣流綠適 當的由框座2 Ο 1周圍釋出時，容易使！c晶圓與框座2 〇丄 @產生碰撞’而使1 CbSsIB翻面或傾放。再者，該種承載盤2 0的框座2 〇 1結毅無法提供人員輯子取放〗c晶圓進 行人工檢測作業模式。 有鏗於上述所未臻至善之處，本案創作人遂以從事該行業 多年之經驗，並本著精益求精之精神，積極研發設計，將理論 運用在實作之基礎上，遂有本創作改良之承餘結構之產生。 【新型内容】 糊作改良之承賴結構’其第―主要目的在於該承載盤 結構可提供設備將I C晶圓置入承載盤之框槽内時，同時導引 4 M360445 設備所產生氣流的排放。 本創作改良之承載盤結構，其第二主要目的在於該承載盤 結構可提供人員以鐵子取放i c晶圓進行人卫檢測作業模 式’同時亦兼具綠備進行！ c^aK取放的自動化作業模式。 本創作改良之承_舞，料三主要目的在於該承載盤 結構可以提供連續堆疊的結合，以讀承載麵體的運送或儲 放。 二㈣W«盤結構，為實現上述目的所採用的技術 -玉下’於承載盤上設有複數排歹,j之框槽，並於至少一方向 貫穿該框槽之導槽，同時該框槽係由承載盤第 、貝牙至弟二表面，框槽的内緣分別朝第 面方向呈佩„之傾，且—表面略高於第2表 第四表面，n H 略高於 心上^表蚊外緣邊略小於第四表面之外緣邊。 具之高等精w，她可達，效能所 重要件：為静杨之_及進步性雙 述目的、特徵所採= 步瞭解有關本創作為達上 並配合圖式朗如下。射&及其功效舉較佳實施例 【實施方式】 -整體結構示音所不’為本創作改良之承載盤結構之 冓丁一’其中’該承載盤3 ◦係可提供晶圓級封裝 M360445 產品之置人（在此定義為I C晶圓），於承載盤3 Q上設有複 =歹〗之框槽3 q丨，並於至少—方向之框槽3 Q丨間設至有 貝=框槽3 Q1之導槽3 〇 2，如第四圖所示，當設備將j C晶圓吹入_ 3 0 1内時’設備所釋放之氣流可藉由導槽3 〇 2排出’藉此以防止！c晶圓於框槽3 〇丄内產生翻面、傾 放的不良情形，並有效降減流導致〗c晶_框槽3 〇丄間 的碰扣此外’於人工檢測作業模式時，該導槽3 2可提供 作業人員的鑷子末端伸人，並導引録子兩末端靠近I C晶圓之 兩側，方便I C晶圓的夾取及放入。 請併參閱第四、五、六圖所示，該承缝3 Q之框槽3 0 1係由承載盤3 0之第一表面3 0 3貫穿至第二表面3 〇 4，且該框槽3 01的内緣分別朝第一表面3 3及第二表面 3 0 4方向呈喇叭口之傾斜狀，如第五、六圖所示’以俾於ι C晶圓由框槽3 01於第一表面3 〇 3—侧置入時，可依傾斜 狀之内緣順利置入於框槽3 01内所限定之位置。同時，誃承 載盤3 0之第一表面3 0 3略高於第三表面3 〇 5，且第—表 面3 0 3之外緣邊3 0 3 1略小於第三表面3 〇 5之外緣邊 3 〇 5 1 ,該承載盤3 0之第二表面3 〇 4略高於第四表面3 0 6，且第二表面3 0 4之外緣邊3 〇41略小於第四表面3 0 6之外緣邊3 〇 6 1，恰使該承載盤3 〇之第一表面3 〇 3 之外緣邊3 〇 3 1與第二表面3 〇 4之外緣邊3 0 4 1尺寸 相仿。藉此提供承載盤3 0可以疊設方式穩固的一個套接— 6 M360445 個，方便承載盤3 0集體運送或儲放的目的。 綜上所陳，本創作改良之承載盤結構，的確能藉由上述所 揭露之實細，達酬述之功效，且蝻料請前未見於刊物 亦未公開使用’誠已符合翻專利之新難、進步性等要件。 惟，上述簡之圖示及綱，简本創作之触實施例， 非為限定本創作之保護範圍；大凡熟悉該項技藝之人士，其所 依本創狀_吟所狀其它等賴化雜飾，皆應涵苔 • 在以下本案之申請專利範圍内。 ^M360445 V. New description: [New technology field] This creation involves - county structure, especially the type of carrier plate that can be placed in pure-grade package products. [Prior Art] - The average life is connected to _ electronic products, which (10) rides a large number of semiconductors, and "wafer" is an important material for the semiconductor. The fab wafer that has been processed by the fab is sent to the swivel packaging test factory to complete the test, cutting and packaging, and become a semiconductor, and is provided to customers such as 3 c or electronics factory. To manufacture a variety of electronic products. Please refer to the first figure, and the 1C wafer will be tested and cut and packaged at the same time as 'Benmin off the carrier tray i 0. The fascinating i 设有 has a plurality of frames 1 1 1 ' and each frame A [c wafer] can be placed in the holder i, and a plurality of positioning protrusions 10 2 are arranged around the frame 101. The carrier trays i 〇 are each independently formed on the carrier tray 1 , 1 , and the process of injection molding of the carrier tray 10 is likely to cause an increase in the rate of I. 1 The peripherally finer studs 4〇2 are not easily formed. In addition, when the c-wafer is placed on the frame 1 Q 1 , it is easy to close the edge of the column jL 〇 2 to cause the card wafer to be picked up or dropped, or the tilting occurs. In addition, the early ^ round in the cutting ^ 'for dust, scratch, the surface will be S-adhesive - layer 4 film, and the wafer is cut into a number of small pieces of the rear manned tray 1 〇, sent The semiconductor sealing test is a waste. For the sake of light transmission, the protection of the M340445 on the IC wafer must be torn off, due to the structure of the frame ii of the carrier disk 10! The protective film on the C crystal must be peeled off one by one, which will not only increase the working hours but also greatly reduce the productivity. - Yu Yu has a practitioner to improve the above-mentioned Chenglong step, as shown in the second figure, the shouting of the 2Q of the county is not difficult to surround the silk seal structure, but: the frame 2Q 1 calls for 1 ^ circle, then - The Paula film covers the surface of all the frames 2 〇1. Although this structure has been modified for the structure of the carrier 10 of the first figure described above, and overcomes the operation mode of the original protective film-strip tear. However, there are still some drawbacks that need to be further improved, because the carrier tray 20 is a Lai structure due to the frame Q 2 (5) circumference, and the device is implanted in the frame 2 〇1 by the device. Pick and place device to draw 1. The surface of the wafer is then blown into the frame 2 Q 1 , and when the airflow generated by the device is properly released from the frame 2 Ο 1 , it is easy to make! c wafer and frame 2 〇丄 @produce collision ' and turn 1 CbSsIB to face or tilt. Moreover, the frame 2 〇 1 of the carrier tray 20 can not provide a manual recording and reading operation mode. In spite of the above-mentioned advantages, the creators of this case have been engaged in the industry for many years of experience, and in the spirit of excellence, actively research and development design, the theory is applied on the basis of the implementation, and there is no improvement in this creation. The generation of the residual structure. [New content] The main purpose of the reliance structure of paste improvement is that the carrier disk structure can provide the device to guide the emission of airflow generated by the 4 M360445 device when the IC wafer is placed in the frame groove of the carrier disk. . The second main purpose of the improved carrier structure is that the carrier structure can provide personnel to pick up and place the i c wafer for the human security inspection operation mode ‘and also have green standby! The automatic operation mode of c^aK pick and place. The main purpose of this creation improvement is that the carrier tray structure can provide a continuous stacking combination for reading the transport or storage of the carrier body. Two (four) W « disk structure, the technology used to achieve the above purpose - Yu Xia' is provided with a plurality of rows of rafts, a frame groove of j, and a guide groove extending through the frame groove in at least one direction, and the frame groove It is made up of the surface of the carrier disk, the teeth of the teeth, and the inner edge of the frame groove. The inner edge of the frame groove is inclined toward the first surface, and the surface is slightly higher than the fourth surface of the second table, and n H is slightly higher than the heart. The outer edge of the mosquito is slightly smaller than the outer edge of the fourth surface. With the high precision, she can reach, the important part of the performance: for the Jing Yang _ and the progress of the dual purpose, characteristics of the adoption = step to understand the relevant The creation is as follows and the schema is as follows. The preferred embodiment of the shot & and its function [Embodiment] - the overall structure of the sound is not the 'suggested disk structure of the creation of the Kenting one' The carrier 3 can provide the wafer level package M360445 product (herein defined as IC wafer), and the carrier tray 3 Q is provided with a frame slot 3 q丨, and at least—direction The frame slot 3 Q is set to the channel 3 〇2 with the bay = frame slot 3 Q1, as shown in the fourth figure, when the device blows the j C wafer _ 3 0 1 when the 'airflow released by the device can be discharged through the guide groove 3 〇 2' to prevent the !c wafer from turning over and falling in the frame groove 3, and effectively reducing The flow reduction results in a c-crystal _ frame slot 3 碰 的 此外 此外 此外 此外 此外 此外 于 于 于 于 于 于 于 于 于 于 于 人工 人工 人工 人工 人工 人工 人工 人工 人工 人工 人工 人工 人工 人工 人工 人工 人工 人工 人工 人工 人工 人工 人工 人工 人工The sides of the circle facilitate the clamping and insertion of the IC wafer. Please refer to the fourth, fifth and sixth figures. The frame 3 of the seam 3 Q is the first surface of the carrier tray 30. 3 0 3 penetrates to the second surface 3 〇 4, and the inner edge of the frame groove 301 is inclined toward the first surface 3 3 and the second surface 3 0 4 respectively, as shown in the fifth and sixth figures. When the iv C wafer is placed on the first surface 3 〇 3 side by the frame groove 310, the inner edge of the inclined shape can be smoothly placed in the position defined by the frame groove 310. The first surface 3 0 3 of the carrier disk 30 is slightly higher than the third surface 3 〇 5, and the outer edge 3 0 3 1 of the first surface 3 0 3 is slightly smaller than the outer edge 3 of the third surface 3 〇 5 〇5 1 , the carrier tray 3 0 The second surface 3 〇4 is slightly higher than the fourth surface 306, and the outer surface 3 〇41 of the second surface 3 0 4 is slightly smaller than the outer edge 3 〇6 of the fourth surface 3 0 6 The outer surface 3 〇 3 1 of the first surface 3 〇 3 of the carrier tray 3 is similar in size to the outer edge 3 0 4 1 of the second surface 3 〇 4, thereby providing the carrier tray 30 to be stacked in a stable manner. One socket - 6 M360445, which is convenient for carrying the collective transport or storage of the tray 30. In summary, the improved carrier structure of the creation can indeed be realized by the above-mentioned disclosure. Efficacy, and the results have not been seen before in the publication and have not been publicly used. 'Sincere has met the new difficulties and progressive requirements of patents. However, the above-mentioned simplified diagrams and outlines, the examples of the touches of the simplified creations, are not intended to limit the scope of protection of this creation; those who are familiar with the art, according to the creation of the _ 吟 状Decorations, all should be covered by the moss • In the following patent application scope of this case. ^
7 M360445 【圖式簡單說明】 第一圖係習知承載盤之結構示意圖。 第二圖係習知承載盤之結構示意圖。 第三圖係本創作承載盤之結構示意圖。 第四圖係取第三圖一角落之結構放大示意圖。 ' 第五圖係第三圖A—A方向之結構局部剖面示意圖。 第六圖係第三圖B—B方向之結構局部剖面示意圖。 _ 【主要元件符號說明】 承載盤1 0 框座1 0 1 凸柱1 0 2 承載盤2 0 框座2 0 1 承載盤3 0 φ 框槽3 01 導槽3 0 2 第一表面3 0 3 外緣邊3 0 3 1 第二表面3 0 4 外緣邊3 0 4 1 第三表面305 外緣邊3 0 5 1 M360445 第四表面3 Ο 6 外緣邊3 Ο 6 17 M360445 [Simple description of the diagram] The first diagram is a schematic diagram of the structure of a conventional carrier disk. The second figure is a schematic structural view of a conventional carrier disk. The third figure is a schematic diagram of the structure of the creative carrier. The fourth figure is an enlarged schematic view of the structure of the corner of the third figure. The fifth figure is a partial cross-sectional view of the structure in the A-A direction of the third figure. The sixth figure is a partial cross-sectional view of the structure in the B-B direction of the third figure. _ [Main component symbol description] Carrier disk 1 0 Frame 1 0 1 Tab 1 0 2 Carrier 2 0 Frame 2 0 1 Carrier 3 0 φ Frame slot 3 01 Channel 3 0 2 First surface 3 0 3 Outer edge 3 0 3 1 Second surface 3 0 4 Outer edge 3 0 4 1 Third surface 305 Outer edge 3 0 5 1 M360445 Fourth surface 3 Ο 6 Outer edge 3 Ο 6 1