200847460 九、發明說明： 【發明所屬之技術領域】 器 一種二極體發光器構成’尤指提供利俥 構成 曰攸贤更組立操作及有效散熱之發光 【先前技術】 由於二極體發光元㈣技術缝，其照明勒範_及任何需求光源 關有LED背光投光器，其本體爲—直杆狀，縱身以點狀連續分 ==光元件，藉以組合成—陳列形led，或並排成面狀爲液 曰曰監視益的背光模組’該發光元件可_立封裝生產。 1 實施，首先請錢第1圖所示，^、由―長餘杆型本體 销續分佈有多數發光單元1〇，藉以構成一點線卿發光 閱第2圖所示，係在本體1的投光面設有一凹槽， 相=形成反光面12 ’中央置納有晶請，經由架線丨丨導通電性。 圖不表不也爲一般單顆發光晶球構成方式。 傳統LED陳列實施有以下缺點： 1·難以控制均等的亮度 2·難以控制均等的色調 3·難以控制均等的衰減 4.組成其一元件若故障則無法更換。 【發明内容】 有蝴提供—種以組立構成發光單71，並藉導熱基板能形成 旦效t性放熱，或由幹式組立操作，而可隨意選擇制物件、位置及數 里土上以組立方式完成單一發光單元，經串 型_蝴，或平面狀投光器的使用，其優點如下：車為g成支木 1·易於有效指向性散熱； 200847460 2·易於大量生產； 3·可提供幹式組立； 4·易於分類，如不同顏色、亮度之隔離替換； 5·若其-發光單元故障，可獨立維修。 本發明再一目的係該基板對外放熱路徑當中， 月丈熱元件可爲硬質或撓性之材料。 可間隔有散熱元件，該 本發明第, 本發明第五目的爲該基板可爲任何適用形體。 【實施方式】 2本發明之實施，魏請參„ 3 _示，該發光單元的構成， 鐘晶片101 ’結合在具導熱性能之基板33上表，週邊經由 離==出方向之光學錐型容器2所相對組合，基板3二^ 離或接觸性直接吸收晶片101所發生的 獲得快速放熱。 熱’遞父由製冷-嫌出，藉以 2於基板33與錐型容器2之間，經由—疊層3所間接組合，該疊声 ==立之導電層31a、31b，並藉導電層31a、31b而_ b ^日日片1G1 ’若基板33爲金屬具導電性能，則在導電層加、仙對隔 基板33的表面間隔有導熱絕緣層32以得電性絕緣，避免兩側導 31b産生短路干涉。 α ，板33基本爲導熱性能，針對材料比熱不同條件，可輔以導熱膜複人 在基板33表面，增加導熱性。 α 右錐型容H 2爲金屬具導紐，或基板33同料體，可導通其—架 a電極，職線b對外，㈣社絕緣方式與整體_，錢緣方式可 200847460 在疊層3作變化而得。 架線a、b直接連結在晶片101的本體，又晶片m工作之敎源除 輻射波帶放之外，相同部份會傳達給架線a、b，架線a、b相同 歸’^體亦需獲得有效散熱，否則易於„熱而裂解，得是㈣導= 、仙的連結’又導電層31a、31b係鄰近於基板33 _側，或^ 絕緣層32的傳遞，則達成一直通基板33下方熱 " 整體散熱職制纽_助。 側—祕徑’使其 基板33的熱沈下方一側’進一步可設有輔助的散熱元件*，以 擴大散熱面積將該基板33的潛熱往外帶放，該散熱元件4的附:致 41，相對表面經由有效的貼合或藉由結合層34的輔助，使到 光學錐型容器2本質爲-财熱塑化材料，可采射出成型，或以 枓製作，具易於吸熱放熱之性能，若以金屬材料則有效將晶片ι〇ι之廢埶 吸收’傳向外表而對外散熱或被環境吸熱，錐型容器 :由:圓雜節3提供晶片則置，該圓錐 反光層2卜献光層21相同可實施在塑化材料製成之錐型容器2 層可爲平面反光或⑽造面反光，可得漫射光，主要係請 學路徑作反射，以形成指向性_上射出光束，光束射出路徑當中可夢由 先波調變螢光膠35轉換，以將晶片m的波長改變爲期許之光波。曰 上述反光層21的作用，包含反射或漫射光。 =述祈許之光波例如白光’前置條件爲混色，則如晶片雇所發射的 光爲』光（又1)，螢光膠35的的性能爲黃光λ 2，則λ +入2,又;U爲藍光，λ2爲黃光，卽俨占念丄士 之後形成入1 置，則析許結果也會不同 Ρ付白色光波’λ_2的調變或換 錐型容器2底面與基板33之間相對結合，可采結合層34介入，戍以 共晶結合技術等達成，其條件爲視生絲式要求而應對。 請再參閱第3a圖所示，在容器2所設的圓錐空間烈裏部，爲了易於 .200847460 實施光波調變控制，可事先填注具高透光率之 施布一薄狀縣層·，同以得光波轉換。 則51’、出射面再 而無需光波轉換者，則只填注光學材料35 則傳真於晶片iG1的光波。 酬射出之先波， =參閱第4圖所示，經由獨立構成之發光單元iq，可多數串顺人 在美上的方基板33，以縱向分佈構成—支_led投光器，該應用ί =3上方，以直接或_層3的方式連接錐型縮，並如上= ^方=立晶片’讓晶片可接受基板讀，構成—點線型的_發光写 敎鍵土板33的下方可結合魏熱元件4，該散熱元件4爲赌質製成之散 …，"θ，或任浦助的散熱器材，如水冷錢冷裝置皆可爲之。、 請^參閱第5圖所示’縱向排列之發光單元1{)經由疊層3連結一繞性 挽性散熱元件4爲挽性金屬帶42，藉由撓性金屬帶42的變 爲力’則可讓母-發光單元10的光姉出歧形成不轉，可實施 =體的表面安裝，形成點曲線組合的發光安排，其中該金屬帶42爲具= 子散熱性能’在金料的下方相同可再結合其他的散熱元件。’、”、 請再參閱第6圖所示，該基板33的造型除了前述平板狀之外，更進一 封形成盒狀體謝，該盒狀體3()1底部形成一平板317，四面由側頁板 卜312、313、314互對折制形成，側頁板3U、312、313、314 凡件作維護或吸熱。 曰請再參閱第7圖所示，形成之基板33爲盒狀體3〇卜内部空間則提供 晶片101及光學錐型容器2的置納’晶片101原'則爲與底部之平板317结 合’並經由架線a、b導通電性，如此可擴大散熱的面積，以及有效維護光 學錐型容器2的本體安全。 立請再參閱第8圖所示，該盒狀體301㈣基板33,其折制方式除了由底 部的平板317延伸之外’更可藉由側頁板312、314分別所形成之側翼板 312a、312b、314a、314b彎制形成，最後由側頁板311、313折疊。 請再參閱第9圖所示，該基板33可形成一托盤3〇2，該托盤^同樣 200847460 具有-平板317提供前述之晶片所組裝，平板317對外由前後頁板3i5. 對隔’又相關平板317的幅面左右兩側，各別設有扣翼施、施，並往 =形成^延伸之舌板317a ’ 317b，該舌板317a、317b則可提供散熱辅助， 或可任意騎其他纽或進行其他的顧，如扣接或以抓持扣納方式组立 在任何的储社面’使該魏3i7a、3m可作狀大轉性應用。 請再參閱第1G圖所示，如第9圖之托盤观，藉由所f折凸出上身的 扣翼315a、316a存在’則可提供光學錐型容^ 2相賴續扣，使之 機械式的幹式組立固定，侧晶片⑻同樣結合在平板317的 _ 有效放熱路徑。 Τ 凊縣閱第11圖所示，該基板33可形成多數串接方式生產，在兩基 板33中間間隔連結有導電片31，該_ 31可經由裁赠L的架構，二 形成-獨立的基板，而導電片31經分狀後射形成兩 的架線a、_結，該基板33若_„，則_ 31與之；^ 實施等方式，於是該基板33獨立形成之u形托盤303除了 可獨立應狀外，更提生麟該電極可經域 ==化生產，_趣的上方則夾合組立光學__ ^卜J "由=後頁板阳、316挾持’平板317則相同提供有效的散熱路徑。 板3:::，I2圖所不’該基板33可形成一鋸齒狀連續板306，該連續 =隔有:納部319 ’並形成兩側堤邊_、_ 錐型容器2與前述晶片101相對組立在凹納部則 的千謂上表，對隔凹納部胸位置形成_連結帶槪，該連结帶脱 =可具有_變形性能或撓性作用，而提供列對安裝之發光树 後，可經由連結帶319c的變形而使其投光面形成曲率的變化，且該基板泊 ===性能可有效散熱’和組合發光元件1G之間考慮如前_ 3 = 等考量，必需全部具體實施，又光學2 i方堤邊319a'319b的失置之外，更可採用膠 200847460 請再參閱第13圖所示，該基板33進-步可形成截面u型的扣槽酬， 利用兩側延伸的彈扣片315b、316b，可彈扣在光學錐型容器2的相曰關位置 K W提供晶片m的連結 容器2的組立。 請再參閱第14圖所該基板33進-步可形成一扣納槽3〇5之截面， 兩侧向上延伸有倒钩邊318a、318b，形成之平板317相同提θ供晶片m插 置，利用該扣納槽305整體包覆’則可快速吸收裏部的廢熱往=帶放 作相對内部元件的維護。 一 倒鈎邊318a、318b可形成電極，經任何絕緣或連結方式，將電性導通 晶片101。 日請再參閱第15圖所示，該扣納槽305形成兩側倒鈎邊318a、獅，可 約共晶片101所屬的電性架線a、b所導通，該導通的方式至少一側設有另 一極向的電極片3lc，經由絕緣部32a所絕緣，則可導通雙極向電性提 片101驅動使用。 八曰曰 請再參閱第16圖所示，該扣納槽305所形成的倒釣邊318a、_上 =可同步實施有絕緣部32a，以提供兩電極片31c對隔組合形成隔離電性， 趄2此再提供架線a、b導通晶片101，下方所形成的平板317則相同 二導熱及承載上方元件的作用，在上述各實施有關平板317的上方則可 1 3 _實施，輔助設有散熱元件4的使用，該散熱元件4相同主 硬質或撓性變形的材質。 … 胸隹卿17圖所示，前述之光學錐型容器2進一步可採用實心之錐 器2〇，係可采射出成形、利便製作，其本體爲一錐形體，裏部凹 則可f二間2〇1提供晶片1〇1納置，底端面相對連結基板33，該基板33 成了f外直ί帶放散熱，錐形錐型容11 20爲一實心、體，本體錢化材料製 心具有光學傳導能力，則晶片101所發生的光可從出射面22射出，錐來 維型容考？η λαβ ^ 光束' 的錐形表面2〇2則可實施有反光層203，以將晶片1〇1發生的 凋抆往出射面22出射，在出射面22可實施有一光波調變之螢光層 200847460 204 ’藉由該螢光層204可調變射出的光波波長，以及該波長的調變，亦可 將可用的螢光膠填布在空間201與晶片1〇1的相對空間内，以最近距離達 成光波轉換，無需考慮反光層203的變換光波因素。 上述第7、8、9、10、12、13、14圖等，相關實施架線a、b (如第3 圖所示）的安排，同樣可如第3圖所示由圓錐空間23底部經由疊層3的介 入連接，而疊層3的外型可應和需求變化。 錐形錐型容器20底部與基板33之間相同可經由疊層3的實施，而形 成雙側導電層31a、31b提供電性分離，並該基板33若爲具導電性能者， 則由絕緣層32 _介人隔離電性。基板33所形成的平板317下方相同可 進-步細獅之散熱元件作爲散熱獅，絲熱元件相肚張爲硬 撓性變形之材質，則如所示之錐形錐型容器2()所構成的發光單元…相同 可，多數串顺立在如第4或第5 _實施，形成㈣㈣支架型_日: 用，或並排或矩陣排顺合成面狀f光照職置，具良好散熱效Ϊ 本發明之實施制爲實關代表，凡舉解騎 明杻利範圍所涵蓋，於此合先陳明，及本發明所主張 目丁2 = 計，當請轉指教，並懇請早日審定爲盼。 爲目Μ革新政 【圖式簡單說明】 第1圖係爲習用支架型發光器之外觀圖； 第2圖係爲第1圖的結構剖視圖； 第3圖係爲本發明之基礎實施剖視圖； 第3a圖係爲本發明填注光學材料示意圖； 第4圖係爲本發明實施應用示圖；β 弟5圖係爲本發明實施曲率變化之應用示圖； 第6圖係爲本發明基板之實施例之_ ; 第7圖係爲第6圖的應用例； 200847460 第8圖係爲本發明基板之實施例之二； 第9圖係爲本發明基板之實施例之三； 第10圖係爲第9圖之應用圖； 苐11圖係為本發明基板實施例之四； 第12圖係爲本發明基板實施例之五； 第13圖係爲本發明基板實施例之六； 第14圖係爲本發明基板實施例之七； 第15圖係爲第14圖進一步的應用； 第16圖係爲第14圖的再一步應用； 第17圖係爲本發明光學錐型容器進一步應用示 【主要元件符號說明】 10 :發光單元 11、a、b :架線 20 :錐形錐型容器 204 :螢光層 23 :圓錐空間 302 :托盤 305 :扣納槽 31a、31b:導電層 31 卜 312、313、314 ··側頁板 312a、312b 315 ： 316 :後頁板 317 :平板 319 :凹納部 32 :絕緣層 34 :結合層 351 :光學材料 42 :金屬帶 1 :杆型本體 101 ·晶片 2:光學錐型容器 202 :錐形表面 22 :出射面 301 :盒狀體 304 : U型扣槽 31 :導電片 315b、316b ··彈扣片 318a、318b :倒鈎邊 319c ··連結帶 33 :基板 350 :螢光層 41 :散熱縫片 意剖視圖。 100 :點線型發光器 12 :反光面 201 :空間 21、203 ··反光層 3 :疊層 303 : U型托盤 306 :連續板 31c :電極片 、314a、314b ··側翼板 315a、316a :扣翼 317a、317b ··舌板 319a、319b :堤邊 32a :絕緣部 35 :光波調變螢光膠 4:散熱元件 L :裁切線 12200847460 IX. Description of the invention: [Technical field of the invention] A diode illuminator constitutes 'in particular, it provides a light-emitting structure that constitutes a group operation and effective heat dissipation. [Prior Art] Due to the diode illuminator (4) Technical sewing, its lighting Le Fan _ and any required light source with LED backlight emitter, the body is - straight rod shape, the vertical body is divided into points continuous == optical components, by which they are combined into a display-shaped led, or side by side The backlight module is a liquid crystal monitoring device. The light-emitting element can be produced in a package. 1 Implementation, first of all, please see the money shown in the first figure, ^, from the "long residual rod type body" distribution of a majority of the light-emitting unit 1 〇, to form a point of the line of light, as shown in Figure 2, is the projection of the body 1 The smooth surface is provided with a groove, and the phase = the reflective surface 12' is formed in the center to receive the crystal, and the conductive property is guided via the wire. The figure is not a form of a single single crystal ball. Conventional LED display implementation has the following disadvantages: 1. It is difficult to control equal brightness 2. It is difficult to control uniform color tone 3. It is difficult to control equal attenuation 4. If one component is faulty, it cannot be replaced. SUMMARY OF THE INVENTION A butterfly is provided to form a light-emitting single 71, and a heat-transfer substrate can be used to form a dendritic heat release, or a dry assembly operation, and the object, the position, and the number of soils can be randomly selected to form The method of completing a single light-emitting unit, through the use of a string-type butterfly, or a planar light projector, has the following advantages: the vehicle is a bundle of woods. 1. It is easy to effectively directional heat dissipation; 200847460 2. Easy mass production; 3. Dry supply available 4. Easy to classify, such as different colors, brightness isolation and replacement; 5. If its - lighting unit failure, can be independently repaired. A further object of the present invention is that the heat-reducing element of the substrate can be a hard or flexible material. The heat dissipating member may be spaced apart, and the fifth object of the present invention is that the substrate can be any suitable shape. [Embodiment] 2 In the implementation of the present invention, the structure of the light-emitting unit, the clock wafer 101' is bonded to the substrate 33 having thermal conductivity, and the periphery is optically tapered by the direction of == out. The relative combination of the containers 2, the substrate 3 is separated or the contact directly absorbs the wafer 101 to obtain a rapid heat release. The heat 'hands by the cooling-suspect, by 2 between the substrate 33 and the cone-shaped container 2, via - The laminate 3 is indirectly combined, the stacked sound == the vertical conductive layers 31a, 31b, and by the conductive layers 31a, 31b and _b ^ Japanese wafer 1G1 'If the substrate 33 is a metal having electrical conductivity, then the conductive layer is added The surface of the partition substrate 33 is separated by a thermally conductive insulating layer 32 for electrical insulation to avoid short-circuit interference between the two side guides 31b. α, the plate 33 is substantially thermally conductive, and may be supplemented by a thermal conductive film for different specific heat conditions of the material. The person increases the thermal conductivity on the surface of the substrate 33. α The right cone type H 2 is a metal guide, or the substrate 33 is the same material, and can be connected to the a-electrode, the line b is external, (4) the insulation method and the whole_ , Qianyuan way can be 200847460 in the laminate 3 for change. a, b is directly connected to the body of the wafer 101, and the source of the m-chip is removed from the radiation band, the same part is transmitted to the wires a, b, and the wires a and b are also valid. Heat dissipation, otherwise it is easy to heat and crack, so that (four) conduction =, the connection of the fairy 'and the conductive layer 31a, 31b is adjacent to the side of the substrate 33, or ^ the transmission of the insulating layer 32, then the heat is obtained through the substrate 33 ; Overall cooling system New Zealand _ help. The side-secret path 'the lower side of the heat sink of the substrate 33' may further be provided with an auxiliary heat dissipating component* to expand the heat dissipating area to bring the latent heat of the substrate 33 to the outside, and the heat dissipating component 4 is attached: The effective surface of the optical cone container 2 is made of an effective bonding or by the aid of the bonding layer 34, which can be produced by injection molding, or can be produced by enamel, and has the property of being easy to absorb heat and exotherm. The metal material is effective to absorb the waste material of the wafer ' 〇 ' 传 传 向外 向外 向外 向外 向外 向外 向外 向外 向外 向外 向外 向外 向外 向外 向外 向外 锥 锥 锥 锥 锥 锥 锥 锥 锥 锥 锥 锥 锥 锥 锥 锥 锥 锥 锥 锥 锥 锥 锥 锥 锥 锥The tapered container made of plasticized material can be flat reflective or (10) reflective, and diffused light can be obtained. It can be converted by the first wave modulation phosphor 35 to change the wavelength of the wafer m to the expected light wave.曰 The function of the above-mentioned reflective layer 21 includes reflected or diffused light. = The light of the light, such as white light, is pre-conditioned as a color mixture. If the light emitted by the wafer is "light" (also 1), the performance of the fluorescent glue 35 is yellow light λ 2, then λ + 2, Moreover, U is blue light, λ2 is yellow light, and the 卽俨 卽俨 丄 丄 形成 形成 形成 形成 形成 , , , , , , , , , , , , , , , 白色 白色 白色 白色 白色 白色 白色 白色 白色 白色 白色 白色 白色 白色 白色 白色 白色 白色 白色The relative bonding between the two can be achieved by the bonding layer 34, the eutectic bonding technique, etc., and the conditions are met by the requirements of the raw silk type. Please refer to the figure 3a. In the cone-shaped space of the container 2, in order to facilitate the light wave modulation control of 200874860, a thin county layer with a high light transmittance can be filled in advance. With the light wave conversion. Then, 51', the exit surface, and no optical wave converter, only the optical material 35 is filled with the light wave of the wafer iG1. The first wave of the payout, as shown in Fig. 4, through the independently formed light-emitting unit iq, the majority of the square substrate 33 can be arranged in a longitudinal direction to form a branch-light emitter, the application ί =3 Above, connect the cone-shaped shrinkage directly or _layer 3, and as above = ^ square = vertical wafer 'to make the wafer acceptable for substrate reading, constitute - dotted line type _ illuminating write 敎 key below the soil plate 33 can be combined with Wei heat The component 4, the heat dissipating component 4 is made of gambling material, "θ, or a heat sink material of Renpu, such as a water-cooled money cooling device. Please refer to the 'longitudinal arrangement of the light-emitting unit 1{' shown in FIG. 5 via the laminate 3 to connect a winding-like heat dissipating member 4 as a ductile metal strip 42 by the force of the flexible metal strip 42. Then, the pupil of the mother-lighting unit 10 can be formed into a non-rotation, and the surface mounting of the body can be implemented to form a light-emitting arrangement of a point curve combination, wherein the metal strip 42 has a heat dissipation performance under the gold material. The same can be combined with other heat dissipation components. ',', please refer to Fig. 6, the shape of the substrate 33 is further formed into a box-shaped body in addition to the above-mentioned flat shape, and a flat plate 317 is formed at the bottom of the box-shaped body 3 (), which is surrounded by four sides. The side sheets 312, 313, and 314 are formed in a mutually folded manner, and the side sheets 3U, 312, 313, and 314 are used for maintenance or heat absorption. 再Please refer to FIG. 7 again, and the formed substrate 33 is a box-shaped body 3. In the internal space, the wafer 101 and the optical cone-shaped container 2 are provided with the 'wafer 101 original', which is combined with the bottom plate 317' and electrically connected via the wires a and b, thereby expanding the heat dissipation area and effectively The body of the optical cone container 2 is maintained safely. Referring to FIG. 8 again, the box-shaped body 301 (four) substrate 33 is folded in a manner other than extending from the bottom plate 317 by the side plate 312. The side flaps 312a, 312b, 314a, and 314b formed by the respective 314 are bent and finally folded by the side panel 311, 313. Referring to FIG. 9, the substrate 33 can form a tray 3? Tray ^ same 200847460 has - flat plate 317 provides the aforementioned wafer assembly, flat plate 317 external The front and rear page plates 3i5. The left and right sides of the web of the partitions s and the associated flat plates 317 are respectively provided with the wings, and the tongue plates 317a' 317b are formed to be extended, and the tongue plates 317a, 317b are provided. Cooling assistance, or you can ride any other button or other care, such as fastening or holding in the form of holding and holding in any storage area. This makes the Wei 3i7a, 3m can be used for large-scale applications. Please Referring to Fig. 1G, the tray view of Fig. 9 is provided by the f-folding of the upper body of the flaps 315a, 316a to provide an optical cone-shaped retaining ring to make the mechanical dry type The assembly is fixed, and the side wafer (8) is also combined with the _ effective heat release path of the flat plate 317. As shown in Fig. 11 of the 凊 凊 county, the substrate 33 can be formed in a plurality of serially connected manners, and the conductive sheets 31 are interposed between the two substrates 33. The _31 can be formed by the structure of the cleavage L, and the two separate-formed substrates are formed, and the conductive sheets 31 are split and then formed to form two wires a and _ junctions, and if the substrate 33 is _, then _ 31 is followed; In a manner such as implementation, the u-shaped tray 303 independently formed by the substrate 33 can be independently raised in addition to the independent shape. The electrode can be produced by the domain ==, and the upper part of the _ interesting is sandwiched with the optical __^bJ " by = the back panel, the 316 holding plate 317 provides the same effective heat dissipation path. The plate 3:::, I2 is not 'the substrate 33' may form a zigzag continuous plate 306, which is separated by: a portion 319' and forms a side bank _, _ cone type container 2 and the aforementioned wafer 101 Relatively set in the concave section of the thousand-thickness table, forming a _linking belt 对 on the chest position of the recessed portion, the connecting strip detachable can have a _ deformation property or a flexible effect, and provide a column-mounted lighting tree After that, the change of the curvature of the light projecting surface can be formed by the deformation of the joint tape 319c, and the substrate can be effectively dissipated between the substrate and the light-emitting element 1G, and the consideration of the combination of the light-emitting elements 1G is considered as before. Specifically, in addition to the loss of the optical 2 i side bank edge 319a '319b, glue can be used 200847460. Please refer to FIG. 13 again, the substrate 33 can be formed into a section u-shaped buckle groove, using The latching pieces 315b and 316b extending on both sides can be elastically fastened to provide the assembly of the connecting container 2 of the wafer m at the opposite position KW of the optical cone type container 2. Referring to the substrate 33 in Fig. 14, the step of forming the buckle groove 3〇5 may be formed in a stepwise manner, and the barb edges 318a and 318b are extended upward on both sides, and the flat plate 317 is formed to be the same as the wafer m. By using the buckle groove 305 as a whole, the waste heat in the inner part can be quickly absorbed to the maintenance of the relative internal components. A barb edge 318a, 318b can form an electrode that electrically conducts the wafer 101 via any insulation or bonding. Referring to FIG. 15 again, the buckle groove 305 is formed with two sides of the barb edge 318a and the lion, and the electrical wires a and b belonging to the common wafer 101 are electrically connected, and the conduction mode is provided on at least one side. The electrode sheet 31c of the other pole is insulated by the insulating portion 32a, so that the conductive pole can be driven to be used for driving the electric tab 101. Please refer to FIG. 16 again, the inverted fishing edge 318a, _up= formed by the buckle groove 305 can be synchronously implemented with an insulating portion 32a to provide the two electrode sheets 31c to form an isolated electrical property.趄2, this further provides the wires a and b to turn on the wafer 101, and the flat plate 317 formed under the same two functions of the same heat conduction and carrying the upper elements, and can be implemented above the flat plates 317 of the above embodiments, and the auxiliary heat dissipation is provided. The use of the element 4 is the same as the material of the main hard or flexible deformation. As shown in the figure of the chest, the optical cone container 2 can further adopt a solid cone 2 〇, which can be formed by injection molding and facilitated, and the body is a cone, and the inner concave can be two. 2〇1 provides a wafer 1〇1, and the bottom end surface is opposite to the connecting substrate 33. The substrate 33 is formed as a f-outer heat sink, and the tapered cone-shaped capacitor 11 20 is a solid body, and the body is made of a material. With optical transmission capability, the light generated by the wafer 101 can be emitted from the exit surface 22, and the cone can be used for dimensional test. The tapered surface 2 〇 2 of the η λαβ ^ beam ' can be implemented with a light reflecting layer 203 to emit the fading of the wafer 1 〇 1 to the exit surface 22 , and a light modulating phosphor layer can be implemented on the exit surface 22 . 200847460 204 'By the wavelength of the light wave emitted by the luminescent layer 204, and the modulation of the wavelength, the available fluorescent glue can also be filled in the space between the space 201 and the wafer 1 , 1 to the nearest The distance is converted to light, and there is no need to consider the converted light wave factor of the reflective layer 203. The arrangement of the above-mentioned seventh, eighth, ninth, tenth, thirteenth, thirteenth, fourteenth, and the like, and the related implementation of the wires a and b (as shown in FIG. 3) can also be arranged from the bottom of the conical space 23 as shown in FIG. The intervening connection of layer 3, while the appearance of laminate 3 can vary depending on the requirements. The same between the bottom of the tapered cone-shaped container 20 and the substrate 33 can be electrically connected by forming the double-sided conductive layers 31a, 31b via the implementation of the laminate 3, and the substrate 33 is made of an insulating layer if it is electrically conductive. 32 _ Interacting electrical isolation. The heat sink element of the lion is formed as the heat-dissipating lion under the flat plate 317 formed by the substrate 33, and the material of the silk heat element is hard and flexible, and the tapered cone-shaped container 2 () is as shown. The illuminating unit is configured to be the same, and most of the strings are slid in the fourth or fifth _ implementation, forming (four) (four) bracket type _ day: using, or side by side or matrix aligning surface f-lighting position, with good heat dissipation effect The implementation system of the present invention is a representative of the real estate, and all the scopes covered by the scope of the clarification of the singularity of the stipulations of the stipulations of the stipulations of the stipulations of the stipulations of the stipulations of the invention are as follows: . Fig. 1 is an external view of a conventional bracket type illuminator; Fig. 2 is a cross-sectional view showing the structure of Fig. 1; Fig. 3 is a sectional view showing the basic structure of the present invention; 3a is a schematic diagram of the filling optical material of the present invention; FIG. 4 is an application diagram of the implementation of the present invention; FIG. 5 is an application diagram of the curvature change of the present invention; and FIG. 6 is an implementation of the substrate of the present invention. Example 7 is an application example of FIG. 6; 200847460 FIG. 8 is a second embodiment of the substrate of the present invention; FIG. 9 is a third embodiment of the substrate of the present invention; Figure 14 is an application diagram; Figure 11 is a fourth embodiment of the substrate of the present invention; Figure 12 is a fifth embodiment of the substrate of the present invention; Figure 13 is a sixth embodiment of the substrate of the present invention; It is a seventh embodiment of the substrate of the present invention; Fig. 15 is a further application of Fig. 14; Fig. 16 is a further application of Fig. 14; Fig. 17 is a further application of the optical cone container of the present invention. Description of component symbols] 10: Light-emitting unit 11, a, b: Wire 20: Conical taper Container 204: fluorescent layer 23: conical space 302: tray 305: buckle groove 31a, 31b: conductive layer 31 312, 313, 314 · side panel 312a, 312b 315: 316: rear panel 317: flat 319 : recessed portion 32 : insulating layer 34 : bonding layer 351 : optical material 42 : metal strip 1 : rod type body 101 · wafer 2 : optical cone type container 202 : tapered surface 22 : exit surface 301 : box shaped body 304 : U-shaped buckle groove 31: conductive sheets 315b, 316b · elastic pieces 318a, 318b: barb side 319c · connection tape 33: substrate 350: fluorescent layer 41: heat-dissipating slit view. 100: dotted line illuminator 12: reflective surface 201: space 21, 203 · reflective layer 3: laminated 303: U-shaped tray 306: continuous plate 31c: electrode sheets, 314a, 314b · side flaps 315a, 316a: buckle Wings 317a, 317b · tongue plates 319a, 319b: bank 32a: insulating portion 35: light wave modulation phosphor 4: heat dissipating element L: cutting line 12