TWM345951U - Compacting structure of heat dissipation device including annular body - Google Patents

Compacting structure of heat dissipation device including annular body Download PDF

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Publication number
TWM345951U
TWM345951U TW97206147U TW97206147U TWM345951U TW M345951 U TWM345951 U TW M345951U TW 97206147 U TW97206147 U TW 97206147U TW 97206147 U TW97206147 U TW 97206147U TW M345951 U TWM345951 U TW M345951U
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Taiwan
Prior art keywords
annular body
heat
seat plate
compact structure
groove
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TW97206147U
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Chinese (zh)
Inventor
Shi-Ming Chen
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Shi-Ming Chen
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Priority to TW97206147U priority Critical patent/TWM345951U/en
Publication of TWM345951U publication Critical patent/TWM345951U/en

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

M345951 八、新型說明: 【新型所屬之技術領域】 本創作係有關於-種包含環狀體之散熱裝置的緊結構 造,尤指一種將内部設有座板的環狀體,通過沖壓作業而成 型為-散熱裝置’進-步提供如發光二極體、積體電路或其 他電子發熱元件的散熱需求者。 【先前技術】M345951 VIII. New description: [New technical field] This creation is about the compact structure of a heat sink including a ring body, especially an annular body with a seat plate inside, which is formed by punching operation. For the heat sink device, the heat dissipation requirements of the light emitting diode, the integrated circuit or other electronic heating elements are provided. [Prior Art]

包益用口口叨能日益強大,所消耗 之 電功率越來越高’相對所產生的熱能也越來越大, 如何有效移除甚至消除熱能以轉系統處在—個穩定 狀態,已成為產品設計製造上的重要技術議題。“ 散熱技術在電子產品、電器用品之製作過程中曰 非常重要的一環’隨著消費產品市場的領域曰新: 異’散熱需求與挑戰也隨之增加。舉例來說, 燈具如:簡燈、白幟燈已經被發光二極體逐步=、, =二極體具她電量低、元件壽命長、甚至高功率 等多項優點’其體積小,又目前的製程曰趨成熟, 展出可以發出不同波長的光’除了適科各種電哭 作面板、資訊看板、通訊產品等之發光元件,進二 可應用於㈣、路燈等照明燈具上。雖然—般發光 極體在卫作時產生的熱純_的燈純,不過若 M345951 同一區域使用的數量高,或使用高功率的發光二極體 時’由於其普遍設於基板上且散熱環境不佳,仍應該 特別注意散熱問題。 如同本國專利公開第200716911號「發光二極體 燈之散熱裂置」中,主要是利用將高功率發光二極體 燈連接於一均熱器的底面,使發光二極體燈導出的熱 量傳導至平板式熱管或嵌入金屬板之熱管的蒸發器區 域’使熱量被熱管内部流動的蒸氣散佈至均熱器的各 區域,透過對流自動散熱,惟其裝置複雜,並不實用。 另外’則可以參考本國專利公告第M317539號 「發光二極體燈具」之較佳實施例圖,該案之散熱主 要是透過導熱柱及複數個散熱鰭片所組合成的散熱模 組’令該散熱鰭片環繞於該導熱柱之一頂端形成同該 導熱柱軸心之一凹階,放置發光二極體之底座即可放 入凹階中。只不過該散熱器的成型方式係利用焊接方 式進行’生產速度慢且容易發生產品接合瑕疵,並且, 焊接時將產生有害廢氣,對於人體、環境均有危害。 故’本案創作人遂根據對於散熱器結構進行研 九’藉解決上述一體或分離式之散熱結構缺失持續研 究加以改良’完成本創作之開發設計。 【新型内容】 6 M345951 本創作之主要目的’在提供—種包含環狀體之散熱裝置 的緊結構造’在環狀體内部包含成型—體的座板,熱源與座 板對應安裝,且在環狀體相圍緊結散熱鰭片,可適用如發 光二極體’積體電路或其他電子發熱树之散熱,具較佳的 相容性和多元性使用目的。 本創作之次要目的,在提供—種包含雜體之散熱裝置 的緊t構造’其中城體和座板組合的結構,其與散熱韓片 通過沖壓作業緊結—體,可簡化結構和製程,及有效提昇散 熱效能。 為達上述目的,本創作的技術手段,係揭露一種包含 環狀體之散熱裝置的緊結構造,包括有: -環狀體’其外_侧分佈設複數導溝及凹槽, 以及環狀_部設有—提供熱_#安裝的座板; 複數散熱鰭片,沿著環狀體周側之凹槽佈設,且 各散熱鰭片與凹槽對應插合定位; 藉由上述結構特徵,在進行沖壓組配時,成型模 具對正兩相鄰散熱鰭片間之導溝沖壓,同時導溝的兩 侧壁文力變形,以及連帶形變的凹槽夾掣散熱鰭片且 緊結於環狀體外圍周側。 通過上述技術手段,本創作利用成型環狀體和多數散熱 鰭片’經沖壓作業緊結,得以簡化組裝和降低工時成本,提 7 M345951 昇其散熱效率,以及座板位於環狀體内部,其設置位置可於 其内部中間,偏位於一側内部壁面或設於環狀體一側開口 處,進一步提供發光二極體、積體電路或其他電子發熱組 配,具良好的安裝效果,便利性亦佳。 【實施方式】 首請參閱第一〜三圖,本創作一種包含環狀體之 散熱裝置的緊結構造,包括有: .一環狀體10,其形狀可以為圓形、橢圓形、扁圓形 或具封口之環形,而在本實施例中,是以圓形作為說 明,外圍周侧分佈設複數導溝11及凹槽12,該導溝 11與凹槽12為相鄰互錯順序排列,以及環狀體10 内部中間位置一體設有一提供發光二極體、積體電路 或其他電子發熱元件等熱源(圖未示)貼靠安裝的座 板13 ; _ 複數散熱鰭片20,沿著環狀體10周側之凹槽12 佈設,且各散熱鰭片20與凹槽12對應插合定位; 藉由上述結構特徵,在進行沖壓組配時,運動的 成型模具30對正兩相鄰散熱鰭片20間之導溝11沖 壓,同時導溝11的兩側壁受力變形,以及連帶形變 的凹槽12夾掣散熱鰭片20且緊結於環狀體10外圍 周侧。 8 M345951 請繼續參閱第三圖,各散熱鰭片2〇將順序排列在 環狀體10外圍,各散熱鰭片20具有上折座21、下折 座22,故在各散熱鰭片20組合後可形成一排列定位 之組合面,透過該排列組合面可提供各散熱鰭片2〇之 定距和便於成型模具30沖壓進入,透過散熱鰭片2〇 與空氣接觸的大面積進行散熱,而熱源則是設置在環 狀體10内部之純13上。在第二时,相對應之散 熱鰭片20將導引插置在環狀體之凹槽I?中,此時 環狀體10及散熱鰭片20尚未經過沖壓程序。 請參閱第四圖,為藉一成形模具3〇沖壓導溝之動 作示意圖,令該環狀體10受力產生變形,在同一時間 各散熱鰭片2G又受到環狀體1()的兩侧導溝u推擠, 緊密的鉚合於凹槽12中(參考第五圖),並使環狀體 1〇及散熱鰭片2G緊結為—體。沖壓成型之後的散执 鰭片20與環型體10之組合狀態第六〜七圖所示。 本創作環型散熱裝置之特點主要在於透過模具沖 壓隨即成型,省去習知需要焊接等容易造成失誤等人 為因素。第六、七圖為本創作包含·體之散熱裝置 之成品外觀立體和俯視圖,從圖面上可知各散熱籍片 2〇已經緊密與環狀體10之相對應凹槽12鉚合緊結成 一體’該座板13將裝配發光二極體或電子元件等熱 9 M345951 源,以及通過多數散熱鰭片20作高效率散熱。 再請參閱第七、八圖,其中環狀體10内部之座板 13,並不限制的設於其内部中間位置,可依配裝熱源 不同而偏位設於環狀體10 —側之内部壁面,或如第九 圖所示,將座板13設於環狀體10之一侧開口處,以 提供不同熱源安裝,且透過散熱鰭片20散熱。 M345951 【圖式簡單說明】 第一圖、為本創作之立體分解圖; 第二圖、為本創作之組合立體圖; 第三圖、為本創作之組合剖視圖; 第四圖、為本創作進行沖壓之動作示意圖; 第五圖、為本創作進行沖壓之緊結示意圖; 第六圖、為沖壓後本創作環型散熱裝置之立體外觀圖; 弟七圖、為弟六圖之俯視圖, 第八圖、為本創作座板設於環狀體内部之一實施例; 第九圖、為本創作座板設於環狀體内部之另一實施例。 【主要元件符號說明】 10 環狀體 20 散熱鰭片 11 導溝 21 上折座 12 凹槽 22 下折座 13 座板 30 模具Baoyi's mouth can be increasingly powerful, and the electric power consumed is getting higher and higher. 'The relative thermal energy is also getting bigger and bigger. How to effectively remove or even eliminate the heat energy to turn the system in a stable state has become a product. Important technical issues in design and manufacturing. “The cooling technology is a very important part in the production process of electronic products and electrical appliances.” With the new field of consumer products market: the different 'heat dissipation requirements and challenges have also increased. For example, lamps such as: simple lights, The white light has been gradually illuminated by the LEDs. =, = The diode has many advantages such as low power, long component life, and even high power. Its small size, and the current process is mature, and the display can be issued differently. The wavelength of light 'except for the lighting components of Shike's various electric crying panels, information boards, communication products, etc., can be applied to (4), street lamps and other lighting fixtures. Although the general-purpose illuminating body is hot pure in the production _ The lamp is pure, but if the M345951 is used in the same area, or when using a high-power LED, 'because it is generally placed on the substrate and the heat dissipation environment is not good, special attention should be paid to the heat dissipation problem. In 200719711, "The heat sinking of the LED lamp", the high-power LED lamp is connected to the bottom surface of a heat spreader to make the light-emitting diode Heat lamp derived conducted to the region of the evaporator plate type heat pipe or embedded in the heat pipe metal plate 'of the heat is spread vapor inside the heat pipe to flow to each region soaking filter through convection automatic cooling, although its apparatus complicated and not practical. In addition, reference may be made to the preferred embodiment of the "Light Emitting Diode Lamp" of the National Patent Publication No. M317539. The heat dissipation of the case is mainly through a heat dissipating module formed by a heat conducting column and a plurality of heat dissipating fins. The heat dissipating fin surrounds one of the top ends of the heat conducting column to form a concave step with the axis of the heat conducting column, and the base of the light emitting diode is placed in the concave step. However, the method of forming the heat sink is performed by means of welding. The production speed is slow and the product joint is prone to occur, and harmful exhaust gas is generated during welding, which is harmful to the human body and the environment. Therefore, the creator of the case 改良 researched and developed according to the structure of the radiator, and solved the above-mentioned integrated or separate heat dissipation structure and continued to improve it. [New content] 6 M345951 The main purpose of this creation is to provide a seat plate with a molded body inside the annular body, which provides a tight structure for the heat sink including the annular body. The heat source is mounted corresponding to the seat plate and is in the ring. The body is tightly connected to the heat-dissipating fins, and can be applied to heat dissipation such as a light-emitting diode 'integrated circuit or other electronic heating tree, and has better compatibility and diversity. The secondary purpose of this creation is to provide a compact structure consisting of a heat sink containing a hybrid body. The structure of the combination of the city body and the seat plate, which is tightly coupled with the heat sinking piece by stamping, can simplify the structure and process. And effectively improve the heat dissipation performance. In order to achieve the above object, the technical means of the present invention discloses a compact structure comprising a heat dissipating device comprising an annular body, comprising: - an annular body having a plurality of guide grooves and grooves distributed on the outer side thereof, and a ring shape _ The part is provided with a seat plate for providing heat _#; a plurality of heat dissipation fins are arranged along the groove on the circumferential side of the annular body, and each of the heat dissipation fins is correspondingly inserted and positioned with the groove; When the stamping assembly is performed, the forming die presses the guide groove between the two adjacent heat radiating fins, and at the same time, the two side walls of the guiding groove are deformed by the force, and the groove deformed by the groove is sandwiched between the heat radiating fins and tightly attached to the annular body. Peripheral side. Through the above-mentioned technical means, the present invention utilizes a molded annular body and a plurality of heat-dissipating fins to be tightly pressed by a stamping operation, thereby simplifying assembly and reducing labor cost, improving the heat dissipation efficiency of the 7 M345951 liter, and the seat plate is located inside the annular body, The installation position may be located in the middle of the interior, or located on one side of the inner wall surface or at the opening of one side of the annular body, further providing a light-emitting diode, integrated circuit or other electronic heating combination, with good installation effect and convenience. Also good. [Embodiment] Referring first to third figures, the present invention creates a compact structure comprising a heat sink of an annular body, comprising: an annular body 10, which may be circular, elliptical or oblate in shape. Or a ring having a seal, and in the embodiment, a circle is used as a description, and a plurality of guide grooves 11 and grooves 12 are disposed on the peripheral side of the periphery, and the guide groove 11 and the groove 12 are arranged adjacent to each other in an order of mutual error. And a central portion of the inner portion of the annular body 10 is integrally provided with a heat source (not shown) such as a light-emitting diode, an integrated circuit or other electronic heating element, and is mounted on the seat plate 13; _ a plurality of heat-dissipating fins 20, along the ring The groove 12 of the 10th side of the body is disposed, and each of the heat dissipation fins 20 is correspondingly inserted and positioned with the groove 12; by the above structural features, when the press assembly is performed, the moving molding die 30 is aligned with two adjacent heat dissipation The guide groove 11 between the fins 20 is punched, and both side walls of the guide groove 11 are deformed by force, and the groove 12 which is deformed by the band is sandwiched by the heat dissipation fin 20 and is tightly attached to the peripheral side of the outer periphery of the annular body 10. 8 M345951 Please continue to refer to the third figure, the heat dissipating fins 2 〇 will be arranged in the outer periphery of the annular body 10, and each of the heat dissipating fins 20 has an upper folding seat 21 and a lower folding seat 22, so after the heat dissipating fins 20 are combined A combination surface can be formed, and the arrangement surface can provide a distance between each of the heat dissipation fins 2 and facilitate the punching of the molding die 30, and the heat dissipation is performed through a large area of the heat dissipation fin 2 〇 in contact with the air, and the heat source It is disposed on the pure 13 inside the annular body 10. In the second time, the corresponding heat radiating fins 20 are guided into the grooves I? of the annular body, and the annular body 10 and the heat radiating fins 20 have not yet been subjected to a stamping process. Referring to the fourth figure, the action diagram of punching the guide groove by means of a forming die 3〇 causes the annular body 10 to be deformed by force, and at the same time, the heat radiating fins 2G are subjected to both sides of the annular body 1 (). The guide groove u is pushed and tightly riveted into the groove 12 (refer to the fifth figure), and the annular body 1〇 and the heat dissipation fin 2G are tightly joined. The combination state of the loose fins 20 and the ring-shaped body 10 after press forming is shown in the sixth to seventh figures. The main feature of the creation of the ring-shaped heat sink is that it is formed by the punching of the die, eliminating the need for human factors such as the need for welding and the like. The sixth and seventh figures are the three-dimensional and top-view images of the finished product of the heat sink device of the present invention. It can be seen from the drawing that each heat-dissipating film 2 has been tightly riveted and integrated with the corresponding groove 12 of the annular body 10. 'The seat plate 13 will be equipped with a hot 9 M345951 source such as a light-emitting diode or an electronic component, and a high-efficiency heat dissipation by a plurality of heat-dissipating fins 20. Referring to the seventh and eighth figures, the seat plate 13 inside the annular body 10 is not limited to the inner position of the inner portion of the annular body 10, and may be disposed at the inner side of the annular body 10 depending on the heat source. The wall surface, or as shown in the ninth figure, is provided with the seat plate 13 at one side opening of the annular body 10 to provide different heat source mounting and to dissipate heat through the heat dissipation fins 20. M345951 [Simple description of the diagram] The first picture, the three-dimensional exploded view of the creation; the second picture, the combined perspective view of the creation; the third picture, the combined sectional view of the creation; the fourth picture, the stamping for the creation The schematic diagram of the action; the fifth figure, the schematic diagram of the compaction of the stamping for the creation; the sixth figure, the stereoscopic appearance of the ring-shaped heat sink after the stamping; the top view of the younger brother, the sixth figure, the eighth figure, An embodiment in which the creation seat plate is disposed inside the annular body; and the ninth figure is another embodiment in which the creation seat plate is disposed inside the annular body. [Main component symbol description] 10 Ring body 20 Heat sink fins 11 Guide groove 21 Upper fold seat 12 Groove 22 Lower fold seat 13 Seat plate 30 Mold

Claims (1)

M345951 九、申請專利範圍: 1· 一種包含環狀體之散熱裝置的緊結構造,包括有·· 一環狀體,其外圍周側分佈設複數導溝及凹槽, 該導溝與凹槽為相鄰互錯順序排列,以及環狀體内部 S有-提供熱源貼靠安裝的座板; 複數散熱鰭片,沿著環狀體周側之凹槽佈設,且 各散熱㈣與叫_插妓位; 瞻藉由上述結構特徵,在進行沖壓組配時,運動的 成型模具對正兩相鄰散熱鰭片間之導溝沖壓,同時導 /冓的兩側壁叉力變形,以及連帶形變的凹槽失掣散熱 鰭片且緊結於環狀體外圍周側。 2·如申請專利範圍第1項所述包含環狀體之散熱裝置 的緊結構造’其中環狀體之座板係成型一體且設於其 内部壁面。 • 3·如申請專利範圍第1項或第2項所述包含環狀體之散 熱裝置的緊結構造,其中環狀體内部設於一提供熱源 貼靠之座板,以及座板係一體設於環狀體中間位置之 内部壁面。 4·如申請專利範圍第彳項或第2項所述包含環狀體之散 熱裝置的緊結構造’其中環狀體内部於一提供熱源貼 靠之座板,以及座板係偏位設於環狀體一侧之内部壁 12 M345951 面。 5. 如申請專利範圍第1項或第2項所述包含環狀體之散 熱裝置的緊結構造,其中環狀體内部於一提供熱源貼 靠之座板,以及座板係設於環狀體之一側開口處。 6. 如申請專利範圍第1項所述包含環狀體之散熱裝置 的緊結構造,其中散熱鰭片具有一上折座、一下折 座,在各散熱鰭片組合後可形成一排列定位之組合 面。 7. 如申請專利範圍第1項或第2項所述包含環狀體之散 熱裝置的緊結構造,其中環狀體的形狀為圓形、橢圓 形、扁圓形或為具封口環體之任一種。 8. 如申請專利範圍第1項所述包含環狀體之散熱裝置 的緊結構造,其中該熱源為電子發熱元件。 9. 如申請專利範圍第8項所述包含環狀體之散熱裝置 的緊結構造,其中該熱源為發光二極體或積體電路之 任一種。 13M345951 IX. Patent application scope: 1. A compact structure comprising a heat dissipating device of an annular body, comprising an annular body, wherein a plurality of guiding grooves and grooves are arranged on a peripheral side of the periphery, and the guiding groove and the groove are The adjacent inter-error sequences are arranged in sequence, and the inner portion of the annular body S has a seat plate for providing a heat source to be abutted; the plurality of heat-dissipating fins are arranged along the groove on the circumferential side of the annular body, and each heat dissipation (four) is called a plug-in By the above structural features, when the stamping assembly is performed, the moving forming mold is pressed against the guide groove between the two adjacent heat radiating fins, and the two side walls of the guide/turn are deformed by the fork force, and the concave deformation of the joint The groove loses heat dissipation fins and is tightly attached to the peripheral side of the outer periphery of the annular body. 2. The compact structure of the heat sink comprising the annular body according to the first aspect of the invention, wherein the seat plate of the annular body is integrally formed and disposed on the inner wall surface thereof. 3. The tight structure of the heat dissipating device including the annular body according to the first or second aspect of the patent application, wherein the inner portion of the annular body is disposed on a seat plate for providing a heat source, and the seat plate is integrally provided The inner wall of the intermediate position of the annular body. 4. The tight structure of the heat dissipating device comprising the annular body according to the scope of claim 2 or 2, wherein the inner portion of the annular body is disposed on a seat plate that provides a heat source, and the seat plate is offset from the seat plate. The inner wall of one side of the body is 12 M345951. 5. The compact structure of the heat sink comprising the annular body according to claim 1 or 2, wherein the annular body is inside a seat plate that provides a heat source, and the seat plate is attached to the annular body. One of the side openings. 6. The compact structure of the heat dissipating device comprising the annular body according to claim 1, wherein the heat dissipating fin has an upper folding seat and a lower folding seat, and a combination of the positioning and positioning can be formed after the heat dissipating fins are combined. surface. 7. The compact structure of the heat sink comprising the annular body according to claim 1 or 2, wherein the annular body has a circular shape, an elliptical shape, an oblate shape or a sealing ring body. One. 8. The compact structure of the heat sink comprising the annular body according to claim 1, wherein the heat source is an electronic heating element. 9. The compact structure of the heat sink comprising the annular body according to claim 8, wherein the heat source is any one of a light emitting diode or an integrated circuit. 13
TW97206147U 2008-04-11 2008-04-11 Compacting structure of heat dissipation device including annular body TWM345951U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397667B (en) * 2010-02-12 2013-06-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397667B (en) * 2010-02-12 2013-06-01

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