M337823 八、新型說明： 【新型所屬之技術領域】 本創作係涉及一種對稱 構改良，其是用於將製作成 成品半導體切割為若干所需 c版上之切割工作台及治具 【先前技術】M337823 VIII. New Description: [New Technology Field] This creation relates to a symmetry improvement, which is used to cut a finished semiconductor into a number of required c-plate cutting stations and fixtures. [Prior Art]
- 按，一般之半導體等I ^ 設計越來越小，以便於使用 _產品設計也能大幅縮小，而 C晶圓元件在加工上，為了 C晶圓元件都是多數以陣量 後之一片多數的半成品半導 • 切割開’令多數之半成品之 • 導體使用，而以往之半導體 座上設置一切割工作台用以 帶將晶圓固定，使晶圓能夠 具一一切割分離成獨立小塊 _ 生位移，而切割工作台是呈 • 設置有固定裝置，該固定裝 -，故通常是使用可快速拆換 嘴之吸力使治具能夠被吸附 之圓形或是矩形狀，中央具 膠帶由下而上黏附，晶圓再 治具與晶圓隨切割工作台移 割刀具所切割開。 然，此種治具與切割工 其中圓形在矩形工件進行多 ;而矩形則是在圓形或不規 弧形之切割工作台及治具框結 半成品之半導體加工，以將半 要之大小，便於分別焊接於I 框結構加以改良設計者。 c晶圓元件，其使用之設置與 於各式之電子產品上，令電子 方便於攜帶，但是半導體等I 製程方便與量產，半導體等I 方式排列一次生產，待生產完 體再經由切割方式，將其一一 半導體成為若干獨立之成品半 元件的切割，都是利用於一滑 固定一治具，再以治具利用膠 以切割工作台上設置之切割刀 ’滑座是可帶動切割工作台產 現圓形或是矩形狀，並於周邊 置是要固定會更換之治具使用 之真空吸嘴設計，利用真空吸 固定，治具是配合切割工作台 有一透空孔，該透空孔是利用 放置於該透空孔之膠帶上，使 動’讓晶圓能夠依序移動被切 作台是呈現圓形或是矩形狀， 片貼附時，無法有效利用空間 則工件進行貼附時，無法有效 5 M337823 利用空間，因此I、、土士 設備數量多與二c用設備與增加量產’及有 針對上述習知=馬之疑慮，亚不符合經濟效益 具理想實用性之創；；：”之問題點，如何開發-係相關業者須努力：;:；，實使用消費者所殷切企盼 有鐘於此，本及方向。 發與設計經驗=本於Γ從事相關產品之製 ，終得-確具實用性標，詳加設計與審慎評 力口工 〇 癯更 ，亦 造開 估後 【新型内 本創 作台及治 知治具與 形工件進 在圓形或 此無法有 多，與設 本創 台之概為 工作空間 ，藉此可 大工作空 形之晶圓 成本者。 容】 作之主 具框結 切割工 行多片 不規則 效利用 備成本 作解決 四邊形 ’而酉己 更有效 間之效 ，俾以 要目的， 構改良； 作台是呈 貼附時， 工件進行 設備與增 鬲之疑慮 問題之技 主要工作 合之治具 的提供圓 果，使用 有效的利 係在提供 其所欲解 現圓形或 無法有效 貼附時， 加量產， 等之問蹲 術特點， 空間至少 的透空孔 形與运形 之共用性 用設備與 一種對稱 決之問題 是矩形狀 利用空間 無法有效 及有力Π工 點加以改 主要是利 〜對稱邊 亦是配合 之多鼓晶 佳，不侷 增如量產 弧形之切 點，係針 ，為圓形 ;而矩形 利用空間 設備數量 良突破。 用將切割 增加設置 設置弧形 圓置，具 限於圓形 及可降低 割工 對習 在矩 則是 ，因 需求 工作 弧形 透部 有擴 或矩 設備 【實施方式】 請參閱第1、2、3、4及5 弧形之切割工作台及治具框結構圖所示，係本創作 等實施例僅供說明之用，在專利 ^之較佳實施例， 制。 明上教不受此結構 對稱 惟此 之限 6 M337823- Press, general semiconductors, etc. I ^ design is getting smaller and smaller, so that the use of _ product design can also be greatly reduced, while C wafer components are processed, for C wafer components are mostly after the majority of the array Semi-finished semi-conducting • Cutting-opening makes most of the semi-finished products • conductors used, while the previous semiconductor holders have a cutting table for fixing the wafers so that the wafers can be cut into separate small blocks one by one. The displacement is generated, and the cutting table is provided with a fixing device, which is usually a circular or rectangular shape that can be quickly absorbed by the suction of the nozzle, and the center is provided with a tape. On the other hand, the wafer re-fixing tool and the wafer are cut by the cutting tool of the cutting table. However, the fixture and the cutter have a circular shape in the rectangular workpiece; and the rectangle is a semiconductor processing in a circular or irregular curved cutting table and a fixture semi-finished product, to be half-size. It is easy to solder the I frame structure separately to improve the designer. c Wafer components, which are used in various electronic products, make the electronics easy to carry, but the I process is convenient and mass production, and the semiconductors are arranged in the I mode. Cutting one by one into a number of independent finished half-components, all of which are used to fix a fixture, and then use a glue to cut the cutting blade set on the workbench. The slide is capable of driving the cutting work. The Taiwanese product is round or rectangular, and is designed to be a vacuum nozzle designed to be fixed by the fixture. The vacuum suction is used to fix the fixture. The fixture has a through hole for the cutting table. By using the tape placed on the transparent hole, the movement of the wafer can be sequentially moved. The cut table is circular or rectangular. When the sheet is attached, the space cannot be used effectively, and the workpiece is attached. 5 M337823 can not be used effectively, so I, the number of Tusi equipment and the equipment used to increase the mass production and the above-mentioned conventional knowledge = Ma doubts, Asia does not meet the economic benefits I want to be practical;;:" The problem, how to develop - the relevant industry must work hard:;:;, the actual use of consumers is eagerly awaiting this, this and direction. Hair and design experience = Ben Yu Engaged in the production of related products, the ultimate - indeed practical standards, detailed design and prudent evaluation of oral work, but also after the creation of the new type of creation of the table and the governance of the fixture and the shape of the workpiece into the circle Or it can't be much more, and it is the working space of this set-top, which can make the wafer cost of the large-sized work. The main tool is the frame-cutting ICBC. The quadrilateral's effect is more effective, and the purpose is to improve the structure. When the table is attached, the workpiece is used to carry out the equipment and the doubts of the problem. Effectively, when it is provided with a circular shape that cannot be solved or can not be effectively attached, it is also mass-produced, etc., and the space is at least compatible with the shape of the hole and the shape of the device. The problem is The shape utilization space cannot be effectively and powerfully completed. The main difference is that the symmetrical edge is also matched with the multi-drum crystal. It does not increase the cutting point of the arc, and the needle is round. The rectangular space device is used. The number of breakthroughs is set. The circular setting is set by increasing the setting of the cutting, which is limited to a circular shape and can reduce the cut-off of the cutter. In the case of the demand, the arc-shaped transmissive part has a expansion or moment device [implementation] Please refer to 1, 2, 3, 4 and 5 arc-shaped cutting table and jig frame structure diagram, the embodiment of the present invention is for illustrative purposes only, in the preferred embodiment of the patent, the teaching Not subject to this structure symmetry only 6 M337823
圖所示觀之 切割工作台 是提供晶圓 作台20上並 制產生定向 ，切割工作 邊形之主要 一弧狀，讓 ，而切割工 固定裝置23 ，通常為真 能夠被吸附 邊其他位置 割工作台20 31，且透空 各邊沿著長 並設置有對 帶40 —面具 首先， 利用於一滑 切割工作台 固定，而滑 置，其中， 供切割工作 形，中央具 對稱之外周 增加一弧形 22外周邊並 定會更換之 空吸嘴之吸 之弧形工作 柱24 ，治具 一概為四邊 向外突出弧 32，另治具 柱24的定位 下方。 先請由第1 座上設置一 20，治具30 座與切割工 滑座是可控 台20之承載 有一概為四 邊向外突出 工作空間22 分布設置有 治具30使用 力使治具30 空間22外周 30是配合切 形之透空孔 狀，使四周 30之外周緣 槽部33，膠 其晶圓10 20 ’ 一治具 10以專用之 對應有一切 之適度移動 台20是呈現 工作空間21 四周各邊沿 作台20於弧 ’該固定裝 空吸嘴之設 固定，而切 至少一處還 之形狀設置 孔31所對稱 邊分別增加 應切割工作 有黏附性配 之切割都是 30供固定於 膠帶40黏合 割刀具之設 ，滑座上並 基本之四邊 突出，且所 著長邊分別 形工作空間 置23是要固 計，利用真 割工作台20 設置有定位 ，中央具有 之外周邊為 一弧形透部 台20之定位 合於治具30 其結構之使用與組合，由第2、3圖所示觀之，並先 由第2圖觀之，膠帶40是事先由下而上黏合於治具3〇下方 ，使治具30之整個透空孔31連同弧形透部32都被膠帶4〇所 布滿’晶圓10則是由治具30之透空孔31與弧形透部32放置 入，並落於膠帶40上方黏固，再續由第3圖觀之，治具3〇 是以膠帶40連同晶圓1〇放置於切割工作台2〇上，使晶圓1〇 能夠位在切割工作台2〇之主要工作空間21與弧形工作空間 22，且切割工作台20的固定裝置23會將治具3〇所吸固，而 治具30之定位槽部33並對應切割工作台20之定俊柱24，晶 圓10利用膠帶40之黏固與張力作用，可穩穩的固定於切割 工作台20頂面，而治具3〇並會因此被吸附下沉，以此即可 7 刀具進行 晶圓10位 重複使用 4圖所示 切割工作 30之透空 之晶圓10 5圖所示 以切割工 具30之透 空間以提 割工作台 ，該是至 或四邊二 變化，另 ’且因治具 20最頂部， 形形狀之晶 作空間21與 部32配合， M337823 . 使用切割 因此僅有 被割損而 如第 使用，以 22及治具 矩形形狀 如第 '割使用， 間22及治 _空間21之 其切 形透部32 邊設置， • 寸之孤形 晶圓1〇之切割 於切割工作台 0 ’該是提供矩 台20之主要工 孔31與弧形透 排列。 ’該是提供圓 作台20之主要 二孔31與弧形 供 ~ r; Γ 从上之圓 2〇之狐形工作 )其中二邊為 '、'且對稱設置， 一對稱邊為其 30收吸附下沉 可令治具30不 圓10排列切割 弧形工作空間 俾能提供若干 形形狀之晶 工作空間21 透部32配合 形形狀晶圓 圓10 A排列切 與弧形工作空 ’能擴大工作 10設置。 空間22與配合之治具30弧 一組方式對稱，可僅有二 亦可其中一對稱邊為一尺 他尺寸之弧形變化。 功效說明： 本創作功效增進之事實如 . 91孤二利用將切吾彳工作台2〇之概為四邊形的主要工作空間 、'稱周邊增加汉置弧形工作空間U，而配合之治具3〇概 為四化形的透空孔31與弧形透部32配合，該不僅能提供多 數之，圓10的放置，亦能擴大工作空間21之四邊中央空間 以提供一個以上之圓形形狀晶圓1 〇設置，使用之共用性 仏γ不侷限於圓形或矩形之晶圓1〇，且能夠於有效的空間 内提，取多數之任意形狀晶圓排列，可有效利用設備與 增加置產，不需要過多之加工設備，相對的可降低設備成 本者。 上述實施例所揭示者係藉以具體說明本創作，且文中 虽.過特定的術語進行說明，當不能以此限定本新型創作 8 M337823 之專利範圍；熟悉此項技術領域之人士當可在 之精神與原則後對其進行變更與修改而達到等 而此等變更與修改，皆應涵蓋於如后所述之申 所界定範疇中。 瞭解本創作 效之目的， 請專利範圍 M337823 【圖式簡單說明】 第1圖：本創作之立體分解圖。 第2圖：本創作之立體半組合圖。 第3圖：本創作之立體組合圖。 第4圖：本創作治具與切割工作台提供矩形晶圓排列之平 面圖。 第5圖：本創作治具與切割工作台提供圓形晶圓排列之平 面圖 。 【主要元件符號說明】 _ 晶圓------10 切割工作台---20 主要工作空間--21 弧形工作空間--22 固定裝置一一一一23 定位柱一一 一一一24 治具------30 透空孔-----31 ' 孤形透部一 一 一一32 定位槽部一 一一一33 - 膠帶------40The cutting table shown in the figure is provided on the wafer table 20 and is oriented to produce an orientation, and the cutting work edge is mainly formed in an arc shape, and the cutter fixing device 23 is usually capable of being adsorbed while being cut at other positions. The table 20 31, and the sides of the air are along the length and are provided with the pair of belts 40 - the mask is firstly fixed by a sliding cutting table, and is slid, wherein the working shape is cut, and the center is symmetrically increased by an arc. The arc-shaped working column 24 of the outer nozzle of the shape 22 and which will be replaced by the empty suction nozzle is formed by the four-sided outward protruding arc 32, and the lower position of the fixture column 24 is below. First, set a 20 on the first seat, 30 fixtures and the cutter slides are the supports of the controllable table 20. There is a four-sided outwardly protruding work space 22 distributed with the fixture 30 using force to make the fixture 30 space The outer circumference 30 is a transparent hole shape which is matched with the cut shape, so that the peripheral groove portion 33 of the periphery 30 is glued to the wafer 10 20 '. The jig 10 is dedicated to the appropriate movement. The movable table 20 is the presentation work space 21 The surrounding sides of the table 20 are fixed in the arc 'the fixed empty nozzle, and the symmetrical sides of the at least one shape forming hole 31 are respectively increased to be cut. The adhesive is matched and the cutting is 30 for fixing. The adhesive tape 40 is bonded to the cutting tool, and the four sides of the sliding block are protruded, and the long side of the working space is set to 23, and the positioning is made by the real cutting table 20, and the center has a periphery. The positioning of the curved transmissive table 20 is combined with the use and combination of the structure of the jig 30, as shown in Figures 2 and 3, and first viewed from Fig. 2, the tape 40 is bonded from the bottom to the top in advance. Fixture 3 below, make the fixture 30 The through hole 31 and the curved through portion 32 are all covered by the tape 4'. The wafer 10 is placed by the through hole 31 and the curved through portion 32 of the jig 30, and is stuck on the adhesive tape 40. Continued from Figure 3, the fixture 3 is placed on the cutting table 2 with the tape 40 and the wafer 1〇, so that the wafer 1 can be placed in the main working space of the cutting table 2 And the curved working space 22, and the fixing device 23 of the cutting table 20 will suck the fixture 3, and the positioning groove portion 33 of the jig 30 corresponds to the fixed column 24 of the cutting table 20, and the wafer 10 is utilized. The adhesive and tension of the tape 40 can be stably fixed on the top surface of the cutting table 20, and the jig is 3 〇 and will be adsorbed and sunk, so that the tool can be used for wafer 10-bit reuse. The wafer 10 of the illustrated cutting work 30 is shown in FIG. 5 with the space of the cutting tool 30 to lift the table, which is changed to the four sides, and the 'top of the jig 20, the shape of the shape The crystal space 21 is matched with the portion 32, M337823. The use of the cut is therefore only cut and used as the first, with 22 and the ruler moment The shape is set as the first cut, and the cut-away portion 32 of the space 22 and the treatment space 21 is disposed, and the cutting of the inch-shaped wafer 1 is cut on the cutting table 0 'this is the main work of providing the rectangular table 20 The holes 31 are aligned with the arc. 'This is to provide the main two holes 31 of the round table 20 and the curved shape for the ~ r; Γ from the upper circle 2 〇 fox-shaped work) where the two sides are ', ' and symmetrically set, a symmetrical edge is 30 Adsorption sinking can make the fixture 30 not round 10 arranged to cut the arc working space, can provide a number of shapes of crystal working space 21, the transmissive part 32 fit shape wafer round 10 A arrangement cut and curved work space 'can expand work 10 settings. The space 22 and the matching fixture 30 arcs are symmetric in a group, and only two of them can also be one of the symmetrical sides of the one-dimensional shape. Efficacy Description: The fact that the effect of this creation is enhanced is as follows. 91 Solitary 2 will cut the main working space of the quadrilateral of the workbench, and the increase of the Han-shaped curved working space U, and the fixture 3 The four-shaped through-hole 31 cooperates with the curved through-hole 32, which not only provides a plurality of placements of the circle 10, but also enlarges the four-sided central space of the working space 21 to provide more than one circular shape crystal. Circle 1 〇 setting, the common 仏 γ used is not limited to a circular or rectangular wafer 1 〇, and can be lifted in an effective space, taking a large number of arbitrary shape wafer arrays, which can effectively utilize equipment and increase production. , do not need too much processing equipment, relative to reduce equipment costs. The disclosures of the above embodiments are used to specifically explain the creation, and although the specific terms are used in the text, the scope of the patent of 8 M337823 cannot be limited by this; the person familiar with the technical field can be in the spirit Changes and modifications may be made to the changes and modifications of the principles, and such changes and modifications shall be included in the scope of the application as described later. For the purpose of this creative effect, please patent scope M337823 [Simple description of the diagram] Figure 1: An exploded view of the creation. Figure 2: The three-dimensional semi-combination of the creation. Figure 3: The three-dimensional combination of the creation. Figure 4: This creative fixture and cutting table provide a plan view of the rectangular wafer arrangement. Figure 5: This work fixture and cutting table provide a flat view of the circular wafer arrangement. [Main component symbol description] _ Wafer ------10 Cutting table---20 Main working space--21 Curved working space--22 Fixing device one-one-one-one 23 Positioning column 1111 24 Fixture ------30 Perforated hole-----31 'Orphaned through part one by one one 32 positioning groove part one by one 33 - tape ------40