M330554 八、新型說明： 【新型所屬之技術領域】 _ 本創作係涉及一種晶圓研磨環，特別是指晶圓研磨产 之創新型態設計者。 ^ 【先前技術】 按’晶圓研磨環結構通常係由/環狀金屬基材以及_ ，高分子研磨環體所結合構成；而所述金屬基材與研磨環體 φ 之結合固定方式，請調閱臺灣專利公報編號第470690號之 「晶圓研磨環的接著方法」所揭，該案中係揭示將研磨環 體之接著面進行火燄處理，復將金屬基材與研磨環體之接 著面擦拭處理乾淨，然後再利用環氧樹脂加以黏著固定， 藉此而令該金屬基材與研磨環體達成結合固定狀態。 晶圓研磨環使用上，其壽命的長短，除了取決於該研 磨環體的磨耗速度之外，金屬基材與研磨環體之間相結合 的牢固性也是其中之一，概因晶圓研磨環於進行研磨加工 • 過程中，會與晶圓工件之間產生劇烈的磨檫作用，而其反 _作用力將會對晶圓研磨環的金屬基材與研磨環體相結合狀 態產生破壞威脅，因此，該金屬基材與研磨環體之間的結 合狀態牢固與否，於研磨過程中將顯露無遺，而一旦該金 屬基材與研磨環體之間產生相互鬆動脫開現象，亦即等同 該晶圓研磨環損壞報廢；由此反觀前述習知晶圓研磨環之 金屬基材與研磨環體之間係利用環氧樹脂加以黏著固定之 結構型態，因其金屬基材與研磨環體之接著面通常設成平 面狀態，當其接著面相互壓合時，其間的環氧樹脂將大量 5 M330554 向外溢出而 的問題。 另者， 成壞凹溝， 而獲致更佳 環體部份作 接合面來與 之間的黏合 是以， ，如何開發 業者再加以 有鑑於 與设什經驗 終得一確具 造成浪費，並且造成接著強度難以進—步提昇 後續雖有 以使環氧 之結合固 補強，而 研磨環體 強度仍舊 針對上述 一種更具 努力研發 此，創作 ’針對上 實用性之 業者於 樹脂或 定效果 對於金 做黏合存在不 習知晶 理想實 突破之 人本於 述之目 本創作 該研磨 其它黏 ?然此 屬基材 ，使得 足之問 圓研磨 用性之 目標及 多年從 標，詳 環體之 著劑可 種作法 而言， 該研磨 題。 壤結構 創新結 方向。 事相關 加設計 接著面再加工形 嵌入該環凹溝中 ’係只針對研磨 仍舊是以其平整 壤體與金屬基材 所存在之問題點 構’實有待相關 產品之製造開發 與審慎評估後， 【新型内容】 本創作之主要目的，係在提供一種晶圓研磨環改良結 構，其所欲解決之問題點，係針對習知晶圓研磨環之基材 與研磨環體之結合固定結構設計上仍舊無法達到較佳穩固 結合定位狀態、又能兼顧製造簡易性之問題點加以改良突 破；所述晶圓研磨環包括一環狀基材以及一研磨環體，該 環狀基材與研磨環體相對設有接著面以藉由接著劑料相斧 合固定，該環狀基材具有間隔排列的定位孔槽。 本創作解決問題之技術特點，主要在於該環狀基材所 設定位孔槽係設為貫穿孔型態，構成所述定位孔槽一端係 6 M330554 .貫通該環狀基材之接著面，以使接著劑料對應各定位孔 部位得以形成嵌入部者；藉此創新獨特設計，使本創作 照先前技術而言，大致可達到如下功效： 藉由將該環狀基材原本即必須設置的定位孔槽設為 牙孔型恶之設計’使得環狀基材與研磨環體之間的接著 ，料得以對應各定位孔槽形成嵌入部，藉此即可大幅擴增 著劑料之結合固定面積而確實達到更加穩固之結合固定 態’且由於所述欲入部的形成是藉由環狀基材原本即必 _設置的定位孔槽改設成貫穿孔型態所達成，製造成本無 增加，故本創作整體設計可令晶圓研磨環達到兼具較佳 固結合定位性和製造簡易性之實用效益及較佳產業經濟 益者。 【實施方式】 請參閱第1〜5圖所示，係本創作晶圓研磨環改良 鲁構之較佳實施例，惟此等實施例僅供說明之用，在專利 請上並不受此結構之限制。 所述晶圓研磨環A包括一環狀基材1〇以及一研磨環 2〇，該環狀基材1〇與研磨環體20相對設有接著面u、21 藉由接著劑料30相結合固定，該環狀基材1〇具有間隔排 的定位孔槽12，該研磨環體20之接著面21並可設有接著 甘欠入部23，该環狀基材1〇所設定位孔槽12係為貫穿孔型 ’構成所述定位孔槽12 —端係貫通該環狀基材1〇之接著 11，以使接著劑料30對應各定位孔槽12部位得形成嵌入 31者。 槽 對 孙 貝 劑 接 狀 須 須 穩 效 結 中 體 以 列 劑 態 面 部 7 M330554 其[該研磨％體20之研磨面22可為平整研磨面或 設有環形排列之排屑槽24。 其中，該接著劑嵌入部23可為數道環形凹溝23ι以 呈放射狀間隔排列且跨越該各環形凹溝之長形凹槽 構成者。 n 定位孔槽12部位之深度’係可藉由-塞體40預先組入定位M330554 VIII. New Description: [New Technology Area] _ This creation relates to a wafer grinding ring, especially to the innovative design of wafer grinding. ^ [Prior Art] According to the 'wafer grinding ring structure is usually composed of / ring metal substrate and _, polymer grinding ring body combined; and the metal substrate and the grinding ring body φ combined fixed way, please In the case of the "Method for Advancing the Wafer Grinding Ring" of Taiwan Patent Publication No. 470690, it is disclosed that the bonding surface of the grinding ring body is subjected to flame treatment to reattach the metal substrate to the end surface of the grinding ring body. The wiping process is cleaned and then adhered and fixed by epoxy resin, thereby bringing the metal substrate and the grinding ring body into a bonded and fixed state. The use of the wafer grinding ring, the length of its life, in addition to the wear rate of the grinding ring body, the solidity of the combination of the metal substrate and the grinding ring body is also one of them, due to the wafer grinding ring During the grinding process, the workpiece will have a sharp honing effect with the wafer workpiece, and the anti-force will damage the metal substrate of the wafer grinding ring and the grinding ring. Therefore, the bonding state between the metal substrate and the grinding ring body is firm or not, and will be revealed during the grinding process, and once the metal substrate and the grinding ring body are loosened from each other, the same is true. The wafer grinding ring is damaged and scrapped; thus, the structure between the metal substrate of the conventional wafer grinding ring and the grinding ring body is adhered and fixed by epoxy resin, because the metal substrate and the grinding ring body are in contact with each other. Usually set to a flat state, when the bonding faces are pressed against each other, the epoxy resin between them will overflow a large amount of 5 M330554. In addition, it becomes a bad groove, and the better part of the ring body is used as the joint surface to bond with, so how to develop the industry and then in view of the experience with the setting up, it will cause waste and cause Then the strength is difficult to advance. Although the subsequent step is to make the bonding of the epoxy solid, and the strength of the grinding ring is still more developed for the above-mentioned one, the author of the 'principal practicality in the resin or the effect on the gold The existence of a bond that does not know the ideal breakthrough of the crystal is based on the purpose of the book. The other is the base material, which makes the target of the round grinding effect and the multi-year target from the standard. In terms of practice, the grinding problem. The structure of the soil is innovative. The matter is related to the design and the re-processing of the shape into the groove groove. The system is only for the grinding and the problem of the problem of the flat soil and the metal substrate. The manufacturing development and careful evaluation of the related products are required. [New content] The main purpose of this creation is to provide a modified structure of the wafer grinding ring. The problem to be solved is that the design of the combined fixing structure of the substrate of the conventional wafer grinding ring and the grinding ring body is still impossible. An improved breakthrough is achieved by achieving a better stable combined positioning state and a combination of ease of manufacture; the wafer grinding ring includes an annular substrate and a grinding ring body, and the annular substrate is opposite to the grinding ring body The backing surface is fixed by axe bonding, and the annular substrate has spaced positioning holes. The technical feature of the present invention is mainly that the position of the hole in the annular substrate is a through-hole pattern, and one end of the positioning hole is formed as 6 M330554. The end surface of the annular substrate is penetrated to The adhesive material is formed corresponding to each positioning hole portion to form an embedded portion; thereby, the innovative and unique design enables the present invention to achieve the following effects according to the prior art: by positioning the annular substrate originally necessary The design of the hole groove is made of a hole-shaped type of evil. The subsequent connection between the annular substrate and the grinding ring body allows the insertion portion to be formed corresponding to each positioning hole groove, thereby substantially expanding the combined fixed area of the agent material. However, the formation of the desired portion is achieved by the fact that the formation of the desired portion is achieved by changing the positioning hole of the annular substrate to the through-hole shape, and the manufacturing cost is not increased. The overall design of the creation can make the wafer grinding ring achieve the practical benefits of better solid combination positioning and manufacturing simplicity and better industrial economic benefits. [Embodiment] Please refer to Figures 1 to 5 for a preferred embodiment of the modified wafer grinding ring. However, these embodiments are for illustrative purposes only and are not subject to this structure. The limit. The wafer grinding ring A includes an annular substrate 1〇 and a grinding ring 2〇. The annular substrate 1〇 is disposed opposite to the grinding ring body 20 with a bonding surface u, 21 combined by an adhesive material 30. Fixedly, the annular substrate 1 has a locating hole 12 in a row, and the bottom surface 21 of the grinding ring 20 can be provided with a sloping portion 23, and the annular substrate 12 is provided with a hole 12 The through-hole type 'constituting the positioning hole groove 12' is formed so as to penetrate the end surface 11 of the annular substrate 1 so that the adhesive material 30 is formed to be embedded in the portion corresponding to each of the positioning hole grooves 12. The groove should be stabilized in the form of a medium agent. The surface of the body is 7 M330554. [The grinding surface 22 of the grinding body 20 can be a flat grinding surface or a chip arrangement 24 having an annular arrangement. The adhesive inserting portion 23 may be formed by a plurality of annular grooves 23i arranged radially at intervals and spanning the elongated grooves of the annular grooves. n The depth of the location of the locating hole 12 can be pre-positioned by the plug body 40
孔槽12中，復藉由所述塞體4G内端41對接著劑料3q形成擒 阻限制作用而形成其嵌入部31 田 木度控制效果，該塞體4〇 π為螺栓，位孔槽12則設有内螺紋12〇以供其螺合。 猎田上迷之 情形說明如下： 紙故砟，茲就本創作之使用作動 如弟3、4圖所示，當所述環狀基材1〇與研磨環體罚 欲做接合時，先將所述塞體4〇與定位孔槽12相對位 參*螺鎖方式將該塞體4〇與定位孔槽12相組配結合，: 定位後，再於該環狀基材1〇 ”、、、 ..^ ^ 接者面11與研磨環體20之接 者面21塗上接著劑料30，使該 要 十丨山^ 00 考M枓30可均勻佈滿接著 劑肷入部23所形成之環形凹溝23 者 士 傅ui與長形凹槽232内。 縯接上述，於兩接著面U、涂 — ^ ^ 1主上接者劑料30進行接 者黏曰過程中，由於該環狀基材 丄π人 才10與研磨環體20之間係μ 由壓合方式將部份接著劑料3〇掩 ”曰 组执絲帮Α々山 佾入塞體40與定位孔槽12相 :;:;Γ 部31’其中’該塞體40内端”為-平 满面’使得嵌入之接著劑料3。與内 一平整凝聚面。 设啁曲此獲付 8 M330554 續接上述’當該環狀基材10與研磨環體20之間所塗抹 之接著劑料3G全部散入所述研磨環體2〇所形成之各個嵌入 部31後，復藉由螺開方式將研磨環體2〇上各個塞體4〇取出 ，藉此，該晶圓研磨環A便可藉由環狀基材1〇與研磨環體 20之間所叹接著劑嵌入部23與嵌入部31皆均勻佈滿接著劑 料30 ’進而使得晶圓研磨環A的黏合強度得以提昇。 第6圖所不，係本創作另一較佳實施例，係於該環 狀基材10之接著面n設有内凹孔槽32，該内凹孔槽32 一端 係貫通該環狀基材1〇之接著面u。 如第7圖所示，當該環狀基㈣與研磨環體2〇結合後 ，可令部份接著劑料30嵌入該環狀基材1◦所設内凹孔槽32 内，使該環狀基材10與研磨環體2〇間所塗抹接著劑料30可 均句佈滿接著劑嵌入部23、嵌入部31以及内凹孔槽π内， 使得晶0研磨環A可達到更佳的黏合效果。 • 功效說明： - 本創作功效增進之事實如下 π為貫穿孔二，藉由將該環狀基材1。之定位孔 υ貝牙孔“ ’再令所述塞體4〇 定位孔槽12中，復令淨壯 、負方式組扠於 又土材10與研磨環體2〇之卩η Μ I 劑料3"喪入環狀基體2〇之間的接: 嵌入部3卜藉此即可大巾C…孔槽12以形， J大巾田擴增接著劑料人 而令該環狀基材10與研 ”固定面$ 固定狀態，且由於犧入：：之：達到更加穩固之結告 〜入4 31的形成是藉由環狀基材1〇 9 M330554 -原本即必須汉置的定位孔槽12改設成貫穿孔型態所達成， 口此製i成本無項增加，故本創作整體設計可令晶圓研磨 _ % A達到兼具車又佳穩固結合定位性和製造簡易性之實用效 益及較佳產業經濟致益者。 •、上迭實施例所揭示者係藉以具體說明本創作，且文中 雖透過特定的術語進行說明，當不能以此限定本新型創作 之專利範圍；熟悉此項技術領域之人士當可在瞭解本創作 •之精神與原則後對其進行變更與修改而達到等效之目的， 而此等變更與修改，皆應涵蓋於如后所述之申請專利範圍 戶斤界定範缚中。 口 10 M330554 _ 【圖式簡單說明】 第1圖：本創作之組合立體圖。 第2圖··本創作之分解立體圖。 第3圖：本創作之研磨環體與環狀基材結合步驟圖一。 第4圖：本創作之研磨環體與環狀基材結合步驟圖二。 第5圖··本創作之研磨環體與環狀基材完成結合狀態之剖 視圖。 ~第6圖：本創作之研磨環體與環狀基材另一實施例結合步 _ 驟圖一。 第7圖：本創作之研磨環體與環狀基材另一實施例結合步 驟圖二。 【主要元件符號說明】 晶圓研磨環 環狀基材 定位孔槽 内螺紋 研磨環體 接著面 研磨面 接著劑嵌入部 環形凹溝 長形凹槽 排屑槽 接著劑料 A ， 10 12 12 0 2 0 1 1、2 1 2 2 2 3 2 3 1 2 3 2 2 4 3〇 11 M330554In the hole 12, the inner portion 41 of the plug body 4G forms a damper restricting effect on the adhesive material 3q to form a control effect of the embedded portion 31, and the plug body 4 〇 is a bolt, and the hole is grooved. 12 is internally threaded 12 〇 for screwing. The situation of hunting in the field is as follows: Paper, the use of this creation, as shown in Figure 3, 4, when the ring substrate 1〇 and the grinding ring body to engage, first The plug body 4〇 and the positioning hole slot 12 are in a relative position* screw-locking manner, and the plug body 4〇 is combined with the positioning hole slot 12, and after positioning, the ring substrate is further “1”, . . . ^ ^ The contact surface 11 and the contact surface 21 of the grinding ring body 20 are coated with the adhesive material 30, so that the tenth mountain ^ 00 test M 枓 30 can evenly fill the ring formed by the adhesive intrusion portion 23 The groove 23 is in the squirrel ui and the elongated groove 232. In the above, in the process of bonding the bonding agent on the two bonding surfaces U, _ ^ 1 main contact agent 30, due to the cyclic base丄 丄 π talent 10 and the grinding ring body 20 between the μ by pressing the part of the adhesive material 3 曰 曰 曰 执 执 执 执 执 执 Α々 Α々 Α々 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与Γ part 31' where 'the inner end of the plug body 40' is - flat full face' so that the adhesive material 3 is embedded. The inner cohesive surface is flattened. The distortion is set. 8 M330554 is continued. Substrate 10 and After the adhesive material 3G applied between the grinding ring bodies 20 is completely scattered into the respective embedded portions 31 formed by the grinding ring body 2, the grinding ring body 2 is smashed into the respective plug bodies. The wafer grinding ring A can be evenly covered with the adhesive 30' by the adhesive inserting portion 23 and the embedded portion 31 between the annular substrate 1 and the polishing ring 20. The bonding strength of the wafer grinding ring A is improved. In the sixth embodiment, another preferred embodiment of the present invention is provided with a concave groove 32 on the bottom surface n of the annular substrate 10, the concave surface One end of the hole 32 passes through the back surface u of the annular substrate 1 . As shown in Fig. 7, when the annular base (4) is combined with the grinding ring 2, a part of the adhesive 30 can be embedded therein. The adhesive material 30 is applied between the annular base material 10 and the polishing ring body 2 in the inner concave groove 32 of the annular base material, and the adhesive inserting portion 23 and the inserting portion 31 are uniformly covered. Inside the concave hole groove π, the crystal 0 grinding ring A can achieve better bonding effect. • Efficacy description: - The fact that the creative effect is improved is as follows: π is the through hole 2 By positioning the annular base material 1 in the boring hole of the annular substrate 1 'replace the plug body 4 〇 in the hole 12, repeating the net strong, the negative mode group is forked and the soil material 10 and grinding环 Μ Μ 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧 丧The agent is used to make the annular substrate 10 and the fixed surface of the fixed surface $ fixed, and due to the sacrifice:: to achieve a more stable statement ~ into the formation of 4 31 by the annular substrate 1〇9 M330554 - Originally, the positioning hole 12 of the Han must be changed to the through-hole type. The cost of the system is not increased, so the overall design of the creation can make the wafer grinding _ % A both good and good. Consolidate the practical benefits of combining positioning and manufacturing simplicity with the benefits of better industrial economy. • The person disclosed in the above embodiment is specifically used to explain the creation, and although the text is explained by specific terms, the scope of the patent of the new creation cannot be limited by this; those who are familiar with the technical field can understand this The spirit and principles of the creation shall be changed and modified to achieve the equivalent purpose, and such changes and modifications shall be included in the definition of the patent application scope as described later. Mouth 10 M330554 _ [Simple description of the drawing] Figure 1: A perspective view of the combination of the creation. Figure 2 · An exploded perspective view of the creation. Figure 3: The first step of the combination of the grinding ring body and the annular substrate of the present invention. Figure 4: The second step of the combination of the grinding ring body and the ring substrate of the present invention. Fig. 5 is a cross-sectional view showing the state in which the grinding ring body and the annular substrate of the present invention are combined. ~ Figure 6: Another embodiment of the grinding ring body of the present invention and the annular substrate is combined with step _ Figure 1. Figure 7: Another embodiment of the abrasive ring body and the annular substrate of the present invention is combined with the second step. [Main component symbol description] Wafer grinding ring annular substrate positioning hole groove internal thread grinding ring body surface grinding surface adhesive inserting portion annular groove long groove groove receiving groove material A, 10 12 12 0 2 0 1 1, 2 1 2 2 2 3 2 3 1 2 3 2 2 4 3〇11 M330554