1357475 六、發明說明： _ 【發明所屬之技術領域】 _ 本發明係與照明用燈泡有關，更詳而言之係指一種易 於調整色溫之三波長led白光照明燈泡結構。 【先前技術】 按’由於發光二極體（Light Emitting Diode，簡稱LED) 具有低耗能、高效率的特性及優點，因此目前各國及業界 * 皆將此一技術列為策略發展的重點技術，以取代現有傳統 之照明設備。 第一圖所示’現有之LED照明燈泡，係將多數可發出 紅光、綠光、藍光LED元件1、2、3電性連接於一電路 板4上’再由該電路板4連接一連接端子（圖中未示），以 由該連接端子與電源（或燈座）電性連接，使能利用三原 色光（紅、綠、藍）混出可供照明用之白光而照射。但此 籲種利用紅、綠、藍光加以混成白光之方式，除了波長配合 要能配出白色外’光強度亦要有適當的配比，因此在混光 實施上有著相當之困難度，常見白光僅出現在光束交集的 區域中央’遠離中央區域的混光色溫會逐漸趨近紅、綠、 藍二廣色光，在照明區域形成色彩繽紛的色塊，為混光不 均所造成之缺失，使照明效果不佳。 讀參閱二圖所示，另有一種LED照明燈泡，係將多數 可發出紅光、綠光、藍光LED元件丄、2、3電性連接於 1357475 一電路板4上，再由該電路板4連接一連接端子（圖中未 ,, 示），並於該電路板4前置設一透明燈罩5，該透明燈罩5 _ 内部則加入螢光粉（劑）6，以利用三原色光（紅、綠、 藍）經由螢光粉之混合而混出可供照明用之白光。但此種 方式所能照明之廣度有限，且因LED元件1、2、3發光 的同時必然伴隨著高熱，而螢光粉6本身並不耐高溫，故 當LED元件溫度提高時，螢光粉會快速產生質變，造成 LED元件產生光衰現象，嚴重影響照度或明亮度。 • 其次，LED的波長取決於磊晶層的結構及組成的材 料，更重要的是晶格匹配的課題，導致半導體因溫度的高 低致生波長飄移的問題不容忽視。就開機初期和通電一段 時間來說，開機初期隨著紅光發光效率的強度，該RGB三 原色光混出白色偏紅的光源；通電一段時間，隨著發光效 率較高的藍光逐步增強，讓混光色溫偏向冷光系的白色偏 藍光，故於兩段時期所混光的色溫各不相同。依光譜的角 φ 度來看，波長由暖色系移動到冷色系的熱飄移範圍過大， 嚴重影響混光色溫的白平衡，相對減損光源的照度。 另外，亦有一種利用一發白光之LED充當主要光源， 並於白光LED附近置設一組由紅、綠、藍光等LED構成 之色溫補償單元，即當白光LED亮度因螢光層質變而快速 下降而形成光衰時，以紅、綠、藍光LED隨著衰變的白光 LED進行單顆或多顆之電流強度調整。但此種方式不僅無 法精確地恢復至原先白光之標準色溫，且欲精準地控制單 5 1357475 - 顆或多顆之電流強度，於實際上有著相當高之難度而不符 V 經濟效益。 【發明内容】 有鑑於此，本發明之主要目的乃在提供一種易於調整 色溫之三波長led白光照明燈泡結構，係能減少混光不均 •之情形，使照明效果較佳。 本發明之另一主要目的乃在提供一種易於調整色溫之 •二波長LED白光照明燈泡結構，係可將色溫於冷色系白光 至暖色系白光間加以調整者。 本發明之再一主要目的乃在提供一種易於調整色溫之 二波長LED白光照明燈泡結構，係可形成高演色性之三波 長白光者。 緣此，本發明乃提供一種易於調整色溫之三波長LED 白光照明燈泡結構，包含有：一承載基板；至少三紅光lED 鲁封裝兀件，係設置並電性連接於該承载基板上，具有一可 發出紅光之LED晶片、一罩覆於該紅光LED晶片上之罩 覆體及多數佈設於該罩覆體中之擴散粒子；至少三綠光 LED封裝元件，躲置並電性連接於該承餘板上，具有 一可發出綠光之LED晶片、-罩覆於該綠光咖晶片上 之罩覆體及多數佈設於該罩覆體中之擴散粒子；至少三藍 光LED封裝元件，係設置並電性連接於該承載基板上，且 有一可發出藍光之LED 3、-軍覆於雜光LED晶片 1357475 - 上之罩覆體及多數佈設於該罩覆體中之擴散粒子；一罩型 ，燈殼，係連接於該承載基板之周緣；一導電件，係連接於 該罩型燈殼上，並與該承載基板電性連接，用以將外部之 電源導入至該承載基板上。 【實施方式】 為使貴審查委員能對本發明之特徵與特點有更進一 步之了解與認同’茲列舉以下較佳實施例並配合圖式說明 • 如下： 凊參閱第二及第四圖’係本發明第一較佳實施例所提 供一種易於調整色溫之三波長LED白光照明燈泡結構丄〇 0，包含有一承載基板1 0、多數紅光LED封裝元件2 〇、 多數綠光LED封裝元件3 0、多數藍光LED封裝元件4 〇、一罩型燈殼5 0及一導電件6 0 :其中： 請參閱第三圖，該承載基板i 〇，為一呈圓形板狀之 鲁印刷電路板（PCB)，佈設有多數預定態樣之電路佈線（圖 中末示）。 請參閱第三圖及第四圖，該紅光LED封裝元件2 Q， 包含有一紅光LED晶片2 1、一罩覆體2 2及多數之擴散 粒子2 3，該紅光LED晶片2 1係能接通預定電流而發射 出紅光，該罩覆體2 2係由透光之材質所製成，如環氧樹 脂（ppoxy)、矽膠（Silicone)、玻璃…等透光材質，該罩 覆體2 2係覆蓋於該紅光LED晶片2 1上，該等擴散粒子 7 1357475 -2 3係散佈於該罩覆體2 2中，該擴散粒子2 3係由具高 .. 反射率或高散射率之材料所製成，例如銀（Silver)、樹脂、 矽（Silicon)或其它材質。該等紅光LED封裝元件2 〇係 依預定態樣佈設於該承載基板i 〇上，並與該承載基板丄 0電性接通，以由該承載基板1 〇供給該等紅光LEd封裝 几件2 0電流，以使該紅光LED晶片2 1能發射出紅光。 請參閱第三圖，該綠光LED封裝元件3 〇，與該紅光 LED封裝元件2 〇相同具有一綠光LED晶片（圖中未示）、 鲁叾覆體32及多數擴散粒子3 3;惟該綠光LED封裝元 件3 0與該紅光LED封裝元件2 〇之差異僅在於所發出之 光色不同而已，即紅光LED封裝元件2 〇係發出紅光，而 綠光LED封裝元件3㈣發$綠光，並肖樣設於該承載基 板1 〇上，並與該承载基板1 0電性接通。 明參閱第二圖，該藍光LED封裝元件4 〇，與該紅光 LED封裝το件2 Q相同具有—藍光LED晶片（圖中未示）、 Φ罩覆體4 2及多數擴散粒子4 3 ;惟該藍光LED封裂元 件4 0與《亥紅光LED封裝元件2 〇之差異僅在於所發出之 光色不同而已’即紅光LED封裝元件2 q係發出紅光，而 藍光LED封Q則發丨藍光，並目樣設於該承载基 板1 〇上並與該承载基板1 Q電性接通。 、4 0非發光方向之位 、月二閱第―圖’該罩型燈殼50係由不透光之材質所 製成’係罩設於該承载基板1 Q之周緣上 ，並位於該紅、 綠、藍光LED封裝元件2 Q、3 〇 13^7475 置上，用以支擇並同時保護該承載基板1 〇。 請參閱第三圖，該導電件6〇,具有—方型 及一導電端子6 2，該方型殼體6 1係連接於診 1 50上，且該方型殼體61係由絕緣材質所製Ζ型燈殼 電端子6 2係由導電材質所製成，係置於該方型導 中，並於該承載基板！ ◦電性連接，且該二 =6 i m該方型殼體61外，於與 中未不），而由外部之電源由導電端子6 2導入=座（圖 板1 0上’再由該承載基板i 〇提供該等至载基 封裝元件2〇、30、4_，使該等紅亦2咖 封裳元件2G、3G、4G能發“、綠、以。先LED 是以，上述即為本發明第-較佳實施_提^ 色溫之三波長LED白光照明燈泡結構丄◦ 〇之各^整 其組裝方式介紹，接著再將其特點介紹如下： 及 由於該各紅、綠、藍光LED料元件2q 〇之罩覆财㈣設有呈預絲樣之擴散粒子，且擴散 子在罩覆體内之散佈密度及數量、位置並不相同， 紅、綠、藍光LED晶片分別發出紅、綠、藍光時，立光^ 經由該擴餘子較佳之㈣轉“分^，以提供較佳 之光線散射路徑，使紅、綠、藍光之光束能近衫全重義， 而能均勻地混成白光，並不致有其它顏色之色塊產生，且呈 未能均句混合之色塊區域僅會發生於光形之周緣區域其 所佔之比例遠低於人眼所能見及<比率，以達成均句混光 1357475 ' 之效果，況且光線經由擴散粒子所發散後，將使照明之廣 、 度更佳。 ' 再者，由於本實施例易於調整色溫之三波長LED白光 照明燈泡結構1 0 0，係具有多數各色紅、綠、藍光之 封裝元件，因此可利用佈設於承載基板上位置之置換或調 配，來達成調整色溫之功效，即使混成之白光能於冷色系 白光至暖色系白光間進行調整，如室内照明或室外照明所 採用不同色溫之白光，以能因應不同之照明需求。藉此， ♦本發明易於調整色溫之三波長LED白光照明燈泡結構工0 0，不僅具有較佳之混光效果，使能光而盈 其它色塊之產生，更具備藉由佈設於承載基板上各色LED 封裝元件之數量、設置位置之變化，來達成調整色溫之效 果，並防止產生眩光之情形’而無需習知技術必須：變電 流、電壓之複雜方式，使其調整色溫之方式較為簡易。 請參閱第五圖，係本發明第二較佳實施例所^提供 •易於調整色溫之三波長led白光照明燈泡結構= 與第一較佳實施例相同包含有一承載基板1 0、夕其 LED封裝元件2 〇、多數綠光LED封裝元件3 〇、^、工光 光LED封裝元件4 〇、-罩型燈殼5 〇及—導夕數藍 惟與第一較佳實施例之主要差異在於： 6 〇 該易於調整色溫之三波長LED白光照明燈泡 0更包含有一圓弧狀之增光片7〇,該增光片7 光之材質所製成，如環氧樹脂（Epoxy)、矽膠（SiiJH)透 13574751357475 VI. Description of the invention: _ [Technical field to which the invention pertains] _ The present invention relates to a bulb for illumination, and more particularly to a three-wavelength led white light bulb structure that is easy to adjust color temperature. [Prior Art] According to 'light Emitting Diodes (LEDs), which have low energy consumption and high efficiency, they are listed as a key technology development strategy by countries and industries*. To replace the existing traditional lighting equipment. In the first figure, the existing LED lighting bulbs are characterized in that a plurality of red, green and blue LED elements 1, 2, 3 are electrically connected to a circuit board 4, and then a connection is made by the circuit board 4. A terminal (not shown) is electrically connected to the power source (or the socket) by the connection terminal, so that the three primary colors of light (red, green, and blue) can be used to illuminate the white light for illumination. However, this method uses red, green, and blue light to mix white light. In addition to the wavelength matching, it is necessary to match the white light. The light intensity must also have an appropriate ratio. Therefore, it is quite difficult to implement the light mixing. Common white light. It only appears in the center of the intersection of the beams. The color temperature of the mixed light away from the central area will gradually approach the red, green and blue light, forming a colorful color block in the illumination area, which is caused by the uneven mixing. The lighting is not good. As shown in the second figure, there is another type of LED lighting bulb, which is characterized in that a plurality of red, green and blue LED elements 丄, 2, 3 are electrically connected to a 1357475 circuit board 4, and then the circuit board 4 A connection terminal (not shown, shown) is connected, and a transparent lamp cover 5 is disposed in front of the circuit board 4, and a phosphor powder (agent) 6 is added inside the transparent lamp cover 5_ to utilize the three primary colors of light (red, Green, blue) mixed with white light for illumination through the mixing of phosphor powder. However, the breadth of illumination in this way is limited, and the LED elements 1, 2, and 3 are accompanied by high heat, and the phosphor powder 6 itself is not resistant to high temperature, so when the temperature of the LED element is increased, the phosphor powder It will quickly produce a qualitative change, causing the LED component to produce light decay, which seriously affects the illumination or brightness. • Secondly, the wavelength of the LED depends on the structure and composition of the epitaxial layer. What is more important is the problem of lattice matching. The problem of semiconductor wavelength drift due to high temperature can not be ignored. In the initial stage of power-on and power-on for a period of time, with the intensity of red light-emitting efficiency at the beginning of the booting, the RGB three primary colors of light mix out a white reddish light source; after a period of power-on, the blue light with higher luminous efficiency is gradually enhanced, allowing mixing The color temperature is biased toward the white light of the cold light system, so the color temperature of the light mixed in the two periods is different. According to the angle φ of the spectrum, the thermal drift range of the wavelength from the warm color system to the cool color system is too large, which seriously affects the white balance of the mixed color temperature and relatively reduces the illumination of the light source. In addition, there is also a light source that uses a white light as a main light source, and a set of color temperature compensation units composed of red, green, blue light and the like are disposed near the white light LED, that is, when the brightness of the white light LED changes rapidly due to the quality of the fluorescent layer. When the light decays, the red, green, and blue LEDs are adjusted with the current intensity of the single or multiple white LEDs. However, this method can not only accurately restore the original color temperature of the original white light, but also to accurately control the current intensity of the single 5 1357475 - or more, in fact, it has a relatively high difficulty and does not meet the economic benefits of V. SUMMARY OF THE INVENTION In view of the above, the main object of the present invention is to provide a three-wavelength led white light bulb structure that is easy to adjust the color temperature, which can reduce the unevenness of light mixing, and the illumination effect is better. Another main object of the present invention is to provide a two-wavelength LED white light bulb structure which is easy to adjust the color temperature, and can adjust the color temperature between cool white light and warm white light. Still another main object of the present invention is to provide a two-wavelength LED white light bulb structure which is easy to adjust the color temperature, and which is capable of forming a high color rendering three-wavelength white light. Accordingly, the present invention provides a three-wavelength LED white light bulb structure that is easy to adjust color temperature, and includes: a carrier substrate; at least three red light lED package components are disposed and electrically connected to the carrier substrate, An LED chip capable of emitting red light, a cover covering the red LED chip, and a plurality of diffusion particles disposed in the cover; at least three green LED package components, hidden and electrically connected On the lining plate, there is an LED chip capable of emitting green light, a cover covering the green ray wafer, and a plurality of diffusion particles disposed in the cover; at least three blue LED package components And being disposed on the carrier substrate, and having a blue light emitting LED 3, a cover covering the stray light LED chip 1357475, and a plurality of diffusion particles disposed in the cover body; a cover type, a lamp housing is connected to the periphery of the carrier substrate; a conductive member is connected to the cover type lamp housing and electrically connected to the carrier substrate for introducing an external power source to the carrier substrate on. [Embodiment] In order to enable the reviewing committee to have a better understanding and recognition of the features and features of the present invention, the following preferred embodiments will be described with reference to the following figures: • Refer to the second and fourth figures. The first preferred embodiment of the present invention provides a three-wavelength LED white light bulb structure 易于0 that is easy to adjust color temperature, and includes a carrier substrate 10, a plurality of red LED package components 2 〇, and a plurality of green LED package components 30. Most of the blue LED package components 4 一, a cover type lamp housing 50 and a conductive member 60: wherein: Referring to the third figure, the carrier substrate i 〇 is a circular printed circuit board (PCB) ), the circuit layout of most of the predetermined aspects is arranged (shown at the end of the figure). Referring to the third and fourth figures, the red LED package component 2 Q includes a red LED chip 21, a cover 2 2 and a plurality of diffusion particles 23, and the red LED chip 2 1 is The predetermined current can be turned on to emit red light, and the cover 2 2 is made of a light transmissive material, such as a transparent material such as phenol, silicone, or glass. The body 2 2 is coated on the red LED chip 2 1 , and the diffusion particles 7 1357475 - 2 3 are dispersed in the cover 2 2 , and the diffusion particles 23 are made of high reflectance or high. The material of the scattering rate is made of, for example, silver, resin, silicone or other materials. The red LED package component 2 is disposed on the carrier substrate i 依 according to a predetermined state, and is electrically connected to the carrier substrate ,0 to supply the red light LEd package by the carrier substrate 1 〇 A current of 20 is generated so that the red LED chip 2 1 can emit red light. Referring to the third figure, the green LED package component 3 〇 has a green LED chip (not shown), a reed body 32 and a plurality of diffusion particles 33 in the same manner as the red LED package component 2 ;; However, the difference between the green LED package component 30 and the red LED package component 2 is only that the emitted light color is different, that is, the red LED package component 2 emits red light, and the green LED package component 3 (4) The green light is emitted, and is disposed on the carrier substrate 1 and electrically connected to the carrier substrate 10 . Referring to the second figure, the blue LED package component 4 相同 has the same blue light LED chip (not shown), Φ cover 4 2 and most diffusion particles 4 3 as the red LED package τ 2 2 ; However, the blue LED chipping component 40 differs from the "red LED package component 2" only in that the emitted light color is different. That is, the red LED package component 2 q emits red light, and the blue LED package Q emits red light. The blue light is generated and placed on the carrier substrate 1 and electrically connected to the carrier substrate 1 Q. 4, the position of the non-illuminating direction, the second reading of the first picture - the 'the cover type lamp housing 50 is made of a material that is opaque, 'the cover is disposed on the periphery of the carrier substrate 1 Q, and is located in the red The green and blue LED package components 2 Q, 3 〇 13^7475 are placed to support and simultaneously protect the carrier substrate 1 〇. Referring to the third figure, the conductive member 6A has a square shape and a conductive terminal 62. The square housing 61 is connected to the medical meter 50, and the square housing 61 is made of an insulating material. The 灯-type lamp housing electrical terminal 6 2 is made of a conductive material and is placed in the square guide and on the carrier substrate! ◦ electrically connected, and the two = 6 im outside the square housing 61, in the middle and not), and the external power source is introduced from the conductive terminal 62 into the = seat (on the board 10' and then by the carrier The substrate i 〇 provides the above-mentioned carrier-based package components 2 〇 , 30 , 4 _ , so that the red and 2 garnished 2G, 3G, 4G can emit ", green, and the first LED is, the above is the Inventive first-best implementation _ to raise the color temperature of the three-wavelength LED white light bulb structure 丄◦ 各 each of the whole assembly method, and then introduce its features as follows: and because of the red, green, blue LED material components 2q 〇 覆 覆 ( (4) There are pre-filament-like diffusion particles, and the diffusion density and quantity and position of the diffusers in the cover are not the same. The red, green and blue LED chips emit red, green and blue light respectively. When the light beam ^ is preferably (4) turned "divided" to provide a better light scattering path, so that the red, green and blue light beams can be completely weighted, and the white light can be uniformly mixed. The color blocks of other colors are generated, and the color patch regions that are not mixed in the same sentence only occur in the light shape. The proportion of the peripheral area is much lower than that seen by the human eye and the ratio can be achieved to achieve the effect of equalizing the light of 1357475 ', and the light will diffuse through the diffusing particles, which will make the illumination wider and better. Furthermore, since the three-wavelength LED white light bulb structure of the present embodiment is easy to adjust the color temperature, the package component has a plurality of red, green and blue colors, so that the replacement or deployment of the position on the carrier substrate can be utilized. The effect of adjusting the color temperature is achieved, even if the mixed white light can be adjusted between the cool white light to the warm white light, such as white light of different color temperatures used for indoor lighting or outdoor lighting, in order to meet different lighting requirements. The three-wavelength LED white light bulb structure that is easy to adjust the color temperature 0 0 not only has a better light mixing effect, but also enables the generation of light and other color blocks, and has the number of LED package components arranged on the carrier substrate. Set the position change to achieve the effect of adjusting the color temperature and prevent the occurrence of glare' without the need for the prior art: variable current, The complicated method of pressing makes the method of adjusting the color temperature relatively simple. Please refer to the fifth figure, which is a three-wavelength led white light bulb structure which is easy to adjust the color temperature according to the second preferred embodiment of the present invention. The embodiment includes the same carrier substrate 10, the LED package component 2 〇, the majority of the green LED package components 3 〇, ^, the work light LED package component 4 〇, the cover type lamp housing 5 〇, and the number of eves The main difference between the blue and the first preferred embodiment is as follows: 6 〇 The three-wavelength LED white light bulb 0 which is easy to adjust the color temperature further includes an arc-shaped brightening sheet 7〇, which is made of the material of the light 7 Such as epoxy resin (Epoxy), silicone (SiiJH) through 1357475
玻等透储f，係連接於鮮型燈殼5 0上，並位於 該等紅、綠、1於 Η…件2〇、3〇、4〇之發光方向 等、二、綠' 藍光封襄元件20、30、40所發 出之光線距離更長，而可加強聚光效果。 a 請參閱第六®，係本發明第三較佳實施_提供一種 易於5周整色溫之三波長LED白光照明燈泡結構3 〇 〇，其 與第二較佳實施例相同包含有一承載基板i 〇、多數紅光 LED封裝元件2 〇、多數綠光LED封裝元件3 〇、多數藍 光LED封裝元件4 〇、一罩型燈殼5 〇、一導電件6 〇及 一增光片7 〇 ’；惟與第二較佳實施例之主要差異在於： 該增光片7 0’係呈一長型管狀。 另外’雖然上述第二及第三較佳實施例皆增加增光片 之構件，但實際上亦可將增光片改以設置一擴散片（圖中 未示）加以取代。該擴散片具有一擴散平板及多數之擴散 粒子；該擴散平板係由透光之材質所製成，如環氧樹脂 (Ep0Xy)、矽膠（silicone)、玻璃…等透光材質，該等擴 散粒子係散佈於該擴散平板中，該擴散粒子8 2係由具高 反射率或高散射率之材料所製成，例如銀（Silver)、樹脂、 矽（Silicon)或其它材質。 藉由增加一擴散片之設置，可使原本未設置擴散片 時’其混光後之光線於周緣位置所產生之色塊加以消除， 而利用第二次混光，以增加混光之均勻度。 請參閱第七圖，係本發明第四較佳實施例所提供一種 1357475 -易於難色溫之三波長LED白絲日叫祕構4 〇 〇，立 '與第一較佳實施例相同包含有-承载基板工〇、多數紅光 LED封裝元件2 Q、多數綠光LED封震元件3 q、多數藍 光㈣封震元件40、一罩型燈殼5〇及-導電件80 ; 惟與第一較佳實施例之主要差異在於： 該導電件8 0之外周面上形成有一外螺紋8 2，且該 外螺紋8 2係由可導電之材質所製成，並與該承載基板工 0電性連接，以由該外螺紋8 2直接旋入於現有一般供燈 參泡置設之燈座中，使本發明能立即運用於現有之燈座上。 另外於本實施例中，更具有多數之第四光LED封裝元 件9 0，該第四光LED封裝元件9 〇同樣包含有一第四光 LED晶片、一罩覆體及多數之擴散粒子；該第四光led晶 片係能接通於預定電流，而發射出第四光，該第四光係一 波長在5 6 Onm〜6 1 〇nm或4 7 Onm〜5 0 Onm頻 譜範圍的光束，前者依光譜圖來看泛稱一黃光（Yell〇w φ Light ’ YL) ’後者泛稱一青光或稱藍綠光（Bluish Green Light，BGL)。 該等第四光LED封裝元件g 〇係與該承载基板1 〇電 性接通，以由該承載基板1 〇供給該等第四光封裝元 件9 0電流，以使該第四光LED晶片能發射出有別於紅 光、綠光、藍光之第四光。 其中，該第四光LED封裝元件9 〇所發出之第四光為 一黃光，黃光為紅光與綠光的混色光，可與藍光混成白光。 12 1357475 • 请參閱第八圖，係本發明第五較佳實施例所提供一種 易於調整色溫之三波長led白光照明燈泡結構5 〇 〇，其 與第一較佳實施例相同包含有一承載基板1 0、多數紅光 LED封裝元件2 〇’、多數綠光LED封裝元件3 〇,、多數 藍光LED封裝元件4 〇，、一罩型燈殼5〇及一導電件6 〇;惟與第一較佳實施例之主要差異在於： 前述之實施例中各光色封裝元件係採用LEDIjAMp (插件型LED)型式之LED，而本實施例中該等紅光、綠 •光、藍光LED封裝元件2 Q，、3 0，、40,則採用為SMD LED (Surface mount device LED)，即貼片型 LED (亦稱表 面黏著型LED)，其差異僅在封裝態樣不同，但同樣可達成 本發明之目的。 另外，請參閱第九圖，係本發明第六較佳實施例所提 供一種易於調整色溫之三波長led白光照明燈泡結構6 〇 0，其中該等紅光LED封裝元件2 〇，’、多數綠光LED封 籲裝凡件3 0”、多數藍光LED封裝元件4 〇，，，亦可採用高 功率（如1瓦（W)或以上）之LED封裝元件，而能減少所 需設置之數量，其同樣可達成本發明之目的。 13 1357475 ' 【圖式簡單說明】 -第一圖係習用一種LED燈泡之照明狀態示意圖。 第一圖係習用另一種LED燈泡之照明狀態示意圖。 第二圖係本發明第一較佳實施例之立體圖。 第四圖係第一圖所示較佳實施例之局部構件示意圖。 第五圖係本發明第二較佳實施例之立體圖。 第六圖係本發明第三較佳實施例之立體圖。 第七圖係本發明第四較佳實施例之立體圖。 第八圖係本發明第五較佳實施例之立體圖。 第九圖係本發明第六較佳實施例之立體圖。 【主要元件符號說明】 「習知」 紅光LED元件1 綠光LED元件2 : 藍光LED元件3 電路板4 •透鴨$光粉6 「本發明」 易於調整色溫之三波長LED白光照明燈泡結構1 〇 0、2 〇〇、300、400、500、600 承載基板1 0 紅光LED封裝元件2 0 紅光LED晶片2 1 罩覆體2 2 擴散粒子2 3 綠光LED封裝元件3 〇 1357475 \ 罩覆體32 藍光LED封裝元件4 0 擴散粒子43 導電件6 0 導電端子6 2 增光片7 0’ 外螺紋8 2 φ 紅光LED封裝元件2 0’ 藍光LED封裝元件4 0 ’ 綠光LED封裝元件3 0 ’’ 擴散粒子3 3 罩覆體4 2 罩型燈殼5 0 方型殼體61 增光片7 0 導電件8 0 第四光LED封裝元件9 〇 綠光LED封裝元件3 〇 ’ 紅光LED封裝元件2 0，， 藍光LED封裝元件4 0’’ •r T· 15Glass, etc., is connected to the fresh lamp housing 50, and is located in the red, green, 1 in the Η... 2 〇, 3 〇, 4 〇 light direction, etc., 2, green 'blue light blocking The elements 20, 30, 40 emit a longer distance of light and enhance the concentrating effect. a Referring to the sixth embodiment, a third preferred embodiment of the present invention provides a three-wavelength LED white light bulb structure 3 that is easy to color temperature for 5 weeks, which includes a carrier substrate i 相同 as in the second preferred embodiment. , most red LED package components 2 多数, most green LED package components 3 〇, most blue LED package components 4 〇, a cover type lamp housing 5 〇, a conductive member 6 〇 and a brightness enhancement sheet 7 〇 '; The main difference of the second preferred embodiment is that the brightness enhancement sheet 70' has a long tubular shape. Further, although the above second and third preferred embodiments all add members of the brightness enhancement sheet, in practice, the brightness enhancement sheet may be replaced by a diffusion sheet (not shown). The diffusion sheet has a diffusion plate and a plurality of diffusion particles; the diffusion plate is made of a light transmissive material, such as epoxy (Ep0Xy), silicone, glass, etc., such diffusing particles. The diffusion particles are made of a material having high reflectivity or high scattering rate, such as silver, resin, silicone or other materials. By adding a diffusion sheet setting, the color patches generated by the light after the light mixing at the peripheral position can be eliminated when the diffusion sheet is not provided, and the second mixed light is used to increase the uniformity of the mixed light. . Referring to FIG. 7 , a third preferred embodiment of the present invention provides a 1357475-three-wavelength LED white light that is easy to be difficult to color temperature, and the same as the first preferred embodiment includes - The carrier substrate process, the majority of the red LED package components 2 Q, the majority of the green LED light-blocking components 3 q, the majority of the blue (four) vibration-sense components 40, a cover-type lamp housing 5 〇 and the conductive member 80; The main difference of the preferred embodiment is that: an external thread 82 is formed on the outer peripheral surface of the conductive member 80, and the external thread 82 is made of an electrically conductive material and electrically connected to the carrier substrate. The present invention can be immediately applied to the existing lamp holder by directly screwing the external thread 82 into the existing lamp holder which is generally provided for the lamp. In addition, in this embodiment, a fourth LED package component 90 further includes a fourth LED chip, a cover, and a plurality of diffusion particles. The four-light LED chip can be turned on at a predetermined current to emit a fourth light, and the fourth light is a light beam having a wavelength in the range of 5 6 Onm~6 1 〇nm or 4 7 Onm~5 0 Onm, the former The spectrum shows a yellow light (Yell〇w φ Light ' YL) 'The latter is generally called a blue light or blue light (Bluish Green Light, BGL). The fourth optical LED package component g is electrically connected to the carrier substrate 1 to supply the fourth optical package component 90 current from the carrier substrate 1 to enable the fourth LED chip to It emits a fourth light that is different from red, green, and blue light. The fourth light emitted by the fourth LED package component 9 is a yellow light, and the yellow light is a mixed light of red light and green light, and can be mixed with blue light to form white light. 12 1357475 - Please refer to the eighth embodiment, which is a three-wavelength led white light bulb structure 5 易于 which is easy to adjust color temperature according to the fifth preferred embodiment of the present invention, and includes a carrier substrate 1 as in the first preferred embodiment. 0, most red LED package components 2 〇 ', most green LED package components 3 〇, most blue LED package components 4 〇, a cover type lamp housing 5 〇 and a conductive member 6 〇; The main difference between the preferred embodiments is that the LEDs of the foregoing embodiments use LEDIjAMp (plug-in type LED) type LEDs, and in the present embodiment, the red, green, and blue LED package components 2 Q , 3 0, 40, is used as SMD LED (Surface mount device LED), that is, chip-type LED (also known as surface-adhesive LED), the difference is only in the package aspect, but also can reach the cost of the invention purpose. In addition, referring to the ninth embodiment, a three-wavelength led white light bulb structure 6 〇0 for easily adjusting the color temperature is provided in the sixth preferred embodiment of the present invention, wherein the red LED package components 2 〇, ', most green The light LED package appeals for everything, and most of the blue LED package components can be used in high-power (such as 1 watt (W) or above) LED package components, which can reduce the number of required settings. It can also achieve the purpose of the invention. 13 1357475 ' [Simple description of the diagram] - The first diagram is a schematic diagram of the illumination state of an LED bulb. The first diagram is a schematic diagram of the illumination state of another LED bulb. The first embodiment of the present invention is a perspective view of a preferred embodiment of the first embodiment of the present invention. The fifth embodiment is a perspective view of a second preferred embodiment of the present invention. The seventh embodiment is a perspective view of a fourth preferred embodiment of the present invention. The eighth embodiment is a perspective view of a fifth preferred embodiment of the present invention. The ninth embodiment is a sixth preferred embodiment of the present invention. Stereogram [Main component symbol description] "Knowledge" Red LED component 1 Green LED component 2 : Blue LED component 3 Circuit board 4 • Translucent duck #光粉6 "Invention" Three-wavelength LED white light bulb structure easy to adjust color temperature 1 〇0, 2 〇〇, 300, 400, 500, 600 carrier substrate 1 0 red LED package component 2 0 red LED chip 2 1 cover 2 2 diffusion particles 2 3 green LED package component 3 〇1357475 \ Cover 32 Blue LED package component 4 0 Diffusion particles 43 Conductor 6 0 Conductor terminal 6 2 Adder 7 0' External thread 8 2 φ Red LED package component 2 0' Blue LED package component 4 0 ' Green LED package Element 3 0 '' Diffusion particle 3 3 Cover 4 2 Cover type lamp housing 0 0 Square housing 61 Brightening sheet 7 0 Conductive member 8 0 Fourth LED package component 9 〇 Green LED package component 3 〇 'Red Light LED package component 2 0,, blue LED package component 4 0'' • r T· 15