M332866 八、新型說明： ^ 【新型所屬之技術領域】 、 本創作係有關液晶顯示裝置改良，尤針對液晶顯示裝 置當中的發光模組結構加以改良，旨在提供一種具有較佳 散熱功效，以及具有較佳光源投射效果的液晶顯示裝置及 ^ 其發光模組結構。 【先前技術】 •一般液晶顯示裝置（Liquid Crystal Display，LCD) 基本上係由如第一圖所示的液晶面板總成10、以及發光 模組20兩個主要部份所組成；其中，液晶面板總成10 及發光模組20係被定置在由底板31及外框32所組成的 框架30當中；液晶面板總成10則係包括有一面板11以 及光學膜片12或導光板等。 至於，發光模組20則係以複數個舖設在底板31上的 燈管21做為發光元件，使燈管21的光線能夠在光學膜片 ❿ 12的光學機制作用下，均勻的投射於面板11上。然而， 由於整體發光模組20係裝設在框架30的内部，加上發光 模組20並未具備任何的散熱機制，無法配合將燈管21 ' 所產生的熱源釋出，導致整體液晶顯示裝置的溫度過熱， 進而影響液晶顯示裝置之使用壽命。 【新型内容】 有鑑於此，本創作即針對液晶顯示裝置當中的發光模 5 M332866 組結構加以改良，旨在 具有較佳光源投具有㈣散熱效能’以及 構。 又果的液晶顯示裝置及其發光模組結 板以光本，示的發光模組係由-個載 撓性底層為糾，;^—^所構成n載㈣由一可 層以及導μ撓性底層上料設有導熱絕緣 透過導二，光一極體即建構在載板的導電層上， ===電源導通。再者，發光模組的載板上係可預 可撓性底^ 是裁切線，以及可以進—步在載板相對應 底層下方舖設一焊料層。 «的導1:2之二’在於整體液晶顯示裝置可以透過 底板或框層將|光二極顏產生熱轉放傳導至 本創ΐ因此具有較佳的散熱效能。 晶顯示力效之二，在於可以利用軟性的載板配合液 體的光源，^架等結構體彎折，可以有效集中發光二極 本倉 此具有杈佳的光線投射效果。 折疊線η::力效之，三，在於發光模組的載板上所預設的 利性。⑼線’可增加發光模組彎折、分割的操作便 方便效之四’在於可撓性底層下方之烊料層可 板、側框等框二接上黏著在相關液晶顯示裝置的底 【實施方式】 6 M332866 而緙之特點’可參閱本案圖式及實施例之詳細說明 而獲仔清楚地瞭解。 如第二圖所示’本創作之液晶顯示裝置係在一框架 23之有一液晶面板總成10以及一使用發光二極體 22以二f組2G ’該發光模組2G基本上係由一個載板 笛：m 個發光二極體23所構成；請同時配合參照 π ’該載板22係由—可撓性底層221為基材， 軟性的載板結構，並且在可撓性底層221上依序設 2= 邑緣層223以及導電層222，各發光二極體23即 建構在载板22的導電層222上。 只知日τ，可撓性底層221係可以由銘、銅、鐵、不 錄鋼等金屬材料所製成的軟性結構體；JL於，導電層222 係可以全面或局部鋪蓋於導熱絕緣層223上，其具有以銅 為主的線路2221，並且在線路2221之間設有由絕緣材料 所構成的絕緣部2222供發光二極體23定置，發光二極體 23之導線231則配合接續至導電層22的線路2221處， 亚與線路2221形成電性連接，使能夠透過導電層2 電源導通。 、 ^ 再者，導熱絕緣層223以為導熱膠或導熱膠片，該 熱膠係可為雙面膠，由導熱絕緣層223構成導電層2以 與可撓性底層221相結合；尤其，整體發光模組2〇係可 以如第四圖（Α)所示，在載板22上預先設有裁切線224 或是摺疊線，以增加發光模組2〇分割、彎折的操作便 性，甚至於可以如第五圖所示，進一步在載板22相對於 7 M332866 :撓性底層221的下方鋪設一焊料層225，方便整體發光 - 模組直接黏著在相關的結構體上。 ， /在第二圖所示的實施例當中，液晶顯示裝置的框架 3〇係包括有一底板31及外框32，而且液晶顯示裝置的光 ，係相對來自液晶面板總成1〇的背面；據以，整體發光 杈組20即可如第二圖所示，以整面載板22黏著在框架 3〇的底板31上，而能夠由載板22提供反射發光二極體 =光源的效果；或是直接將載板22藉由摺疊線226，如 苐四圖（B)所示，彎折成有如底板之外型。 ^抑或是如第六圖所示，將載板22裁切成若干分割的 單條狀，再將複數個建構有發光二極體23的單條狀載板 22黏著在框架30的底板31上，當發光模組2〇遇有發光 一極體23故障或損毀時，只需要針對該發光二極體23 所屬的單條載板22加以更換即可。 加再者，第七圖所示的實施例當中，液晶顯示裝置的框 采30係包括有一底板31、一外框32以及一侧框33，而 籲且液晶顯示裝置的光源係相對來自液晶面板總成1〇的倒 面’由於整體發光模組20的載板22係以可撓性底層為灵 •—材而具有可彎曲、摺疊的特性，因此可以如第七圖及第二 圖所示，發光模組20配合液晶顯示裝置之側框33等結構 體秦折配置，除了可以符合不同光源方向的設計需求之 外’更可以藉此獲致較佳的光源投射效果。 值得一提的是，整體發光模組20於實際運作時，係 可以遷過載板22的導熱絕緣層223將發光二極體23所產 8 M332866 生熱源釋放傳導至可撓性底層221，並可由側框33或底 ' 板或等框架結構體釋放，因此具有較佳的散熱效能。 ， 藉由上述發光模組當中以可撓性底層為基材的載板 結構設計’可以配合液晶顯示裝置之底板、側框架等框架 結構體彎折配置，以及透過載板的導熱絕緣層將發光二極 體所產生熱源釋放’確貫^供一適用性廣以及具有較佳散 熱效能的發光模組，以及具有較佳光線投射效果之液晶顯 示裝置結構，爰依法提呈新型專利之申請。 •本創作之技術内容及技術特點巳揭示如上，然而熟悉 本項技術之人士仍可能基於本創作之揭示而作各種不背 離本案創作精神之替換及修飾。因此，本創作之保護範圍 應不限於實施例所揭示者，而應包括各種不背離本創作之 替換及修飾’並為以下之申清專利範圍所涵盖。 【圖式簡單說明】 第一圖係為一習用液晶顯示裝置之結構分解圖。 % 第二圖本創作第一實施例之液晶顯示裝置結構分解圖。 第三圖本創作第一實施例之發光模組結構示意圖。 第四圖本創作第一實施例之發光模組平面結構圖。 第五圖本創作第二實施例之發光模組結構示意圖。 、第六圖本創作第三實施例之發光模組配置狀態示意圖。 第七圖本創作第四實施例之發光模組配置狀態示意圖。 第八圖本創作第五實施例之發光模組配置狀態示意圖。 9 M332866 【主要元件代表符號說明】 10液晶面板總成 11液晶面板 12光學膜片 20發光模組 21燈管 22載板 221可撓性底層 ⑩ 222導電層 2221線路 2222絕緣部 223導熱絕緣層 224裁切線 225焊料層 226摺疊線 23發光二極體 _ : 231導線 30框架 31底板 . 32外框 ，33侧框M332866 VIII. New description: ^ [New technical field] The invention is related to the improvement of liquid crystal display device, especially for the structure of the light-emitting module in the liquid crystal display device, aiming to provide a better heat dissipation effect, and A liquid crystal display device with better light source projection effect and a light emitting module structure. [Prior Art] A liquid crystal display (LCD) is basically composed of two main parts, a liquid crystal panel assembly 10 as shown in the first figure, and a light-emitting module 20; The assembly 10 and the light-emitting module 20 are disposed in a frame 30 composed of a bottom plate 31 and an outer frame 32. The liquid crystal panel assembly 10 includes a panel 11 and an optical film 12 or a light guide plate. As for the light-emitting module 20, a plurality of tubes 21 laid on the bottom plate 31 are used as light-emitting elements, so that the light of the tube 21 can be uniformly projected onto the panel 11 under the optical mechanism of the optical film 12 on. However, since the entire light-emitting module 20 is installed inside the frame 30, and the light-emitting module 20 does not have any heat-dissipating mechanism, the heat source generated by the lamp tube 21' cannot be released, resulting in the overall liquid crystal display device. The temperature is overheated, which in turn affects the service life of the liquid crystal display device. [New content] In view of this, this work is to improve the structure of the light-emitting module 5 M332866 in the liquid crystal display device, aiming to have a better light source with (4) heat dissipation performance and structure. The liquid crystal display device and the light-emitting module of the light-emitting module are light-based, and the light-emitting module is modified by a flexible bottom layer; the ^-^ is composed of n-loaded (four) by a layer and a guide The bottom layer is provided with a heat-conducting insulation through the second guide, and the light-pole is constructed on the conductive layer of the carrier, and the === power supply is turned on. Furthermore, the pre-flexible bottom of the light-emitting module is a cutting line, and a solder layer can be placed under the corresponding bottom layer of the carrier. «Guide 1:2 bis" is that the whole liquid crystal display device can conduct heat transfer from the photodiode to the enamel through the bottom plate or the frame layer, thus having better heat dissipation performance. The second effect of crystal display is that it can use a flexible carrier plate to match the liquid source of the liquid, and the structure such as the frame is bent, which can effectively concentrate the light-emitting diode. This has a good light projection effect. Folding line η:: force effect, three, is the pre-set advantage of the light-emitting module carrier board. (9) The line 'can increase the bending and splitting operation of the light-emitting module, and the convenience is the fourth one. The bottom layer of the material layer and the side frame below the flexible bottom layer are adhered to the bottom of the related liquid crystal display device. The method] 6 M332866 and the characteristics of the ' can be clearly understood by referring to the detailed description of the drawings and the examples. As shown in the second figure, the liquid crystal display device of the present invention has a liquid crystal panel assembly 10 in a frame 23 and a light-emitting diode 22 in two groups of 2G. The light-emitting module 2G is basically composed of one load. Plate flute: m light-emitting diodes 23; please also refer to π ' at the same time, the carrier 22 is composed of a flexible bottom layer 221 as a substrate, a flexible carrier structure, and on the flexible bottom layer 221 The sequence 2 = the edge layer 223 and the conductive layer 222, and each of the light-emitting diodes 23 is formed on the conductive layer 222 of the carrier 22. Only the day τ, the flexible bottom layer 221 can be a soft structure made of metal materials such as Ming, copper, iron, and non-recorded steel; JL, the conductive layer 222 can be fully or partially covered by the heat conductive insulating layer 223 In the above, it has a copper-based line 2221, and an insulating portion 2222 made of an insulating material is disposed between the lines 2221 for the light-emitting diodes 23 to be fixed, and the wires 231 of the light-emitting diodes 23 are connected to be electrically connected. At the line 2221 of the layer 22, the sub-connection is electrically connected to the line 2221 so that the power supply through the conductive layer 2 can be turned on. Further, the thermal conductive insulating layer 223 is a thermal conductive adhesive or a thermal conductive film, and the thermal adhesive may be a double-sided adhesive, and the conductive layer 2 is formed by the thermal conductive insulating layer 223 to be combined with the flexible bottom layer 221; in particular, the overall light emitting mold The group 2 can be provided with a cutting line 224 or a folding line on the carrier 22 as shown in the fourth figure (Α), so as to increase the operational convenience of the light-emitting module 2, such as division and bending, and even As shown in the fifth figure, a solder layer 225 is further disposed on the carrier 22 opposite to the 7 M332866: flexible underlayer 221 to facilitate direct adhesion of the entire light-emitting module to the associated structure. In the embodiment shown in the second figure, the frame 3 of the liquid crystal display device includes a bottom plate 31 and an outer frame 32, and the light of the liquid crystal display device is opposite to the back surface from the liquid crystal panel assembly; Therefore, as shown in the second figure, the entire illuminating cymbal group 20 can be adhered to the bottom plate 31 of the frame 3〇 by the entire surface carrier 22, and the effect of reflecting the light emitting diode=light source can be provided by the carrier plate 22; The carrier 22 is directly bent into a shape other than the bottom plate by a folding line 226 as shown in FIG. Or, as shown in the sixth figure, the carrier 22 is cut into a plurality of divided single strips, and then a plurality of single carrier plates 22 constructed with the light-emitting diodes 23 are adhered to the bottom plate 31 of the frame 30, when When the light-emitting module 2 fails or is damaged by the light-emitting diode 23, it is only necessary to replace the single carrier 22 to which the light-emitting diode 23 belongs. In addition, in the embodiment shown in FIG. 7 , the frame 30 of the liquid crystal display device includes a bottom plate 31 , an outer frame 32 and a side frame 33 , and the light source of the liquid crystal display device is relatively from the liquid crystal panel. The inverted surface of the assembly 1〇 is characterized in that the carrier 22 of the overall light-emitting module 20 has the characteristics of being bendable and foldable with the flexible bottom layer as a flexible material, so that it can be as shown in the seventh and second figures. The light-emitting module 20 is matched with the structure of the side frame 33 of the liquid crystal display device, and the like, in addition to the design requirements that can meet the direction of different light sources, a better light source projection effect can be obtained. It is worth mentioning that, in actual operation, the thermal conductive insulating layer 223 of the overloading plate 22 can release the 8 M332866 heat generating source produced by the LED 23 to the flexible bottom layer 221, and can be The side frame 33 or the bottom plate or the like frame structure is released, so that it has better heat dissipation performance. The carrier structure design with the flexible bottom layer as the base material in the above-mentioned light-emitting module can be flexed with the frame structure of the bottom plate and the side frame of the liquid crystal display device, and the thermal conductive insulating layer of the carrier plate is illuminated. The heat source generated by the diode is 'supreme' for a wide range of light-emitting modules with better heat dissipation performance, and a liquid crystal display device structure with better light projection effect, and a new patent application is proposed according to law. • The technical content and technical characteristics of this creation are disclosed above, but those skilled in the art may still make various substitutions and modifications without departing from the spirit of the present invention based on the disclosure of this creation. Therefore, the scope of protection of this work should not be limited to the disclosure of the embodiments, but should include all alternatives and modifications that do not depart from the present invention and are covered by the scope of the following patents. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is an exploded view of a conventional liquid crystal display device. % Fig. 2 is an exploded view showing the structure of the liquid crystal display device of the first embodiment. The third figure is a schematic structural view of the light-emitting module of the first embodiment. The fourth figure is a plan view of the light-emitting module of the first embodiment. FIG. 5 is a schematic structural view of a light-emitting module according to a second embodiment of the present invention. FIG. 6 is a schematic diagram showing the configuration state of the light-emitting module of the third embodiment. Figure 7 is a schematic view showing the configuration state of the light-emitting module of the fourth embodiment of the present invention. Figure 8 is a schematic view showing the configuration state of the light-emitting module of the fifth embodiment. 9 M332866 [Description of main components] 10 liquid crystal panel assembly 11 liquid crystal panel 12 optical film 20 light module 21 lamp tube 22 carrier plate 221 flexible bottom layer 10 222 conductive layer 2221 line 2222 insulating portion 223 thermal conductive insulating layer 224 Cutting line 225 solder layer 226 folding line 23 light emitting diode _ : 231 wire 30 frame 31 bottom plate. 32 outer frame, 33 side frame