TWM330570U - Packaging structure of light source of high light-emitting rate - Google Patents

Packaging structure of light source of high light-emitting rate Download PDF

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Publication number
TWM330570U
TWM330570U TW96213422U TW96213422U TWM330570U TW M330570 U TWM330570 U TW M330570U TW 96213422 U TW96213422 U TW 96213422U TW 96213422 U TW96213422 U TW 96213422U TW M330570 U TWM330570 U TW M330570U
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Taiwan
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light
layer
light source
circuit substrate
refracting
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TW96213422U
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Chinese (zh)
Inventor
ji-yuan Xu
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Iledm Photoelectronics Inc
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Priority to TW96213422U priority Critical patent/TWM330570U/en
Publication of TWM330570U publication Critical patent/TWM330570U/en

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M330570 八、新型說明: 【新型所屬之技術領域】 本新型係一種光源封裝結構,特別是指一種高發光率之 光源封裝結構,其充份運用發光光源發出的各角度光線,且 月色降低發光光源的需求量。 ’ 【先前技術】 ❿ 現今傳統照明燈具存在許多問題,例如:白熾燈泡雖便 宜,但白熾燈泡有發光效率低、高耗電、壽命短、易碎等缺 點。而日光燈雖很省電’但日光燈的廢棄物有采污染、易碎 ^ 壽命短等問題。 - 相對而言,符合各國節能環保安全標準的發光二極體 LED、冷光光源等產品就產生出相對的優勢,其特性及優點在 於:壽命長、低耗電量、光顏色純、高防震性、安全不易碎、 φ無污染及小型化可封裝等等; 雖然具有前述多種優勢,但是受到發光二極體LED、冷 光光源等光源發光效率、亮度方向性等限制的影響,前述光 源產品仍不足以完全應用在人類生活之中,請參閱第丨圖的 習用範例,此種習用發光二極體LED晶片結構如圖所示,其 作為發光光源的產品問題在於: 其一,目前市場上出現產品多是在一個電路基板1〇上安 裝多數發光光源晶片11,且電路基板10上佈設有導電層12, M330570 並且各發光光源晶片11朝向不同方向與角度發出光線,由於 -發光光源晶片11朝電路基板10方向發出的光線無效果,故 ,一般習用的LED、冷光光源皆會出現發光率過低(發出光線 有效比率)的問題,雖然此種設計仍能組合出類似傳統燈泡 等照明光度,但是能源浪費卻是令人無法忽視的問題;故全 球光源設備相關廠商和研究單位不斷的積極研究,力求尋找 可以充份發揮光源所有光線能量的設計。 • 其二,習用電路基板10上會使用樹脂覆層13定位、保 護發光光源晶片11,再以一透鏡14折射光線,且該電路基 板10表面若無另行製槽或製覆層限制阻擂樹脂覆層時,則該 -樹脂覆们3的佈設範圍不容易控制,而此製槽或製覆層步驟 同樣產生成本的耗用。 為了能夠有效解決前述相關議題,本新型創作人基於過 Φ去研發相關光源照明設備及發光光源系統的技術與經驗,在 改善前述問題的目標下研發設計及實驗,終於發展出一種全 新的高發光率之光源封裝結構。 【新型内容】 本新型之首要目的是提供一種高發光率之光源封裝結 構,其能充份運用發光光源光線; 為達成上述目的,本新型於電路基板相應該發光光源的 M330570 表面處製作一光線折射層,且於發光光源週側佈設複數折射 - 凸部,前述光線折射層不僅能將發光光源的無效光線折射為 有效光線,特別是利用該折射凸部可以充份折射發光光源水 平方向的無效光線, 藉此,本新型結構可以充份運用該發光光源發出的各角 ^ 度光線,且該折射凸部更能充份折射發光光源水平方向的無 ' 效光線,確實是一種高發光率之光源封裝結構。 本新型之次一目的是提供一種高發光率之光源封裝結 構,利用發光光源水平方向光線的高折射補光來降低發光光 源的數量需求, 為達成上述目的,本新型特別於發光光源週侧及各個發 光光源之間佈設折射凸部,前述折射凸部可以充份折射發光 光源水平方向的無效光線,不僅可以充份補光,且能讓折射 0 凸部發揮平均光度、利用無效光線的優點,而讓一定光度需 求的產品内可以減少發光光源的安裝數量。 前述發光光源週侧佈設複數折射凸部可以是採金屬濺 鍍、電鍍或表面沈積技術製作而成,且折射凸部可以是與該 光線折射層採用相同材質同步製作; 另外,該折射凸部的製作成型位置可以在任何一個發光 光源週侧或兩個發光光源之間,皆能發揮折射水平方向無效 M330570 光線的效果; 而該折射凸部的的形狀可以是一般折射設計常見的半圓 型、圓錐型、方塊型、水滴型等設計,皆能依照設計發揮各 種需求下的折射變化。 在此要說明的是’本新型的電路基板的光線折射層也可 以是採金屬濺鍍、電鍍或表面沈積技術製作而成,令其具備 光滑金屬鏡面,且光線折射層相應發光光源可以製作導光斜 面或導光弧面,再度提昇本新型的發光率。 【實施方式】 請參閱第2、3及4圖的本新型實施例,依據本創作上 述目的,其提供一種高發光率之光源封裝結構,包括有一電 路基板20、光線折射層30、複數折射凸部A、複數發光光源 40、樹脂覆層50、螢光層60及透鏡70,其中; 該電路基板20,其上設置一具有電極銲墊211之印刷 電路層21 ; 該光線折射層30,採金屬濺鍍技術在該電路基板20表 面製作的金屬薄層’此光線折射層30的表面為金屬鏡面31 ’ 且濺鍍出的凸出光線折射層30相應該電路基板20之電極銲 墊211佈設範圍凸設有擋部32,該擋部32相應電極銲墊211 方向製作有導光斜面33 ; 該折射凸部A,係與該光線折射層30相同材質並採金屬 M330570 濺鍍在該電路基板20表面,故折射凸部A同樣具備金屬鏡 面,該折射凸部A呈浮凸半圓型,且折射凸部A位於該電路 基板20之電極銲墊211旁; 該發光光源40,為一發光二極體LED,發光光源40位於 該光線折射層30上,且該發光光源40相應該電路基板(20) 之電極銲墊211膠合定位,且發光光源40以銲線41電性連 接至該電路基板20之印刷電路層21上的電極銲墊211,而 任二個發光光源40之間皆具有一折射凸部A ; 該樹脂覆層50,填覆在該發光光源40及銲槔41外,且 樹脂覆層50被限制在該光線折射層30凸設的擋部32内;以 及 該螢光層60及透鏡70,該螢光層60罩設在該樹脂覆層 50之上,該透鏡70則罩設在該螢光層60上,以透鏡70配 合螢光層60有效發揮該發光光源40的光度表現; 以上所述,即為本創作實施例各構件結構、組態及其相 互關係的說明。 為求清楚說明本新型之各種實施方式,請配合本新型各 圖所示進行說明: 本新型結構運作時,由於該電路基板20上設置該光線折 射層30,且此光線折射層30的表面為金屬鏡面31,而該電 路基板20之擋部32相應電極銲墊211方向製作有導光斜面 M330570 33 ;當該發光光源40發光時,朝向照射方向的光線會透過該 樹脂覆層50與透鏡60射出;基本上具備一般習用的發光效 果; 此外,該發光光源40朝向該光線折射層30發出的光線 由於會被光線折射層30的金屬鏡面31反射,又配合該播部 32的導光斜面33折射向週邊外侧的水平向光線;故本創作 能有效折射該發光光源40各方向的光線,發揮出較一般習用 鲁更佳的發光率; 關鍵在於,由於任二個發光光源40之間皆具有一折射凸 部A,且該折射凸部A係與該光線折射層3〇相同材質(同樣 ‘ 具備金屬鏡面),故本創作的折射凸部A利用浮凸半圓型的形 狀可以有效折射任二個發光光源4〇之間的水平方向光線,並 且產生類似月焭反射太陽光線的月光現象,讓本創作電路基 板20上除了原本的發光光源4〇之外,增加複數個折射凸部 _ A向外發光; 由前述可知,本新型產品的發光光源4〇無論是向外水平 方向、朝向底面或彼此之間水平方向的光線都會有效折射運 用’確實是一種高發光率之光源封裝結構。 特別是各個折射凸部A能夠發揮發光效果,讓本創作電 路基板20上除了原本的發光光源4〇之外,增加複數個折射 .凸部A向外發光;不但有效增加光線均句補光,並且讓同一 M330570 面積、相同光度需求的產品能夠降低發光光源40數量,達成 大幅降低成本之目的。 在此重新總結本創作結構改良後的特徵功效於下: 1.本新型於電路基板相應該發光光源的表面處製作光線折 射層及於發光光源週側佈設複數折射凸部,利用此光線折射 ‘ 層配合折射凸部將發光光源的無效光線折射為有效光線;藉 Φ 此充份運用該發光光源發出的各角度光線、提高發光率。 2.本新型的折射凸部能夠發光,讓本創作電路基板上除 了原本的發光光源之外,增加複數個折射凸部向外發光,且 讓同一面積、相同光度需求的產品能夠降低發光光源數量, 達成大幅降低成本之目的。 綜上所述,本案之創新結構設計係包括有一電路基板、 0 至少一發光光源、罩覆該發光光源的樹脂覆層及罩覆該樹脂 覆層的螢光層,其特徵是另於電路基板相應該發光光源的表 面處製作一光線折射層,且於發光光源週側佈設複數折射凸 部,利用前述光線折射層不僅能將發光光源的無效光線折射 為有效光線,且折射凸部可以充份折射發光光源水平方向的 無效光線; 藉此充份運用該發光光源發出的各角度光線,降低發光 光源的使用需求量,確是一種高發光率之光源封裝結構;所 11 M330570 以本創作之『具有產業之可彻性』應已毋庸置疑,除此之 外’在本案實施例所揭露出的特徵技術,於申請之前並未曾 ^於諸韻或被公開❹,*但具有如上功效增進之事 實’更具有不可輕忽_加功效,是故,本創作的『新賴性』 以及『進步性』都已符合專利法規,料惠予審查並早日賜』 准專利,實感德便。M330570 VIII, new description: [New technology field] This new type is a light source package structure, especially a high illuminance light source package structure, which fully utilizes the angle light emitted by the illuminating light source, and the moonlight reduces the illuminating The amount of light required. ‘[Prior Art] ❿ There are many problems with traditional lighting fixtures today. For example, incandescent bulbs are inexpensive, but incandescent bulbs have the disadvantages of low luminous efficiency, high power consumption, short life and fragility. The fluorescent lamp is very energy-saving, but the waste of the fluorescent lamp is polluted, fragile, and has a short life. - Relatively speaking, LEDs, cold light sources and other products that meet the national energy conservation and environmental protection safety standards have a comparative advantage. Their characteristics and advantages are: long life, low power consumption, pure light color, high shock resistance. It is safe and not fragile, φ is non-polluting, and can be packaged in a small size. Although it has the above various advantages, it is still limited by the luminous efficiency of the light source such as the LED, the cold light source, and the directionality of the brightness. In order to be fully applied in human life, please refer to the conventional example of the figure. The structure of the conventional LED chip is shown in the figure. The problem of the product as a light source is: First, products appear on the market. A plurality of light-emitting source wafers 11 are mounted on a circuit board 1 , and a conductive layer 12 , M330570 is disposed on the circuit board 10 , and each of the light-emitting source wafers 11 emits light in different directions and angles, because the light-emitting source wafer 11 faces the circuit. The light emitted from the direction of the substrate 10 has no effect. Therefore, the conventional LED and the cold light source may have a low luminosity. The problem of the effective ratio of light rays, although this design can still combine illumination luminosity like traditional light bulbs, but energy waste is a problem that cannot be ignored; therefore, the global light source equipment manufacturers and research units are constantly actively researching and striving Look for designs that take full advantage of all the light energy of the light source. • Second, the conventional circuit board 10 uses a resin coating 13 to position and protect the illuminating light source wafer 11 and refract light by a lens 14, and the surface of the circuit substrate 10 is free of grooves or coatings to limit the barrier resin. In the case of coating, the layout of the resin-coated 3 is not easily controlled, and the groove or cladding step also consumes cost. In order to effectively solve the aforementioned related issues, the creator of this new model developed the design and experiment based on the Φ to develop the technology and experience of related light source lighting equipment and illuminating light source system, and finally developed a new high illuminating light under the goal of improving the above problems. The source of the light source package structure. [New content] The primary purpose of the novel is to provide a high-luminosity light source package structure, which can fully utilize the light of the light source; to achieve the above object, the present invention produces a light on the surface of the circuit board corresponding to the light source of the M330570. a refractive layer, and a plurality of refraction-convex portions are disposed on a peripheral side of the illuminating light source, and the ray refraction layer not only refracts the invalid light of the illuminating light source into effective light, and particularly, the refracting convex portion can fully refract the horizontal direction of the illuminating light source. Light, thereby, the novel structure can fully utilize the angles of light emitted by the illuminating light source, and the refracting convex portion can fully refract the illuminating light source in the horizontal direction without the effective light, which is indeed a high illuminance Light source package structure. The second object of the present invention is to provide a light source package structure with high illuminance, which utilizes high-refraction fill light of horizontal light of the illuminating light source to reduce the number of illuminating light sources. To achieve the above object, the present invention is particularly applicable to the peripheral side of the illuminating light source and A refracting convex portion is disposed between each of the illuminating light sources, and the refracting convex portion can fully refract the ineffective light in the horizontal direction of the illuminating light source, not only can fully fill the light, but also can make the refracting 0 convex portion play the average illuminance and utilize the advantage of the invalid light. The number of illuminating light sources installed can be reduced in products with a certain luminosity requirement. The plurality of refracting convex portions disposed on the circumferential side of the illuminating light source may be made by metal sputtering, electroplating or surface deposition technology, and the refracting convex portion may be synchronously formed with the same material as the light refracting layer; The forming position can be performed on the circumference of any one of the illuminating light sources or between the two illuminating light sources, and the effect of refracting the horizontal direction of the M330570 ray can be exhibited; and the shape of the refracting convex portion can be a semicircular type or a cone commonly used for general refraction design. Designs such as type, block type, and water drop type can all be used to reflect the refraction changes under various requirements. It should be noted that the light-refractive layer of the circuit board of the present invention can also be made by metal sputtering, electroplating or surface deposition technology, so that it has a smooth metal mirror surface, and the light-reflecting layer corresponding light source can be used as a guide. The light bevel or the light guiding arc surface enhances the luminous rate of the novel. [Embodiment] Please refer to the new embodiment of Figures 2, 3 and 4, according to the above object of the present invention, a light source package structure with high illuminance includes a circuit substrate 20, a light refraction layer 30, and a complex refraction convex a portion A, a plurality of illuminating light sources 40, a resin coating layer 50, a phosphor layer 60, and a lens 70, wherein the circuit substrate 20 is provided with a printed circuit layer 21 having an electrode pad 211; The metal thin layer formed on the surface of the circuit substrate 20 is a metal mirror surface 31' and the sputtered convex light refraction layer 30 is disposed corresponding to the electrode pad 211 of the circuit substrate 20. The illuminating portion 32 is formed with a light guiding inclined surface 33 corresponding to the direction of the electrode pad 211; the refracting convex portion A is made of the same material as the light refracting layer 30 and is plated with the metal M330570 on the circuit substrate. 20, the refracting convex portion A also has a metal mirror surface, the refracting convex portion A is embossed and semicircular, and the refracting convex portion A is located beside the electrode pad 211 of the circuit substrate 20; the illuminating light source 40 is a light emitting diode Polar body LE D, the illuminating light source 40 is located on the light refracting layer 30, and the illuminating light source 40 is glued and positioned corresponding to the electrode pad 211 of the circuit substrate (20), and the illuminating light source 40 is electrically connected to the circuit substrate 20 by the bonding wire 41. The electrode pad 211 on the printed circuit layer 21, and any two of the illuminating light sources 40 have a refracting convex portion A; the resin coating layer 50 is filled outside the illuminating light source 40 and the soldering 41, and the resin is coated. The layer 50 is confined in the protruding portion 32 of the light-refractive layer 30; and the phosphor layer 60 and the lens 70 are disposed on the resin coating 50, and the lens 70 is covered. On the phosphor layer 60, the luminosity of the illuminating light source 40 is effectively exhibited by the lens 70 in cooperation with the luminescent layer 60. The above description is the description of the structure, configuration, and relationship of the components of the present embodiment. In order to clarify the various embodiments of the present invention, the description will be made in conjunction with the drawings of the present invention. When the novel structure is in operation, the light refraction layer 30 is disposed on the circuit substrate 20, and the surface of the light refraction layer 30 is The metal mirror 31 has a light guiding slope M330570 33 formed in the direction of the electrode pad 211 of the circuit board 20; when the light source 40 emits light, the light toward the irradiation direction passes through the resin coating 50 and the lens 60. The light emitted from the illuminating light source 40 toward the refracting layer 30 is reflected by the metal mirror surface 31 of the light refracting layer 30 and cooperates with the light guiding slope 33 of the concentrating portion 32. Refraction of the horizontal light to the outer side of the periphery; therefore, the creation can effectively refract light in all directions of the illuminating light source 40, and exert a better luminosity than the conventional ruling; the key is that since any two illuminating light sources 40 have a refractive convex portion A, and the refractive convex portion A is the same material as the light-refractive layer 3〇 (the same 'with a metal mirror surface'), so the refractive protrusion of the present creation A can effectively refract horizontal light rays between any two illuminating light sources 4 利用 by using the embossed semicircular shape, and generate a moonlight phenomenon similar to the moonlight reflecting solar rays, so that the original illuminating light source 4 is on the circuit board 20 of the present invention. In addition to 〇, a plurality of refracting convex portions _ A are externally illuminating; as can be seen from the foregoing, the illuminating light source 4 of the novel product can be effectively refracted in the horizontal direction, the bottom surface or the horizontal direction between each other. It is indeed a high-luminance light source package structure. In particular, each of the refracting convex portions A can exert a illuminating effect, so that the original circuit board 20 has a plurality of refractions in addition to the original illuminating light source 4 .. The convex portion A emits light outward; not only effectively increases the light uniform fill light, And the same M330570 area, the same luminosity requirements of the product can reduce the number of illuminating light sources 40, achieving a significant cost reduction. Here, the functional features of the improved structure are re-summarized as follows: 1. The present invention fabricates a light refraction layer on the surface of the circuit substrate corresponding to the illuminating light source and arranges a plurality of refracting convex portions on the peripheral side of the illuminating light source to refract the light. The layer cooperates with the refracting convex portion to refract the invalid light of the illuminating light source into effective light; by using Φ, the illuminating light of each angle emitted by the illuminating light source is fully utilized, and the illuminating rate is improved. 2. The refracting convex portion of the novel can emit light, so that in addition to the original illuminating light source, the plurality of refracting convex portions are externally illuminated, and the products of the same area and the same luminosity requirement can reduce the number of illuminating light sources. , achieving the goal of significantly reducing costs. In summary, the innovative structural design of the present invention includes a circuit substrate, 0 at least one illuminating light source, a resin coating covering the illuminating light source, and a fluorescent layer covering the resin coating, which is characterized by another circuit substrate. Corresponding to the surface of the illuminating light source, a light refraction layer is formed, and a plurality of refracting convex portions are disposed on the peripheral side of the illuminating light source, and the illuminating light layer can not only refract the invalid light of the illuminating light source into effective light, and the refracting convex portion can be fully charged. Refraction of the ineffective light in the horizontal direction of the illuminating light source; thereby fully utilizing the various angles of light emitted by the illuminating light source to reduce the use requirement of the illuminating light source, and is indeed a high illuminance light source packaging structure; 11 M330570 There is no doubt that the industry can be completely clarified, except for the fact that the feature technology revealed in the embodiment of this case has not been published before the application, but it has the same effect. 'More must not be neglected _ plus effect, is the reason, the "new dependence" and "progressive" of this creation have been in line with patent regulations, expected Review and give early 'patent-pending, will be a real sense of ethics.

12 M330570 【圖式簡單說明】 第1圖 係習用設計結構示意圖。 第2圖 係本創作電路基板及發光光源立體示意圖。 第3圖 係本創作實施例立體組合剖視圖。 第4圖 係本創作折射狀態示意圖。 【主要元件符號說明】12 M330570 [Simple description of the diagram] Figure 1 is a schematic diagram of the design of the application. Figure 2 is a three-dimensional schematic diagram of the circuit board and the light source. Fig. 3 is a perspective sectional view showing the present embodiment. Figure 4 is a schematic diagram of the refractive state of the present creation. [Main component symbol description]

《習用》 電路基板10 導電層12 透鏡14 《本創作》 電路基板20 電極銲墊211 光線折射層30 擋部32 折射凸部A 發光光源40 樹脂覆層50 螢光層60 透鏡70 發光光源晶片11 樹脂覆層13 印刷電路層21 鏡面31 導光斜面33 銲線41 13<<Applied』 Circuit board 10 Conductive layer 12 Lens 14 "This creation" Circuit board 20 Electrode pad 211 Light refraction layer 30 Resistor 32 Refractive convex part A Light source 40 Resin coating 50 Fluorescent layer 60 Lens 70 Illumination source wafer 11 Resin coating 13 Printed circuit layer 21 Mirror surface 31 Light guiding slope 33 Bonding wire 41 13

Claims (1)

M330570 九、申請專利範圍: 1· 一種高發光率之光源封裝結構,包含有·· 一電路基板; 至少一發光光源,裝設於該電路基板上; 至少-折射凸部,位於該發光光源旁,且折射該發光光 ’源水平方向的光線;以及 ^ 一樹脂覆層,填覆在該發光光源及該折射凸部外。 2·如申請專利範圍第i項所述之高發光率之光源封裝結構, 另包括有一光線折射層;其中: • 該電路基板,其上設置一具有電極銲墊之印刷電路層; 該光線折射層,為金屬製薄層,此光線折射層的表面為 金屬鏡面;以及 該折射凸部係與該光線折射層同材質,該折射凸部表面 籲為金屬鏡面,且一併製作在該電路基板表面。 3·如申請專利範圍第2項所述之高發光率之光源封裝結構, 另外依序罩覆有一螢光層及一透鏡,其中: 該電路基板,其上設置一具有電極銲墊之印刷電路層; 該光線折射層相應該電路基板之電極銲墊佈設範圍凸設 有擋部; 該發光光源,位於該光線折射層上,該發光光源相應該 M330570 電路基板之電極銲墊定位,且發光光源以銲線電性連接至該 電路基板之印刷電路層上的電極銲墊; °亥樹知覆層,填覆在該發光光源及銲線外,且樹脂覆層 被限制在該光線折射層凸設的擋部内; 5玄螢光層’填覆在該樹脂覆層外;以及 該透鏡,位於該發光光源及銲線外,且透鏡與該樹脂覆 層重豐,以有效折射該發光光源的光線。 4.如申明專利範圍第1項所述之高發光率之光源封裝結構, 其中,裝设有數個發光光源,且該折射凸部位於各個發光光 源之間。 5·如申請專利範圍第丨項所述之高發光率之光源封裝結構, 其中,該折射凸部之造型為半圓型、圓錐型、方塊型或水滴 書型。 6· —種高發光率之光源封裝結構,包括有: -電路基板,其上設置—具有電極銲墊之印刷電路層; 一光線折射層,採製作在該電路基板表面製作的金屬薄 層’此光線折射層的表面為金屬鏡面; 數個折射凸部’係製作在該電路基板表面,1各折射凸 部能折射光線,且該各折射凸部位於該電路基板之電極鲜塾 15 M330570 旁; 數個發光光源,位於該光線折射層上,且各個發光光源 •以銲線電性連接至該電路基板之印刷電路層上的電極銲 墊,而任二個發光光源之間皆具有一折射凸部; 一樹脂覆層,填覆在該發光光源及銲線外; 一螢光層,該螢光層罩設在該樹脂覆層之上;以及 一透鏡,罩設在該螢光層上。 » 7·如申睛專利圍第6項所述之高發光率之光源封裝結構, 其中,該折射凸部之造型為半圓型、圓錐型、方塊 型。 — I如申明專利圍第6項所述之高發光率之光源封裝結構, 其中,該發光光源為發光二極體(LED)。M330570 IX. Patent application scope: 1. A high illuminance light source package structure, comprising: a circuit substrate; at least one illuminating light source mounted on the circuit substrate; at least a refractive convex portion located beside the illuminating light source And refracting the light in the horizontal direction of the illuminating light; and a resin coating filling the illuminating light source and the refracting convex portion. 2. The high-luminance light source package structure of claim i, further comprising a light-refractive layer; wherein: • the circuit substrate on which a printed circuit layer having an electrode pad is disposed; the light is refracted The layer is a thin metal layer, the surface of the light refracting layer is a metal mirror surface; and the refracting convex portion is made of the same material as the light refracting layer, and the surface of the refracting convex portion is called a metal mirror surface, and is formed on the circuit substrate. surface. 3. The high-luminous light source package structure according to claim 2, further comprising a phosphor layer and a lens, wherein: the circuit substrate is provided with a printed circuit having an electrode pad The light-refractive layer is provided with a blocking portion corresponding to the electrode pad of the circuit substrate; the light-emitting source is located on the light-refractive layer, and the light source is positioned corresponding to the electrode pad of the M330570 circuit substrate, and the light source is An electrode pad electrically connected to the printed circuit layer of the circuit substrate by a bonding wire; a coating layer covering the illuminating light source and the bonding wire, and the resin coating layer being confined to the ray refraction layer a light shielding layer is disposed outside the resin coating; and the lens is located outside the light source and the bonding wire, and the lens and the resin coating are heavy to effectively refract the light source. Light. 4. The high-luminance light source package structure according to claim 1, wherein a plurality of illuminating light sources are disposed, and the refracting convex portions are located between the respective illuminating light sources. 5. The high luminous efficiency light source package structure according to the invention of claim 2, wherein the refractive convex portion is shaped as a semicircular shape, a conical shape, a square shape or a water droplet book type. 6. A high-luminance light source package structure, comprising: - a circuit substrate on which a printed circuit layer having an electrode pad is disposed; and a light refraction layer for producing a thin metal layer formed on the surface of the circuit substrate The surface of the light-refractive layer is a metal mirror surface; a plurality of refractive protrusions are formed on the surface of the circuit substrate, and each of the refractive protrusions can refract light, and the respective refractive protrusions are located beside the electrode of the circuit substrate 15 M330570 a plurality of illuminating light sources are disposed on the light refracting layer, and each of the illuminating light sources is electrically connected to the electrode pads on the printed circuit layer of the circuit substrate by a bonding wire, and each of the two illuminating light sources has a refraction therebetween a convex portion; a resin coating layer covering the illuminating light source and the bonding wire; a fluorescent layer disposed on the resin coating layer; and a lens disposed on the fluorescent layer . The light-emitting package structure of the high illuminance according to Item 6 of the patent application, wherein the refracting convex portion has a semicircular shape, a conical shape and a square shape. The light source package structure of the high illuminance according to claim 6, wherein the illuminating light source is a light emitting diode (LED).
TW96213422U 2007-08-14 2007-08-14 Packaging structure of light source of high light-emitting rate TWM330570U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9210763B2 (en) 2008-11-13 2015-12-08 Maven Optronics Corp. Phosphor-coated light extraction structures for phosphor-converted light emitting devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9210763B2 (en) 2008-11-13 2015-12-08 Maven Optronics Corp. Phosphor-coated light extraction structures for phosphor-converted light emitting devices
TWI608760B (en) * 2008-11-13 2017-12-11 行家光電有限公司 Method of forming phosphor-converted light emitting devices
US10038123B2 (en) 2008-11-13 2018-07-31 Maven Optronics International, Ltd. Phosphor-coated light extraction structures for phosphor-converted light emitting devices

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