M330609 八、新型說明： 【新型所屬之技術領域】 本創作係有關一種具控制單元之連接器，特別是可用於記憶 體封裝體之一種具控制單元之連接器及其應用。 【先前技術】 隨著科技的進步，記憶卡(memory card)已廣泛應用於各式各樣的電 子裝置，如個人電腦(Personal Computer，PC)、手機(cellphone)、數位相機 (Digital Camera, DC)、數位攝影機(Digital Video, DV)及個人數位助理 (Personal Digital Assistant，PDA).··等。通常，記憶卡内含具有記憶體 晶片（memory chip)的至少一記憶體封裝體(memory package)。而且，隨 著3C產品的廣泛使用，記憶體晶片的記憶容量正不斷的增加，朝向高容 量發展，如32G、64G或128G。 然而，不同容量與型式的記憶卡可能會不同的訊號(signal)輸入/輸 出(Input/0utput，I/0)袼式(f_at)。因此，為了因應此一問題必須於相關電 子產品内新增轉換工具。每每新推出高容量記憶卡，相關電子產品就必須 針對記憶卡不同輸入/輸出袼式加以修改升級推出新電子產品，而舊電子產 品則應相容性問題無法使用。 【新型内容】 w為了解決上述問題，本創作目的之-係提供〆種具内建控制 早元之連接器及其應用，藉由連接器内之控制單元可將記憶M330609 VIII. New Description: [New Technology Field] This creation is about a connector with a control unit, especially a connector with a control unit that can be used for a memory package and its application. [Prior Art] With the advancement of technology, memory cards have been widely used in various electronic devices, such as personal computers (PCs), mobile phones (cell phones), digital cameras (Digital Camera, DC). ), Digital Video (DV) and Personal Digital Assistant (PDA). Generally, a memory card contains at least one memory package having a memory chip. Moreover, with the widespread use of 3C products, the memory capacity of memory chips is constantly increasing, moving toward high capacity, such as 32G, 64G or 128G. However, different capacities and types of memory cards may have different signal input/output (Input/0utput, I/0) ( (f_at). Therefore, in order to respond to this problem, a conversion tool must be added to the relevant electronic product. Every time a new high-capacity memory card is introduced, the related electronic products must be modified and upgraded to introduce new electronic products for different input/output types of the memory card, while the old electronic products should not be used due to compatibility problems. [New content] w In order to solve the above problems, the purpose of this creation is to provide a built-in control connector and its application, which can be remembered by the control unit in the connector.
裝體之訊號輸入/輸出袼式加轉換成所需要之訊號輸入/輪出格 效提高記憶體封裝體之相容性。 I M330609 為了達到上述目的士 接器，係包括：_主體Ί創作—實施例之具内建控制單元之連 -外接端子;以及複數個;子係;置於主體;複數個第 接端子係分別暴露於主轉本卜接编子。弟一外接端子與第二外 外接端子係用以與面且電性連接控制單元。其t，第一 _ 、 v 一記憶體封裝體電性連接。 封裝結構，此記憶體封裝具内建控制單元之連接II之記憶體 設置於連接器之主體上了匕:一連接器；一第一記憶體封裝體，係 封裝體與連接IIH外翻。—電性連接結構，係電輯接記憶體 【實施方式】 圖1所示為本創作一實施例具内建控制單元 構示意圖。於本實施例令，此連接器10，包括 Ί 控制料㈣設置於續1G，第—外接端子3q與第 32係分麻置於主體1G的表面且與控制單元電 中，第-外接端子30可用來與記憶體封裝體（圖 電性 連接。 电旺 接續上述說明，請參照圖2，於一實施例中，一記憶體 結構60包括··連接器10’ ；記憶體封裝體4〇 ;以及電性連接結構％。': 憶體封裝體40係設置於連接器10,之主體10上並藉由第一電性連^ 結構50與第一外接端子30電性連接。此記憶體封裝結構6〇中，記憶體 封裝體40之I/O訊號格式透過連接器1〇,中控制單元2〇之轉換，轉=後 之I/O訊號格式可透過第二外接端子32輸出。 ' 接著，請參照圖3A，於一實施例中，連接器之主體為一 + 路板110。複數個第一外接端子130與複數個第二外接端子 係設置於電路板11 〇兩側的不同表面上。其中，第一外接端子1 % M330609 與第二外接端子132與控制單元（圖上未示）電性連接。控制單 元可以是設置於電路板110上之控制電路或是一控制晶片。 繼續上述說明’一第一記憶體封裝體丨4〇設置於電路板110 上並利用一第一電性連接結構，如複數條金屬引線150或金屬銲 球，與第一外接端子130電性連接。於一實施例中，一封裝材料 160係包覆第一記憶體封裝體140與金屬引線150並暴露出電路 板110另一側之第二外接端子132。 如圖3B所示，於一實施例中，一第一記憶體封裝體142設 置於電路板110上並利用一第一電性連接結構，如複數個金屬銲 球152或金屬引線，與部分第一外接端子13〇電性連接。另外， 於此記憶體封裝結構中更包括一第二記憶體封裝體144並排設置 於電路板110上並利用一第二電性連接結構，如複數個金屬銲球 154或金屬引線，與部分第一外接端子13〇電性連接。一封裝材 料160係包覆第一記憶體封裝體142、第二記憶體封裝體144、 金屬銲球152與金屬銲球154並暴露出電路板11〇另一側之第二 外接端子132。於本實施例中，第一記憶體封裝體142與第二記 憶體封裴體144係並排設置。然，本創作並不限於此，第一記憶 體封裝體142與第二記憶體封裝體144亦可互相堆疊設置並利用 金屬引線或金屬銲球電性連接，圖上未示。 置 晴參照圖4A，於一實施例中，連接器之主體可為一殼體 in '複數個第一外接端子130與複數個第二外接端子132係設 置1喊體111的不同表面上。其中，第一外接端子130與第二外 接端子132與控制單元（圖上未示）電性連接。控制單元可以是 設置於殼體111内之一控制晶片。 接續上述說明，於一實施例中，一第一記憶體封裝體ι4〇 設置於殼體11。上並利用一第—電性連接結，如複數條金屬引線 150或金屬銲球，與第一外接端子130電性連接。一封裂材料16〇 M330609 注入殼體111内包覆第一記憶體封裝體140與金屬引線15〇並暴 露出第二外接端子132。 繼續，如® 4B所示，於一實施例中，—第一記憶體封裝體 142與一第二記憶體封裝體144係堆疊設置於殼體hi内。第一 記憶體封裝體142係利用一第一電性連接結構，如複數個金屬銲 球152或金屬引線，與第一外接端子13〇電性連接。另外，第二 記憶體封裝體144則利用一第二電性連接結構，如複數個金屬銲 球152或金屬引線，與第一記憶體封裝體142電性連接。一封裝 材料160注入殼體in内包覆第一記憶體封裝體142、第二記憶 體封I體144、金屬銲球152與金屬銲球154並暴露出第二外接 端子132。 請參照上述說明與圖4C，於一實施例中，第一記憶體封裝 體142係利用金屬引線152,與部分第一外接端子13〇電性連接。 另外，第一記憶體封裝體142堆疊於第一記憶體封裝體142上並 利用金屬引線154’與部分第一外接端子13〇電性連接。 本創作之記憶體封裝結構可應用於數位安全卡(Secure Digital card, SD card)、迷你數位安全卡(mini SD card)、微型數位安全卡⑽⑽犯 card，#Dcard)、多媒體卡快閃記憶卡(c〇mpact Flash card, CF card)、動態隨機存取記憶體（Dynamic Rand〇m MemOTy，D丽）、同步靜態隨機存取記憶體（Synchr〇n〇usStatieRandam Access Memory，SSRAM)或 NOR 快閃記憶體。 根據上述，本創作藉由具内建控制單元之連接器將記憶體封 裝體之tfl餘人/輸祕歧過控鮮元無麟轉之峨輸入/輪 格式，可有效提高記憶體封裝體之相容性。 以上所述之貝施例僅係為說明本創作之技術思想及特點，意 目的在使熟習此項技藝之人士能夠瞭解本創作之内容並據以二 施’當不能以之限定本創作之專利範圍，即大凡依本創作所揭二 M330609 之精神所作之均等變化或修飾，仍應涵蓋在本創作之專利範圍 内。 【圖式簡單說明】 圖1所示為根據本創作一實施例之架構示意圖。 圖2所示為根據本創作一實施例之架構示意圖。 圖3A與圖3B所示為根據本創作不同實施例之結構示意圖。 圖4A、圖4B與圖4C所示為根據本創作不同實施例之結構示意圖。 【主要元件符號說明】 10 主體 10， 連接器 20 控制單元 30 第一外接端子 32 第二外接端子 40 記憶體封裝體 50 電性連接結構 60 記憶體封裝結構 110 電路板 111 殼體 130 第一外接端子 132 第二外接端子 M330609 140 第一記憶體封裝體 142 第一記憶體封裝體 144 第二記憶體封裝體 150 金屬引線 152 金屬銲球 154 金屬銲球 152’金屬引線 154’金屬引線 160 封裝材料The signal input/output of the package is converted into the required signal input/round output to improve the compatibility of the memory package. I M330609 In order to achieve the above purpose, it includes: _ main body Ί creation - the connection of the built-in control unit of the embodiment - external terminal; and a plurality of; sub-system; placed in the main body; a plurality of first terminal respectively Exposed to the main transfer book and pick up the editor. The external terminal and the second external terminal are used to connect and electrically connect the control unit. The first _, v memory package is electrically connected. The package structure has a memory of the connection II of the built-in control unit. The memory is disposed on the main body of the connector: a connector; a first memory package, and the package is connected to the IIH. - Electrical connection structure, electrically connected to memory [Embodiment] FIG. 1 is a schematic diagram of a built-in control unit according to an embodiment of the present invention. In the embodiment, the connector 10, including the Ί control material (4), is disposed in the continued 1G, and the first external terminal 3q and the 32nd portion are placed on the surface of the main body 1G and electrically connected to the control unit. The first external terminal 30 It can be used to connect with the memory package (electrical connection. The above description, please refer to FIG. 2, in one embodiment, a memory structure 60 includes a connector 10'; a memory package 4; And the electrical connection structure %. ': The memory package 40 is disposed on the main body 10 of the connector 10 and electrically connected to the first external terminal 30 by the first electrical connection structure 50. The memory package In the structure 6A, the I/O signal format of the memory package 40 is transmitted through the connector 1 and the middle control unit 2, and the I/O signal format after the conversion can be output through the second external terminal 32. Referring to FIG. 3A, in one embodiment, the main body of the connector is a +-way board 110. The plurality of first external terminals 130 and the plurality of second external terminals are disposed on different surfaces of the two sides of the circuit board 11 Among them, the first external terminal 1% M330609 and the second external terminal 132 and control The unit (not shown) is electrically connected. The control unit may be a control circuit or a control chip disposed on the circuit board 110. Continuing the above description, a first memory package 〇4 is disposed on the circuit board 110. The first external connection terminal 130 is electrically connected to the first external terminal 130 by using a first electrical connection structure, such as a plurality of metal leads 150 or metal solder balls. In one embodiment, a package material 160 covers the first memory package. The second external terminal 132 is exposed on the other side of the circuit board 110. As shown in FIG. 3B, in an embodiment, a first memory package 142 is disposed on the circuit board 110 and utilizes a The first electrical connection structure, such as a plurality of metal solder balls 152 or metal leads, is electrically connected to a portion of the first external terminals 13 . In addition, the second memory package 144 is further included in the memory package structure. It is disposed on the circuit board 110 and electrically connected to a portion of the first external terminal 13 by a second electrical connection structure, such as a plurality of metal solder balls 154 or metal leads. A package material 160 is wrapped around the first memory. seal The body 142, the second memory package 144, the metal solder balls 152 and the metal solder balls 154 expose the second external terminals 132 on the other side of the circuit board 11. In the present embodiment, the first memory package 142 The first memory package 142 and the second memory package 144 are also stacked on each other and utilize metal leads or metal solder balls. Electrical connection, not shown. Referring to FIG. 4A, in one embodiment, the main body of the connector may be a housing in which a plurality of first external terminals 130 and a plurality of second external terminals 132 are provided. Shouting on different surfaces of body 111. The first external terminal 130 and the second external terminal 132 are electrically connected to a control unit (not shown). The control unit can be a control wafer disposed within the housing 111. Following the above description, in one embodiment, a first memory package ι4 is disposed in the housing 11. And electrically connected to the first external terminal 130 by using a first electrical connection, such as a plurality of metal leads 150 or metal solder balls. A cracked material 16〇 M330609 is injected into the casing 111 to cover the first memory package 140 and the metal lead 15〇 and expose the second external terminal 132. Continuing, as shown in FIG. 4B, in one embodiment, the first memory package 142 and the second memory package 144 are stacked in the housing hi. The first memory package 142 is electrically connected to the first external terminal 13 by a first electrical connection structure, such as a plurality of metal solder balls 152 or metal leads. In addition, the second memory package 144 is electrically connected to the first memory package 142 by using a second electrical connection structure, such as a plurality of metal solder balls 152 or metal leads. A package material 160 is injected into the housing in the first memory package 142, the second memory package body 144, the metal solder balls 152 and the metal solder balls 154 to expose the second external terminals 132. Referring to the above description and FIG. 4C, in one embodiment, the first memory package 142 is electrically connected to a portion of the first external terminals 13 by metal leads 152. In addition, the first memory package 142 is stacked on the first memory package 142 and electrically connected to a portion of the first external terminals 13 by metal leads 154'. The memory package structure of the present invention can be applied to a Secure Digital card (SD card), a mini digital card (mini SD card), a micro digital security card (10) (10) card, #Dcard), a multimedia card flash memory card. (c〇mpact Flash card, CF card), dynamic random access memory (Dynamic Rand〇m MemOTy, D), synchronous static random access memory (Synchr〇n〇usStatieRandm Access Memory, SSRAM) or NOR flash Memory. According to the above, the present invention can effectively improve the memory package by using the connector with the built-in control unit to convert the memory package to the input/wheel format. compatibility. The above-mentioned examples are only for explaining the technical ideas and characteristics of the creation, and the purpose is to enable those skilled in the art to understand the content of the creation and to apply the patents of the creation. The scope, that is, the equivalent changes or modifications made by the company in accordance with the spirit of this article, M330609, should still be covered by the scope of this creation. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an architecture according to an embodiment of the present invention. FIG. 2 is a schematic diagram of the architecture according to an embodiment of the present invention. 3A and 3B are schematic views showing the structure of different embodiments according to the present creation. 4A, 4B and 4C are schematic views showing the structure of different embodiments according to the present creation. [Main component symbol description] 10 main body 10, connector 20 control unit 30 first external terminal 32 second external terminal 40 memory package 50 electrical connection structure 60 memory package structure 110 circuit board 111 housing 130 first external connection Terminal 132 Second External Terminal M330609 140 First Memory Package 142 First Memory Package 144 Second Memory Package 150 Metal Lead 152 Metal Solder Ball 154 Metal Solder Ball 152' Metal Lead 154' Metal Lead 160 Packaging Material