M346590 八、新型說明： -【新型所屬之技術領域】 • 本創作係有關於一種料盒結構，更詳而言之，係有關 一種應用於自動化取放設備之基板料盒結構。 【先前技術】M346590 VIII. New description: - [New technical field] • This creation is about a box structure, more specifically, a substrate cassette structure for automatic pick and place equipment. [Prior Art]
Ik著毛子產業的蓬勃發展，電子產品之外型趨向輕薄 短=，在功能上則逐漸邁入高性能、高功能、高速度化的 研Γ t向。而為滿足半導體封裝件高積集度以及微型化的 、哀而求提供半導體元件及線路載接之基板亦逐漸由雙 ，板演變成多層板，俾於有限空間，藉由層間連接技術 mayer咖政tiGn)擴大基板可利用的電路面積以 配&而禮度之積體電路需求。 工作製造過程中並非完全不脫離機台，於每一個 輸送帶運送，係仿制和丁 η 一 ，土板木、、，口成相再以 式。以制作〜又衣王同的需求而選用不同的輸送方 排放在說’係將條狀的基板橫^ 狀，若要蔣其知 收木最係為一封底的盒體形 導致電鍍“損取出時’勢必會碰觸到基板的電鍍面，而Ik's hair industry is booming, and the appearance of electronic products tends to be thin and light. Shortly speaking, the function is gradually entering the high-performance, high-function, high-speed research and development. In order to meet the high degree of integration and miniaturization of semiconductor packages, the substrate for providing semiconductor components and line-loading has gradually evolved from a double board to a multi-layer board, which is limited to space, and the interlayer connection technology mayer Politics tiGn) expands the circuit area available for the substrate to match the circuit requirements of the integrated circuit. In the process of manufacturing, it is not completely out of the machine, and it is transported on every conveyor belt. It is copied and re-entered with Ding yi, earthen slab, and slab. In order to make the demand of ~ Yi Yi Wang Tong, the different conveyors are used to discharge the liquid in the form of a strip-shaped substrate. If the shape of the box is to be the bottom of the box, the plating will be damaged. Will touch the plating surface of the substrate, and
^ ^ r Γ ^#J 積在收集盒内，：拿;基板時在二集盒^^ 易刮傷基板的表面， 知在收本益内的粉塵容 如第1圖所示之或成為報廢品，為此而有 之本國專利公告第5_93號「基板集塵 5 M346590 盒」，係為一具有一容置空間1 1 〇之矩形立體結構箱體的 ， 箱體11，該容置空間110係提供置放基板12 ;主要係於 . 该谷置空間11 〇内設有複數個支稽體13，該支撐體13具 有一支撐面13a，而該支撐面i3a係為一凹凸相間的表 面，得藉由該支撐體13以供架放基板12,並將該基板12 架咼，以避免接觸箱體Π的内底面，以及基板12表面之 粉塵係會落入至複數間隔支撐體13所形成之凹槽中，以 減少基板表面摩擦的機率，亦方便後續粉塵的清理。^ ^ r Γ ^#J Accumulate in the collection box, take it; when the substrate is in the second set of boxes, it is easy to scratch the surface of the substrate, knowing that the dust content in the income is as shown in Figure 1 or becomes scrapped. For this purpose, there is a national patent publication No. 5_93 "Substrate dust collection 5 M346590 box", which is a rectangular solid structure box having a housing space of 1 1 ,, a housing 11, the accommodating space 110 Providing a substrate 12; mainly in the ridge space 11 〇 is provided with a plurality of support bodies 13 having a support surface 13a, and the support surface i3a is a concave-convex surface. The support body 13 is used to mount the substrate 12, and the substrate 12 is framed to avoid contact with the inner bottom surface of the casing, and the dust of the surface of the substrate 12 falls into the plurality of spaced support bodies 13. In the groove, the probability of friction on the surface of the substrate is reduced, and the subsequent dust cleaning is also facilitated.
惟習知用以容裝基板丨2的箱體丨丨係供手動拿取的容 器，該基板12必須以人工方式取放，而人工取放基板12 的速度緩反，且生產速度緩慢，無法達到穩定速度生產的 目的，亚且人工取放仍然容易造成基板表面被刮傷。 而著自動化控制的進步，以自動化之取放機構業已 逐漸取代人工取放，一方面可提高生產速度，另一方面可 I1牛，基板刮傷的機會；$因應自動化取放機構之實施，習However, it is customary to use a box for accommodating the substrate 丨丨2 for manually taking the container. The substrate 12 must be manually taken and placed, and the speed of manually picking up the substrate 12 is slow, and the production speed is slow. To achieve the goal of stable production, the manual pick-and-place is still likely to cause the surface of the substrate to be scratched. With the advancement of automation control, the automated pick-and-place mechanism has gradually replaced manual pick and place, which can increase the production speed on the one hand, and the I1 cattle and substrate scratching opportunities on the other hand;
头合政基板12的釦體丨丨已無法應用於自動化系統中，而 必須因應自動化設備加以改進。 因此’如何找到一種可應用於自動化系統中之取放機 構取放基板的知人工取㈣隸之缺失λ 遂成為目鈉亟待解決的問題。 【新型内容】 繁於上逑習知技術之缺點，本創作之主要目的在 供一種基板料盒牡糂 、 、、°構’此配合自動化取放機構之料盒。 本創作夕7 飢 目的係提供一種基板料盒結構，能避免 6 M346590 數直立的插槽213,且於該相對瘅 有擋板26 ’以於該直立箱體22 : 21中滑動插設 板％取下，並將複數橫向層疊之==得將該擋 入該直立箱體21中，缺後將二基9手的方式置 槽213中，以將^ ^板26插設於相對應的插 …:二: 於該直立箱體21中，且該 :Ϊ:美:置於不同相對應之插槽213,以因應不同 二“; 整’而供容裝不同寬度的基板3。前述 :板m之外側係可設置有—提耳214，且於該側板鄰近 開口處設置一穿孔24。 請參閱第4A圖，或以取放機構5將該基板3 一一放 入該直立箱體21與擋板26組成之容置空間中。 請荼閱第4B圖，於該直立箱體21之底板21〇設有槽 口 22’侍將該已容裝有基板3之直立箱體2ι裝設於自動 化設備上，且使該槽口 22對應昇降機構4，使該昇降機 構4將基板3向上頂出，並使該取放機構5取出該基板3。 、或於δ亥侧板212上設有穿孔24，並於自動化設備（圖 式中未表示）上設有感測器6，且該感測器6之發射端係 對應至穿孔24，當該取放機構5將該基板3取出後，該 感測裔6偵測不到該基板3，此時該昇降機構4即將該層 疊的基板3向上推舉，當該感測器6可偵測到基板3時， 即令該昇降機構4停止動作，且該取放機構5又可進行取 料動作。 請再參閱第2圖，該二側板212外側各設有一提耳 214，以供搬運時使用。 M346590 然，有關昇降機構4 繁多，惟乃業界所周知， f 取放機構5及感測器β之種類 且其非本案技術特徵，故不再贅 述。 層堆==:=於該直立箱體之底板上層 茨，、，H4a 再則§板予以封閉，以避免該基板散 工七、自動化设備之昇降機構、取放機構及感測器 =放，以避免人工取放時所產生之刮傷，能有效降低 土板在移送過程中產生之刮傷，且能減少人工搬移之時 間’進而可縮短製程工時及提升基板之良率。 上述實施例係用以例示性說明本創作之原理及其功 效’而土非用於限制本創作。任何熟習此項技藝之人士均可 在不違背本創作之精神及範疇下，對上述實施例進行修 改。因此本創作之權利保護範圍，應如後述之申請專利範 圍所列。 【圖式簡單說明】The button body of the head of the government board 12 has not been applied to the automation system, but must be improved in response to automation equipment. Therefore, how to find a kind of pick-and-place mechanism that can be applied to the pick-and-place mechanism in an automated system (4) is missing the problem λ 遂 becomes a problem to be solved. [New Content] Due to the shortcomings of Shangyu's conventional technology, the main purpose of this creation is to provide a material box for the oysters of the substrate box, which cooperates with the automatic pick-and-place mechanism. This creation provides a substrate cassette structure that avoids the 6 M346590 number of upright slots 213, and has a baffle 26' relative to the opposite side of the upright box 22: 21. Remove and stack the plurality of horizontally == to block the upright box 21, and then place the two bases and 9 hands in the slot 213 to insert the board 26 into the corresponding plug. ...: 2: In the upright box 21, and the: Ϊ: US: placed in different corresponding slots 213, in order to accommodate different widths of the substrate 3 for different widths; The outer side of the m can be provided with a puller 214, and a through hole 24 is disposed adjacent to the opening of the side plate. Please refer to FIG. 4A, or the substrate 3 is placed into the upright box 21 by the pick-and-place mechanism 5. The baffle 26 is formed in the accommodating space. Please refer to FIG. 4B, and the bottom plate 21 of the upright box 21 is provided with a notch 22' to mount the upright box 21 which has the substrate 3 mounted thereon. In the automation device, the notch 22 is corresponding to the elevating mechanism 4, so that the elevating mechanism 4 pushes the substrate 3 upward, and the pick-and-place mechanism 5 takes out the substrate 3. Or a perforation 24 is provided on the δH side plate 212, and a sensor 6 is disposed on the automation device (not shown), and the emitting end of the sensor 6 corresponds to the through hole 24, when the After the substrate 5 is taken out by the accommodating mechanism 5, the sensing body 6 does not detect the substrate 3. At this time, the lifting mechanism 4 pushes up the stacked substrate 3, and when the sensor 6 can detect the substrate 3 At this time, the lifting mechanism 4 is stopped, and the pick-and-place mechanism 5 can perform the take-up operation. Referring to FIG. 2, a pair of ears 214 are provided on the outer side of the two side plates 212 for use during transportation. M346590 There are a lot of lifting mechanisms 4, but it is well known in the industry, f is the type of pick-and-place mechanism 5 and sensor β and it is not a technical feature of this case, so it will not be described again. Layer stack ==:= on the bottom plate of the upright box The upper layer, and H4a are then closed to avoid the substrate. 7. The lifting mechanism, pick-and-place mechanism and sensor of the automation equipment are placed to avoid scratches caused by manual pick and place. Effectively reduce the scratches caused by the soil board during the transfer process, and reduce the time of manual removal In addition, the process time can be shortened and the yield of the substrate can be improved. The above embodiments are used to exemplify the principle and function of the present invention, and the soil is not used to limit the creation. Anyone familiar with the art can The above embodiments are modified without departing from the spirit and scope of this creation. Therefore, the scope of protection of this creation should be as listed in the patent application scope described later.
第1圖係為本國專利公告第568093號「基板集塵盒 之立體圖； 第2圖係為本創作基板料盒結構之立體圖； 第3圖係為本創作基板料盒結構之擋板插置前之立 體示意圖；以及 第4A及4B圖係為本創作基板料盒結構配合自動化設 備之使用狀態示意圖。 【主要元件符號說明】 11 箱體 9The first figure is a perspective view of the substrate dust box of the national patent publication No. 568093; the second figure is a perspective view of the structure of the substrate of the creation substrate; the third figure is before the insertion of the bezel of the creation of the substrate cartridge structure The three-dimensional schematic diagram; and the 4A and 4B diagrams are schematic diagrams of the use state of the creation of the substrate cassette structure with the automation equipment. [Main component symbol description] 11 cabinet 9