M358301 八、新型說明： 【新型所屬之技術領域】 本創作係在提供一種有關晶圓電性測試器之探針卡妹 構改良，主要應用在晶圓電性測試器之探針卡的技術上。 【先前技術】 按，傳統習用的晶圓電性測試器之探針卡，敬參閱第 一圖所示.係習式之結構示意圖。其結構主要是由探針卡 固定治具1、印刷電路板2、微積電製程之探針卡3及微 • 積電製程之懸臂探針4所組合而成。 惟，上述傳統習用的晶圓電性測試器之探針卡，在實 際操作應用上，卻仍然至少存在下顺項尚待克服解決的 問題與缺失： ~ 一、 由於探針是由微積電製程（MEMS)方式做出 來的，其材質為石夕，石夕的本質硬且脆，只要操作不當或是 不小心碰撞，即可能造成探針斷裂，探針耐用度不佳。 二、 探針本身是固定在一玻璃基板上面，其固定方式 籲係利用鑛上金屬（Cu銅)之方式來固定探針，其所使用的設 備’只有原廠才可能有，如遇探針損壞之情形，不易維修 ’即必須將整組探針送回原廠維修，費時費工。 三、 由於印刷電路板與探針卡設計成一體，無法分開 ’造成只要制產品規格變更，即其職_位置改變， 其探針卡上之探針位魏必舰變，崎針卡整組就必須 重新製做新的，必須更換整套的探針卡，成本高。 【新型内容】 4 M358301 有鑑於此’本創作人緣是積極投入研究開發與創新改 良之精神，終於完成之本創作，係在提供一種晶圓電性測 試器之探針卡結構改良。 新型解決問題-所應用的技術手段以及對照先前技術 的功效一係在於：將矽探針改為金屬探針，金屬本身具有 較佳的強度，故不易損壞，耐用度佳。 新型解決問題二所細的技術手段以及賴先前技術 的功效二係在於：即便探針因使用不當而變形，仍然可以 籲利用人工的方式將探針做調整’回復原來的功能，維修容 易，省時省工。 新型解決問題三所應用的技術手段以及對照先前技術 的功效三係在於：將印刷電路板與探針卡設計成兩塊獨立 的電路板，並於印刷電路板與探針卡兩者之間利用軟性的 中間導通介面來做連結，所以只要待測產品的測試點位置 改變時’僅需更換探針卡即可’印刷電路板與中間導通介 面都不需要更換，成本低。 • 【實施方式】 為使專精熟悉此項技藝之人仕業者易於深入瞭解本創 作的構造内容以及所能達成的功能效益，茲列舉一具體實 施例，並配合圖式詳細介紹說明如下： 一種晶圓電性測試器之探針卡結構改良，敬請參閱第 二圖所示：係本創作實施例一之立體組合示意圖。與第三 圖所示：係本創作實施例一之斷面組合示意圖。以及第四 圖所示：係本創作實施例一之使用狀態示意圖。其結構的 M358301 設計方式是射間導通介面1 Q與印刷電路板2 〇結合， 再使用螺絲3 0將巾間導通介面1Q與探針卡固定治具4 0鎖緊，使巾㈣通介面1 〇能完全密合醉印刷電路板 2 0，而達成中間導通介面1〇所需的平面度。再以中間 導通介面10的平面度當作基準面，將探針卡5 〇固定在 中間導通介面1〇下方，藉由調整螺絲6 〇及彈簧塾片7 0來做固定及調整平面度，上述中間導通介面丄〇上、下 對應於印刷電路板2 0與探針卡5 〇的金屬墊2丄、5工 ♦ 處設有由金屬粉末製成的導電介面針丄i，做為印刷電路 板2 0與探針卡5 0電性導通之用，同時探針卡5〇的探 針5 2係由金屬材質製成。 敬請參閱第五、六圖所示：係本創作實施例二之斷面 組合與使用狀態示意圖。上述導電介面針i i包括套管工 2、彈性元件13及三介面針頭14，使其介面針頭11 具有彈性，做為印刷電路板2 〇與探針卡5 〇電性導通之 用。 籲纟宗合上述所陳，本創作係提供—種晶圓電性測試器之 探針卡結構改I 本創作人實際製做絲以及反覆操 作測試之後’證實_可以達到摘作__功能效益 ，同時為目前坊間尚無見聞之「首先創作」，具有「產業 上的利用價值」’誠然已經符合新型專利「實用性」與「 進步性」之成立要義，菱依專利法之規定，向鈞局提出 新型專利之申請。 【圖式簡單說明】 M358301 第一圖：係習式之結構示意圖。 第二圖：係本創作實施例一之立體組合示意圖。 第三圖：係本創作實施例一之斷面組合示意圖。 第四圖：係本創作實施例一之使用狀態示意圖。 第五圖：係本創作實施例二之斷面組合示意圖。 第六圖：係本創作實施例二之使用狀態示意圖。 【主要元件符號說明】 [習式部分] 1 探針卡固定治具 2 印刷電路板 3 微積電製程之探針卡 4 微積電製程之懸臂探針 [本創作部分] 10 中間導通介面 11 導電介面針 12 套管 13 彈性元件 14 介面針頭 2 0 印刷電路板 2 1 金屬墊 3 0 螺絲 40 探針卡固定治具 5 0 探針卡 5 1 金屬墊 5 2 探針 6 0 調整螺絲 70 彈簧墊片M358301 VIII. New Description: [New Technology Field] This creation is to provide a probe card modification for the wafer electrical tester, which is mainly applied to the technology of the probe card of the wafer electrical tester. . [Prior Art] According to the probe card of the conventional wafer electrical tester, refer to the structure diagram of the conventional formula. The structure is mainly composed of a combination of a probe card fixing jig 1, a printed circuit board 2, a probe card 3 for a micro-product process, and a cantilever probe 4 for a micro-product process. However, the probe card of the above-mentioned conventional wafer electrical tester still has at least the problems and defects that need to be solved in the practical application: ~ First, because the probe is made up of micro-products Made by the process (MEMS) method, the material is Shi Xi, the essence of Shi Xi is hard and brittle. As long as the operation is improper or accidental collision, the probe may be broken and the probe durability is not good. 2. The probe itself is fixed on a glass substrate. The fixing method is to fix the probe by means of metal on the ore (Cu copper). The equipment used is only available in the original factory, such as the probe. In case of damage, it is not easy to repair', that is, the entire set of probes must be returned to the original factory for repair, which is time-consuming and labor-intensive. Third, because the printed circuit board and the probe card are designed to be integrated, they cannot be separated. As long as the product specifications change, that is, their position _ position changes, the probe position on the probe card is changed, and the needle card is complete. It is necessary to re-create a new one, and it is necessary to replace the entire set of probe cards, which is costly. [New Content] 4 M358301 In view of the fact that this creative personality is actively investing in research and development and innovation, the final creation of this book is to provide a probe card structure improvement for the wafer electrical tester. New problem-solving - the technical means applied and the effect of the prior art are based on the fact that the 矽 probe is changed to a metal probe, and the metal itself has better strength, so it is not easily damaged and has good durability. The new technical means to solve the problem 2 and the efficacy of the prior art are: even if the probe is deformed due to improper use, it can still be called to manually adjust the probe to 'return the original function, easy to maintain, save Time labor. The technical means of applying the new problem solving three and the efficacy of the prior art are based on: designing the printed circuit board and the probe card into two separate circuit boards, and utilizing between the printed circuit board and the probe card. The soft intermediate conduction interface is used for the connection, so as long as the test point position of the product to be tested is changed, 'the probe card only needs to be replaced, the printed circuit board and the intermediate conduction interface do not need to be replaced, and the cost is low. • [Embodiment] In order to make it easier for those who are familiar with the technology to understand the construction content of the creation and the functional benefits that can be achieved, a specific embodiment will be listed, and the detailed description will be given as follows: The structure of the probe card of the wafer electrical tester is improved, please refer to the second figure: a schematic diagram of the three-dimensional combination of the first embodiment of the present invention. And the third figure shows a schematic diagram of the sectional combination of the first embodiment of the present invention. And the fourth figure shows a schematic diagram of the state of use of the first embodiment of the present invention. The structure of the M358301 is designed in such a way that the inter-radiation interface 1 Q is combined with the printed circuit board 2 ,, and then the screw-on interface 1Q and the probe card fixing fixture 40 are locked by the screw 30 to make the towel (4) interface 1 〇 can completely close the drunk printed circuit board 20, and achieve the flatness required for the intermediate conduction interface 1〇. Then, using the flatness of the intermediate conductive interface 10 as a reference surface, the probe card 5 〇 is fixed under the intermediate conductive interface 1 ,, and the fixing screw and the spring cymbal 70 are adjusted to adjust and adjust the flatness. The intermediate conductive interface 丄〇 upper and lower corresponding to the printed circuit board 20 and the probe card 5 〇 metal pad 2 丄, 5 work ♦ is provided with a conductive interface pin 丄i made of metal powder, as a printed circuit board 20 and the probe card 50 are electrically conductive, and the probe 5 2 of the probe card is made of a metal material. Please refer to the fifth and sixth figures: a schematic diagram of the combination and use of the section in the second embodiment of the present invention. The conductive interface pin i i includes a sleever 2, an elastic member 13 and a three-interface needle 14 to make the interface needle 11 elastic, and is used as a conductive connection between the printed circuit board 2 and the probe card 5.纟 纟 纟 上述 上述 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , At the same time, it is the "first creation" that has not yet been seen in the market. It has the "utility value of the industry". It has already met the important requirements of the "practicality" and "progressiveness" of the new patents. The bureau filed an application for a new patent. [Simple description of the diagram] M358301 First figure: Schematic diagram of the structure of the system. The second figure is a three-dimensional combination diagram of the first embodiment of the present invention. The third figure is a schematic diagram of the sectional combination of the first embodiment of the present invention. The fourth figure is a schematic diagram of the state of use of the first embodiment of the present invention. The fifth figure is a schematic diagram of the sectional combination of the second embodiment of the present creation. Figure 6 is a schematic diagram showing the state of use of the second embodiment of the present invention. [Description of main component symbols] [Live part] 1 Probe card fixing jig 2 Printed circuit board 3 Probe card for micro-product process 4 Cantilever probe for micro-product process [This creation part] 10 Intermediate conduction interface 11 Conductive interface pin 12 Sleeve 13 Elastic element 14 Interface needle 2 0 Printed circuit board 2 1 Metal pad 3 0 Screw 40 Probe card fixing fixture 5 0 Probe card 5 1 Metal pad 5 2 Probe 6 0 Adjustment screw 70 Spring Gasket