TWM338431U - Package structure for light emitting diode - Google Patents

Package structure for light emitting diode Download PDF

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Publication number
TWM338431U
TWM338431U TW97204719U TW97204719U TWM338431U TW M338431 U TWM338431 U TW M338431U TW 97204719 U TW97204719 U TW 97204719U TW 97204719 U TW97204719 U TW 97204719U TW M338431 U TWM338431 U TW M338431U
Authority
TW
Taiwan
Prior art keywords
lens
base
light
optical lens
package structure
Prior art date
Application number
TW97204719U
Other languages
Chinese (zh)
Inventor
Chu-Fong Lam
Yi-Fan Liao
Original Assignee
E Pin Optical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by E Pin Optical Industry Co Ltd filed Critical E Pin Optical Industry Co Ltd
Priority to TW97204719U priority Critical patent/TWM338431U/en
Priority to JP2008004562U priority patent/JP3144867U/en
Publication of TWM338431U publication Critical patent/TWM338431U/en

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Abstract

A package structure for light emitting diode (LED) comprises a base, an LED die, an optical lens and a lens holder. The base has at least one holder cavity formed on the surface, and at least one chase formed on the side surface. The lens holder has an opening, at least one holder stem and at least one wedge. The optical lens is arranged between the lens holder and the base through the opening. The lens holder is fastened on the base by wedging the wedge with the chase, and positioned on the base by embedded the holder stem into the holder cavity, for enhancing the positioning between the optical lens and the base, so that the optical lens can generate a desired light pattern. Therefore, the required time of packaging process can be reduced, and the lens holder can be removed simply for replacing the optical lens, so the objective of changing light pattern quickly can be achieved.

Description

M338431 八、新型說明: 【新型所屬之技術領域】 本創作是有關於一種發光二極體之封裝結構,特別是 有關於一種以卡合方式使用鏡片固定座將光學鏡片固定 於基座且可快速更換光學鏡片之技術領域。 【先前技術】 發光二極體(LED)是利用電能直接轉化為光能的原 理,在半導體内正負極2個端子施加電壓,當電流通過, 使電子與電洞相結合而釋放能量,其以光的形式釋放, 此為發光二極體之發光原理。發光二極體依使用的材料 的不同,其能階高低使光子能量產生不同波長的光。發 光二極體具有體積輕巧、反應速度快及無污染等優勢, 這些優勢讓發光二極體應用領域逐漸跨足各產業界,且 逐漸發展出高功率之發光二極體,以解決亮度不足之問 題,使二極體亦可應用於照明光源領域,並有逐漸取代 傳統鑛絲燈之趨勢’是未來替代傳統照明之潛力產品。 發光二極體主要由基座、發光二極體晶片、光學鏡 片及鏡片固定座所構成,基座係提供發光二極體晶片之 承載、電極導接,在結構上,通常光學鏡片以鏡片固定 座固定於基座上,或使用黏膠將學鏡片黏固於基座。其 結構如美國專利US2004/0126913,將LED組裝於導線架 (lead frame)上,光學鏡片則崁合於基座或反光罩上;或 如曰本專利JP3191580 ’使用導電夾(electric contacts)將 6 M338431 發光二極體晶片與光鏡片固定;或如蘇俄專利 W02006109113,係將光學鏡片穿過載板(substrate)以導 桿(melted plastic indexing means)固定;或如台灣專利 TW238542,使用螺紋或或插槽(Socket)固定;或如日本 專利JP2007080879 ,使用光學鏡片卡勾於基座上;其他 , 各種組裝結構如日本專利JP2000150968、美國專利 • US5440468、US506877卜 US2007023CH、US2004190304、 ·· US2007139931等。由於使用黏膠填塞於發光二極體晶片 • 與光學鏡片之間,以固定光學鏡片與基座,可能因黏膠 受熱老化或黏膠黃化而影響亮度;而使用鏡片固定座將 光學鏡片固定方法,為具實用的結構,如日本專利 JP60198412等。如第1圖,其係繪示使用鏡片固定座之 發光一極體之封裝結構之侧視圖。圖中,封農結構1包 含一基座(base) 10、一發光二極體晶片(LED die) 11、一 光學鏡片12及一鏡片固定座(lens holder) 13。發光二極 體晶片11係設置於基座10上,透鏡12覆蓋該發光二極 • 體晶片,且置於鏡片固定座13及基座1〇之間且穿過铲 片固定座13之開孔。基座10之表面具有至少—通^ 1〇1,而鏡片固定座13之支撐柱131係穿過通孔1〇1, 著將支撐柱131露出通孔1〇1的支撐柱露出通孔部分妾 熱熔而產生形變,使支撐柱131無法脫離通孔,雜此19 到鏡片固定座13將光學鏡片12固定於基座上的目曰的達 使用此種結構除可固定光學鏡片外,也可適當防止埶。, 脹造成光學鏡片與基座分離,尤其適用於具特殊光^腌 LED ;特殊光型的LED在結構上更需要光學鏡片與旯的 7 M338431 能穩固結合。然而,此種結構卻難以達到光學鏡片與基 座定位的功效,且需要使用熱熔將支撐柱131產生形變, 在組裝上難以達成快速之目的。 隨著發光二極體日益普及,應用的領域也越來越 廣,對於能產生特殊光型(light pattern)的發光二極體的需 / 求也越來越多,如第2圖所示之發光二極體,其係發出 ' 一五角形之光型。然而,此種能產生特殊光型的發光二 龜極體對於封裝結構中的光學鏡片的定位要求十分嚴格, ,因為光學鏡片的位置有些微的改變,或是光學鏡片有些 微的轉動,都會影響此種發光二極體的光型品質。而上 述之習知技藝之封裝結構丨,僅以鏡片固定座13之支撐 柱131限定於通孔ιοί中的方式來將鏡片固定座13及光 予鏡片12固疋於基座1〇上,但是經過長時間的使用, 封裝結構難免會受到外力晃動或震動,致使支撐柱露出 通孔部分19無法有限地將支撐柱131限定於通孔1〇1中 而使得鏡片固定座13可能會鬆動而導致光學鏡片12的 • 移動或轉動,進而影響發光二極體的發光光型。 尤以,若使用黏膠或支撐柱131熱溶而產生形變所 - 製成的發光二極體,若裝設於燈具或其他發光體上,其 光型已受光學鏡片固定於發光二極體而無法改變;當有 更換光型需求時,必須替換整組發光二極體,此造成不 便及費用的提高。 為改善上述所提出的問題。本創作人基於多年從事 研究與諸多實務經驗,經多方研究設計與專題探討,遂 8 M338431 於本創作提出一種發光二極體之封裝結構以作為前述期 望一實現方式與依據。 【新型内容】 有鑑於此,本創作之目的就是在提供一種發光二極 ^ 體之封裝結構,以縮短封裝程序所需之時間,並兼顧加 - 強鏡片固定座於基座上之固定及光學鏡片與基座之間的 Λ 定位;更進一步可達快速替換光學鏡片以改變光型之目 •的。 根據本創作之目的,提出一種發光二極體之封裝結 構,其包含一基座(base)、一發光二極體晶片(LED die)、 一光學鏡片(optical lens)及一鏡片固定座(lens holder)。基 座之一表面具有至少一固定座定位孔(holder cavity),且 基座之一侧邊具有至少一容槽(chase)。發光二極體晶片 係設置於基座上,用以發出光線。光學鏡片係覆蓋發光 二極體晶片,用以將發光二極體晶片發出的光線予以集 聚並產生需要之光型。鏡片固定座具有一開孔 (opening)、至少一個固定座定位柱(holder stem)及^—^勾 - 結構(wedge),而光學鏡片係設置於鏡片固定座及基座之 間且穿過開孔,而鏡片固定座係藉由卡勾結構卡住容槽 而固定於基座上,且藉由固定座定位柱欲入固定座定位 孔而定位於基座上。 此外,此光學鏡片視需要可進一步具有至少一鏡片 定位柱(lens stem),且基座之表面上相對應具有至少一鏡 M338431 片定位孔(lens cavity),而光學鏡片係藉由鏡片定位柱喪 入鏡片定位孔而定位於基座上。 此外’此光學鏡片視需要可進一步具有至少一鏡片 對準部(lens alignment),且鏡片固定座之開孔之内壁上係 具有相對應的至少一固定座對準部(holder alignment),當 鏡片固定座固定於基座上時,鏡片固定座係藉由固定座 對準部結合鏡片對準部以定位該光學鏡片。 此外,此鏡片固定座之開孔内壁表面視需要可進一 步具有一反光層(reflection layer)。 承上所述,因依本創作之發光二極體之封裝結構, 具有以下優點: (1) 本創作之發光二極體之封裝結構可縮短封裝程 序所需之時間。 (2) 本創作之發光二極體之封裝結構可使鏡片固定 座較佳地固定及定位於基座上。 (3) 本創作之發光二極體之封裝結構可使光學鏡片 較佳地固定及定位於基座上。 (4) 本創作之發光二極體之封裝結構可簡易拆解以 更換光學鏡片,可達快速更換光型之目的。 【實施方式】 為使本創作更加明確詳實,茲列舉較佳實施例並配 合下列圖示,將本創作之結構及其技術特徵詳述如後·· M3 3 8431 本創作以下所揭示之實施例,乃是針對本創作發光二極 體之封裝結構之主要構成元件而作說明,因此本創&以 下所揭示之實施例雖是應用於一發光二極體中,但就一 般具有發光二極體之封裝結構而言,除了本創作揭 之封裝結構外,其他結構乃屬—般通知之技術,因此 •般在此領域中熟悉此項技藝之人士瞭解,本創作所揭示 毛光一極體之封裝結構之構成元件並不限制於以下所揭 ·- 不之實施例結構,也就是該發光二極體之各構成元件是 • 可以進行許多改變、修改、甚至等效變更的,例如:該 發光二極體之封裝結構中光學鏡片之形狀設計、光型設 計並不限制;或基座之外型、厚度、材質並不限制;或 鏡片固定座之外型、厚度、材質也不限制;或定位柱與 疋位孔之配合方式或形狀也不限制。 ’ 請參閱第3圖及第4圖,其係分別繪示本創作之發 光一極體之封裝結構之第一實施例之外觀分解示意圖及 侧視圖。圖中,封裝結構2包含一基座20、一發光二極 • 體晶片21、一光學鏡片22及一鏡片固定座23。光學鏡 • 片22係覆蓋發光二極體晶片21,用以將發光二極體晶片 21發出的光線予以集聚並產生需要之光型,而鏡片固定 座23係用以將光學鏡片22固定於基座20上。 基座20之一表面具有至少一固定座定位孔(holder cavity) 201 ’且基座20之一侧邊具有至少一容槽(chase) 202。發光二極體晶片21係設置於基座20上,用以發出 光線。其中,光學鏡片22較佳的是一玻璃或塑膠所製成 之可產生預定光型之透鏡。而基座20之表面視需要可具 11 M338431 有一凹面以容置發光二極體晶片21。 鏡片固定座23具有一開孔231、至少一個固定座定 位柱(holder stem) 232 及^—^ 勾結構(wedge) 233,固定座 定位柱232及卡勾結構233之位置係分別對應固定座定 位孔201及容槽202之位置。光學鏡片22設置於鏡片固 • 定座23及基座20之間且穿過開孔231,而鏡片固定座 \ 23係藉由卡勾結構233卡住容槽202而固定於基座20 ' 上,且藉由此固定座定位柱232嵌入固定座定位孔201 Φ 而定位於基座20上。藉此封裝架構,鏡片固定座23可 將光學鏡片22固定於基座上。 在封裝程序中,卡勾結構233係對準容槽202之位 置,而固定座定位柱232對準固定座定位孔201之位置, 接著將鏡片固定座23下壓於基座20上,當卡勾結構233 碰觸到基座20而繼續被下壓時,卡勾結構233會約略變 形而沿基座20之侧邊向外擴,直到卡勾結構233被下壓 到容槽202,卡勾結構233的彈性使得卡勾結構233恢復 • 原狀而與容槽202相卡合,而且鏡片固定座23下壓於基 座20亦使固定座定位柱232嵌入固定座定位孔201,藉 此可進一步加強鏡片固定座23於基座20上之定位。 當欲更換不同光型鏡片時,可將鏡片固定座23之卡 勾結構233以簡易工具略變形而脫離容槽202,分離鏡片 固定座23、基座20及光學鏡片22;經更換不同型之光 學鏡片22,再依據上述之組裝方法,可達快速不破壞元 件之方式完成光學鏡片22之更換。 12 M338431 由上述說明可知,習知技藝之封装結構需要將鏡片 固定座之支撐柱熱融變形,而本創作之發光二極體之封 裝結構與習知技藝相比,可達到縮短封裝程序所需時間 之功效,更可不必破壞鏡片固定座而快速更換光學鏡片。 、此外,鏡片固定座23之開孔内壁表面234視需要可 .進一步具有一反光層(reflection layer),例如在内壁表面 _ 234上電鍍銘或銀、喷附銘基或銀基物質,以形成一薄膜 ' 層,以提高内壁表面234的反射效果。此外,基座2〇之 •外型可視需要而改變,並不限於第3圖所示之四方形, 其他外形之基座亦在本創作之保護範圍内。 请參閱第5圖,其係為本創作之發光二極體之封裝 結構之第二實施例之外觀分解示意圖。圖中,封裝結構3 與封裝結構2不同之處在於,封裝結構3所包含之光學 鏡片32具有至少一鏡片定位柱(lens stem) 322,而基座 3〇之表面上相對應具有至少一鏡片定位孔cavity) 301。光學鏡片32係藉由鏡片定位柱322嵌入鏡片定位 孔=〇1而定位於基座30上。藉此,光學鏡片32可較佳 -地定位於基座30上,以降低因封裝結構3受到外力晃動 •或震動而導致光學鏡片32移動或轉動的可能性。 "月參閱第6圖,其係為本創作之發光二極體之封裝 結構之第三實施例之外觀分解示意圖。圖中,封裝結構4 上述封裝結構2不同之處在於,封裝結構4所包含之 ,學鏡片42’係以塑膠射出成型,具有至少一鏡片對準 口P (lens alignment) 423,此鏡片對準部423可於塑膠射出 13 M338431 之模具所設置,而與光學鏡片42同時射出成梨, 固定座43之開孔之内壁234上係具有相對應的至= 而繞片 定座對準部(holder alignment) 439。當鏡片固定座〜固 定於基座20上時,鏡片固定座43係藉由固定遂A 43 439結合鏡片對準部423以定位光學鏡片42。轉對準 片固定座43可較佳地將光學鏡片42固定及定^此’輓 20上,以降低因封裝結構4受到外力晃動或震;基座 光學鏡片42移動或轉動的可能性。 而導致 由此,上述鏡片定位孔 '鏡片定位柱、繞片 及固定座對準部可視需要組合使用,而不受限 斟準 固 部 部 例之描述,亦即,光學鏡片亦可同時具有鏡片定&見施 鏡片對準部,且鏡片固定座及基座分別具有固定&挺及 部及鏡片定位孔,藉此來達到更好的定位及固定歲對率 '功致。 請參閱第7圖,其係為本創作之發光二麵題.° 結構之第四實施例之外觀分解示意圖。圖中,麵 與上述封裝結構不同之處在於,封裝結構5所包攝S 座50及鏡片固定座53之外型係為一圓型,从適^文基 同應用。在本實施例,光學鏡片42係使用坡續精a於不 造 品規格之玻璃預型體(glass preform)或玻璃材料复处戍 模具中,經由加溫鑄造(heating and casting)過種镇造 若使用於白光LED,可使用螢光粉壓滲玻璃(Phospho°r powder Inserted Glass Surface,簡稱為 pigs)製造技術 所製成的光學鏡片42,其在鏡片表層渗入榮光粉,可將 LED發出的光線轉換波長成為白光。在本實施例,圓型 (glass precision molding manufacture)技術,其係 14 M338431 基座50之表面具有固定座定位孔201,而侧邊具有容槽 202,而圓型鏡片固定座53亦具有相對應之固定座定位 柱232及卡勾結構233,所以鏡片固定座53亦可藉由卡 勾結構233卡住容槽202而固定於基座20上,且藉由固 定座定位柱232嵌入固定座定位孔201而定位於基座50 „ 上,藉此,鏡片固定座53可將光學鏡片22固定於基座 50上,而不受基座及鏡片固定座之外型所限制。由於此 . 結構簡單,使用鏡片固定座53容易將剛性的玻璃材質的 φ 光學鏡片42固定及定位;製成之圓形的LED容易裝設於 燈具或使用於汽車車燈内使用。 以上所述僅為本創作的較佳實施例,對本創作而言 僅是說明性的,而非限制性的;本專業技術人員理解, 在本創作權利要求所限定的精神和範圍内可對其進行許 多改變,修改,甚至等效變更,但都將落入本創作的保 護範圍内。 ® 【圖式簡單說明】 " 第1圖係繪示習知技藝之發光二極體之封裝結構之侧視 - 圖; 第2圖係繪示一發出五角形光型之發光二極體之示意圖; 第3圖係繪示本創作之發光二極體之封裝結構之第一實 施例之外觀分解示意圖; 第4圖係繪示本創作之發光二極體之封裝結構之第一實 施例之側視圖; 15 M338431 第5圖係繪示本創作之發光二極體之封裝結構之第二實 施例之外觀分解示意圖; 第6圖係繪示本創作之發光二極體之封裝結構之第三實 施例之外觀分解示意圖;以及 第7圖係繪示本創作之發光二極體之封裝結構之第四實 • 施例之外觀分解示意圖。 【主要元件符號說明】 p 1,2,3,4,5 :發光二極體之封裝結構; ^ 10,20,30,50 :基座; 101 :通孔; 11,21 :發光二極體晶片; 12,22,32,42 :光學鏡片; 13,23,43,53 :鏡片固定座; 131 :支撐柱; 19 :支撐柱露出通孔部分; 201 :固定座定位孔; • 202 :容槽; - 231 :開孔; 232 :固定座定位柱; 233 :卡勾結構; 234 :開孔内壁表面; 301 :鏡片定位孔; 322 :鏡片定位柱; 423 :鏡片對準部;以及 439 :固定座對準部。 16M338431 VIII. New Description: [New Technology Field] This creation is about a package structure of a light-emitting diode, especially for a lens holder that uses a lens holder to fix the optical lens to the base and can be quickly The technical field of replacing optical lenses. [Prior Art] A light-emitting diode (LED) is a principle that directly converts light into light energy by using electric energy. A voltage is applied to two terminals of the positive and negative electrodes in the semiconductor, and when the current passes, the electrons and the hole are combined to release energy. Release in the form of light, this is the principle of illumination of a light-emitting diode. The light-emitting diodes have different energy levels depending on the materials used, so that the photon energy produces light of different wavelengths. The light-emitting diode has the advantages of light weight, fast response and no pollution. These advantages make the application field of the light-emitting diode gradually span various industries, and gradually develop a high-power light-emitting diode to solve the problem of insufficient brightness. The problem is that the diode can also be used in the field of lighting sources, and there is a tendency to gradually replace the traditional wire lamp' is the potential to replace traditional lighting in the future. The light-emitting diode is mainly composed of a pedestal, a light-emitting diode chip, an optical lens and a lens holder. The pedestal provides a bearing of the light-emitting diode chip and an electrode connection. In structure, the optical lens is usually fixed by a lens. The seat is fixed to the base, or the adhesive lens is used to adhere the lens to the base. The structure is as shown in US Patent No. 2004/0126913, the LED is assembled on a lead frame, and the optical lens is coupled to the pedestal or the reflector; or, as in the patent JP3191580, the use of electric contacts 6 The M338431 light-emitting diode chip is fixed with the optical lens; or, as in the Russian patent WO2006109113, the optical lens is fixed through a substrate by a melted plastic indexing means; or, as in Taiwan patent TW238542, a thread or a plug is used. The Socket is fixed; or, as in Japanese Patent JP2007080879, an optical lens is used to hook the pedestal; other various assembly structures such as Japanese Patent JP2000150968, US Patent No. 5440468, US506877, US2007023CH, US2004190304, USC139139931, and the like. Because the adhesive is filled between the LED chip and the optical lens to fix the optical lens and the pedestal, the brightness may be affected by the aging of the adhesive or the yellowing of the adhesive; and the optical lens is fixed by using the lens holder. The method is a practical structure such as Japanese Patent JP60198412. As shown in Fig. 1, a side view of a package structure using a light-emitting diode of a lens holder is shown. In the figure, the agricultural structure 1 comprises a base 10, an LED die 11, an optical lens 12 and a lens holder 13. The LED chip 11 is disposed on the susceptor 10, and the lens 12 covers the illuminating diode chip and is placed between the lens holder 13 and the pedestal 1 且 and passes through the opening of the shovel holder 13 . The surface of the susceptor 10 has at least a through hole, and the support post 131 of the lens holder 13 passes through the through hole 1〇1, and the support post that exposes the support post 131 to the through hole 1〇1 exposes the through hole portion. The heat is melted to deform, so that the support post 131 cannot be detached from the through hole, and the 19 to the lens mount 13 fixes the optical lens 12 to the base, and the structure can be used to fix the optical lens. It can be prevented properly. The expansion causes the optical lens to be separated from the pedestal, especially for special light-cured LEDs; the special light-type LEDs are structurally more in need of optical lenses and 旯 7 M338431 can be firmly combined. However, such a structure is difficult to achieve the effect of positioning the optical lens and the base, and it is necessary to use the heat fusion to deform the support post 131, which makes it difficult to achieve rapid assembly. With the increasing popularity of light-emitting diodes, the field of application is becoming wider and wider, and the demand for light-emitting diodes that produce special light patterns is increasing, as shown in Figure 2. A light-emitting diode that emits a 'pentagonal light' type. However, such a light-emitting two-pole body capable of producing a special light type requires strict positioning of the optical lens in the package structure, because the position of the optical lens is slightly changed, or the optical lens is slightly rotated, which may affect The light quality of such a light-emitting diode. In the above-mentioned conventional packaging structure, the lens holder 13 and the optical lens 12 are fixed to the base 1 only by the support post 131 of the lens holder 13 being defined in the through hole ιοί, but After a long period of use, the package structure is inevitably subjected to external force sway or vibration, so that the support post exposed through hole portion 19 cannot limit the support post 131 to the through hole 1〇1, so that the lens mount 13 may be loosened. The movement or rotation of the optical lens 12 affects the illuminating light pattern of the light-emitting diode. In particular, if a polarizer is formed by using a glue or a support column 131 to be thermally dissolved, the light-emitting diode is mounted on a lamp or other illuminator, and the light pattern is fixed to the light-emitting diode by the optical lens. It cannot be changed; when there is a need to replace the light type, the entire group of light-emitting diodes must be replaced, which causes inconvenience and cost. To improve the problems raised above. Based on many years of research and many practical experiences, this creator has been researching and designing and discussing the topic. 遂 8 M338431 proposed a package structure of light-emitting diodes in this creation as the realization and basis of the above-mentioned expectations. [New content] In view of this, the purpose of this creation is to provide a light-emitting diode package structure to shorten the time required for the packaging process, and to take into account the fixing and optical of the strong-fix lens holder on the base. The positioning of the 之间 between the lens and the pedestal; further, it is possible to quickly replace the optical lens to change the shape of the light. According to the purpose of the present invention, a package structure of a light emitting diode is provided, which comprises a base, an LED die, an optical lens and a lens mount (lens) Holder). One of the surfaces of the base has at least one holder cavity, and one side of the base has at least one chase. A light emitting diode chip is disposed on the pedestal for emitting light. The optical lens covers the light-emitting diode wafer for aggregating the light emitted by the light-emitting diode wafer and producing the desired light pattern. The lens holder has an opening, at least one holder stem and a wedge, and the optical lens is disposed between the lens holder and the base and passes through The hole fixing frame is fixed to the base by the hook structure clamping the groove, and is positioned on the base by the fixing seat positioning post to be inserted into the fixing seat positioning hole. In addition, the optical lens may further have at least one lens stem, and the surface of the pedestal has at least one mirror M338431 lens cavity, and the optical lens is positioned by the lens positioning column. The lens is positioned in the positioning hole of the lens and positioned on the base. In addition, the optical lens may further have at least one lens alignment as needed, and the inner wall of the opening of the lens holder has a corresponding at least one holder alignment, when the lens When the mount is fixed to the base, the lens mount is coupled to the lens alignment portion by the mount aligning portion to position the optical lens. Further, the inner wall surface of the opening of the lens holder may further have a reflection layer as needed. As described above, the package structure of the light-emitting diode according to the present invention has the following advantages: (1) The package structure of the light-emitting diode of the present invention can shorten the time required for the package process. (2) The package structure of the light-emitting diode of the present invention allows the lens holder to be preferably fixed and positioned on the base. (3) The package structure of the light-emitting diode of the present invention allows the optical lens to be preferably fixed and positioned on the susceptor. (4) The package structure of the light-emitting diode of the present invention can be easily disassembled to replace the optical lens for the purpose of quickly changing the light type. [Embodiment] In order to make the present invention more clear and detailed, the preferred embodiment and the following diagrams are used to describe the structure of the present invention and its technical features as follows. M3 3 8431 This is an embodiment disclosed below. The present invention is directed to the main constituent elements of the package structure of the present light-emitting diode. Therefore, the embodiments disclosed in the present invention are applied to a light-emitting diode, but generally have a light-emitting diode. In terms of the package structure of the body, in addition to the package structure disclosed in the present invention, other structures are generally notified techniques, and therefore, those skilled in the art are familiar with the art, and the present disclosure reveals the The constituent elements of the package structure are not limited to the following embodiments, which are not the embodiment structure, that is, the constituent elements of the light-emitting diode are: • many changes, modifications, and even equivalent changes can be made, for example, the illumination The shape design and optical design of the optical lens in the package structure of the diode are not limited; or the shape, thickness and material of the pedestal are not limited; or the lens holder is not limited , Thickness, material is not restricted; or fit or shape of the positioning holes and the positioning post Cloth not limiting. Please refer to FIG. 3 and FIG. 4, which are respectively an exploded perspective view and a side view showing a first embodiment of the package structure of the light-emitting diode of the present invention. In the figure, the package structure 2 comprises a base 20, a light emitting diode, a body wafer 21, an optical lens 22 and a lens holder 23. The optical lens • the film 22 covers the light-emitting diode chip 21 for collecting the light emitted from the light-emitting diode chip 21 and generating a desired light pattern, and the lens holder 23 is used for fixing the optical lens 22 to the base. On the seat 20. One surface of the base 20 has at least one holder cavity 201' and one side of the base 20 has at least one chase 202. A light emitting diode chip 21 is disposed on the susceptor 20 for emitting light. Among them, the optical lens 22 is preferably a lens made of glass or plastic to produce a predetermined light type. The surface of the susceptor 20 may have a concave surface to accommodate the LED chip 21 as needed. The lens holder 23 has an opening 231, at least one holder stem 232 and a hook 233, and the positions of the fixing post 232 and the hook structure 233 are respectively positioned corresponding to the fixing seat. The position of the hole 201 and the pocket 202. The optical lens 22 is disposed between the lens holder 23 and the base 20 and passes through the opening 231. The lens holder 23 is fixed to the base 20' by the hook structure 233. And positioning on the base 20 by the fixing seat positioning post 232 being embedded in the fixing seat positioning hole 201 Φ. With this package architecture, the lens holder 23 secures the optical lens 22 to the base. In the packaging process, the hook structure 233 is aligned with the position of the pocket 202, and the fixed positioning post 232 is aligned with the position of the fixing seat positioning hole 201, and then the lens holder 23 is pressed down on the base 20, when the card When the hook structure 233 touches the base 20 and continues to be pressed down, the hook structure 233 is approximately deformed and expands outward along the side of the base 20 until the hook structure 233 is pressed down to the receptacle 202, the hook The elasticity of the structure 233 causes the hook structure 233 to be restored to be engaged with the pocket 202, and the lens holder 23 is pressed against the base 20 to embed the holder positioning post 232 into the holder positioning hole 201, thereby further The positioning of the lens holder 23 on the base 20 is reinforced. When the different optical lenses are to be replaced, the hook structure 233 of the lens holder 23 can be slightly deformed by the simple tool to be separated from the pocket 202, and the lens holder 23, the base 20 and the optical lens 22 are separated; The optical lens 22, in accordance with the assembly method described above, completes the replacement of the optical lens 22 in a manner that does not destroy the component quickly. 12 M338431 It can be seen from the above description that the packaging structure of the prior art requires hot-melt deformation of the support post of the lens holder, and the package structure of the LED of the present invention can achieve the shortening of the packaging process compared with the prior art. The effect of time makes it possible to quickly change the optical lens without damaging the lens holder. In addition, the inner wall surface 234 of the lens holder 23 may further have a reflection layer, for example, an inner surface _ 234 plated with silver or silver, sprayed with a base or a silver-based substance to form A film 'layer to enhance the reflection of the inner wall surface 234. In addition, the shape of the base 2 can be changed as needed, and is not limited to the square shown in Fig. 3. The base of other shapes is also within the protection scope of the present invention. Please refer to FIG. 5, which is a schematic exploded view of the second embodiment of the package structure of the light-emitting diode of the present invention. In the figure, the package structure 3 is different from the package structure 2 in that the optical lens 32 included in the package structure 3 has at least one lens stem 322, and the surface of the base 3 has at least one lens correspondingly. Positioning hole cavity) 301. The optical lens 32 is positioned on the base 30 by the lens positioning post 322 being embedded in the lens positioning hole = 〇1. Thereby, the optical lens 32 can be preferably positioned on the base 30 to reduce the possibility of the optical lens 32 moving or rotating due to external force swaying or vibration of the package structure 3. "Monthly, Fig. 6 is a schematic exploded view showing the third embodiment of the package structure of the light-emitting diode of the present invention. In the figure, the package structure 4 differs from the package structure 2 in that the package lens 4 is formed by plastic injection molding, and has at least one lens alignment 423, which is aligned. The portion 423 can be disposed in the mold of the plastic injection 13 M338431, and is simultaneously formed into the pear at the same time as the optical lens 42. The inner wall 234 of the opening of the fixing seat 43 has a corresponding to = and the wafer seating alignment portion (holder) Alignment) 439. When the lens holder is fixed to the base 20, the lens holder 43 is coupled to the lens alignment portion 423 by the fixed jaw A 43 439 to position the optical lens 42. The aligning plate holder 43 preferably fixes and fixes the optical lens 42 to reduce the possibility that the package structure 4 is shaken or shaken by an external force; the susceptor optical lens 42 moves or rotates. Therefore, the lens positioning hole 'the lens positioning post, the winding piece and the fixing seat alignment part can be used in combination, and is not limited to the description of the quasi-solid part, that is, the optical lens can also have the lens at the same time. See <See the lens alignment part, and the lens holder and the base respectively have a fixing & and a positioning hole of the lens, thereby achieving better positioning and fixing the age-rate. Please refer to FIG. 7 , which is a schematic exploded view of the fourth embodiment of the light-emitting surface of the present invention. In the figure, the surface is different from the above-mentioned package structure in that the package structure 5 is surrounded by the S-seat 50 and the lens holder 53 in a circular shape, and is applied in the same manner. In the present embodiment, the optical lens 42 is spliced into a glass preform or a glass material in a mold without a product specification, and is subjected to heating and casting. If it is used for a white LED, an optical lens 42 made by a phosphor powder infiltrated glass surface (pigs) manufacturing technology can be used to infiltrate the glory powder on the surface of the lens to emit the LED. The light conversion wavelength becomes white light. In the embodiment, the glass precision molding manufacture technology has a fixing seat positioning hole 201 on the surface of the base 14 of the M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M The fixing frame 232 and the hook structure 233 are fixed to the base 20 by the hook structure 233, and the positioning post 232 is embedded in the fixed seat. The hole 201 is positioned on the base 50 „, whereby the lens holder 53 can fix the optical lens 22 to the base 50 without being restricted by the shape of the base and the lens holder. Because of this, the structure is simple. The rigid glass material φ optical lens 42 is easily fixed and positioned by using the lens holder 53. The round LED made is easy to be installed in a lamp or used in a car lamp. The above is only for the creation of the present invention. The present invention is intended to be illustrative, and not restrictive, and it will be understood by those skilled in the art The effect is changed, but it will fall within the scope of protection of this creation. ® [Simple description of the drawing] " Figure 1 shows the side view of the package structure of the light-emitting diode of the prior art - Figure 2 FIG. 3 is a schematic exploded view showing the first embodiment of the package structure of the light-emitting diode of the present invention; FIG. 4 is a schematic diagram showing the appearance of the first embodiment of the package structure of the light-emitting diode of the present invention; A side view of a first embodiment of a package structure of a light-emitting diode; 15 M338431 Fig. 5 is a schematic exploded view showing the second embodiment of the package structure of the light-emitting diode of the present invention; FIG. 7 is a schematic exploded view showing the third embodiment of the package structure of the light-emitting diode of the present invention; and FIG. 7 is a schematic exploded view showing the fourth embodiment of the package structure of the light-emitting diode of the present invention. [Description of main component symbols] p 1,2,3,4,5 : package structure of light-emitting diode; ^ 10,20,30,50 : pedestal; 101 :through hole; 11,21 : light-emitting diode Wafer; 12, 22, 32, 42: optical lens; 13, 23, 43, 53: lens holder; 131 : support column; 19: support column exposing the through hole portion; 201: fixing seat positioning hole; • 202: cavity; - 231: opening; 232: fixing seat positioning column; 233: hook structure; 234: opening inner wall Surface; 301: lens positioning hole; 322: lens positioning post; 423: lens alignment portion; and 439: fixing seat alignment portion.

Claims (1)

M338431 九、申請專利範圍: 1、 一種發光二極體之封裝結構,其包含: 一基座,該基座之一表面具有至少一固定座定位 孔,且該基座之一侧邊具有至少一容槽, 一發光二極體晶片,係設置於該基座上,用以發出 _ 光線; • 一光學鏡片,係覆蓋該發光二極體晶片,用以將該 _ 發光二極體晶片發出的光線予以集聚並產生需要之光 , 型;以及 一鏡片固定座,係具有一開孔、至少一個固定座定 位柱及一卡勾結構,該光學鏡片係設置於該鏡片固定座 及該基座之間且穿過該開孔,而該鏡片固疋座係藉由該 卡勾結構卡住該容槽而固定於該基座上,且藉由該固定 座定位柱嵌入該固定座定位孔而定位於該基座上。 2、 如申請專利範圍第1項所述之封裝結構,其中該光學鏡 _ 片進一步具有至少一鏡片定位柱,而該基座之該表面上 相對應具有至少一鏡片定位孔,而該光學鏡片係藉由該 鏡片定位柱嵌入該鏡片定位孔而定位於該基座上。 3、 如申請專利範圍第1項所述之封裝結構,其中該光學鏡 片進一步具有至少一鏡片對準部,而該鏡片固定座之該 開孔之内壁上係具有相對應的至少一固定座對準部,當 該鏡片固定座固定於該基座上時,該鏡片固定座係藉由 該固定座對準部結合該鏡片對準部以定位該光學鏡片。 4、 如申請專利範圍第丨項所述之封裴結構,其中該鏡片固 17 M338431 定座之開孔内壁表面係具有一反光層。 5、 如申請專利範圍第1項所述之封裝結構,其中該光學鏡 片係為一玻璃或塑膠所製成之可產生預定光型之透鏡。 6、 如申請專利範圍第4項所述之封裝結構,其中該鏡片固 定座之反光層係包含一電鍍鋁或電鍍銀所形成之薄膜 - 層。 - 7、如申請專利範圍第4項所述之封裝結構,其中該鏡片固 _ 定座之反光層係包含一喷塗鋁基或銀基之反光物質所 . 形成之薄膜層。M338431 IX. Patent application scope: 1. A package structure of a light-emitting diode, comprising: a base having a surface of at least one fixing seat on one surface thereof; and one side of the base has at least one side a light-emitting diode chip disposed on the pedestal for emitting _ light; an optical lens covering the light-emitting diode chip for emitting the OLED chip The light is concentrated to generate a desired light, and a lens holder has an opening, at least one fixing seat positioning post and a hook structure, and the optical lens is disposed on the lens holder and the base And passing through the opening, and the lens fixing seat is fixed on the base by the hook structure clamping the groove, and is positioned by the fixing seat positioning post being embedded in the fixing seat positioning hole On the base. 2. The package structure of claim 1, wherein the optical lens further comprises at least one lens positioning post, and the surface of the base has at least one lens positioning hole corresponding to the surface, and the optical lens The lens positioning post is embedded in the lens positioning hole to be positioned on the base. 3. The package structure of claim 1, wherein the optical lens further has at least one lens alignment portion, and the inner wall of the opening of the lens holder has a corresponding at least one fixed seat pair The lens fixing seat is coupled to the lens alignment portion by the fixing seat alignment portion to position the optical lens when the lens holder is fixed on the base. 4. The sealing structure as claimed in claim 3, wherein the lens solid surface of the opening of the lens has a reflective layer. 5. The package structure of claim 1, wherein the optical lens is a lens made of glass or plastic to produce a predetermined light pattern. 6. The package structure of claim 4, wherein the reflective layer of the lens holder comprises a film-layer formed by electroplating aluminum or electroplating silver. 7. The package structure of claim 4, wherein the reflective layer of the lens-fixing layer comprises a sprayed aluminum-based or silver-based reflective material.
TW97204719U 2008-03-19 2008-03-19 Package structure for light emitting diode TWM338431U (en)

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JP2008004562U JP3144867U (en) 2008-03-19 2008-07-04 Light emitting diode package structure

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TWI489663B (en) * 2012-03-29 2015-06-21 Advanced Optoelectronic Tech Led package

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JP5303579B2 (en) * 2011-01-11 2013-10-02 京セラコネクタプロダクツ株式会社 Semiconductor light emitting element mounting module and semiconductor light emitting element module
JP5841839B2 (en) * 2011-12-28 2016-01-13 スタンレー電気株式会社 Alignment structure and alignment method of LED and condenser lens
US20150372204A1 (en) * 2013-01-31 2015-12-24 Panasonic Intellectual Property Management Co.,Ltd Ultraviolet light emitting device
KR20160088003A (en) * 2015-01-15 2016-07-25 아이오솔루션(주) Leakage prevention type optical holder comprises a molding lens
CN113488437B (en) * 2021-05-31 2024-04-19 安庆市晶科电子有限公司 Transistor installation shell

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI489663B (en) * 2012-03-29 2015-06-21 Advanced Optoelectronic Tech Led package

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