TWM336675U - Gravity type capillary pumped loop (CLP) two-phase flow heat-dissipating device - Google Patents

Description

M336675 (I) The representative representative of the case is: Figure (13). (2) Early description of the component symbols in this representative figure · CPL dual-phase flow heat sink 2 Evaporator 10 head side 12 Liquid head 13 tail side 14 vapor head 15 Capillary body ( Porous wick part ) 16 open groove 161 flange 162 steam groove 17 chamber 18 annular channel 20 VIII, new description: [new technical field] force type hair and soil road (cpl) dual camera Registration, especially - can be applied to high-energy density products such as digital video recording system (mdVR), armored production MDVR requires control at wide temperature -30 u6〇〇c: meet the system such as [previous technology 】 "Carryer requirements. With the development of semiconductor technology, lithography and other circumstances, the size of electronic components has been greatly improved, the crystal is placed in the integrated circuit (IC), in other words, the more The number of transistors increases sharply, and the electric (3) σ in the accumulative speed of ic increases the 1C to generate very large thermal power when operating at 3 M336675. In the current central processing unit (CPU) in a personal computer, the heat is generated. Amount from the pentium 20W to Pentium Π 30W or even 43W, while Pentiumiv is estimated to be above 150W, CPU junction temperature can be as high as 150 °C, if you can not effectively and quickly remove the heat generated by the CPU, it will make the CPU Due to the high heat accumulation temperature, the machine is even damaged. At present, in order to prevent the electronic components from affecting their working performance or even being damaged due to high heat and high temperature, a heat dissipating fin (fm) is usually added thereto and flowed in one axial flow. The fan forces air convection to increase its heat removal capability, which is the structure of the conventional electronic component heat sink. Generally, the single-phase air forced convection heat transfer coefficient and heat transfer surface area increase and increase. Therefore, in order to increase the heat transfer rate, It is usually achieved by increasing the fin area or using a fan with a large air flow. However, the disadvantages of increased surface area and air flow are volume increase, vibration noise, etc. In addition to using thermal fins and fans. In addition to the heat sink, there are two ways to dissipate the air-cooling section and the heat pipe. The method of using air impingement cooling = heat dissipation as an electronic component For its use, its average thermal convection coefficient can reach ΛW/m _〇 or even more 咼, although this method can have better thermal convection coefficient than the general air cooling, but the disadvantage is that it needs to provide a high pressure air teaching x right general air cooling method. Only one fan is needed to drive the air flow. In addition, the most commonly used heat pipe is a high thermal conductivity device. The heat transfer coefficient can be greater than KKKJW/A t, which can transfer a large amount of heat energy. Producing a phase change and turning into a vapor, transferring heat from the area of the crucible to a low temperature area, the working fluid continuously circulates in the heat pipe, and no additional power is required to drive the working fluid to flow. However, the heat is still only a kind of heat transfer. Device, not a tool for cooling. Comprehensive 4 M336675 = scatter: mode, all have fatal shortcomings, although it can meet the current requirements of sub-component heat dissipation, the value will not meet the requirements of future electronic components in space, heat removal and integration with Ic package. Because the = heat pipe type radiator can not meet the heat dissipation requirements, and other heat dissipation methods to achieve the best heat method is to separate the liquid and steam transfer channels, and by a special separator (» r), causing the working fluid to flow in one direction. When the heat source (10) and the heat sink (inks) are in different positions due to the external environment, the heat transfer mechanism is different. In general, if the heat _ position is low and the heat sink position is high, the driving force of the ship circulation is mainly the buoyancy of the liquid due to the density difference formed by heat. If the relative position of the source and the heat sink is horizontal or the loop is in a microgravity environment, the driving force of the cycle cannot be used as the driving force by the additional buoyancy of the liquid on the ground due to the change in density ( Drivingf〇rce). Therefore, when heated in the evaporator, the working fluid in the liquid passage must be adsorbed by the capillary force to flow into the evaporator, and the heat is absorbed into the steam, and then introduced into the steam guide through the evaporator. The gas passage, which flows from the vapor head into the condenser, releases latent heat, and then flows into the evaporator through the liquid head to be heated and evaporated to complete the natural emulation. The mechanism developed according to this concept Right, the capillary suction of the porous material is used as the driving force of the loop, which is called the Capillary Pumped Loop, abbreviated as “cpl.” The two-phase capillary pumping loop (CPL) is a kind The heat is transferred by the latent heat of the phase change between the working fluid and the vapor phase, and no mechanical pump is required. The working fluid is completely circulated by the capillary of the internal capillary structure 5 M336675. Heat transfer. Because it relies on the latent heat of the working fluid to transfer heat, so if it is designed by CPL, it can be easily transferred from the heat source (cpu) to the notebook. Near the outer casing, the Case Fan can be used to remove a very high amount of heat, far more than the usual single-phase heat dissipation (such as fans and fins). The device with simple structure, long heat transfer distance and no gravity constraint, and no need for any external power is most suitable for general high-value electronic assembly heat dissipation or artificial satellite. CPL was applied to the Challenge Space Shuttle in 1986. Excellent achievement. The double-phase flow loop with capillary force can effectively remove heat, and can remove 25W heat and maintain cpu at 90 °C under natural condensation convection. According to this principle, if The forced convection will effectively remove the heat from the box fan (CaseFan). The capillary pumping two-phase flow high efficiency heat transfer system CPL (Capillary Pumped Loop) four main components include · evaporator, evaporation head, Condenser and condenser head. In addition, since the box fan (CaseFan) must be used as a tool for heat sinking, the influence of the airflow of the axial fan and the impedance of the system must be fully considered. The thermal test can be measured by the cpu thermal simulation test system, but how to design a higher efficiency CPL loop has taken away more than 15 〇w of heat 1 depends on the capillary structure including the capillary radius (Wick Radius), capillary penetration Permeability and the improvement of the specifications of the condensing section depend on the establishment of the theoretical model. The traditional heat dissipation and management of electronic components are often the last _ ring of the whole (4) program, that is, electronic components. After the manufacturing and packaging tests are completed, the heat dissipation problem is considered and how the heat sink is combined with the electronic components. For a less demanding application, such a financial formula can have lower cost and 6 M336675 good heat dissipation performance, but when the package size is required to be more compact, the performance leads to high heat generation and the electronic components are at - high temperature Evil ^^〗 When you see, the old ideas and methods will not be able to meet the electronic components. Therefore, a new cooling method and device are needed to solve the problems that will be encountered. Also in September 2001, u 曰 US Nine--Event, October 12, 2002: ^2: Island Terrorist Attack, March 11th, 2nd, Spanish Train Explosion and 7 7 αm in 2005

The squad, the Japanese central London subway and bus bombings and other terrorist attacks have increased the awareness of the European and American crisis. Through security monitoring equipment, it can be used to prevent crimes and rumors. In the case of prevention, sin and H-set evidence needs to continue to improve, the security monitoring product temple grew. Digital video recording system DVR (Digital vide〇Reeonlei· or digital video recorder), such as the digital video recording system (MDVR 'Mobile Digital Video Recorder, Mobile dvr), is a small computer monitor installed in the car. The safety system is especially popular in large foreign buses or school buses of all primary and high schools. The system is mainly used for advertising, description, warning, broadcasting, internet, satellite navigation, etc. Service devices are increasingly attracting the attention of large foreign buses. In order to overcome the large impedance in the space where MobileDVR is so tight, this work proposes a gravity-type capillary pumping loop heat sink (CPLCooler) for high-energy-density electronic components such as MobileDVR. The effect of maximum heat transfer without a fan. [New content] The main purpose of this creation is to provide a gravity-type capillary drip loop 7 M3 3 6675 (CPL) dual-phase flow heat sink for high-density electronic components such as digital video recording systems for vehicles ( MDVR); the capillary pumping loop (CPL) mainly comprises: at least one evaporator, the external bottom surface corresponding to a heat source part such as a central processing unit (CPU) of the system motherboard, the head a liquid head and a vapor head are respectively provided on the side of the tail two for the working liquid

The liquid phase flows in and the vapor phase flows out, and a porous wick part and a plurality of vapor grooves are disposed at the periphery of the capillary portion; an annular passage is arranged and connected to the steam head And a liquid head; and a condensation portion, which may include an annular passage and may be coupled with a heat sink fin or connected to the outer casing to form a heat sink; and a working fluid may be filled in the loop. For example, the fluorine gas is burned (Freon); thereby, the liquid phase working fluid can flow from the liquid head into the evaporation portion, and then adsorbed by the capillary force of the capillary portion and simultaneously evaporates into a vapor phase by the endothermic heat, and then borrows a plurality of steam. The guide trough is introduced into the steam head and flows out from the evaporation portion to the annular passage, and then the latent heat is released by the condensation portion to return to the liquid phase, and then flows into the evaporation portion through the liquid head to be evaporated by heat, thereby completing a capillary action to enhance the capillary action. The gravity-type natural circulation heat transfer function is used to achieve the heat dissipation effect of the maximum heat transfer without the fan, and effectively overcome the cumbersome, bulky and unsolvable *high wattage of the conventional pump circuit. Unable to meet the problem of wide temperature range -30 C to 60 C) of the temperature control. This creation is again aimed at providing a gravity-type capillary drip loop two-phase flow heat sink, wherein the capillary pumping loop (CPL) is above the evaporation section, and the scale evaporation section is based on the joint discharge type setting = On the annular passage, the money-generating part (4) is more connected to the ring. 8 M336675 can simultaneously enter the evaporation sections by the liquid-phase working head condensed by the condensation section from each liquid channel. Another purpose of this creation is to provide a gravity '= device, which can first enter the working system into the rhyme, so as to enhance the heat dissipation effect, and the temperature is required to be controlled at a wide temperature.

Dispersion provides - 4 force capillary pumping loop, but the phase is recognized, and 1 is set to 'advance step'. Attach a diffusing heat spreader on the outer bottom surface of the capillary sucking loop (CPL). W), " =, attached to the heat source part such as the central processing unit (cpu), in order to enhance the dispersion, and efficiency. It can meet the temperature control requirements of the system. (10) requires temperature control at a wide temperature of -30 °C to 6 °C. Another object of the present invention is to provide a gravity-type capillary pumping loop two-phase flow heat dissipating device, which can further add a work between the cold portion of the capillary pumping loop (cpL) and the liquid head of the evaporation portion. The fluid storage tank can be used to meet the temperature control requirements of the system, such as MDVR requirements for temperature control from -30 °C to 60 °C. [Embodiment] The above and other technical features and advantages of the present invention will be described in more detail below with reference to the accompanying drawings. Referring to Figures 1, 2, and 3, respectively, an embodiment of the present invention is provided. The basic structure and the schematic view of the internal structure of the evaporation section and the transverse section. This creation is a gravity-type capillary pumping loop C Capillary Pumped Loop, abbreviated as CPL) two-phase flow heat sink 9. M3.36675 1 , the two-phase flow heat transfer method is far more efficient than single-phase heat transfer, and its characteristics are utilized Workfluid The latent heat change between two phases quickly removes a large number of heat sources, which can be applied to high-energy-density electronic components such as MDVR (Mobile Digital Video Recorder, MobileDVR). For removing the heat source part of the system, such as the heat generated by the central processing unit (CPU) of the system motherboard; and in the state where the liquid phase and the vapor phase coexist, there is no temperature difference between the two phases, and the heat energy is absorbed or released. The direction changes from the liquid phase back to the vapor phase or from the vapor phase back to the liquid phase. The former is called the evaporation process, the latter is the condensation process, and the heat transfer device developed according to this concept is called the capillary sucking loop ( CPL). The creation gravity CPL dual-phase flow heat dissipation device 1 mainly comprises at least one evaporator 10, an annular passage 20 and a condensation portion 3, and is provided by the evaporation portion 10, the annular passage 20 and the condensation portion. 3〇 constitutes a capillary pumping loop (CPL)' and the working fluid (w〇rking Qiuqiu) such as Freon is filled in the loop. The evaporator 10 can be a square casing made of a metal having a good heat conduction effect, such as an aluminum alloy, and the outer bottom surface η serves as a heat transfer surface for being closely attached to a heat source portion such as a system. The central processing unit CPU (not shown) of the motherboard removes the heat generated by the operation of the central processing unit (cpu) by the heat transfer to the evaporator; the liquid is disposed on the head side 12 A liquid head liquid 13a flows into the evaporation portion 10, and a vapor head 15 is disposed on the tail side 14 for the vaporized working liquid 4〇b after evaporation to flow out of the evaporation portion 1〇. The interior of the Taifa Department is provided with at least one porous wick part 16 and a plurality of vapor grooves. The inside of the capillary portion 16 has a capillary structure and a function, and can be high-density and The permeability of polyethylene or sintered copper powder (sinter powder), the capillary diameter of which may be 1·05χ10·5ιη, and the penetration degree is 6xl (T1() m2. The plurality of vapor grids (vaporgroove) 17 series On the periphery of the capillary portion 16, the design concept of how to increase the driving force of the overall capillary pumping loop (CPL) must be considered by increasing the capillary pressure difference and reducing the entire loop pressure drop. A small capillary radius is used to adsorb the condensed liquid phase working liquid 40a to reach the inner surface of the evaporator 1 加热. On the one hand, it is also necessary to consider the porous capillary of the working fluid inside the evaporator 10 due to the use of a smaller aperture. The problem of increased flow resistance (fl〇w resistance) caused by the flow in the portion 16 is such that a plurality of steam channels 17 are designed to transmit vapor phase working fluid which evaporates due to heat absorption. The body 40b, and the vapor phase working liquid 40b is collected at the end of the plurality of steam channels 17, and is discharged from the vapor head 15 on the tail side 14 of the evaporator 1 . The annular channel 20 is arranged to evaporate. The outside of the device 10 is connected between the steam head 15 and the liquid head 13, and the layout thereof is not limited, and the layout can be changed according to the internal space of the electronic component product such as the digital video recording system (MDVR) of high energy and quantity density applied. The condensing portion 30 is mainly disposed on the annular passage 2, that is, the annular passage 20 can be used as a condensing pipe, and its main function is to remove the squid discharged from the steam head 15 of the evaporator. The heat of the working liquid 4〇b causes the vapor phase working liquid 40b to be disguised (condensed) into a liquid phase working liquid 4〇& and flows into the evaporation portion 10 via the liquid head 13. The condensation portion 3〇 can be applied as applied The energy density of the electronic component product, such as the interior space of the digital video recording system (MDVR), changes the layout. The condensation section 3 can be covered with a conductor 3ι at 11 M336675

All of the annular passages 20 (as shown in FIG. 18) or a portion (as shown in FIG. 9) may be combined with the heat dissipation fins 32 (as shown in FIGS. 9 and 18) or the conductors 31 and/or heat dissipation. The fins 32 are connected to an outer casing (not shown) of the MDVR to form a heat sink to effectively remove heat from the vapor phase working liquid 40b in the annular passage 20; in other words, the structure of the condensation portion 30 is formed. Simpler, in order to reduce flow resistance, all annular channels 2 can be used as condenser tubes, and both are smooth and thermally conductive. The condensing section 30 can also be made into a hollow aluminum shell by using the existing outer casing of the mobile DVR. The main consideration of the juice is that it has sufficient capacity to condense the steam element generated by the evaporator 1 全. With the above structure, the liquid phase working fluid 4〇a can flow from the liquid head 13 into the interior of the evaporation portion 10, and is adsorbed by the capillary force of the capillary portion 16 and simultaneously evaporates into the vapor phase working fluid 40b by the heat absorption, and then borrows A plurality of steam guiding grooves 17 are taken out to guide the steam head 15 to be discharged and flow to the annular passage 2 (), and then released to the liquid phase working fluid 4〇a by the latent heat released by the condensation portion 30, = via the liquid head The 13-person evaporating part _ is further heated and evaporated to complete the heat transfer effect of a gravity-type natural circulation that strengthens the two-capillary action thrust, thereby achieving the heat dissipation effect of the maximum heat transfer without the fan, and effectively overcoming the conventional fruit j-loop It's cumbersome, secret A and can't solve high wattage and can't satisfy wide (such as _30. (: to 60. (:) temperature control problem. Nightmare L ί creation of gravity capillary and loop ( CPL) Two-phase flow is a vacuum problem, because the vacuum will cause non-condensation, which will also affect the heat transfer of the condensing part 3〇 and the evaporation part, and the control temperature of the overall loop, because (4) the system vacuum The requirements are particularly strict, and the loop design must reduce the valve The use of, in order to reduce the need for 12 M336675 to the leakage, the general design of the vacuum specification is lxl〇_5t〇rr (Taoer force unit, equivalent to 1 cm mercury quotient cm-Hg column height), that is, Before the pressure of the working fluid 40, the capillary of the present invention is sucked (the pressure is reduced to lxl0_5 torr (Taul), and the pressure is 760 torr (Taur). Evaporator 10 is designed as a square housing, b, with the geometry of electronic heating elements (such as CPU), and its size is 50mmx50mmx20mm to meet Intel's pen^jm π sigh

v early chip C single chip ), or set to 105 mmx 162 mmx 24 mm to meet the needs of the umbrella CPU. , 'Double reference to Figure 4_8, which is a schematic view of the internal structure of the other part of the evaporation section of the present invention, the transverse section, the front section, and the body and the assembly of the capillary part (and the reference In the inside of the evaporator of the present embodiment, at least one hairy body part 16 and a plurality of steam guiding grooves (vap〇r, 谷 groove) 17 are provided, and the capillary portion is provided. The sister configuration between the 16 and the plurality of steam guiding slots is not particularly limited, and a plurality of steam guiding grooves (vap〇) may be respectively disposed above and below the private portion of the evaporation portion (evap〇rat〇r). r sing groove] 17 as shown in Figures 4 and 5, and in the upper and lower rows of a plurality of rows, between the channel 17 forming a chamber 18 for the setting - the corresponding shape of the capillary = I516 as shown in Figure 7, The capillary portion π can be sandwiched between the upper and lower rows of the plurality of steam guiding grooves 17 as shown in FIG. 8; and the capillary portion 16 is provided with an opening groove 161 facing the liquid head 13 for the liquid working fluid. 4〇a may flow into the interior of the evaporation portion 10 from the liquid stalk 13 and flow into the capillary via the open groove 161 Inside the part 16 (please refer to FIG. 4-8 at the same time), the crucible can be adsorbed by the capillary force of the capillary portion 13 M336675 16 and simultaneously evaporates into a vapor phase working fluid 于此 under the heat absorption, and then borrows a plurality of vapor guides. The trough n is introduced into the steam head (4); and the capillary portion 16 is provided with a quenching flange 162 at the open end of the opening groove 161, thereby blocking the liquid phase working fluid 4 from being adsorbed by the capillary force of the capillary portion 16. And returning to the liquid head 13. Referring to Figures 9, 10 and 11, respectively, they are schematic views of a partial perspective and decomposition of the present embodiment (the two evaporation portions) and the evaporation portion thereof. The two-phase flow heat dissipating device of the gravity type capillary I suction loop (CPL) of the present invention has two evaporation portions 1G corresponding to two electron heating elements such as cpu (not shown), and the two evaporation portions are relatively The annular passages are connected in parallel, that is, the liquid of the two evaporation portions 1G is connected to the same annular passage 20' so that the liquid phase working fluid 40a condensed by the condensation portion 3G can be simultaneously supplied by the respective liquid heads 13 It enters each evaporation part 1〇. The condensation enthalpy 30 of the present embodiment is not limited to the partial structure shown in FIG. 9. The condensing portion can be covered by the conductor 31 in the annular channel 2, as shown in FIG. 18, and can be matched with the heat dissipation fins. 32 (as shown in Figures 9, 18) or to connect the conductor 31 and/or the heat sink fin 32 to an outer casing (not shown) of the MDVR. Further, the inside of the evaporation portion 10 of the present embodiment is provided with at least one capillary portion 16 and a plurality of vapor guides 17, and the capillary portion 16 and the plurality of steams The structural form between the guide grooves 17 is not particularly limited, and a plurality of vapor grooves 17 may be disposed on the lower inner surface of the casing of the evaporator 10 as shown in FIGS. 1 and π. And forming a chamber 18 above the plurality of steam guiding grooves 17 of the lower edge surface for providing a corresponding shape of the capillary portion 16 as shown in FIG. 11, so that the capillary portion 16 can be embedded in the plurality of vapor guides. Above the groove 17, the capillary portion 16 is provided with an opening groove 161 toward the liquid head 13 toward the liquid head 13, and the liquid phase working fluid 4 is supplied from the liquid head 13 into the evaporation portion 10 and flows into the capillary portion 16 through the opening groove 161. Internally (please refer to the figure at the same time), the crucible can be adsorbed by the capillary force of the capillary body portion 16 and simultaneously evaporated to become the vapor phase working fluid crucible by the endothermic heat, and then introduced into the steam head 15 by a plurality of steam guiding channels 17 Discharge; and the capillary portion 16 is opened in the open slot 161 End stop is provided with supporting flanges 162, thereby retaining the liquid working fluid 4〇a beat by capillary force of the capillary member 16 and the back flow of the liquid portion of the adsorption head 13. Referring to Figures 12-15, there are shown, respectively, partial perspective, exploded, partial perspective and exploded views of another embodiment of the evaporation section of Figure 9. The two-phase flow heat dissipating device 2 of the gravity capillary pumping loop (CPL) of the present embodiment is provided with two evaporation portions 10 to correspond to two electronic heating elements such as a CPU (not shown), which is dual-phased as shown in FIG. The main difference between the flow heat sinks 2 is the internal structure of the evaporation portion 10; the interior of the evaporation portion 1 of the present embodiment is provided with a capillary portion 16 and a plurality of vapor grooves 17, of which The lower edge surface of the casing of the evaporator 10 (which may be an aluminum extruded body) may be formed into a circular arc shape and a plurality of vapor grooves (vaporgroove) 17 are arranged as shown in FIG. 13-15. A plurality of chambers 18 are formed above the plurality of steam guiding grooves 17 of the circular arc-shaped lower edge surface for providing a correspondingly shaped capillary portion 16 as shown in FIG. 13-15, so that the capillary portion 16 can be embedded in the plurality of vapor guides. Above the groove 17, the capillary portion 16 is provided with an opening groove 161 facing the liquid head 13, and the liquid phase working fluid 40a can flow from the liquid head 13 into the interior of the evaporation portion 1 and into the inside of the capillary portion 16 via the opening groove 161.俾 can be adsorbed by the capillary force of the capillary portion 16 At this time, it absorbs heat and evaporates into a vapor phase working fluid 40b, and then flows through a plurality of steam channels 15 M336675 17 to be introduced into the steam head 15; and the capillary portion 16 is provided with a stopper flange at the open end of the opening groove 161. 162, in order to prevent the liquid phase working fluid 40a from being adsorbed by the capillary force of the capillary portion 16 and returning to the liquid head 13. Referring to Fig. 16, there is shown a partial perspective view of an evaporation portion when the two evaporation portions are arranged in series in Fig. 9. The two-phase flow heat dissipating device of the gravity type capillary pump suction road (CPL) of the present embodiment is provided with a long-sized steamed broom', which is also a capillary portion (P〇r〇USwiekpart) 16 and a plurality of strips. The length of the vapor groove 17 is relatively large, so that the evaporation portion can be arranged in series with respect to the annular passage 20 to correspond to a two-electron heating element such as a CPU (not shown), that is, the evaporation portion is opposite to the ring. The channel has only a liquid head (13) and a steam head (15), and the outer bottom surface of the evaporation portion is closely attached to the two electronic heating elements such as the CPUJi with a length corresponding to the length of the evaporation portion (not shown) Removing the heat generated by the operation of the two electronic heating elements such as the CPU to the same evaporation portion, that is, the position of the two electronic heating elements such as the CPU is arranged in series with respect to the annular channel. It is different from the parallel arrangement of the two evaporation sections in Fig. 9; it is known from the physical experiment that the evaporation section adopts a series arrangement manner, and the removal effect of the heat source is worse than that of the parallel arrangement. As shown in Fig. 17, the outer surface of the evaporation portion of the present invention is provided with a spreader for the second broadcast as a transverse section of the heat transfer surface: The gravity-type capillary pumping loop (CPL) of the creation is further available in its core (-) 50, and then in the heat source part, such as the central processor (CPU) of the 6G board. On the basis of the increase in government ♦,, and effects, and can meet the temperature control requirements of the system, such as Na, the temperature control requirements of ^ M336675 temperature -30 C to 60 C. Referring to Figure 18, it is shown in Figure 9. A schematic view of another embodiment of the condensation portion of the embodiment. The specifications of the dual-phase flow heat sink of the gravity capillary pumping loop (CPL) of the present embodiment are as follows: 1. Material of CPL: | Lu or Aluminum (Copper) 2) Evaporation section: 45X45X23.5 mm3 & 45X45X23.5 mm3 3. Condensation section: 8ψ 4. Steam head: 8mm Φ 5. Liquid head: 8 mm 6. Capillary body · Polyethylene with permeability ( Porous Polyethylene ) 7. Porous Effect Radius : ΙΟ·4 m~10-5 m 8. Porous Permeability: 6X10_1Gm2 9. Working Fluid (FingerFluid): Fluorine (Freon) 10, Ring Road Vacuum (System Vacuum ) : 10-4 ~l〇_5Torr

11, the maximum heat (Qmax): l〇〇W

12, System Thermal Resistance: 0.3 °C / W Φ 13, system operating temperature Tcpu (System Operation Temperature): 70

°C

14. Ambient temperature: 40 ° C Referring again to Figs. 19 and 20, respectively, the embodiment shown in Fig. 18 is further provided with an exploded three-dimensional and combined perspective view of a working liquid storage tank. The creation further includes a storage tank 70 for the working fluid 40 between the condensation portion (c〇ndenser) 30 of the capillary pumping road (CPL) and the liquid head 13 of the evaporation unit 10. In order to improve the heat dissipation effect, it can meet the temperature control requirements of the system, such as MDVR requires 17 M336675 temperature control requirements at a wide temperature _3〇t to 60 °C; therefore, the difference between this embodiment and the embodiment shown in FIG. 18 is the implementation. In addition, a tank 70 is added for temperature control of the loop. When steam enters the condensing unit 30 from the steam head 15, the latent heat is released therefrom to complete the heat transfer. The main point of the design of this embodiment is to ensure The outlet of the condensing section 30 is subcooled. The specifications of this embodiment are as follows: 1. Material of CPL: Aluminum or Copper 2. Evaporation: 45X45X23.5 mm3 & 45X45X23.5 mm3 3. Condensation: 8ψ _ 4. Steam head: 8mm 5. Liquid head: 8mm 6. Capillary part: Porous Polyethylene 7. Porous Effect Radius: ΚΓ4 m~10·5 m 8. Porous Permeability : 6X10&quot ; 10 m2 9, Working Fluid (FingerFluid): Fluorine (Freon) 10, Loop Vacuum (SystemVacuum): 10_4~10-5Torr

11, the maximum heat (Qmax): 100W

Lu 12, System Thermal Resistance: <0.95 °C /W 13, system operating temperature Tcpu (System Operation Temperature) : 70

°C

14. Ambient temperature ·· _25 °C ~70 °C 15. Reservoir (Reservoir) ·· 30X30X20mm3 16. Applicable: mobile DVR (Digital Video Recording System MDVR) The above is only for this creation. The preferred embodiment is illustrative only and not limiting. It will be understood by those skilled in the art that many modifications can be made within the spirit and scope defined by the requirements of this M336675 J. >Change 'even equivalent change, but will fall within the scope of protection of this creation [Simple description of the schema] Figure i is the basic structure of the creation - the embodiment (set - evaporation section) three-dimensional evaporation department (evapomtoO - implementation _ part structure

The top view is schematic. = 3 is a schematic transverse sectional view of the internal structure of the evaporation portion shown in Fig. 2. f Engaged, the evaporation section of this creation is another example. The internal crusting of the embodiment shows the reference but the capillary part has not been assembled. Figure: is a schematic transverse sectional view of the internal structure of the evaporation portion shown in Figure 4. (Folding reference size), Fig. = The internal structure of the non-evaporating portion of Fig. 4 is not referenced.) ^ is a three-dimensional schematic view of the capillary portion of the evaporation portion shown in Fig. 4. (Marking the deficient size) 乂 Figure 8 is a schematic transverse cross-sectional view of the internal structure of the non-evaporating portion of Figure 4. (Mixed body portion has been assembled) Fig. 9 is a perspective view of another embodiment of the present invention (provided with two evaporation portions and arranged in parallel). Figure 10 is a partial perspective schematic view of the evaporation section of the Figure 9 - embodiment. Figure 11 is an exploded perspective view of the evaporation portion of Figure 10. Figure 12 is a partial perspective schematic view of another embodiment of the evaporation section of Figure 9. Figure 13 is an exploded perspective view of the evaporation section of the system 1212. M336675 Figure 14 is a partial perspective view showing the internal structure of the evaporation portion of Figure 13. (The capillary portion has been assembled) Fig. 15 is an exploded perspective view of Fig. 14. Fig. 16 is a partial perspective view showing the formation of a longer evaporation portion when the two evaporation portions are arranged in series in Fig. 9. Fig. 17 is a schematic transverse cross-sectional view showing a spreader for use as a heat transfer surface on the outer bottom surface of the evaporation portion of the present invention. Figure 18 is a perspective view showing another embodiment of the condensing portion of the embodiment shown in Figure 9. Figure 19 is an exploded perspective view of the embodiment of Figure 18 with a working fluid reservoir. Figure 20 is a perspective view showing the combination of the embodiment shown in Figure 19. [Main component symbol description] CPL two-phase flow heat sink 1, 2 Evaporator 10 External bottom surface 11 Head side 12 Li Liquid head 13 Tail side 14 Steam head 15 Capillary part (porous Wick part ) 16 Open groove 161 Flange 162 Vapor guide (ventilation groove) 17 Chamber 18 Annular passage 20 M336675 Condensation 30 Conductor 31 Heat sink fin 32 Working liquid 40 Liquid phase working fluid 40a Vapor phase working fluid 40b Dispersion Heat spreader (spreader) 50 motherboard 60 _ central processing unit (CPU) 61 storage tank 70

twenty one

Claims (1)

M336675 IX. Patent application scope: - A gravity-type capillary drip loop (CPL) dual-phase flow heat sink for high-energy density electronic components such as digital video recording systems for vehicles (MDVR); The system comprises: at least an evaporation portion, an - annular passage and a condensation portion, thereby forming a capillary pumping loop (CPL), and the working fluid is filled in the loop, wherein: The evaporating portion is a casing made of a metal having a heat conducting effect, and an outer bottom surface thereof serves as a heat transfer surface for being closely attached to a heat source portion to remove the heat source by heat conduction; The liquid head is supplied to the liquid working liquid to evaporate (4), and the eight-phase working liquid for evaporating from the tail side H steam head flows out of the evaporation portion, and at least one capillary portion and a plurality of steam guiding grooves are disposed inside the capillary portion. Having a capillary structure and function, the plurality of steam channels are arranged around the capillary portion; the annular passage is disposed between the liquid heads of the evaporator; the outside is connected to the steam head and The condensing portion is mainly disposed on the annular passage to form a heatsink for removing the heat discharged from the steam head of the evaporator: the heat of the working liquid, so that the vapor phase I can be condensed into a liquid And flowing into the evaporation portion through the liquid head; by the above structure, the liquid phase fluid can flow from the liquid head to the evaporation portion of the liquid, and then adsorbed by the capillary force of the capillary portion and simultaneously evaporates into the vapor phase J1 by the heat. The fluid is then introduced into the vapor-inducing tank by a plurality of steam guiding channels and flows to the channel, and then returns to the liquid working fluid by releasing the latent heat through the portion, and then flows through the liquid; the head 22 M336675 flows into the evaporation portion and is then evaporated by the heat. , to complete the movement of a natural cycle. "," 2. For example, the gravity-type capillary pumping loop (CPL) two-phase 〃IL heat sink according to item i of the patent application scope, wherein the capillary sucking loop may be provided with two or more evaporation portions. And the evaporation portions are arranged in a parallel arrangement on the annular passage, so that the liquid heads of the evaporation portions are connected to the same annular passage, so that the liquid phase working body condensed by the condensation portion can be simultaneously The liquid head enters each evaporation portion. 3. The gravity capillary pumping loop (CPL) dual-phase flow heat dissipation device according to the scope of the patent application, wherein the evaporation portion can be a square housing. The gravity-type capillary pumping loop (CPL) dual-phase flow heat dissipating device according to the first aspect of the patent, wherein the evaporating portion is made of aluminum. 5. The gravity type capillary pump according to claim 1 The suction loop (CPL) is a two-phase flow heat dissipating device, wherein the capillary portion can be made of Kaohsiung, permeable and permeable polyethylene or sinter powder. Gravity capillary pumping loop (CPL) a two-phase flow heat dissipating device, wherein the capillary portion of the capillary portion may be 1·〇5χ1〇5ιη, and the permeability thereof is 7. The gravity capillary pumping loop (CPL) as described in claim 1 a two-phase flow heat sink in which the vacuum of the capillary pumping loop (CPL) is reduced to lxl 〇 _5 t 〇fr (Taur) is preferably 0 23 M336675 8 as described in claim 1 Gravity capillary pumping loop (CPL) two-phase flow heat sink, wherein the working fluid is a fluorine gas (Freon) 〇9, the gravity capillary pumping loop (CPL) as described in claim 1 a two-phase flow heat dissipating device, wherein the plurality of steam channels are disposed on a lower edge surface of the interior of the casing of the evaporation portion. 10. The gravity capillary pumping loop (CPL) as described in claim 1 a two-phase flow heat sink, wherein the plurality of steam channels are disposed on a circular arc-shaped lower edge surface inside the casing of the evaporation portion. 11. Gravity capillary pumping as described in claim 1 Loop (CPL) two-phase flow heat sink, wherein the condensation portion can utilize heat conduction The body is coated on all or a part of the annular passage, and the heat transfer body can be provided with heat dissipation fins. 12. The gravity capillary pumping loop (CPL) two-phase flow as described in claim 11 a heat dissipating device, wherein the heat conducting body can be a casing of a digital video recording system (MDVR) for a vehicle. • 13. A gravity-type capillary pumping loop (CPL) dual-phase flow heat dissipating device according to claim 1 of the patent application scope, The capillary portion is provided with an opening groove facing the liquid head, so that the liquid phase working fluid can flow from the liquid head into the interior of the evaporation portion and flow into the inside of the capillary portion through the opening groove. 14. The gravity-type capillary pumping loop (CPL) two-phase flow heat dissipating device according to claim 13, wherein the capillary body portion is provided with a blocking flange at the open end of the opening groove, thereby blocking The liquid phase working fluid is returned to the liquid head. 15. The gravity capillary pumping loop 24 M336675 (CPL) dual-phase flow heat sink according to claim 1, further capable of attaching a spreader for spreading on the outer bottom surface of the evaporation portion. . 16. The gravity-type capillary pumping loop (CPL) two-phase flow heat sink according to claim 1, further capable of being in the condensation portion of the capillary pumping loop (CPL) and the liquid head of the evaporation portion A working fluid reservoir is provided between them.