TWM356225U - LED lead-frame structure having better heat dissipation effect - Google Patents

LED lead-frame structure having better heat dissipation effect Download PDF

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Publication number
TWM356225U
TWM356225U TW97219148U TW97219148U TWM356225U TW M356225 U TWM356225 U TW M356225U TW 97219148 U TW97219148 U TW 97219148U TW 97219148 U TW97219148 U TW 97219148U TW M356225 U TWM356225 U TW M356225U
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TW
Taiwan
Prior art keywords
heat dissipation
dissipation effect
emitting diode
light
diode package
Prior art date
Application number
TW97219148U
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Chinese (zh)
Inventor
Xing Chen
Original Assignee
Solidlite Corp
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Application filed by Solidlite Corp filed Critical Solidlite Corp
Priority to TW97219148U priority Critical patent/TWM356225U/en
Publication of TWM356225U publication Critical patent/TWM356225U/en

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Description

M356225 如是,晶粒l6所散發之熱能將傳導至散熱體u,並由 散熱體14之第二表面24散發出。 惟,散熱體14之周邊皆被絕緣體12包覆住,因此,晶粒 16所散發之熱能僅可由散熱體14之第二表面24導出,以至 於無法有效錄速地將熱料出,轉_發光二極體的使用 壽命及效能。 【新型内容】 本創作之-目的’姐提供-種具錄絲效果之發光二 極體封裝支_造,其具有較大之散細積,㈣雜能 效及快速的散發出之目的。 本創作之另-目的,在於提供—種具紐餘效果之發 光二極體難核構造’其具有不增加龍體積之情形下,可 增加其散熱面積,使熱能可有效及快舰散發出。 為達上述之目的,本創作之特徵在於包括有具較佳散熱 效果之發光二極體封裝支架構造,其包括有金屬導線架;一絕 緣體’其係包覆住部份之該金料翁,且其t央部形成-貫 ^之鎮空容室;一錄體,其中央位置形成有-凸出部,該散 …體係與箱:峨目接合,使該凸出部恰位於該鏤空容室内, ::亥細之底面積等於或大於該絕緣體之底面積;一晶粒, …體之凸出部上’並電連接該金屬導線架;及 —鏡片,$錢置於魏緣體上,_晶粒覆蓋住。 如疋’晶粒所散發出的熱能,可由散熱體周邊及其底 M356225 面散發出,而得到較佳之散熱效果。 藉由具體實施例配合所附的圖式詳加說明,當更容易瞭解 本創作之目的、技術内容、特點及其所達成之功效。 【實施方式】 為使貴審查委員方便簡潔瞭解本創作之其他特徵内容與 優點及其所達狀功效㈣更為顯現,歸本_配合附圖, 詳細說明如下: 請參閱第三圖及第四圖,為本創作具較佳散熱效果之發 光二極體支架構造,其包括有金屬導線架3〇、一絕緣體32、 一散熱體34、一晶粒36、一透明層38及一鏡片40。其中 絕緣體32係包覆住部份之金屬導線架3〇,其中央部位 形成一貫通之鏤空容室42。 散熱體34為一銅材質’其中央位置設有一體成型鍛造而 形成之凸出部44,並於凸出部44上形成一凹穴46,於凹穴 46周邊形成有傾斜之反射面48。絕緣體32之底面係固定於散 熱體34 ’使散熱體34之凸出部44恰位於絕緣體%之鏤空容 室42内。而散熱體34之面積係等於或大於絕緣體%之面積, 使散熱體34之周緣及底面自絕緣體32露出。另,散熱體糾 設有一個以上之貫通孔50,絕緣體32相對於貫通孔5〇位置 形成有凸塊52,用以設置於散熱體34之貫通孔5〇内,使絕 緣體32與散熱體34的結合更為穩固。散熱體34之面積較絕 緣體32之面積大時’於散熱板34上形成有外露之固定孔%, M356225 、使散…體34可藉由螺鎖元件螺鎖於IU定孔54内。 44曰曰^36為發光二極體晶片,係設置於散熱體%之凸出部 内’並藉導線56電連接至金屬導線架3〇上。 透明層38為螢光膠,係塗佈於晶粒36上。 a鏡片40係固定於絕緣體32上,用以將晶粒36覆蓋住。 “、本創作將絕緣體32設置於散熱體34上時,可使發 光j體封裝構造得到較大的散熱面積,使其有效及快速地將 熱能導出,而延長發光二極體的使用壽命及效能。 辦進日她在突破先狀技術結構下,確實已達到所欲 非熟絲項技藝者所易於思及,再者,本創作申 型’繼提出新型專利申請,懇請貴局核准本件新 型專利申睛案,以勵創作,至感德便。 以上所述之實施例僅係為說明本創作之技術思想及特點,其目 的在使熟習此微藝之人士㈣瞭解本創作之内容鱗以實施Ί 不能以之限定本創狀專概gj ’即大凡依摘作所揭示之精田 作之均等變化或修飾,仍應涵蓋在本創作之專利範圍内。’、所M356225 If so, the thermal energy emitted by the die l6 is conducted to the heat sink u and is emitted by the second surface 24 of the heat sink 14. However, the periphery of the heat sink 14 is covered by the insulator 12, so that the heat energy radiated by the die 16 can only be led out by the second surface 24 of the heat sink 14, so that the hot material cannot be effectively outputted. The service life and performance of the LED. [New Content] The purpose of this creation is - the 'sister' provides a kind of light-emitting diode package with a silking effect, which has a large scattered product, (4) a hybrid energy effect and a fast emission. Another purpose of this creation is to provide a kind of refractory core structure with a balance effect, which can increase the heat dissipation area without increasing the volume of the dragon, so that the heat can be effectively and quickly released. In order to achieve the above object, the present invention is characterized in that it comprises a light-emitting diode package structure having a better heat dissipation effect, which comprises a metal lead frame; and an insulator which covers a portion of the metal material, And the t-portion portion forms a space chamber of the town; a recorded body has a convex portion formed at a central position thereof, and the system is engaged with the box: the eyepiece is engaged so that the protruding portion is located in the hollow space Indoor, :: the bottom area of the bottom is equal to or greater than the bottom area of the insulator; a die, the body of the body is 'and electrically connected to the metal lead frame; and - the lens, $ money placed on the edge of the body , _ grain coverage. For example, the thermal energy emitted by the 晶粒's grains can be radiated from the periphery of the heat sink and the bottom surface of the M356225 to obtain a better heat dissipation effect. It is easier to understand the purpose, technical content, features, and effects achieved by the specific embodiments in conjunction with the accompanying drawings. [Embodiment] In order to make it easier for your review committee to understand the other features and advantages of this creation and its effect (4) is more obvious, the original _ with the drawings, as detailed below: Please refer to the third and fourth The figure shows a light-emitting diode support structure with a better heat dissipation effect, which comprises a metal lead frame 3, an insulator 32, a heat sink 34, a die 36, a transparent layer 38 and a lens 40. The insulator 32 covers a portion of the metal lead frame 3〇, and a central portion thereof forms a through hollow chamber 42. The heat dissipating body 34 is made of a copper material. The central portion is provided with a convex portion 44 integrally formed and forged, and a recess 46 is formed in the convex portion 44, and an inclined reflecting surface 48 is formed around the recess 46. The bottom surface of the insulator 32 is fixed to the heat radiating body 34' so that the convex portion 44 of the heat radiating body 34 is located in the hollow cavity 42 of the insulator. The area of the heat sink 34 is equal to or larger than the area of the insulator, so that the periphery and the bottom surface of the heat sink 34 are exposed from the insulator 32. In addition, one or more through holes 50 are formed in the heat dissipating body, and the insulator 32 is formed with a bump 52 at a position of the through hole 5 , for being disposed in the through hole 5 散热 of the heat sink 34 to make the insulator 32 and the heat sink 34 The combination is more stable. When the area of the heat dissipating body 34 is larger than the area of the insulating body 32, the exposed fixing hole % is formed on the heat dissipating plate 34, and the M356225 can be screwed into the IU fixing hole 54 by the screw locking member. 44曰曰^36 is a light-emitting diode wafer which is disposed in the projection of the heat sink body' and is electrically connected to the metal lead frame 3 by a wire 56. The transparent layer 38 is a fluorescent glue applied to the die 36. The lens 40 is attached to the insulator 32 for covering the die 36. "When the insulator 32 is placed on the heat sink 34, the light-emitting body package structure can obtain a large heat dissipation area, so that the heat energy can be effectively and quickly exported, and the service life and performance of the light-emitting diode are prolonged. Under the breakthrough of the technical structure, she has indeed reached the desired skill of the non-cooked silk art. Moreover, this creation application type follows the new patent application, and you are requested to approve the new patent. The purpose of the application is to create a creative idea. The above-mentioned examples are only for explaining the technical ideas and characteristics of this creation. The purpose is to enable those who are familiar with this micro-art (4) to understand the scale of the creation to implement Ί It is not possible to limit the creation of this creation to the gj', that is, the equivalent change or modification of Jingtian, which is revealed by Dafanyi, should still be covered by the scope of this creation patent.

Claims (1)

-M356225 九、申請專利範園: 1. 一種具較佳散熱效果之發 金屬導線架;-M356225 IX. Applying for a patent garden: 1. A metal lead frame with better heat dissipation effect; 光二極體封裝支架構造,其包括有: 一絕緣體,蝴_金料縣,且 成一貫通之鏤空容室; Λ ιη/ 一散熱體,其中央位罟# 4、士 n , 置开滅有—凸出部,該散熱體係與該絕 緣體相接合,使該凸出部恰位於該鏤空^_ 踔工奋至内,而該散熱體之底 Φ 面積等於或大於該絕緣體之底面積; -晶粒,其係設置於該散熱體之凸㈣上,並電連接該金屬 導線架,及 -鏡片,其係設置於雜緣體上,_晶粒覆蓋住。 2.如申請專利範圍第1項所述之具較佳散熱效果之發光二極體 封裝支賴造,其巾該散熱體之凸出部形成有—凹穴,該晶粒 係設置於該凹穴上。 φ 3.如申請專利範圍第2項所述之具較佳散熱效果之發光二極體 封裝支架構造,其巾該凸出部之凹穴周邊形成有傾斜之反射 面。 4. 如申β專利範圍弟1項所述之具較佳散熱效果之發光二極體 封裝支架構造,其中該散熱體係為銅材質。 5. 如申請專利範圍第1項所述之具較佳散熱效果之發光二極體 封裝支架構造,其中該散熱體設有一個以上之貫通孔,該絕緣 體相對於該貫通孔位置形成有凸塊,用以設置於該散熱體之貫 10 M356225 通孔内。 .’其巾5錄熱體之底面積較該絕緣體之底面積 大’而形成有外露之固定孔。 种月口專利範圍第1項所述之具較佳散熱效果之發光二極體晶 裝支架構造,其帽散熱_⑽造方式—體成型製成。 8. 如申睛專利酬第1項所述之具較佳散熱效果之發光二極體封 裝支架構造,其更包括有—翻層包覆住該晶粒。 9. 如士申請專利細f 8項所叙具較佳散熱效果之發光二極體封 裝支架構造,其中該透明層為螢光層。 10·如申明專利範圍第1項所述之具較大散熱效果之發光二極體 封裝支架構造,其中該晶粒係藉由導線與該金屬導線架電連The photodiode package support structure comprises: an insulator, a butterfly-metal material county, and a through-opening cavity; Λ ιη/ a heat sink, the central position of which is #4, 士n, open and extinguished- a protruding portion, the heat dissipating system is engaged with the insulator such that the protruding portion is located within the hollowing out, and the bottom Φ area of the heat dissipating body is equal to or larger than a bottom area of the insulating body; It is disposed on the convex (four) of the heat dissipating body, and is electrically connected to the metal lead frame, and the lens, which is disposed on the impurity body, and is covered by the crystal grain. 2. The light-emitting diode package having a better heat dissipation effect according to the first aspect of the patent application, wherein the protrusion of the heat sink is formed with a recess, and the die is disposed in the concave On the hole. Φ 3. The light-emitting diode package structure having a preferred heat dissipation effect as described in claim 2, wherein the periphery of the protrusion of the protrusion is formed with an inclined reflection surface. 4. The light-emitting diode package structure with a better heat dissipation effect as described in the first paragraph of the patent application of the present invention, wherein the heat dissipation system is made of copper. 5. The light-emitting diode package structure according to claim 1, wherein the heat sink is provided with more than one through hole, and the insulator is formed with a bump relative to the through hole. It is disposed in the through hole of the 10 M356225 of the heat sink. The exposed bottom area of the towel 5 is larger than the bottom area of the insulator, and an exposed fixing hole is formed. The light-emitting diode mounting frame structure with the preferred heat dissipation effect described in the first paragraph of the patent of the moon mouth is made by the body heat dissipation_(10) manufacturing method. 8. The light-emitting diode package structure according to the first aspect of the invention, which has the preferred heat dissipation effect, further comprises a layer covering the grain. 9. The light-emitting diode package structure of the preferred heat dissipation effect described in the patent application, wherein the transparent layer is a fluorescent layer. 10. A light-emitting diode package structure having a large heat dissipation effect as described in claim 1 wherein the die is electrically connected to the metal lead frame by a wire. 12 46 * M35622512 46 * M356225 第三_third_ 48、 4648, 46 1313
TW97219148U 2008-10-24 2008-10-24 LED lead-frame structure having better heat dissipation effect TWM356225U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479706B (en) * 2010-06-28 2015-04-01 Lg Display Co Ltd Light emitting diode and backlight unit and liquid crystal display device with the same
TWI581449B (en) * 2012-06-20 2017-05-01 Aoi Electronics Co Ltd Light source integrated light sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479706B (en) * 2010-06-28 2015-04-01 Lg Display Co Ltd Light emitting diode and backlight unit and liquid crystal display device with the same
TWI581449B (en) * 2012-06-20 2017-05-01 Aoi Electronics Co Ltd Light source integrated light sensor

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