M356950 五、新型說明： 【新型所屬之技術領域】 本創作是有關於一種電腦主趟 白 王铖之水冷散熱結構改 良，尤扎一種可利用電腦主機内部 碰 〈合置早兀進行水冷機 構之设置，以防止外部環境之干捧 ^ 而達到防塵、藉定播 _轉及較佳之散熱之功效者。 L疋運 . 【先前技術】 按，一般習用電腦主機之散熱結構， 央處理器上設置有一散埶鳍片機板之中 u戶* —日片組，另於該散熱鰭片組上组 °又有風扇，其散熱之方式係夢r u 9由放熱片吸取中参虛揀哭 所產生之熱氣擴大熱源區域， 、po 吹風產夺气、六丹由放熱片上所組設之風扇 祝抓，使放熱片之熱流向 邱介与、在、+ w々々丨l動，亚同時讓外 邛空軋進入電腦主機内，而利 了㈣ 方所却夕厨戶彼也 驷主機中電源供應器下 式達到散熱之功效。猎以利用内、外氣體對流之方 雖然上述習用之散 功效，但是南於甘A ^使^主機達到散熱之 —由於，、進行散熱時係利用内、外 式達到散熱之功效， 巩版對抓之方 , 口此，於進行散熱時，容易脾冰邺严 境中之灰塵、丰届梦1 丁奋易將外部裱 .,^ 寺干h物吸入電腦主機 結構及電腦内部之夂带 ^使仔散熱 率，更合導μ口电 雙到干擾’不但會影響散熱 手更曰V致電腦主機無法穩定運轉。 新型内容】 M356950 * , j 因此，本創作之主要目 邻之裳署一、p u 的係在於’可利用電腦主機内 邰之奋置早兀進行水冷機構 』s 又5又置，以防止外部環境之千 擾’而達到防塵、穩定運輕 , 疋連柃及較佳之散熱之功效。 為達上述之目的，本創作 结構改声，4入目士 電腦主機之水冷散熱 有主機板、儲存單元、 碭仔早兀“供應器、連接器及多數 -件，且該機殼之後端面係設有I； t 3 . 夕數牙孔，一設於機殼中且 對應各牙孔之容置單元. 早兀，以及—没於容置單元中之水冷機 、、至少具有-端面與機殼後端面各穿孔對應之冷卻單 凡、至少-與冷卻單元連通並與主機板贴覆之吸熱單元、 -連接於冷卻單元與吸熱單元間之增壓單元、及—對應設 於冷卻單元另一端面之氣體導引單元。 【實施方式】 、請參閱『第一、二、三、四及第五圖』所示’係分 J為本創作之立體外觀示意圖、本創作之容置單元示意 圖、本創作之水冷機構示意圖、本創作之水冷機構與容 置單元結合示意圖及本創作之侧視狀態示意圖。如圖所 二本創作種電腦主機之水冷散熱結構改良，其至少 係由甩細主機1、一容置單元2以及一水冷機構3所 構成。 上述所提之電腦主機1其至少具有一機殼1 1 ,該 機殼1 1中至少設有主機板1 2、儲存單元1 3、電源 M356950M356950 V. New description: [New technical field] This creation is about the improvement of the water-cooling structure of a computer main 趟白王铖, a type of water-cooling mechanism that can be used by the internal host computer Prevent the external environment from being able to take care of it, and achieve the effect of dustproofing, delegating broadcast and better heat dissipation. L疋运. [Prior Art] According to the general heat dissipation structure of the computer host, the central processor is provided with a fan-type fin board in the u-unit*-day group, and on the heat-dissipating fin group. There is also a fan, the way of heat dissipation is the dream ru 9 by the heat release sheet to absorb the heat generated by the ginseng in the ginseng to expand the heat source area, and the po hair dryer produces the gas, and the six dans are fanned by the fan set up on the heat release sheet. The heat flow of the heat release film moves to Qiu Jie, and at the time of + w々々丨l, and at the same time, the outer stencil is rolled into the computer host, and the profit is (4), but the cooker is also under the power supply of the host. The style achieves the effect of heat dissipation. Hunting to use the internal and external gas convection side, although the above-mentioned conventional use of the effect, but the South A Gan ^ ^ to the host to achieve heat dissipation - because, when using heat, the use of internal and external to achieve heat dissipation, the version of the Grab the side, the mouth, in the heat dissipation, easy to spleen ice, the dust in the harsh environment, Feng Meng dream 1 Ding Fen Yi will external 裱., ^ Temple dry h objects inhaled computer host structure and computer inside the ^ belt The heat dissipation rate is more suitable for the dual-interference of the μ port. This will not only affect the heat dissipation, but also cause the computer to fail to operate stably. The new content] M356950 * , j Therefore, the main target of this creation is the Department of the Department of Labor, the pu is in the 'computer can be used in the host computer to make the water cooling mechanism 』 and 5 again, to prevent the external environment of thousands Disturbing 'to achieve dust, stable and light, 疋 柃 and better heat dissipation. In order to achieve the above purpose, the structure of the creation is changed. The water cooling of the 4th entry computer mainframe has a main board, a storage unit, and the "supplier, connector and most-pieces", and the rear end of the casing I; t 3 . The number of teeth in the case, one in the casing and corresponding to the receiving unit of each tooth hole. Early, and - the water cooler not in the receiving unit, at least - end face and machine Each of the perforations of the rear end surface of the shell corresponds to a cooling unit, at least a heat absorbing unit that communicates with the cooling unit and is attached to the motherboard, a boosting unit connected between the cooling unit and the heat absorbing unit, and a corresponding cooling unit The gas guiding unit of the end face. [Embodiment] Please refer to the "first, second, third, fourth and fifth figures" as shown in the figure, which is a schematic diagram of the three-dimensional appearance of the creation, and a schematic diagram of the housing unit of the creation. The schematic diagram of the water-cooling mechanism of the present creation, the schematic diagram of the water-cooling mechanism and the accommodating unit of the present creation, and the side view state of the creation. As shown in the figure, the water-cooling heat-dissipating structure of the computer host is improved, at least by the thin host 1 The computer main unit 1 has at least one casing 1 1 , and the casing 1 1 is provided with at least a main board 1 2, a storage unit 13 , and a power supply. M356950
J « I 供應器1 4、連接器1 5及多數電子元件1 6，且該機 殼11之後端面係設有多數穿孔1 7。 °亥谷置單元2係設置於上述機殼1 1中且對應機殼 1 1後端面之各穿孔1 7，並設於電源供應器1 4下 方而D亥谷置單元2係由一底板2 1、一垂直設於底板 ' 2 1 一端緣之背板2 2、一垂直設於底板2 1 —侧緣且 與β板2 2連接之侧板2 3、一傾斜設於側板2 3端緣 >之斜板2 4、及分別設於底板2 1、背板2 2及侧板2 3上之彎折板2 5，使該容置單元2上形成至少三面開 放之空間A、β、c，讓其一端面之空間a對應機殼1 1後 端面之各穿孔1 7，側面之空間B對應機殼1 1之一側， 而頂面之空間C則對應電源供應器1 4，且該底板2 1、 月板2 2、侧板2 3及彎折板2 3上係設有固定孔2 6。 该水冷機構3係設置於上述容置單元2中，其至少 有一端面與機殼1 1後端面各穿孔1 7對應之冷卻單 • 力3 1、至少一與冷卻單元3 1連通並與主機板1 2貼 设之吸熱單元3 2、一連接於冷卻單元3 1與吸熱單元 3 2間之增壓單元3 3、及一對應設於冷卻單元3 1另 :端面之氣體導引單元3 4 ’且該冷卻單元3 1、吸熱 單元3 2及增壓單元3 3中係填充有工作流液（圖未 下）。如是，藉由上述之結構構成一全新之電腦主機之水 冷散熱結構改良。 5 M356950J « I supply 1 4, connector 15 and a plurality of electronic components 16 are provided, and a plurality of perforations 17 are provided on the rear end face of the casing 11. The Hau Valley unit 2 is disposed in the casing 1 1 and corresponds to each of the through holes 17 of the rear end surface of the casing 1 1 and is disposed under the power supply 14 and the DH Valley unit 2 is provided by a bottom plate 2 1. A backing plate 2 disposed perpendicularly to one end edge of the bottom plate '2 1 2, a side plate 2 3 vertically disposed on the side edge of the bottom plate 2 1 and connected to the β plate 22, and an inclined edge disposed at the edge of the side plate 2 3 < sloping plate 2 4, and bent plate 25 respectively disposed on the bottom plate 2 1 , the back plate 2 2 and the side plate 2 3 , so that the accommodating unit 2 forms at least three open spaces A and β, c, the space a of one end face corresponds to each of the perforations of the rear end surface of the casing 1 1 , the space B of the side corresponds to one side of the casing 1 1 , and the space C of the top surface corresponds to the power supply 14 , and The bottom plate 2 1 , the moon plate 2 2 , the side plate 23 , and the bent plate 23 are provided with fixing holes 26 . The water-cooling mechanism 3 is disposed in the accommodating unit 2, and has at least one end surface corresponding to the perforation 17 of the rear end surface of the casing 1 and a cooling unit 3, at least one of which is in communication with the cooling unit 31 and the motherboard 1 2 is attached to the heat absorbing unit 3 2, a boosting unit 3 3 connected between the cooling unit 3 1 and the heat absorbing unit 32, and a gas guiding unit 3 4 ' corresponding to the cooling unit 3 1 and the end surface The cooling unit 31, the heat absorbing unit 32, and the pressurizing unit 33 are filled with a working fluid (not shown). If so, the water-cooling heat dissipation structure of a completely new computer mainframe is improved by the above structure. 5 M356950
« I 本創作於組裝時，係可將水冷機構3之吸熱單元3 2配合散熱膏及相關之固定元件與主機板i 2上之晶片 (如.CPU、南橋晶片與北橋晶片，圖未示）貼覆，之後 再將該冷卻單元3 1與氣體導引單Tt 3 4設於容置單元 2中’使冷卻單元3 1與容置單元2-端面之空間A對 應’侧面之空間β對應機殼1 1之-侧，而頂面之空間c 則對應電源供應器i 4，之後再將容置單元2設置於機 殼11中’冷卻單元31與機殼11後端面之各穿孔丄 7對應’之後再以固定元件配合彎折板23上之固定孔 2 6與機殼1 1進行鎖固，^ ^ 設置於電腦主m之内Γ。 水冷機構2 ^:^:’係㈣熱單元^吸取主機板！ θ士伤 …、源，而當該吸熱單元3 2進行吸埶 问時啟動㈣單元3 3，使該增壓單 ： -壓力由冷卻單元3 !、隹λ #曰5^早凡3 3輸出 埶單元3 ?巾 進入，*以將工作流液輸出至吸 二:二Γ而將吸熱單元3 2所吸取之熱源帶離， 作液將吸敛單^· ο Γ) ，液係進，單元33中:：:=了時，該 :收熱源之工作流液進傳輸至冷卻單：3二3將該 :可利用氣體導輪34將氣體導二:此時’ 上’而讓吸收熱源之 〇早兀31 熱時之熱氣以氣體㈣單:仃：：源之散逸，並將散 |早兀34之氣體㈣，而由穿孔 6 M356950 丄’置接排出機殼1 1 . 時，係結合於電腦主機〗 機構3於設置 機…冰： 之内部，且其熱氣係直接排出 =11外部而不會有氣體對流之情形發生，因此，可 有效防止外部環境之 氣..n,、 欠U ·水乳、鹽份、渔度、熱 产定運射.制防塵之功效，並使該水冷機構3可 %疋運轉獲得較佳之散熱效果。 可刺=所述，本創作電腦主機之水冷散熱結構改良， 了利用電腦主機内部之容置單元進行水冷機構之設置， 外部環境之干擾，而達到防塵、穩定運轉及較佳 …之功效’進而使本創作之產生能更進步、更實用、 更仃“吏用者之所需’確已符合創作專利申請之要件， 爰依法提出專利申請。· 淮以上所述者’僅為本創作之較佳實施例而已，去 不能以此限定本創作實施之範圍；故，凡依本創作申： 專利範圍及創作說明書内容所作之簡單的等效變化與^ 飾，左應仍屬本創作專利涵蓋之範圍内。 【圖式簡單說明】 第圖’係本創作之立體外觀示意圖。 第二圖’係本創作之容置單元示意圖。 第二圖’係本創作之水冷機構示意圖。 第四圖，係本創作之水冷機構與容置單元結合示意圖 第五圖’係本創作之侧視狀態示意圖。 M356950 k > 【主要元件符號說明】 電腦主機1 機殼1 1 主機板1 2 儲存單元13 電源供應器1 4 連接器1 5 φ 電子元件1 6 穿孔1 7 容置單元2 底板2 1 背板2 2 侧板2 3 斜板2 4 φ 彎折板2 5« I created this assembly, the heat sink unit 3 2 of the water cooling mechanism 3 can be combined with the thermal grease and related fixing components and the chip on the motherboard i 2 (such as .CPU, South Bridge wafer and North Bridge wafer, not shown) After the affixing, the cooling unit 3 1 and the gas guiding unit Tt 3 4 are disposed in the accommodating unit 2 'the space A corresponding to the cooling unit 3 1 and the end surface of the accommodating unit 2' The side of the shell 1 1 , and the space c of the top surface corresponds to the power supply i 4 , and then the accommodating unit 2 is disposed in the casing 11 'the cooling unit 31 corresponds to each of the perforations 丄 7 of the rear end surface of the casing 11 After that, the fixing hole 26 of the bending plate 23 is fixed with the fixing member to be locked with the casing 1 1 , and is disposed inside the main body m of the computer. Water cooling mechanism 2 ^: ^: ' Department (four) thermal unit ^ suction motherboard! θ士伤..., source, and when the heat absorbing unit 3 2 performs suction, start (4) unit 3 3, so that the pressurization list: - pressure is output by the cooling unit 3 !, 隹 λ #曰 5 ^ 3 3 3埶 unit 3 towel enters, * to output the working fluid to the suction two: two Γ and the heat source sucked by the heat absorbing unit 3 2 is removed, the liquid will suck the single ^· ο Γ), the liquid is into the unit When 33:::=, the working fluid of the heat receiving source is transported to the cooling sheet: 3 2 3: The gas guide wheel 34 can be used to guide the gas 2: at this time, the heat source is absorbed. 〇 兀 兀 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热In the computer host, the mechanism 3 is set inside the machine...Ice: and its hot gas is directly discharged = 11 outside without the occurrence of gas convection, so it can effectively prevent the external environment..n,, U ·Water emulsion, salt, fishing degree, heat production and transportation. The dust-proof effect is made, and the water-cooling mechanism 3 can be operated at a high speed to obtain a better heat dissipation effect. Stinger = As described, the water-cooling and heat-dissipating structure of the computer mainframe of the present invention is improved, and the setting of the water-cooling mechanism and the external environment are utilized by the accommodating unit inside the computer main body, thereby achieving the functions of dustproof, stable operation and better... Make the creation of this creation more progressive, more practical, and more "the needs of the user" have indeed met the requirements for the creation of a patent application, and filed a patent application according to law. The best example is that we can't limit the scope of the creation of this creation; therefore, the simple equivalent changes and the decoration of the patent scope and the content of the creation manual are still covered by this creation patent. Within the scope. [Simple diagram of the diagram] The diagram of the figure is a schematic diagram of the three-dimensional appearance of the creation. The second diagram is a schematic diagram of the housing unit of the creation. The second diagram is a schematic diagram of the water-cooling mechanism of the creation. The fifth diagram of the water cooling mechanism and the accommodating unit of the present invention is a schematic view of the side view of the present creation. M356950 k > [Key component symbol description] Computer Machine 1 Chassis 1 1 Motherboard 1 2 Storage unit 13 Power supply 1 4 Connector 1 5 φ Electronic component 1 6 Perforation 1 7 accommodating unit 2 Base plate 2 1 Back plate 2 2 Side plate 2 3 Slant plate 2 4 φ Bending plate 2 5
‘固定孔2 6 水冷機構3 冷卻單元3 1 吸熱單元3 2 增壓單元3 3 氣體導引單元3 4 空間A、B、C‘Fixed hole 2 6 Water-cooling mechanism 3 Cooling unit 3 1 Heat-absorbing unit 3 2 Pressurizing unit 3 3 Gas guiding unit 3 4 Spaces A, B, C