M359638 五'新型說明： 【新型所屬之技術領域】 本創作係與發光二極體（led)白光照明模組有關，更 詳而言之係指一種兼具防眩光及可調色溫之LED白光照明 模組。 【先前技術】 按，發光二極體（Light Emitting Diode，簡稱 LED) _ 之發光原理，仍是利用磊晶（Epitaxy)為光電元件，藉由 電光（Electro Luminescence )轉換效應而發出某波長的光。 由於LED具有低耗能、高效率的特性及優點，因此目前各 國及業界皆將此一技術列為策略發展的重點技術，欲以光 電元件取代現有傳統之既明設備，並將LED之發展技術概 述如下： 如美國專利第6,765,237號專利案.，係在單顆磊晶片上 方直接塗佈黃色螢光層，再以環氧樹脂（Ep〇xy)加以罩覆 鼸封裝以構成單-顆咖，所運狀發光技術為遙晶片依電 光轉換效應發出單波長的藍光，照射螢光層使化學結構的 電子忐罝從基態轉換到激發態產生黃色螢光，與藍光混為 •接近白色的二波長光源射出，故此種技術可稱之為化學混 . 光。 由於化學混光技術之製作及成品使用較為簡單，迄今 仍為白光LED的线’但因晶片發光的同時必然伴隨著高 熱’而螢光層本身並不财高溫，故當晶片溫度提高時，晶 M359638 片及螢光層會快速產生質變，使得LED發生所稱的光衰及 色衰現象’嚴重影響LED的照度或明亮度，此即為「光衰 現象」。 雖然目前白光LED的主流仍為化學混光，但因化學混 光有著上述之諸多缺失，因此仍不適用於需具備較長使用 壽命之照明用途發展。 請參閱第一圖’係一種多晶發光二極體照射法 (Multi-Chip LED Approach)之示意圖，其是顯示LED最 常利用三原色光混出白光之技術，藉由可分別發出紅光 (RL)、綠光（GL)及藍光（BL) LED 封褒 1、2、3， 混為接近白色的光源，但除了波長配合配比要能配出白色 外，光強度亦要有適當的配比，因此在混光實施上有著相 菖之困難度，常見難在於白光僅出現在光束交集的區域中 央，遠離中央區域的混光色溫會逐漸趨近R、G、B三原色 光，在照明區域形成色彩繽紛的色塊，此為混光不均所造 成之缺失。 右將各晶片的發光角度加大，雖可改善部份混光色塊 現象但由於人的眼晴對光波長555nm(綠光）的靈敏度最 问，對於低於或高於此波長的光的靈敏度較差，我們稱呼 這種特性為光譜靈敏度特性，如下表所示： M359638 波長（nm) 人眼光譜 靈敏度 (lm/w) 波長（nm) 人眼光譜 靈敏度 (lm/w) 波長（nm) 人眼光譜 靈敏度 (lm/w) 380 0. 05 510 343. 0 640 119. 0 390 0. 13 520 484. 0 650 73. 0 400 0.27 530 588. 0 660 41.4 410 0. 32 540 650. 0 670 21. 3 420 2. 73 550 679. 0 680 11.6 430 7. 91 560 679 690 5. 59 440 15.7 570 649.0 700 2. 78 450 25.9 580 593. 0 710 1.43 460 40.9 590 516. 0 720 0. 716 470 62. 1 600 430.0 730 0. 355 480 94. 3 610 343. 0 740 0. 170 490 142. 0 620 260. 0 750 0. 082 500 220. 0 630 181. 0 760 0. 041 而眼睛直視光源時感到的刺眼眩光，如直視照明燈具、太 • 陽、夜間對方來車車燈及閱讀時的直接眩光，即看燈光時 的刺眼眩光。此為造成直接眩光之缺失。 請參閱第二圖，係我國專利第1255566號專利案，同 • 樣係一種多晶發光二極體照射法（Multi-Chip LED -Approach )之示意圖，其是顯示LED最常利用三原色光混 出白光之技術。藉由可分別發出紅光（RL)、綠光（GL) 及藍光（BL)之晶片4、5、6，以一封膠7將紅、綠、 藍光晶片4、5、6覆蓋於一封裝基底8上，並於該封膠 M359638 7内散設多數之擴散粒子9 ’以藉由擴散粒子9使各晶片 4、 5、6之光束能充分地進行混光而形成均勻的白光。 雖然上述之技術能提供較佳之白光混光效果，但直接 使用在照明上，尚無法接受的色塊，致目前市場上無此量 產產品使用在照明上，應可印證。再者，將三原色晶片4、 5、 6同時覆蓋於一封膠γ支架内，其所產生之熱量密度 極高（溫度提升極快）致熱及壽命問題待解決。 另外，台灣第1246207號專利案則揭露利用一發白光 之LED充當主要光源，並於白光LED附近置設一組由紅、 '、·藍光專led構成之色溫補償單元，即當白光led亮 度因螢光層質變而快速下降而形成光衰時，以紅、綠、藍 光LED隨著衰變的白光led進行單顆或多顆之電流強度 调整。但此種方式在原先白光led光衰之後整個模組的亮 度、色温、色塊顯現均會大幅改變，且欲精準地控制單顆 或多顆之電流強度，於實際上有著相當高之難度而不符經 濟效益。 ”其次，LED的波長取決於磊晶層的結構及組成的材 料更重要的是晶格匹配的課題，導致半導體因溫度的高 低致生波長飄移的問題不容忽視。就開機初期和通電一段 時間來說，開機初期隨著紅光發光效率的強度，該RGB三 原色光混出白色偏紅的光源；通電—段時間，隨著發光效 率較雨的藍光逐步增強，讓混光色溫偏向冷光系的白色偏 藍光，故於兩段時期所混光的色溫各不相同。依光譜的角 M359638 度來看’波長由暖色系移動到冷色系的熱飄移範圍過大， 嚴重影響混光色溫的白平衡，相對減損光源的照度。 【新型内容】 ' 有鑑於此，本創作之主要目的乃在於提供一種兼具防 眩光及可調色溫之led白光照明模組，係利用多個非白光 '的led元件經過物理混光為一白光，並能將其白光於冷色 ，系白光至暖色系白光區間進行調整。 _ 本創作之另一主要目的乃在於提供一種兼具防眩光及 可調色溫之LED白光照明模組，係利用發出三原色光之 LED及一第四色光，經該四色光混光發出一接近白色的光 源，減少照區的混光色塊及減少熱飄移且增進白平衡。 本創作之再一主要目的乃在於提供一種兼具防眩光及 可凋色溫之LED白光照明模組，係可防止眩光現象產生者。 緣此，本創作乃提供一種兼具防眩光及可調色溫之 • [ED白光照明模組’主要包含有一承載板、至少四紅光lED 封裝單元、至少四綠光LED封裝單元及至少四藍光LED 封裝單元；該承載體係一或多數電路板所構成；該等紅光 • led封裝單元，係分別設置於該承載體之預定位置上，並 •與該承載體電性連通，該各紅光led封装單元分別具有一 紅光LED晶片、一罩覆該紅光LED晶片之罩覆體及多數 政佈於该罩覆體内之擴散粒子；該等綠光LED封裝單元， 係分別設置於該承载體之預定位置上，並與該承載體電性 M359638 料，該各祕LED難單元分別财―、料led晶片、 一罩覆該綠光㈣晶片之罩覆體及多數散佈於該罩覆體内 之擴散粒子；該錢光LED縣單元，係分職置於該承 載體之預定位置上，並與該承載體電性連通，該各藍光LED 縣單元分別具有-藍光LED晶片、一罩覆該^光LED 晶片之軍覆體及多數散佈於該罩覆體内之擴散粒子；由於 擴散粒子具有可將光束折射、反射的作用，而達到減少各 LED封裝單元之眩光情形的產生。 【實施方式】 為使貴冑查委員能對本創作之特徵與特點有更進一 步之了解與認同，兹列舉以下較佳實施例並配合圖式說明 如下： 請參閱第三至第五圖，係本創作第一較佳實施例所提 ，、種兼㈣眩光及可調色溫之LED白光㈣模组，主 包含有-承載體1()、多數之紅光LED封裝單元 ==封褒單元30及多數之藍光LED封裝單元4 ::載：i 〇 ’為一印刷電路板(PCB)， 預疋態樣之電路佈線（圖中未示）。 夕数 該等紅光LED封褒單开9 n ^ ^ 红光㈣㈣一 π早疋2 〇，於本實施例中係以三組 、·工先㈣封裝早兀2 〇呈現，該各紅光 0包含有一紅光LED曰Η 0 , 了哀早70 2 曰曰片21、一罩覆體22及多數之擴 M359638 散粒子23 ;該紅光LEDW 2 1係能接通於預定電产， 而發射出紅光，該罩覆體2 2係由透光之材質所製成：如 壞乳樹脂（Epoxy)、♦膠（Siu_e)、玻璃...等透 該罩覆體2 2健蓋賴紅紅ED q 2 :上，該等 粒子2 3係散佈於該罩覆體2 2 _，該擴散粒子2 由 具高反射率或高散射率之材料所製成，例如銀（阳叫、M359638 Five's new description: [New technology field] This creation is related to the LED light-emitting diode module. More specifically, it refers to an LED white light illumination with anti-glare and color temperature. Module. [Prior Art] According to the principle of light-emitting diode (LED) _, the epitaxial (Epitaxy) is still used as a photoelectric element, and a certain wavelength of light is emitted by an electroluminescence (Electro Luminescence) conversion effect. . Due to the low energy consumption and high efficiency of LEDs, LEDs are listed as a key technology development strategy in various countries and industries. They want to replace existing traditional optical devices with optoelectronic components and develop LED technology. The outline is as follows: For example, in U.S. Patent No. 6,765,237, a yellow fluorescent layer is directly coated on a single epitaxial wafer, and then covered with an epoxy resin (Ep〇xy) to form a single-coffee. The illuminating technology emits a single-wavelength blue light according to the electro-optical conversion effect of the remote wafer, and illuminates the phosphor layer to convert the chemical structure of the electron enthalpy from the ground state to the excited state to generate yellow fluorescence, which is mixed with the blue light and is close to the white two-wavelength. The light source is emitted, so this technique can be called chemical mixing. Due to the simple production of chemical mixing technology and the use of finished products, it is still the line of white LEDs. However, because the wafer emits light, it must be accompanied by high heat, and the phosphor layer itself is not high in temperature, so when the temperature of the wafer is increased, the crystal M359638 film and phosphor layer will quickly produce a qualitative change, which causes the LED to have the known light decay and color decay phenomenon, which seriously affects the illumination or brightness of the LED. This is the "light decay phenomenon". Although the current mainstream of white LEDs is still chemically mixed, due to the above-mentioned lack of chemical mixing, it is still not suitable for lighting applications that require a long service life. Please refer to the first figure, a schematic diagram of a multi-Chip LED Approach, which is a technique for displaying LEDs that most commonly use white light to mix white light, by which red light can be emitted separately (RL). ), green (GL) and blue (BL) LEDs are sealed 1, 2, 3, mixed into a white light source, but in addition to the wavelength matching ratio can be matched with white, the light intensity should have an appropriate ratio Therefore, there is a relative difficulty in the implementation of light mixing. It is often difficult for white light to appear only in the center of the intersection of the beams. The color temperature of the mixed light away from the central region will gradually approach the R, G, and B primary colors, forming in the illumination area. Colourful color blocks, this is the lack of mixed light. Right, the light-emitting angle of each wafer is increased, although the phenomenon of partial light-mixing color block can be improved, but the sensitivity of the human eye to the light wavelength of 555 nm (green light) is the most important, for light below or above this wavelength. Sensitivity is poor, we call this characteristic spectral sensitivity characteristics, as shown in the following table: M359638 Wavelength (nm) Human eye spectral sensitivity (lm / w) Wavelength (nm) Human eye spectral sensitivity (lm / w) Wavelength (nm) Eye spectral sensitivity (lm/w) 380 0. 05 510 343. 0 640 119. 0 390 0. 13 520 484. 0 650 73. 0 400 0.27 530 588. 0 660 41.4 410 0. 32 540 650. 0 670 21 3 420 2. 73 550 679. 0 680 11.6 430 7. 91 560 679 690 5. 59 440 15.7 570 649.0 700 2. 78 450 25.9 580 593. 0 710 1.43 460 40.9 590 516. 0 720 0. 716 470 62 1 600 430.0 730 0. 355 480 94. 3 610 343. 0 740 0. 170 490 142. 0 620 260. 0 750 0. 082 500 220. 0 630 181. 0 760 0. 041 and the eyes feel when looking directly at the light source The glare of glare, such as direct-view lighting, Taiyang, nighttime car lights and direct glare when reading, is the glare of the lights. This is the cause of direct glare. Please refer to the second figure, which is a schematic diagram of a multi-Chip LED-Approach, which is a display of LEDs that are most commonly used to absorb light from three primary colors. White light technology. Red, green, and blue wafers 4, 5, and 6 are overlaid in a package by using a wafer 4, 5, and 6 that emit red (RL), green (GL), and blue (BL), respectively. On the substrate 8, a plurality of diffusion particles 9' are interspersed in the sealant M359638, so that the light beams of the respective wafers 4, 5, and 6 can be sufficiently mixed by the diffusion particles 9 to form uniform white light. Although the above technology can provide a better white light mixing effect, it is directly used in lighting, an unacceptable color block, so that no such product is currently used in lighting on the market, and should be verified. Furthermore, the three primary color wafers 4, 5, and 6 are simultaneously covered in a single yoke holder, and the heat density generated is extremely high (the temperature rises extremely fast). The heat and life problems are to be solved. In addition, Taiwan Patent No. 1246207 discloses that a white light LED is used as the main light source, and a set of color temperature compensation units composed of red, ', and blue light LEDs is disposed near the white LED, that is, when the white light LED is bright. When the phosphor layer changes rapidly and rapidly declines to form a light decay, the red, green, and blue LEDs are adjusted in single or multiple current intensity with the decaying white light led. However, in this way, the brightness, color temperature, and color block of the entire module will change greatly after the original white light led light decay, and the current intensity of one or more pieces is precisely controlled, which is actually quite difficult. Not in line with economic benefits. Secondly, the wavelength of the LED depends on the structure and composition of the epitaxial layer. The more important thing is the problem of lattice matching. The problem of the wavelength drift caused by the temperature of the semiconductor cannot be ignored. It is said that with the intensity of the red light emitting efficiency at the beginning of the booting, the RGB three primary colors of light mix out the white reddish light source; during the energization period, the blue light gradually increases as the luminous efficiency is slower, and the mixed color temperature is biased toward the white of the cold light system. The blue light is different, so the color temperature of the light mixed in the two periods is different. According to the angle of the spectrum M359638, the wavelength of the thermal shift from the warm color to the cool color is too large, which seriously affects the white balance of the mixed color temperature. The illumination of the light source is degraded. [New content] ' In view of this, the main purpose of this creation is to provide a LED white light illumination module with anti-glare and color temperature, which uses multiple non-white light LED components to pass through the physical The light is mixed into a white light, and the white light can be adjusted in the cool color, and the white light to the warm white light interval is adjusted. _ Another main purpose of the creation is The invention provides an LED white light illumination module with anti-glare and color temperature, which uses an LED emitting three primary colors and a fourth color light, and emits a light source close to white through the four-color light mixing to reduce the mixed color of the illumination area. Block and reduce heat drift and improve white balance. Another main purpose of this creation is to provide an LED white light illumination module with anti-glare and color temperature, which can prevent glare phenomenon. Providing an anti-glare and color temperature control system [ED white lighting module" mainly comprises a carrier board, at least four red light lED package units, at least four green LED package units and at least four blue LED package units; One or more circuit boards are formed; the red light-emitting package units are respectively disposed at predetermined positions of the carrier, and are electrically connected to the carrier, and each of the red LED package units respectively has a a red LED chip, a cover covering the red LED chip, and a plurality of diffusion particles disposed in the cover; the green LED package units are respectively disposed on the support At a predetermined position of the body, and the carrier is electrically M359638, the secret LED hard unit is separately made of materials, the led wafer, a cover covering the green (four) wafer, and most of the cover are dispersed in the cover Diffusion particles; the Qianguang LED county unit is placed in a predetermined position on the carrier and electrically connected to the carrier, and each of the blue LED county units has a blue LED chip and a cover The military-coated body of the light-emitting LED chip and the majority of the diffusion particles dispersed in the cover body; the diffusion particles have the function of refracting and reflecting the light beam, thereby reducing the glare of each LED package unit. Ways: In order to enable the members of the committee to have a better understanding and recognition of the characteristics and characteristics of the creation, the following preferred embodiments are listed below with the following description: Please refer to the third to fifth figures, which is the first in this creation. In the preferred embodiment, the LED white light (four) module of the (four) glare and the color temperature is mainly included with the carrier 1 (), the majority of the red LED package unit == the sealing unit 30 and most of the blue light LED package unit 4 :: Load: i 〇 ' is a printed circuit board (PCB), pre-turned circuit wiring (not shown). The number of red LEDs in the eve is 9 n ^ ^ red (4) (4) π 疋 2 〇, in the present embodiment, the three groups, the first (four) package is presented in the early 兀 2 ,, the red light 0 includes a red LED 曰Η 0, a sorrow 70 2 cymbal 21, a cover 22 and a majority of expanded M359638 scattered particles 23; the red LED W 2 1 can be connected to a predetermined power, and The red light is emitted, and the cover body 2 2 is made of a light transmissive material: such as Epoxy, Siu_e, glass, etc., through the cover 2 2 ED q 2 : the particles 2 3 are dispersed in the cover 2 2 _, and the diffusion particles 2 are made of a material having high reflectivity or high scattering rate, such as silver (yang,
樹脂、/ (Sili_)或其它材質。該等紅光封褒單元 2 0係依預定態樣佈設於該承賴：Q上，並與該承載體 ^ 〇電性接通，以由該承載體i Q供給料紅紅助封裝 早疋2 Q電流’以使該紅光LED晶片2丨能發射出紅光。 該等綠光LED封裝單元3 〇，於本實施例中係以三組 綠光LED封裝單元3 〇呈現，該各綠光LED封裝單元3 〇包含有一綠光LED晶片3丄、一罩覆體32及多數之擴 散粒子3 3 ;該綠光LED晶片3 i係能接通於預定電流，' 而發射出綠光，該罩覆體3 2係由透光之材質所製成，如 壤氧樹脂（Epoxy)、矽膠（Silic〇ne)、玻璃…等透光材質， 該罩覆體3 2係覆蓋於該綠光LED晶片3 1上，該等擴散 粒子3 3係散佈於該罩覆體3 2中，該擴散粒子3 3係由 具馬反射率或高散射率之材料所製成，例如銀（Silver)、 封脂、矽（SiHcon)或其它材質。該等綠光led封裝單元 3 〇係依預定態樣佈設於該承載體1 〇上，並與該承載體 1 0電性接通，以由該承載體1 0供給該等綠光LED封裝 單凡3 〇電流’以使該綠光led晶片3 1能發射出綠光。 9 M359638 該等藍光LED封裝單元4 〇，於本實施例中係以三組 藍光LED封裝單元4 〇呈現，該各藍光LED封裝單元^ 〇包含有一藍光LED晶片4 1、一罩覆體4 2及多數之擴 散粒子4 3，該藍光LED晶片4： 1係能接通於預定電流， 而發射出藍光，該罩覆體4 2係由透光之材質所製成，如 環氧樹脂（Epoxy)、矽膠（Silicone)、玻璃…等透光材質， 該罩覆體4 2係覆蓋於該藍光LED晶片4 1上，該等擴散 粒子4 3係散佈於該罩覆體4 2中，該擴散粒子4 3係由 具高反射率或高散射率之材料所製成，例如銀（Silver)、 樹脂、矽（Silicon)或其它材質。該等藍光1^1)封裝單元 4 0係依預定態樣佈設於該承載體i 〇上，並與該承載體 1 0電性接通，以由該承載體1 〇供給該等藍光封枣 單兀4 〇電流，以使該藍光LED晶片4 1能發射出藍光: 請參閱第五圖所示，為使各色（紅、綠、藍）光線能 具有較佳之散射路徑而充分混光，因此擴散粒子在罩覆2 内之散佈密度及數量、位置並不相同，以提供較佳之光線 散射路徑，使紅、綠、藍光之光束能近乎完全重疊，而能 均勻地混成白光，並不致有其它顏色之色塊產生。 是以，由於本實施例之各色LED㈣單元，係以單一 led晶片騎㈣，因此其散熱效錄習知以三顆哪晶 片進行封裝者較佳，可減少效能之損耗。 再者，由於本實施例之照_組，係分別具有各色三 組之led職單元，因此可利㈣設於承载體上位置之置 10 M359638 換或調配，來達成調整色 冷色系白光至暖色系白^功效，即使混成之白光能於 色糸白光間進行調整，如 照明所採用不同色、严夕以 至門…、明或至外 茲α 之白先，以能因應不同之照明需求。Resin, / (Sili_) or other materials. The red light-sealing unit 20 is disposed on the reliance: Q according to a predetermined state, and is electrically connected to the carrier, so that the red body is packaged by the carrier i Q. 2 Q current 'to enable the red LED chip 2 to emit red light. The green LED package unit 3 〇 is presented in the present embodiment by three sets of green LED package units 3 〇 including a green LED chip 3 丄 and a cover. 32 and a plurality of diffusion particles 3 3 ; the green LED chip 3 i can be connected to a predetermined current, and emit green light, and the cover 3 2 is made of a light-transmitting material, such as soil oxygen. a light-transmitting material such as a resin (Epoxy), a silicone, or a glass. The cover 3 2 covers the green LED chip 31, and the diffusion particles 3 3 are dispersed in the cover. In 3 2, the diffusing particles 3 3 are made of a material having a horse reflectance or a high scattering rate, such as silver, sealant, SiHcon or other materials. The green LED package unit 3 is disposed on the carrier 1 in a predetermined manner, and is electrically connected to the carrier 10 to supply the green LED package by the carrier 10 Where the current is '3' so that the green LED chip 31 can emit green light. 9 M359638 The blue LED package units 4 〇 are presented in the present embodiment by three sets of blue LED package units 4 ,, each of which includes a blue LED chip 4 1 and a cover 4 2 And a plurality of diffusion particles 4 3, the blue LED chip 4: 1 can be connected to a predetermined current, and emit blue light, the cover 4 2 is made of a transparent material, such as epoxy resin (Epoxy a transparent material such as silicone, glass, etc., the cover 4 2 is coated on the blue LED wafer 41, and the diffusion particles 4 3 are dispersed in the cover 4 2 , the diffusion The particles 43 are made of a material having high reflectance or high scattering rate, such as silver, resin, silicone or other materials. The blue light 1^1) package unit 40 is disposed on the carrier i 依 according to a predetermined state, and is electrically connected to the carrier 10 to supply the blue light seals by the carrier 1 〇 Single 兀4 〇 current, so that the blue LED chip 4 1 can emit blue light: Please refer to the fifth figure, in order to make the light (red, green, blue) light have a better scattering path and fully mix light, therefore The scattering density, number and position of the diffusing particles in the cover 2 are not the same, so as to provide a better light scattering path, so that the red, green and blue light beams can be almost completely overlapped, and the white light can be uniformly mixed without any other Color blocks are produced. Therefore, since the LED (four) units of the respective embodiments are mounted on a single LED chip (four), it is preferable that the heat dissipation recording is preferably packaged in three wafers, which can reduce the loss of performance. Furthermore, since the photo group of the embodiment has three sets of led units of different colors, it is possible to adjust or arrange the 10 M359638 on the position of the carrier to achieve the adjustment of the color cool white light to warm color. It is white effect, even if the mixed white light can be adjusted between the white and white light, such as the different colors used in lighting, the eternal eve, the door, the white or the first, to meet the different lighting needs.
-模組社rt兼具賊歧可調色溫之l e d白光照明 益b ’、較佳之混光效果’使能均勻地混成白光而 、…、匕色塊之產生，更具備藉由佈設於承载體上各色LED ，t裝單元之數4、設置位置之，來達成調整色溫之效 而無需習知技術必微變電流、電壓之娜方式，使 其調整色溫之方式較為簡易。 請參閱第六圖，係本創作所揭示第二較佳實施例之兼 具防眩光及可調色溫之LED白光照明模組2 〇 〇，其同樣 包含有一承載體5 0、多數之紅光LED封裝單元2 〇、多 數之綠光LED封裝單元3 Q、多數之藍光LED封裝單元 4 〇，惟與前述實施例之主要差異在於： 該承载體5 0，係由三組電路板5丄所構成，且各電 傷路板5 1分別設置不同光色之LED封裝單元，各電路板5 1間係互相1：性接通’而能與第一較佳實施例達成同樣之 目的，況且本實施例更可有效減低製造及組裝上之成本， ii同時達到多樣變化組合之功效。 請參閱第七圖，係本創作所揭示第三較佳實施例兼具 防眩光及可調色溫之LED白光照明模組3 〇 〇，其同樣包 含有一承載體6 0、多數之紅光led封裝單元2 〇、多數 之綠光LED封裝單元3 〇、多數之藍光LED封裝單元4 M359638 Ο ’惟與第一較佳實施例之主要差異在於： · 該承載體60，係由九組電路板61所構成，以由各 '. 電路板θ 1分別設置單顆之UED封裝單元，各電路板6 i -間係互相電性接通，而能與第一較佳實施例達成同樣之目 的’况且本實施例更可有效減低製造及組裝上之成本，並 . 同時達到多樣變化組合之功效。 ， δ月參閱第八圖，係本創作所揭示第四較佳實施例兼具 防眩光及可調色溫之led白光照明模組4 〇 〇，其同樣包 含有一承載體1 0、多數之紅光LED封裝單元2〇、多數 _ 之綠光LED封裝單元3 〇、多數之藍光LED封裝單元4 0，惟與第一較佳實施例之主要差異在於： 本實施例中係採用四組紅光led封裝單元2 〇、五組 綠光LED封裝單元3 〇及三組藍光LED封裝單元， 並依所欲控制之白光色溫而佈設於預定位置上，其相同可 達成本創作調整色溫之目的。 請參閱第九圖，係本創作所揭示第五較佳實施例兼具馨 防眩光及可調色溫之LED白光照明模組5 0 〇，其同樣包 含有-承載體1 〇、多數之紅光LED封裝單元2 〇、多數 之綠光LED封裝單元3 〇、多數之藍光Led封裝單元4 0，惟與第一較佳實施例之主要差異在於： 本實施例中係採用五組紅光1^]0封裝單元2 〇、七組 綠光LED封裝單元3 〇及四組藍光LED封裝單元4 〇， 並依所欲控制之白光色溫而佈設於預定位置上，便能達到 12 M359638 調整色溫之目的。 •請參閱第十圖’係本創作所揭示第六較佳實施例兼具 '防眩光及可調色溫之LED白光照明模組6 〇 〇，其同樣包 含有一承載體1 〇、多數之紅光LED封裝單元2 〇、多數 ' 之綠光LED封裝單元3 0、多數之藍光LED封裝單元4 、 〇 ’惟與第一較佳實施例之主要差異在於： 本實施例兼具防眩光及可調色溫之LED白光照明模組 . 6 0 0更包含有一第四光LED封裝單元7 〇，該第四光 • LED封裝單元包含有一第四光LED晶片7 1、一罩覆體7 2及多數之擴散粒子7 3 ;該第四光LED晶片7 1係能接 通於預定電流，而發射出第四光，該第四光係一波長在5 6 0 nm〜6 1 0 nm或470nm〜5 0 〇nm頻譜範圍的光 束，前者依第十一圖光譜圖來看泛稱一黃光（Y)，後者泛 稱一青光（C);該罩覆體7 2係由透光之材質所製成，如 環氧樹脂（Epoxy)、矽膠（Silicone)、玻璃…等透光材質， φ 該罩覆體7 2係覆蓋於該第四光LED晶片7 1上，該等擴 散粒子7 3係散佈於該罩覆體7 2中，該擴散粒子7 3係 由具高反射率或高散射率之材料所製成’例如銀（Silver)、 樹脂、梦（Silicon )或其它材質。該專第四光LED封農單 .元7 0係依預定態樣佈設於該承載體1 〇上，並與該承载 體1 0電性接通，以由該承載體1 〇供給該等第四光LED 封裝單元7 0電流，以使該第四光LED晶片7 l·能發射出 有別於紅光、綠光、藍光之第四光。 13 M359638 一主:中—該第四光LED封裝單元7 Q所發出之第四光為 二黃光為紅光與綠光的混色光，可與藍光混成白光。 ，主、/―圖所示’白色光源的波長位於光譜的中央區 (Υ)可與自线綠光束混光使其色溫接近光譜 、、區塊’波長在光譜的熱飄移現象相對減少，自缺地 平衡。同樣地’黃光⑺與白系偏紅光束或白系 ^先束混光後’色溫亦調和至光譜中央區_白光波長 Ι&圍内減少熱飄移現象使照度相對趨近於明亮的正白光。 請參閱第十二圖，係本創作所揭示第七較佳實施例兼 具防眩光及可調色溫之LED白光照明模組7 〇 〇，其同樣 包含有—承載體1 0、多數之紅光LED封裝單元2 〇、多 數之綠S LED封裝單元3 q、乡數之藍光LED封裝單元 4 0 ’惟與第一較佳實施例之主要差異在於： 本實施例更設置有一擴散片8 〇，係位於該等 LED封 裝單元20、30、40發光方向上，並距該等LED封裝 單疋2 0、3 0、4 〇預定之距離，該擴散片8 〇具有一 擴散平板8 1及多數之擴散粒子8 2 ;該擴散平板8 1係 由透光之材質所製成，如環氧樹脂（Epoxy )、矽膠 (Silicone)、玻璃...等透光材質，該等擴散粒子8 2係散 佈於該擴散平板8 1中，該擴散粒子8 2係由具高反射率 或高散射率之材料所製成，例如銀（silver)、樹脂、矽 (Silicon)或其它材質。 藉由增加—擴散平板8 0之設置，可使原本未設置擴 14 M359638 散平板時，其混光後之光線於周緣位置所產生之色塊（如 第十圖所示）加以消除（如第十二圖所示）’而利用第二次 混光’以增加混光之均勻度。 請參閱第十三圖，係本創作所揭示第八較佳實施例兼 .具防眩光及可調色溫之Lm)白光照明模組8 〇 〇，其同樣 '包含有一承載體1 0、多數之紅光LED封裝單元2 〇、多 數之綠光LED封裝單元3 〇、多數之藍光LEd封裝單元 4 0，惟與第七較佳實施例之主要差異在於： 籲除擴散片8 0外，更於該等led封裝單元20、30、 4 0之發光方向上增設有一增光片9 i，該增光片9丄係 可用以加強聚光效果’使光線之所能發散之距離更長。 請參閱第十四圖，係本創作所揭示第九較佳實施例兼 具防眩光及可調色溫之LED白光照明模組9 〇 〇，其同樣 包含有一承載體1 〇、多數之紅光LED封裝單元2 〇、多 數之綠光LED封裝單元3 0、多數之藍光LED封裝單元 _ 4 0，惟與第一較佳實施例之主要差異在於： 該承載體1 0上更設有一保護罩體9 2，該保護罩體 9 2係可由如環氧樹脂（Epoxy)、矽膠（Silicone)、玻璃… - 等透光材質所製成，係覆蓋於該等LED封裝單元2 〇、3 〇、4 0上，以防止異物碰摱或異物附著於該等LED封裝 單元20、30、40上。 最後，雖然上述實施例係皆係先將各色LED晶片進行 封裝後再設置於承载體上，但實際上本創作亦可使用未經 15 M359638 封裝之LED晶片來達成同樣之目的，其作法為··先將至少 四紅光LED晶片、至少四綠光LED晶片及至少四藍光led 晶片直接正裝或倒裝固設於該承載體上，再以一佈植有預 定態樣擴散粒子之罩覆體設置於該承载體上，以完整地將 該等紅光、綠光、藍光LED晶片上加以覆蓋；藉此，能同 樣達成本創作防止眩光及可調色溫之功效。 另外’利用未經封裝晶片來達成本創作之目的，亦可 採用其它型態，如先將至少三紅光LED晶片、至少三綠光 LED晶片、至少三藍光LED晶片及至少一第四光lED晶 片（前些實施例對第四光晶片已有述敘，容不再此贅述） 直接正裝或倒裝固接於該承載體上，再以一佈植有預定態 樣擴散粒子之罩覆體設置於該承載體上，以完整地將該等 紅光、、綠光、藍光LED晶片上加以覆蓋；如此一來，亦能 同樣達成本創作防眩光及可調色溫之功效。 16 M359638 【圖式簡單說明】 ' 第一圖係習知一種多晶發光二極體照射法之示意圖。 第二圖係習知一種多晶發光二極體之封裝結構示意圖。 第三圖係本創作第一較佳實施例之設置示意圖。 - 第四圖係第三圖所示較佳實施例之局部構件剖視圖。 * 第五圖係第三圖所示較佳實施例之混光效果示意圖。 第六圖係本創作第二較佳實施例之設置示意圖。 第七圖係本創作第三較佳實施例之設置示意圖。 • 第八圖係本創作第四較佳實施例之設置示意圖。 第九圖係本創作第五較佳實施例之設置示意圖。 第十圖係本創作第六較佳實施例之混光效果示意圖。 第十一圖係一光譜示意圖。 第十二圖係本創作第七較佳實施例之設置示意圖。 第十三圖係本創作第八較佳實施例之設置示意圖。 第十四圖係本創作第九較佳實施例之設置示意圖。 【主要元件符號說明】 「習知」 藍光LED 3 藍光LED 6 擴散粒子9 紅光LED 1 綠光LED 2 ' 紅光LED 4 綠光LED 5 封膠7 封裝基底8 「本創作」 17 M359638 「第一較佳實施例」 兼具防眩光及可調色溫之LED白光照明模組1 〇 〇 承載體1 0 紅光LED封裝單元2 0 紅光LED晶片2 1 罩覆體2 2 擴散粒子2 3 綠光LED封裝單元3 0 綠光LED晶片3 1 罩覆體3 2 擴散粒子3 3 藍光LED封裝單元4 〇 藍光LED晶片4 1 擴散粒子43 罩覆體4 2 「第二較佳實施例」 兼具防眩光及可調色溫之LED白光照明模組2 〇 〇 承載體5 0 電路板5 1 紅光LED封裝單元2 0 藍光LED封裝單元4 0 綠光LED封裝單元3 〇 「第三較佳實施例」 兼具防眩光及可調色溫之LED白光照明模組3 〇 〇 承載體6 0 電路板6 1 紅光LED封裝單元2 0 藍光LED封裝單元4 〇 綠光LED封裝單元3 〇 「第四較佳實施例」 兼具防眩光及可調色溫之LED白光照明模組4 0 〇 承載體1 〇 紅光LED封農單元2 〇 18 M359638 綠光LED封裝單元3 0 藍光LED封裝單元4 Ο 「第五較佳實施例」 兼具防眩光及可調色溫之LED白光照明模組5 0 0 承載體1 0 紅光LED封裝單元2 0 綠光LED封裝單元3 0 藍光LED封裝單元4 0 「第六較佳實施例」 兼具防眩光及可調色溫之LED白光照明模組6 0 0 I 承載體10 紅光LED封裝單元2 0 綠光LED封裝單元3 0 第四光LED封裝單元7 0 藍光LED封裝單元4 0 第四光LED晶片7 1 罩覆體7 2 擴散粒子7 3 「第七較佳實施例」 兼具防眩光及可調色溫之LED白光照明模組7 0 0 承載體1 0 紅光LED封裝單元2 0 φ 綠光LED封裝單元3 0 藍光LED封裝單元4 0 擴散片8 0 擴散粒子8 2 擴散平板8 1 「第八較佳實施例」 兼具防眩光及可調色溫之LED白光照明模組8 0 0 承載體1 0 紅光LED封裝單元2 0 綠光LED封裝單元3 0 藍光LED封裝單元4 0 擴散片8 0 增光片9 1 19 M359638 「第九較佳實施例」 兼具防眩光及可調色溫之LED白光照明模組9 0 0 承載體10 紅光LED封裝單元2 0 綠光LED封裝單元3 0 藍光LED封裝單元4 0 保護罩體9 2 20- Module Society rt has a thief difference color temperature led white light illumination b ', better light mixing effect ' enables evenly mixed white light, ..., 匕 color block production, more by laying on the carrier The color LEDs, the number of t-mounted units, and the position of the device are used to achieve the effect of adjusting the color temperature without the need to change the current and voltage in a conventional technique, so that the method of adjusting the color temperature is relatively simple. Please refer to the sixth figure, which is an LED white light illumination module 2 with anti-glare and color temperature according to the second preferred embodiment of the present disclosure, which also includes a carrier 50 and a plurality of red LEDs. The package unit 2, the majority of the green LED package unit 3 Q, and the majority of the blue LED package unit 4 〇, but the main difference from the foregoing embodiment is that the carrier 50 is composed of three sets of circuit boards 5 And each of the electrical circuit boards 51 is provided with LED package units of different light colors, and each of the circuit boards 51 is electrically connected to each other to achieve the same purpose as the first preferred embodiment, and the present embodiment The example can effectively reduce the cost of manufacturing and assembly, and at the same time achieve the effect of diverse combinations of changes. Referring to the seventh embodiment, the third preferred embodiment of the present invention has an anti-glare and color-adjustable LED white light illumination module 3, which also includes a carrier 60, and a plurality of red LED packages. The main difference between the unit 2 〇, the majority of the green LED package unit 3 〇, and the majority of the blue LED package unit 4 M359638 Ο 'only with the first preferred embodiment is: · The carrier 60 is composed of nine sets of circuit boards 61 According to the configuration, a single UED package unit is provided by each of the circuit boards θ 1 , and the circuit boards 6 i - are electrically connected to each other, and the same purpose can be achieved as in the first preferred embodiment. This embodiment can effectively reduce the cost of manufacturing and assembly, and at the same time achieve the effects of various combinations of changes. Referring to the eighth embodiment, the fourth preferred embodiment disclosed in the present invention has an anti-glare and color-adjustable LED white light illumination module 4, which also includes a carrier 10 and a plurality of red lights. The LED package unit 2, the majority of the green LED package unit 3, and the majority of the blue LED package unit 40, but the main difference from the first preferred embodiment is: in this embodiment, four sets of red light led are used. The package unit 2 〇, the five sets of green LED package unit 3 〇 and the three sets of blue LED package units are arranged at a predetermined position according to the color temperature of the white light to be controlled, and the same purpose can achieve the purpose of adjusting the color temperature. Please refer to the ninth embodiment, which is a fifth embodiment of the present invention, which has an anti-glare and color-adjustable LED white light illumination module, which also includes a carrier 1 〇 and a plurality of red lights. The LED package unit 2, the majority of the green LED package unit 3, and the majority of the blue LED package unit 40, but the main difference from the first preferred embodiment is: In this embodiment, five sets of red light are used. ] 0 package unit 2 〇, seven groups of green LED package unit 3 〇 and four sets of blue LED package unit 4 〇, and according to the desired white color temperature to be placed at a predetermined position, can achieve 12 M359638 color temperature adjustment purpose . Please refer to the tenth figure. The sixth preferred embodiment disclosed in the present invention has an 'anti-glare and color-adjustable LED white light illumination module 6 〇〇, which also includes a carrier 1 〇, a majority of red light The main difference between the LED package unit 2, the majority of the green LED package unit 30, the majority of the blue LED package unit 4, and the first preferred embodiment is that: the embodiment has both anti-glare and adjustable The color temperature LED white light illumination module 600 further includes a fourth light LED package unit 7 〇, the fourth light LED package unit includes a fourth light LED chip 71, a cover body 7 2 and a majority The fourth light LED chip 71 is capable of being turned on at a predetermined current to emit a fourth light having a wavelength of 560 nm to 6 10 nm or 470 nm to 5 0 The light beam of the 〇nm spectrum range is generally referred to as a yellow light (Y) according to the spectrum of the eleventh figure, and the latter is generally referred to as a blue light (C); the cover body 7 2 is made of a light transmissive material, such as Epoxy, Epoxy, glass, etc., φ, the cover 7 2 is covered by the fourth On the LED wafer 71, the diffusing particles 7 3 are dispersed in the covering body 7 2 , and the diffusing particles 7 3 are made of a material having high reflectivity or high scattering rate, for example, silver. Resin, Silicon or other materials. The fourth light LED sealing sheet is arranged on the carrier 1 依 according to a predetermined state, and is electrically connected to the carrier 10 to supply the first body by the carrier 1 The four-light LED package unit 70 currents, so that the fourth light LED chip 7 l· can emit fourth light different from red light, green light, and blue light. 13 M359638 One master: Medium—The fourth light emitted by the fourth light LED package unit 7 Q is a mixed light of red light and green light, which can be mixed with blue light to form white light. The main white light source has a wavelength in the central region of the spectrum (Υ) that can be mixed with the self-line green beam to make the color temperature close to the spectrum, and the block 'wavelength in the spectrum is relatively reduced. Land balance. Similarly, the yellow light (7) is mixed with the white red light beam or the white light beam, and the color temperature is also adjusted to the central region of the spectrum. The white light wavelength Ι& reduces the thermal drift phenomenon to make the illuminance relatively close to the bright positive white light. Please refer to the twelfth embodiment, which is a seventh embodiment of the present invention, which has an anti-glare and color temperature LED white light illumination module 7 〇〇, which also includes a carrier 10 and a plurality of red lights. The LED package unit 2 〇, the majority of the green S LED package unit 3 q, the number of the blue LED package unit 40 0 'only differs from the first preferred embodiment in that: this embodiment is further provided with a diffusion sheet 8 〇, Located in the direction of illumination of the LED package units 20, 30, 40, and at a predetermined distance from the LED package units 20, 30, 4, the diffusion sheet 8 has a diffusion plate 8 1 and a plurality of Diffusion particles 8 2 ; the diffusion plate 8 1 is made of a light-transmissive material, such as epoxy resin (Epoxy), silicone (Silicone), glass, etc., such diffusing particles 8 2 dispersion In the diffusion plate 81, the diffusion particles 82 are made of a material having high reflectance or high scattering rate, such as silver, resin, silicone or other materials. By increasing the setting of the diffusion plate 80, when the 14 M359638 scatter plate is not set, the color light generated by the mixed light at the peripheral position (as shown in the tenth figure) is eliminated (for example, Figure 12 shows 'and use the second mixed light' to increase the uniformity of the mixed light. Please refer to the thirteenth embodiment, which is an eighth embodiment of the present disclosure, and an Lm) white light illumination module 8 with anti-glare and color temperature, which also includes a carrier 10 and a plurality of The red LED package unit 2, the majority of the green LED package unit 3, and the majority of the blue LED package unit 40, but the main difference from the seventh preferred embodiment is that: the diffusion sheet 80 is called off, A light-increasing sheet 9 i is added to the light-emitting direction of the LED package units 20, 30, and 40, and the light-increasing sheet 9 can be used to enhance the light-concentrating effect to make the distance at which the light can be diverged longer. Please refer to FIG. 14 , which is a ninth preferred embodiment of the present invention, which has an anti-glare and color temperature LED white light illumination module 9 〇〇, which also includes a carrier 1 〇 and a plurality of red LEDs. The package unit 2, the majority of the green LED package unit 30, and the majority of the blue LED package unit _40, but the main difference from the first preferred embodiment is that the carrier 10 is further provided with a protective cover. 9 2, the protective cover 9 2 can be made of light-transmitting materials such as epoxy resin, silicone, glass, etc., covering the LED package units 2 〇, 3 〇, 4 0 to prevent foreign matter from colliding or foreign matter from adhering to the LED package units 20, 30, 40. Finally, although the above embodiments are to package the LED chips of various colors and then mount them on the carrier, in fact, the present invention can also use the LED chip without 15 M359638 package to achieve the same purpose. Firstly, at least four red LED chips, at least four green LED chips and at least four blue LED chips are directly mounted or flip-chip mounted on the carrier, and then covered with a predetermined pattern of diffusion particles. The body is disposed on the carrier to completely cover the red, green, and blue LED chips; thereby, the effect of preventing glare and color temperature can be achieved. In addition, other types may be used for the purpose of achieving the creation by using an unpackaged wafer, such as at least three red LED chips, at least three green LED chips, at least three blue LED chips, and at least one fourth light lED. The wafer (described in the foregoing embodiments for the fourth optical wafer, which will not be further described herein) is directly mounted or flip-chip bonded to the carrier, and then covered with a predetermined pattern of diffusing particles. The body is disposed on the carrier to completely cover the red, green, and blue LED chips; thus, the effect of the anti-glare and the color temperature can be achieved. 16 M359638 [Simple description of the diagram] 'The first figure is a schematic diagram of a polycrystalline light-emitting diode irradiation method. The second figure is a schematic diagram of a package structure of a polycrystalline light-emitting diode. The third figure is a schematic diagram of the setting of the first preferred embodiment of the present creation. - Figure 4 is a cross-sectional view of a partial member of the preferred embodiment shown in the third figure. * The fifth figure is a schematic diagram of the light mixing effect of the preferred embodiment shown in the third figure. Figure 6 is a schematic view showing the arrangement of the second preferred embodiment of the present invention. The seventh figure is a schematic diagram of the setting of the third preferred embodiment of the present creation. • The eighth figure is a schematic view of the arrangement of the fourth preferred embodiment of the present creation. The ninth drawing is a schematic view showing the arrangement of the fifth preferred embodiment of the present creation. The tenth figure is a schematic diagram of the light mixing effect of the sixth preferred embodiment of the present invention. The eleventh figure is a schematic diagram of the spectrum. Figure 12 is a schematic view showing the arrangement of the seventh preferred embodiment of the present invention. The thirteenth drawing is a schematic view showing the arrangement of the eighth preferred embodiment of the present creation. Figure 14 is a schematic view showing the arrangement of the ninth preferred embodiment of the present creation. [Main component symbol description] "Knowledge" Blue LED 3 Blue LED 6 Diffusion particle 9 Red LED 1 Green LED 2 'Red LED 4 Green LED 5 Sealing 7 Package Base 8 "This Creation" 17 M359638 " A preferred embodiment" LED white light illumination module with anti-glare and color temperature 1 〇〇 carrier 1 0 red LED package unit 2 0 red LED chip 2 1 cover 2 2 diffusion particles 2 3 green Light LED package unit 30 Green LED chip 3 1 Cover 3 2 Diffused particles 3 3 Blue LED package unit 4 Blue LED chip 4 1 Diffusion particles 43 Cover 4 2 "Second preferred embodiment" Anti-glare and color-adjustable LED white light illumination module 2 〇〇 carrier 50 circuit board 5 1 red LED package unit 2 0 blue LED package unit 40 green LED package unit 3 第三 "Third preferred embodiment LED white light illumination module with anti-glare and color temperature 3 〇〇 carrier 6 0 circuit board 6 1 red LED package unit 2 0 blue LED package unit 4 〇 green LED package unit 3 第四 "fourth comparison Good example" LED white light illumination module with anti-glare and color temperature 4 0 Body 1 〇Red LED sealing unit 2 〇18 M359638 Green LED package unit 3 0 Blue LED package unit 4 第五 "Fifth preferred embodiment" LED white light illumination module with anti-glare and color temperature 5 0 0 carrier 1 0 red LED package unit 2 0 green LED package unit 3 0 blue LED package unit 40 "sixth preferred embodiment" LED white light illumination module with anti-glare and color temperature 6 0 0 I carrier 10 red LED package unit 2 0 green LED package unit 3 0 fourth LED package unit 7 0 blue LED package unit 4 0 light LED chip 7 1 cover 7 2 diffusion particles 7 3 Seven preferred embodiments LED white light illumination module with anti-glare and color temperature 70 0 0 carrier 1 0 red LED package unit 2 0 φ green LED package unit 3 0 blue LED package unit 4 0 diffusion sheet 80 diffusion particles 8 2 diffusion plate 8 1 "eighth preferred embodiment" LED white light illumination module with anti-glare and color temperature 80 0 0 carrier 1 0 red LED package unit 2 0 green LED package Unit 3 0 Blue LED package unit 40 0 diffuser 8 0 brightness enhancement sheet 9 1 19 M359638 "Ninth preferred embodiment Both glare and adjustable color temperature of white LED lighting module 90 020 30 green LED packaging unit packaging the blue LED unit 40 protection cover 10 carrying a red LED packaging unit 9220