TWM349034U - Alignment device for positioning chip on display panel - Google Patents

Alignment device for positioning chip on display panel Download PDF

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Publication number
TWM349034U
TWM349034U TW97215032U TW97215032U TWM349034U TW M349034 U TWM349034 U TW M349034U TW 97215032 U TW97215032 U TW 97215032U TW 97215032 U TW97215032 U TW 97215032U TW M349034 U TWM349034 U TW M349034U
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TW
Taiwan
Prior art keywords
wafer
display panel
alignment
predetermined position
image
Prior art date
Application number
TW97215032U
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Chinese (zh)
Inventor
zhu-sheng Li
hui-long Chen
Original Assignee
Top Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Top Optronics Corp filed Critical Top Optronics Corp
Priority to TW97215032U priority Critical patent/TWM349034U/en
Publication of TWM349034U publication Critical patent/TWM349034U/en

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

M349034 八、新型說明: 【新型所屬之技術領域】 裝置 本創作係有關於-賴位裝置,其係尤指—種設置⑼於顯㈣板之對位 【先前技術】 按’早期晶片設置於基板的技術,是運用打線接合(Wire B〇nding)的方式, 然而此傳統的打線接合技術無法滿足電性上的要求,所以進而發展出覆 裝,覆晶封裝是採賴鉛凸塊作為晶片與基板連接的封裝技術其_將晶面 朝下並藉由錫錯凸塊而與基板接合,來達到封裝的方式,如曰 片接腳(pi_密度。細,其於實施上仍有—定關。 請參閱第-圖’係為習知技術之設置晶片於顯示面板的對位裝置之結構示 思圖。如圖所示,習知技術之設置晶片於顯示面板的對位裝置 操取裝置1〇’與-第二影像梅取裝置12,。第一影像禅 j :裝置設置於-顯示面板2()、下方一晶片22,欲設置;^= =之-驅動電路上的航位置時,係使用第—影像触裝置ig =裝,'分別對準預定位置的二側與晶片22、二側,即使用影像重= ^式,』疋位置之二側的影像與晶片22’之二側的影像重疊,則表 成,之後,便可進行壓合的動作。 打70 承上騎’姐齡的频餅讀程齡親步,⑽ 時代,所以現今的晶片越來越精密,若使用上述之第一影侧取裝置1〇,= 錢情準魷錄的三顺晶片22、二_對位綠容 易因曰曰片過小,而造成對位錯誤的問題。 與裝告編號第1243235號專利揭露出—種雙定標記配合攝 如裝置取像之板材讀方法,此定位方法是利用雙攝影U與—顯 一基準板材定出一基準位置,用以工餹爲與驻w — A δ 材之―彳wn « 麵位及固定,並同時對基準板 材之-疋純錄仔二鱗影像_示賤示幕上,之後騎—狀位板材之 M349034 -疋位^錢彳了取像而於顯示幕上顯4二待定位影像,最後輕待定位板材 之位置’使—待定位影像與二基準影像重4,如此—來,即可將狀位板材調 整至基準位置而完成定位。 然而,此專利案之板材定位方法係利用二攝影裝置分別對基準板材之二定 位標,與狀位板材之二定位標記進魏像,最後婦狀位板材之位置,使 -待疋位讀與—基準影像重4。軸可達狀㈣效果,但纽專利案必須 使用二攝影裝置才能進行取像,因而有待改進之必要。 、、 因此’如何針對上述問題而提出一種新穎設置晶片於顯示面板之對位裝 =僅可改善傳麟位不準叙缺點,又可*需制二攝影裝置,以降低成 夕心直是制者殷姆纽本鋪人賴祕者,而摘作人基於 I八從,顯示裝置相關產品之研究、開發、及銷售實務經驗,乃思及改良之 ==專r識,經多方研究設計、專題探討,終於研究出-= 置曰曰片於顯不面板之對位裳置改良,可解決上述之問題。 【新型内容】 由-目的之y在於提供—種設置晶片於顯示面板之對位裝置,其藉 位置二:置依據—影像棘裝置對位晶片與預定位置的―側,_整晶片之 置;預尺位置的範圍内,以增加對位的精準度。 ^創:之目的之―,在於提供—種設置晶片於顯示面板 由使用—光學顯微鏡進行對位,*增加對位的準確度。 藉 只需ΐΓ乍ί目的之―’在於提供—種設置晶片於顯示面板之對位裝置,由於 衫像擷取裝置進行對位而降低成本。 、 之設置晶片於顯示面板之對位裝置包含— 置’影像擷取裝置麟於—顯柏板之下方, 裝 側’再由校正裝置依據預定位置的—側而調整晶片 示面板之1纽置的叶 W於財-電路之顯 之 位置於預定位置的範圍内。 M349034 生曰曰片22線路錯誤’進而使晶片22損壞轉低顯示面板的良率。 接上所述,於完成晶片22與顯示面板2〇對位後,則會於預定位 晶片22上貼-片導電膠26 ’導電膠%位於顯示面板2()與晶片α,福 =面板20與晶片22 ’並增加其導電性,其中,導電膠沈為—異二 (A_toP1C Conductive Filfn,ACF)。之後,由一壓合裝置壓人 示面板20上’由於壓合裝置為具有通常知識者所皆知 示,^此不再贅述,此外,由於使用導電_合顯示面板 •以,麼口裝置係加熱導電膠後,再壓合晶片22於顯示面板2〇上,、2 膠黏合於晶片22與顯示面板20之間。 《加導電 综上所述,本創作之設置晶片於顯示面板之對位裝置 依據-影像_裝置而績位晶片與預定位置的—側後,再依^ 、正裂置 他側邊’使晶片之位置於預定位置的範圍内,以增加對位的精準声整=的其 使用一台影像擷取裝置即可進行對位,而節省成本。 X並由於僅 、本創作係實為-具械酿、進步性及可供絲糊者, 法所規定之專利申請要件無疑,爰依法提出創作專利 m D專利 專利,至感為禱。 ° _早曰賜准 惟以上所述者,鶴本創作之—錄實關而已, 施之範圍,舉凡依本創作申請專利範圍所述之形狀、 =本創作實 !均等變化與修飾’均應包括於本創作之申請專利範 職及精神所為之 【圖式簡單說明】 第-圖為習知技術之設置晶片於顯示面板的對位裝置之-立. 第二圖本創作之一敉佳實施例之結構示意圖。 、〇不思圖,以及 8 M349034 【主要元件符號說明】 10’第一影像擷取裝置 12’第二影像擷取裝置 20’顯示面板 22’晶片 10 像擷取裝置 12 校正裝置 20 顯示面板 22 晶片 導電膠 26M349034 VIII. New description: [New technical field] The device is related to the - vacancy device, which is especially the type setting (9) aligning with the display (four) board. [Prior Art] According to the 'early wafer set on the substrate The technology is to use Wire B〇nding. However, this traditional wire bonding technology cannot meet the electrical requirements, so the coating is developed. The flip chip package uses the lead bump as the wafer and The package technology of the substrate connection has a crystal face down and is bonded to the substrate by tin bumps to achieve a package, such as a chip pin (pi_density, fine, which is still implemented in the implementation) Please refer to the figure-FIG. ' is a schematic diagram of the structure of the alignment device of the conventional display chip on the display panel. As shown in the figure, the conventional device sets the wafer alignment device on the display panel. 1〇'and-second image capture device 12, the first image is: the device is disposed on the display panel 2 (), a lower wafer 22, to be set; ^ = = - when the navigation position on the drive circuit , using the first - image touch device ig = installed, 'minutes Aligning the two sides of the predetermined position with the wafer 22 and the two sides, that is, using the image weight = ^, the image on the two sides of the 疋 position overlaps with the image on the two sides of the wafer 22', and then it can be formed. Pressing the action. Hit 70 riding on the rider's age, the frequency of reading the cake, the age of (10), so today's wafers are more and more sophisticated, if you use the above-mentioned first shadow side device 1〇, = money The three-shun wafer 22 and the second _ alignment green of the quasi-record are easy to cause the problem of misalignment due to the small size of the cymbal. The patent No. 1243235 discloses that the double-marking is combined with the image capture. The method for reading the plate is to use a double-photographing U and a display base plate to define a reference position for the work of the w-A δ material, the 面 wn « face position and the fixed position, and at the same time The reference plate - 疋 purely recorded two scale images _ show on the screen, then ride - the position of the plate M349034 - ^ position ^ money 取 取 而 而 而 而 而 而 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 The position of the plate is 'to make the image to be positioned and the two reference images are 4, so that's it. The position plate is adjusted to the reference position to complete the positioning. However, the plate positioning method of this patent uses two photographic devices to separately position the reference plate, and the second position of the position plate is marked into the Wei image, and finally the female position. The position of the plate is such that the -to-be-position reading and the -reference image are heavier 4. The axis can reach the shape (4) effect, but the New Zealand patent must use the second photographic device to take the image, so it needs to be improved. The above problem raises a novel arrangement of the wafer on the display panel. It can only improve the shortcomings of the transmission of the lining. It is also necessary to make two photographic devices to reduce the eclipse of the eclipse. The person who is a singer, and the person who is based on I, from the experience of research, development, and sales of display device related products, is thinking and improving == special knowledge, after research and design, special discussion, finally researched -= The placement of the cymbal on the display panel of the display panel can solve the above problems. [New content] The purpose of y is to provide a aligning device for arranging a wafer on a display panel, which is located at the position of the aligning wafer of the aligning wafer and the predetermined position of the image thorn device; Within the range of the pre-scale position to increase the accuracy of the alignment. The purpose of the creation is to provide a set of wafers on the display panel. The alignment is performed by using an optical microscope, and * the accuracy of the alignment is increased. It is only necessary to provide a matching device for setting the wafer on the display panel, and the cost is reduced because the shirt is aligned with the picking device. The positioning device for setting the wafer on the display panel comprises: placing the image capturing device under the cymbal plate, and mounting the side of the device to adjust the position of the wafer display panel according to the side of the predetermined position. The leaf W is in the range of the predetermined position. M349034 The enamel film 22 line error 'and further damage the wafer 22 to lower the yield of the display panel. After the wafer 22 is aligned with the display panel 2, the conductive paste 26 is attached to the pre-positioned wafer 22. The conductive paste is located on the display panel 2 () and the wafer α, and the panel 20 And the wafer 22' increases its conductivity, wherein the conductive paste is A_toP1C Conductive Filfn (ACF). After that, the pressing panel is pressed on the display panel 20. Since the pressing device is known to those having ordinary knowledge, it will not be described again. Moreover, since the conductive display panel is used, the mouth device is used. After heating the conductive paste, the wafer 22 is further pressed onto the display panel 2, and 2 is adhered between the wafer 22 and the display panel 20. "In addition to the above, the setting of the wafer on the display panel is based on the -image_device and the position of the wafer and the predetermined position, and then the side of the wafer is erected." The position is within the range of the predetermined position, so as to increase the accurate sounding of the alignment = it can be aligned using an image capturing device, and the cost is saved. X and because only the creation department is really-armed, progressive and available for the paste, the patent application requirements stipulated by the law are undoubtedly, and the patent for the creation of the patent m D patent is legally proposed. ° _ Early 曰 曰 惟 惟 以上 , , , , , , 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤 鹤The patent application and spirit of this creation are [simplified description of the drawings]. The first figure shows the setting device of the conventional technology on the display panel of the display panel. The second figure is one of the best examples of the creation. Schematic diagram of the structure. 〇 〇 ,, and 8 M349034 [Main component symbol description] 10' first image capturing device 12' second image capturing device 20' display panel 22' wafer 10 image capturing device 12 calibration device 20 display panel 22 Wafer conductive adhesive 26

Claims (1)

M349034 九、申請專利範圍: • 1. 一種設置晶片於顯示面板之對位裝置,其包含: 一影像擷取裝置’設置於一顯示面板之下方,並對位一晶片於具有一電路 之該顯示面板之一預定位置的一側;以及 一校正裝置’依據該預定位置的一側,調整該晶片之位置於該預定位置的 範圍内。 2.如申請專利範圍第1項所述之對位裝置,其更包括: , 一壓合裝置,壓合該晶片與該顯示面板,而設置該晶片於該顯示面板,以 與該電路相耗接。 φ 3_如申請專利範圍第2項所述之對位裝置,其中該壓合裝置係壓合一導電膠於 該晶片與該顯示面板之間。 4. 如申請專利範圍第3項所述之對位裝置,其中該導電膠為一異方向性導電膠 (Anisotropic Conductive Film , ACF)。 5. 如申請專利範圍第2項所述之對位裝置,其中該壓合裝置係使用一熱壓法壓 合該晶片與該顯示面板。 6. 如申請專利範圍第1項所述之對位裝置’其中該影像擷取裝置係使用一影像 疊影對位方法,以對位該晶片於該預定位置的一側。 7. 如申請專利範圍第1項所述之對位裝置,其中該影像擷取裝置為一電荷麵合 _ 元件(Charge Coupled Device,CCD)。 * 8.如申請專利範圍第1項所述之對位裝置,其中該影像擷取裝置為一光學顯微 - 鏡(Optics Microscope , 0M) 〇 9.如申請專利範圍第1項所述之對位裝置,其中該晶片為一驅動晶片。M349034 IX. Scope of Application: 1. A aligning device for arranging a wafer on a display panel, comprising: an image capturing device disposed under a display panel and having a display on a wafer having a circuit One side of the predetermined position of the panel; and a correcting means 'adjusting the position of the wafer within the range of the predetermined position according to one side of the predetermined position. 2. The alignment device of claim 1, further comprising: a pressing device that presses the wafer and the display panel, and sets the wafer on the display panel to consume the circuit Pick up. The aligning device of claim 2, wherein the pressing device presses a conductive paste between the wafer and the display panel. 4. The alignment device of claim 3, wherein the conductive paste is an anisotropic conductive film (ACF). 5. The aligning device of claim 2, wherein the embossing device presses the wafer and the display panel using a hot pressing method. 6. The alignment device of claim 1, wherein the image capture device uses an image overlay alignment method to align the wafer on one side of the predetermined position. 7. The aligning device of claim 1, wherein the image capturing device is a Charge Coupled Device (CCD). 8. The alignment device of claim 1, wherein the image capturing device is an optical microscopy (Optics Microscope, 0M) 〇 9. as described in claim 1 A bit device wherein the wafer is a drive wafer.
TW97215032U 2008-08-21 2008-08-21 Alignment device for positioning chip on display panel TWM349034U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI456547B (en) * 2009-02-13 2014-10-11 Global Oled Technology Llc Dividing pixels between chiplets in display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI456547B (en) * 2009-02-13 2014-10-11 Global Oled Technology Llc Dividing pixels between chiplets in display device

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