TWM327525U - Testing tool of memory module - Google Patents

Testing tool of memory module Download PDF

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Publication number
TWM327525U
TWM327525U TW96210668U TW96210668U TWM327525U TW M327525 U TWM327525 U TW M327525U TW 96210668 U TW96210668 U TW 96210668U TW 96210668 U TW96210668 U TW 96210668U TW M327525 U TWM327525 U TW M327525U
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TW
Taiwan
Prior art keywords
memory module
rod
module test
column
cover body
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Application number
TW96210668U
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Chinese (zh)
Inventor
Chin-Chuan Lu
Original Assignee
I Lai Test Probes And Test Fixtures Co Ltd
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Application filed by I Lai Test Probes And Test Fixtures Co Ltd filed Critical I Lai Test Probes And Test Fixtures Co Ltd
Priority to TW96210668U priority Critical patent/TWM327525U/en
Publication of TWM327525U publication Critical patent/TWM327525U/en

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Description

-M327525 -八、新型說明: 【新型所屬之技術領域】 本創作係關於一種測試治具,特別指一種應用於記憶 — 盤模組重性測量之測試治具。 【先前技術】-M327525 -VIII. New description: [New technical field] This creation is about a test fixture, especially a test fixture used for memory-disk module weight measurement. [Prior Art]

Ik著電腦資訊科技迅速蓬勃發展,於電腦相關領域的 設計與元件亦不斷曰新月異,然而,在日新月異的電子產 品中,均會使用不同類型之記憶體晶片模組,也因此對記 ♦憶體晶片之品質要求亦日益嚴謹,且除了靜態測試外,動 悲測试亦是品質檢驗的重要一環。 動態測試即是於生產線上將電腦主機板之周邊元件裝 設連結後,再將記憶體晶片模組插設於主機板上,以測試 記憶體晶片模組與主機板上各元件之操作是否正常,而由 於動態測試係採用實插式測試,且會造成記憶體晶片快速 磨耗與損傷,使得測試成本相當高,再者,此種實插式之 參-動態賴不但測試速度過慢,並需耗費相當多的時間,實 '有必要進一步改善這些缺失,以提供有效率且低成本的測 試裝置。 【新型内容】 有,於上述課題,本創作之目的為提供一般記憶體模 、且土 :曰曰片之裝载保護並兼具提供外部電子設備檢測晶片 之狀態的裝置。 緣^為達上述目的,本創作記憶體模組測試治具, 匕舌本體、一蓋體、至少一導接件與屬制件及設置於 •M327525 _本體内部之一電路板。其中本體具有一前表面及兩侧分別 具有一第一樞接部,該前表面上適當位置設有至少一與本 體内部相通之開孔,及本體之一端則具有一與本體内部相 —^丄歧[少—-羞1 翠激單 元的位置係對應上述之開孔位置,及電路板上具有一由複 數連接端子所組成之傳輸單元,且傳輸單元係與檢測單元 電性連結,其中傳輸單元係位於本體之插槽内;導接件係 設置於本體之開孔内並與檢測單元電性連結;而蓋體上設 籲有複數個壓制件,及蓋體的兩側分別具有一第二樞接部, 且分別樞接於本體兩側之第一樞接部,而可於一蓋合於本 體前表面之第一位置及一自第一位置向後掀轉而與本體前 表面呈一夾角之第二位置間活動。 【實施方式】 本創作之技術内容與功效,將於以下配合圖式之較佳 實施例詳細說明中詳述。 • ^ 凊參閱第一圖至第六圖所示,為本創作記憶體模組測 4冶具較佳實施例,主要包括一本體1 1、一蓋體1 2、一電 路板13、一基板14、四個導接件][5、二樞接件16、一扣 持件17及四個壓制件18。 一如第一圖所示,本體11主要具有一概呈長條狀之上殼 體1丨1及下殼體112,且藉由複數個鎖固元件113(如螺絲) =組合上殼體111與下殼體112 ;其中上殼體lu具有一 i表面114’且如表面114上之適當位置設有與下殼體I。 結合後之内部相通的四個開孔115 ;而下殼體112的兩側 ‘M327525 -則分別具有一隆起且與下殼體112表面呈垂直之第一樞接 部116,且每一第一樞接部116上設有一穿孔U7 ;此外, 在上殼體111與下殼體112結合後之本體u 一端形成有一 與本體U内部相通的插槽118 ,及另一端設有兩個接合槽 119 〇 其中電路板13及基板14係設置於本體11内部,該電 路板13上設置有四個檢測單元131,且每一檢測單元131 •的位置係分別對應上述之四個開孔115位置;此外,電路 _板13 —端具有一由複數連接端子(俗稱“金手指”)所組成 之傳輸單元132,且傳輸單元132係與每一檢測單元131 電性連結;以及當電路板13組設於本體u内時,其傳輸 單元132則位於本體U之插槽118内,尤如第五圖所示。 基板14係設置於電路板13上,且基板14上具有複數呈條 狀之破孔141,而破孔141的位置係對應其下方之電路板 13上母一檢測單元131及其上方之上殼體111的每一開孔 115的位置。 • 該導接件15於本實施例中可以為導電膠,而本實施例 的四個導接件15係分別設置於基板14上之適當位置,並 分別藉由破孔141而與電路板13上相對應之檢測單元131 電性連接,以及四個導接件15係分別位於本體丨丨之四個 開孔115内。 如苐一圖、苐二圖所示,盍體12於兩側的末端分別具 有一第二樞接部121,且第二樞接部121具有一容置槽 122其中兩側之第二樞接部121係分別藉由一樞接件16 M327525 而可枢接於本體11兩側之第一樞接部116,並可於一蓋合 於本體11前表面114之第—位置及—自該第-位置向後: 轉而,本體11前表面114呈-夾角之第二位置間活動;此 丄i通及荖 體12的前端設有第一凸塊124及第二凸塊125,且第一凸 塊124及第二凸塊125上分別設有相對應之穿孔126。 如第二圖所示’上述之柩接件16主要具有一彈性元件 —161及一栓體162,其中彈性元件161的兩端分別呈有一第 ^ 一延伸段1611及-第二延伸段1612,且第一延伸Μ, 與第-延伸段1612間概呈—9〇。夾角;彈性元件ΐ6ι係設 =體12之容置槽122内,且其第一延伸段“η組設 :二="16之穿孔m内及第二延伸段邮則組設 及二生1 ㈣,並利用栓體162依序穿過穿孔117 平讀161後而組設於第二樞接部121之容 二性使:柩接部116及第二枢接部⑵得以組合。:外, ::61於本貫施例中係為一彈簧,且因彈簧兩端的 .部:ιΓΓΓ-611及第二延伸段1612分別組設於第-樞接 及第一樞接部121,因此,_由彈# 二力== u ;位置移動所需的動力’所以當蓋體12欲蓋合於本體 114:表面114之第-位置時’則需提供-適當且大 :端彳 並藉由扣持件17使蓋體12前端及本體11 如第三、四圖所示’上述之扣持件17具有—拖接於蓋 -M327525 體12前端的卡掣部171及一用以樞接卡掣部171及蓋體 12之栓體172;其中卡掣部171設置於蓋體12之第一凸塊 124及苐一凸塊125間,且卡摯部171相對應第一凸塊124 125 之^穿孔 126 通孔 173,藉^虫 172穿設穿孔126及通孔173使卡摯部171可結合於蓋體 12前端,且卡掣部171可相對於蓋體12呈一小角度轉動; 再者,第一凸塊124及第二凸塊125間之蓋體12前端上設 有兩個凹孔127,而配合扣持件17包括的兩個彈性元件Ik is rapidly evolving with computer information technology, and the design and components in computer-related fields are constantly changing. However, in the ever-changing electronic products, different types of memory chip modules are used, so The quality requirements of the memory chip are also increasingly rigorous, and in addition to static testing, the sorrow test is also an important part of quality inspection. The dynamic test is to install the peripheral components of the computer motherboard on the production line, and then insert the memory chip module on the motherboard to test whether the operation of the memory chip module and the components on the motherboard is normal. Because the dynamic test system uses the plug-in test, and will cause the memory chip to wear and damage quickly, the test cost is quite high. Moreover, the plug-in-dynamics of the plug-in type is not only slow, but also needs to be tested. It takes a considerable amount of time, and it is necessary to further improve these shortcomings to provide efficient and low-cost test equipment. [New Content] Yes, in the above-mentioned subject, the purpose of this creation is to provide a general memory model and a device for loading and protecting the wafer, and to provide a device for detecting the state of the wafer by an external electronic device. For the above purposes, the present invention is a memory module test fixture, a tongue body, a cover body, at least one guide member and a component, and a circuit board disposed inside the M327525 body. The main body has a front surface and two sides respectively having a first pivoting portion, the front surface is provided with at least one opening communicating with the inner portion of the body, and one end of the body has a phase opposite to the inner body of the body. The position of the [small--shame 1 翠 单元 unit corresponds to the above-mentioned opening position, and the circuit board has a transmission unit composed of a plurality of connection terminals, and the transmission unit is electrically connected to the detection unit, wherein the transmission unit The cover member is disposed in the slot of the body; the guide member is disposed in the opening of the body and electrically connected to the detecting unit; and the cover body is provided with a plurality of pressing members, and the two sides of the cover body respectively have a second The pivoting portions are respectively pivotally connected to the first pivoting portions on both sides of the body, and are at a first position that covers the front surface of the body and a rearward rotation from the first position to form an angle with the front surface of the body The second position is active. [Embodiment] The technical contents and effects of the present invention will be described in detail in the following detailed description of the preferred embodiments of the drawings. ^ 凊 第一 第一 第一 第一 第一 第一 第一 , 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳Four guiding members] [5, two pivoting members 16, a holding member 17, and four pressing members 18. As shown in the first figure, the body 11 mainly has a substantially upper upper casing 1丨1 and a lower casing 112, and is combined with the upper casing 111 by a plurality of locking elements 113 (such as screws). Lower housing 112; wherein upper housing lu has an i-surface 114' and is disposed with lower housing I as appropriate on surface 114. The four inner openings 115 are connected to each other; and the two sides 'M327525' of the lower casing 112 respectively have a first pivoting portion 116 which is raised and perpendicular to the surface of the lower casing 112, and each first The pivoting portion 116 is provided with a through hole U7. Further, at one end of the body u joined to the upper casing 111 and the lower casing 112, a slot 118 communicating with the inside of the body U is formed, and the other end is provided with two engaging slots 119. The circuit board 13 and the substrate 14 are disposed inside the body 11. The circuit board 13 is provided with four detecting units 131, and the positions of each detecting unit 131 are respectively corresponding to the positions of the four openings 115; The circuit board 13 has a transmission unit 132 composed of a plurality of connection terminals (commonly referred to as "golden fingers"), and the transmission unit 132 is electrically connected to each detection unit 131; and when the circuit board 13 is assembled When the body u is inside, its transmission unit 132 is located in the slot 118 of the body U, as shown in the fifth figure. The substrate 14 is disposed on the circuit board 13, and the substrate 14 has a plurality of broken holes 141 in the strip shape, and the position of the broken holes 141 corresponds to the mother-side detecting unit 131 and the upper upper shell of the circuit board 13 below it. The position of each opening 115 of the body 111. The conductive member 15 can be a conductive adhesive in the embodiment, and the four conductive members 15 of the embodiment are respectively disposed at appropriate positions on the substrate 14 and respectively connected to the circuit board 13 by the broken holes 141. The corresponding detecting unit 131 is electrically connected, and the four guiding members 15 are respectively located in the four openings 115 of the body 丨丨. As shown in FIG. 1 and FIG. 2, the body 12 has a second pivoting portion 121 at the ends of the two sides, and the second pivoting portion 121 has a second pivoting portion of the receiving slot 122. The portion 121 is pivotally connected to the first pivoting portion 116 on both sides of the body 11 by a pivoting member 16 M327525, and can be attached to the first position of the front surface 114 of the body 11 and from the first - the position is backward: In turn, the front surface 114 of the body 11 is movable between the second positions of the angles; the front end of the body 12 and the body 12 are provided with a first protrusion 124 and a second protrusion 125, and the first protrusion Corresponding perforations 126 are respectively disposed on the block 124 and the second bumps 125. As shown in the second figure, the above-mentioned splicing member 16 mainly has a resilient member 161 and a plug 162. The two ends of the elastic member 161 respectively have a first extending portion 1611 and a second extending portion 1612. And the first extension Μ, and the first extension 1612 is -9 〇. An angle; an elastic member ΐ6ι is provided in the receiving groove 122 of the body 12, and the first extension portion of the first portion "n sets: two = &16; the perforation m of the 16 and the second extension of the postal assembly and the second generation 1 (4), and the plugs 162 are sequentially inserted through the through holes 117 to read the 161, and the second pivotal portions 121 are assembled. The splicing portion 116 and the second pivoting portion (2) are combined. ::61 is a spring in the present embodiment, and the two ends of the spring: the ιΓΓΓ-611 and the second extension 1612 are respectively disposed on the first pivoting and the first pivoting portion 121, therefore, _ By the bullet #二力== u ; the power required to move the position 'so when the cover 12 is intended to cover the body 114: the first position of the surface 114' then need to provide - appropriate and large: end 彳 and by buckle The holding member 17 has the front end of the cover body 12 and the body 11 as shown in the third and fourth figures. The above-mentioned holding member 17 has a latching portion 171 which is dragged to the front end of the cover-M327525 body 12 and a pivoting card. The portion 171 and the plug body 172 of the cover body 12; wherein the latching portion 171 is disposed between the first bump 124 and the first bump 125 of the cover body 12, and the latch portion 171 corresponds to the first bump 124 125 Perforation 126 through hole 173, borrow The worm 172 is provided with a through hole 126 and a through hole 173 so that the latching portion 171 can be coupled to the front end of the cover body 12, and the latching portion 171 can be rotated at a small angle with respect to the cover body 12; further, the first bump 124 and Two recessed holes 127 are formed in the front end of the cover 12 between the second bumps 125, and the two elastic components included in the engaging member 17 are included.

174(彈簧),係組設於蓋體12前端之凹孔127内,且當卡 摯部171組設於蓋體12前端,而該彈性元件! 74係抵住該 卡摯部171的後端。此外,卡摯部171 一端相對本體u 之兩個接合槽119則相對應設有兩個卡勾部175,當蓋體 12蓋合於本體11前表面114之第一位置時,其兩個卡勾 部175係分別扣合相對應之接合槽119内而定位,即用以 拘限蓋體12與本體11維持在第一位置。 而該四個壓制件18係組設於蓋體12上,且相對於當 蓋體12蓋合於本體11前表面114之第一位置時之本體η 四個開孔115的位置;而每一壓制件丨8係包括一支撐桿 181、一底盤182、一彈性元件183、一柱體184、一定位 元件185及一環體186。其中支撐桿181具有一桿體Μ。 及桿體1811下方連接有一直徑較桿體1811直徑大之座體 1812,且桿體1811的頂端環設有一溝槽1813;的底般 係結合於座體1812的下方;彈性元件183(如彈箬套讯 於桿體1811上且受其下方之座體1812的侷限而不脫離$ 8 •M327525 撐桿181 ;而柱體184的内部呈中空及外表面設有外螺纹 部,且柱體184的頂端具有一孔徑容許該支樓桿181 的頂端通過之穿孔麗,其中内部呈中空之柱體184係可 通174 (spring) is disposed in the recessed hole 127 at the front end of the cover body 12, and when the latching portion 171 is assembled at the front end of the cover body 12, the elastic member! The 74 series abuts against the rear end of the hook portion 171. In addition, the two engaging grooves 119 of one end of the latching portion 171 opposite to the body u are correspondingly provided with two hook portions 175. When the cover body 12 is covered with the first position of the front surface 114 of the body 11, the two cards are The hook portions 175 are respectively positioned in the corresponding engaging grooves 119, that is, the cover body 12 and the body 11 are maintained in the first position. The four pressing members 18 are assembled on the cover body 12 and are opposite to the positions of the four openings 115 of the body η when the cover body 12 is closed to the first position of the front surface 114 of the body 11; The pressing member 8 includes a support rod 181, a chassis 182, an elastic member 183, a cylinder 184, a positioning member 185, and a ring body 186. The support rod 181 has a rod body. A seat body 1812 having a diameter larger than that of the rod body 1811 is connected to the lower portion of the rod body 1811, and a top end ring of the rod body 1811 is provided with a groove 1813; the bottom portion is coupled to the lower portion of the seat body 1812; the elastic member 183 (such as a bullet) The sleeve is on the rod 1811 and is limited by the seat 1812 below it without leaving the $8•M327525 strut 181; while the inside of the cylinder 184 is hollow and the outer surface is provided with a male threaded portion, and the cylinder 184 The top end has a hole diameter to allow the top end of the branch rod 181 to pass through the perforation, wherein the inner hollow column 184 is openable

環’·而環體186具有一内螺紋部1861,用以螺設於柱體184 之外螺紋部1841而設置於柱體184的頂端。 此外,上述之每一壓制件18係可藉由其外表面之外螺 紋部1841螺設於蓋體12之内螺孔部123而組設於蓋體12 上,並藉由該外螺紋部1841及内螺孔部123之結合,而可 過穿孔1842,而柱體184的底部並與底盤182結合,使支 撐桿181及彈性元件183大部分容設於柱體184内,僅支 撐桿181頂端露出於柱體184外;及定位元件185係嵌設 於桿體1811頂端的溝槽1813内,使支撐桿181之頂端固 設於柱體184上’其中定位元件185於本實施例中為c型 調整該壓制件18位於該内螺孔部123之相對位置。 於其他實施例中壓制件18的數量、導接件15的數量、 本體11之開孔ι15及電路板13之檢測單元131係相互對 應,而並不以本實施例中之使用四個為限。The ring body 186 has an internal thread portion 1861 for screwing on the threaded portion 1841 of the cylinder 184 to be disposed at the top end of the cylinder 184. In addition, each of the pressing members 18 can be assembled on the cover body 12 by the screw portion 1841 of the outer surface of the outer surface of the cover body 12, and the external thread portion 1841 And the inner screw hole portion 123 is combined to pass through the through hole 1842, and the bottom of the column body 184 is combined with the bottom plate 182, so that the support rod 181 and the elastic member 183 are mostly accommodated in the column 184, and only the top end of the rod 181 is supported. Exposed to the outside of the cylinder 184; and the positioning member 185 is embedded in the groove 1813 at the top end of the rod 1811, so that the top end of the support rod 181 is fixed on the cylinder 184. The positioning member 185 is c in this embodiment. The pressing member 18 is adjusted to be in the relative position of the inner screw hole portion 123. In other embodiments, the number of the pressing members 18, the number of the guiding members 15, the opening ι 15 of the body 11, and the detecting unit 131 of the circuit board 13 correspond to each other, and are not limited to the four used in the embodiment. .

請參閱第六圖、第七圖及第八圖所示,本創作揭示一 種記憶體模組測試治具係提供裝載複數個受測之記憶體模 組上的晶片2,其中記憶體模組上的晶片2是採BGA(球形 封裝)的封裝技術,而記憶體模組可為SIMM、DI匪或rimm, 且該模組上之晶片2可為DRAM、EDO DRAM、SDRAM、DDR SDRAM、DDR Π SDRAM、DDRIE SDRAM、SRAM 或 Flash 晶片。 -M327525 -再者,本創作主要是取出記憶體模組上之晶片2,並將晶 片2設置於本體11之前表面⑴上的開孔115心藉由 體⑽端之扣持件17扣合本體Μ接合槽U9,^晶片盍 位於蓋體12之内螺孔部123之相對位置,而可壓持該晶片 2與開孔115内之導接件15(導電膠)緊密接觸並構成電性 .^接4外’當1制件18壓持晶片2時’且因其内部具有 =7〇件183’而可避免在輯晶片2時造成損壞的情形。 琅彳配· s /σ具1之末端的插槽J} 8可組設於一電子 上’即可藉由該電子設備針對治具1内的晶片2進行測$, ^進行賴的方法並非為本創作之特徵,故在此不予詳 離 均 以上所述僅為舉例性,而非為限制性者。任何未脫 本創作之精神與範臂,而對其進行之等效修改或變更, 應包含於後附之申請專利範圍中。 【圖式簡單說明】Referring to FIG. 6 , FIG. 7 and FIG. 8 , the present invention discloses a memory module test fixture for loading a plurality of wafers 2 on a memory module to be tested, wherein the memory module is mounted on the memory module. The chip 2 is packaged by BGA (spherical package), and the memory module can be SIMM, DI匪 or rimm, and the chip 2 on the module can be DRAM, EDO DRAM, SDRAM, DDR SDRAM, DDR Π SDRAM, DDRIE SDRAM, SRAM or Flash chip. -M327525 - Furthermore, the present invention mainly takes out the wafer 2 on the memory module, and places the wafer 2 on the front surface (1) of the body 11 to fasten the body by the holding member 17 of the body (10) end. The Μ 槽 U U U U U U U U U 盍 盍 盍 盍 盍 盍 盍 盍 盍 盍 盍 盍 盍 盍 盍 U U U U U U U U U U U U U U U U U U U U U U U U U The case where the wafer 2 is pressed while the workpiece 1 is pressed and the inside of the wafer 2 is 183' can avoid the damage caused when the wafer 2 is spliced. The slot J} 8 at the end of the s / sigma 1 can be assembled on an electronic device, so that the method of measuring the wafer 2 in the jig 1 can be performed by the electronic device. This is a feature of the present invention, and is not intended to be exhaustive or to be construed as limiting. Any changes or modifications to the spirit and scope of this creation shall be included in the scope of the appended patent application. [Simple description of the map]

第一圖係本創作本體較佳實施例之立體分解圖; ,一圖係本創作治具較佳實施例之立體分解圖; 第二圖係本創作蓋體較佳實施例之立體分解圖; 第四圖係本創作治具較佳實施例之立體組合圖; 第五圖係本創作治具較佳實施例之另一立體組合圖; 第六圖係記憶體模組的晶片設置於本創作治具之示音 圖 第七圖係蓋體與本體前表面呈—夾角《剖面示意The first drawing is an exploded perspective view of a preferred embodiment of the present invention; a drawing is an exploded perspective view of a preferred embodiment of the present invention; the second drawing is an exploded perspective view of a preferred embodiment of the present creative cover; The fourth figure is a three-dimensional combination diagram of a preferred embodiment of the present invention; the fifth figure is another three-dimensional combination diagram of the preferred embodiment of the creation fixture; the sixth figure is a wafer of the memory module set in the creation The seventh diagram of the sound diagram of the fixture is the angle between the cover and the front surface of the body.

補27525 , 第八圖係蓋體蓋合於本體前表面之剖面示意圖。 【主要元件符號說明】 1 · · •治具 11 · •本體 111 · •上殼體 112 · •下殼體 113 · •鎖固元件 114 · •前表面 115 · •開孔 116 · •第一樞接部 117 · •穿孔 118 · •插槽 119 · •接合槽 12 · •蓋體 121 · •第二枢接部 122 · •容置槽 123 · •内螺孔部 124 · •第一凸塊 125 · •第二凸塊 126 · •穿孔 127 · •凹孑L 13 · •電路板 131 · •檢測單元 132 · •傳輸單元 14 · •基板 141 · •破孔 15 · •導接件 16 · •枢接件 161 · •彈性元件 1611 · •第一延伸段 1612 · •第二延伸段 162 · •栓體 17 · •扣持件 171 · •卡掣部 172 · •栓體 173 · •通孔 174 · •彈性元件 175 · •卡勾部 18 · •壓制件 181 · •支撐桿 1811 · •捍體 1812 · •座體 1813 · •溝槽 182 · •底盤 183 · •彈性元件 184 · •柱體 1841 · •外螺紋部 1842 · •穿孔 185 · •定位元件 186 · •環體 1861 · •内螺紋部 2 · · •晶片Supplement 27525, the eighth figure is a schematic cross-sectional view of the cover body covering the front surface of the body. [Main component symbol description] 1 · · • Fixture 11 · • Body 111 · • Upper housing 112 • • Lower housing 113 • Locking element 114 • • Front surface 115 • • Opening 116 • • First pivot Joint 117 · • Perforation 118 • • Slot 119 • • Engagement groove 12 • • Cover 121 • • Second pivot portion 122 • • accommodating groove 123 • • Inner screw hole 124 • • First bump 125 • • Second bump 126 • • Perforation 127 • • Recess L 13 • • Circuit board 131 • • Detection unit 132 • • Transfer unit 14 • • Substrate 141 • • Broken hole 15 • • Guide member 16 • • Pivot Connector 161 · • Elastic element 1611 • • First extension 1612 • • Second extension 162 • • Plug 17 • • Holder 171 • • Cartridge 172 • • Plug 173 • • Through hole 174 • Elastic element 175 • • Hook part 18 • • Press part 181 • • Support rod 1811 • • Carcass 1812 • • Seat 1813 • • Groove 182 • • Chassis 183 • • Elastic element 184 • • Column 1841 • • External threaded portion 1842 • • Perforated 185 • • Positioning element 186 · • Ring 1861 · • Internal thread 2 · · • Wafer

Claims (1)

-M327525 九、申請專利範園: 1、一種記憶體模組測試治具,係包括 -本體’具有一前表面及兩侧分別具有一第一樞 # ^ ^ ^ ® j, ^ ^ ^ ^ ^ # M ^ 41 it 之開孔’及該本體之—端則具有—與該本體内部相通之 —路板,設置於該本體㈣,該電路板上設置有 > 一檢測單元,且該檢測單元的位置係對應上述之 及該電路板上具有—由複數連接端子所組成之 由:二傳輸皁元係與該檢測單元電性連結,其 μ傳輸單元係位於該本體之插槽内; 單元接件,設置於該檢測單元上,且與該檢測 早70電性連結;以及 ·- 接於其兩侧分別具有—第二樞接部,且分別樞 t该本體兩侧之第—樞接部,而可於—蓋合於 月丨J表面之第—你g η 上 假 σ —自該第一位置向後掀轉而與該 本體别表面呈一夾角之第二位置間活動。 利乾圍第i項所述之記憶體模組測試治具,更 ί上“二㈣置於該本體内之電路板上,其中該基 上之檢測單元的位=。且忒破孔的位置係對應該電路板 中:::利乾圍第1項所述之記憶體模組測試治且,盆 中该導接件為一導電膠。 具 、如申請專利範圍第彳 固弟1員所述之記憶體模組測試治具,更 12 M327525 包括至少-壓制件,係組設於該蓋體上且相對 蓋合於該本體前表面之第、豆 置„ τ < β本體開孔的位 丄如色請專㈣難4顧m憶體模組測試户呈,1 中該壓制件的外表面設有—外螺紋部’及該蓋體上、対 -貫穿該蓋體之内部,且該壓制件可藉由其外螺紋 邛螺汉於该内螺孔部而組設於該蓋體上。 ” 、如申請專利範圍第4項所述之記憶體模組測試治呈,直 中,該壓制件包括: 〃 〃 ^ 一支撐桿,具有一桿體及該桿體下方連接有一直徑 較桿體直徑大之座體,而該桿體的頂端環設有一溝槽1 一底盤,係結合於該座體下方; 曰 一彈性元件,係套設於該桿體上且受其下方之座體 的侷限而不脫離該桿體; ▲ -柱體’其内部呈中空及外表面設有外螺紋部,且 ·- $柱體的㈣具有—孔徑容許該支##的頂端通過之 穿孔,其中該柱體内係容置該支撐桿及彈性元件,且該 支撐桿頂端係通過該穿孔,而該柱體的底部並與該底盤 結合,使該支撐桿及彈性元件大部分容設於該柱體内, 僅該支#桿頂端露出於該柱體外;以及 一定位元件,係嵌設於該溝槽内,使該支撐桿之頂 端固設於該柱體上。 、如申請專利範圍第6項所述之記憶體模組測試治具,其 中該壓制件更包括一環體,具有一内螺紋部,用以螺設 13 •M327525 於°亥柱體之外螺紋部而設置於該柱體的頂端。 8、^申料利範圍第1項所述之記憶體模組測試治具,更 包括一扣持件,該扣持件具有-樞接於該蓋體前端的卡 掣邠可相對於該蓋體呈一小角度轉動。 9如申明專利乾圍第8項所述之記憶體模組,旦 .r;f:rr第—凸塊及第二凸塊,且該二凸塊 置於該第3:::1:二之穿孔,而該卡掣部係設 -凸塊及Μ I,且斜摯部相對應該第 凸塊及第二凸塊之穿孔則設有 端序穿設該穿孔及該通孔使該卡摯部可結=: 10且如广項所述之記憶體模組測試治 …中该本體則端係開設—於 端位置下供該扣持件容置之接合槽,且亥本體前 對該接合槽則設有-卡勾部,當該蓋體;端相 =之第一位置時’該卡勾部係扣合該接:二前 用以拘限該蓋體與本體維持在該第―位^疋位,-M327525 IX. Application for Patent Park: 1. A memory module test fixture consisting of a body having a front surface and two sides respectively having a first pivot # ^ ^ ^ ® j, ^ ^ ^ ^ ^ The opening of the #M ^ 41 it and the end of the body have a road board communicating with the inside of the body, disposed on the body (4), the circuit board is provided with a detection unit, and the detecting unit The position corresponding to the above-mentioned circuit board has a plurality of connection terminals: the second transfer soap element is electrically connected to the detecting unit, and the μ transmission unit is located in the slot of the body; And disposed on the detecting unit, and electrically connected to the detecting 70; and-- respectively connected to the two sides of the second pivoting portion, and respectively pivoting the first pivotal portion on both sides of the body And - can be attached to the surface of the moon 丨 J - you g η on the false σ - from the first position to the back to the second position between the object and the surface of the object. The memory module test fixture described in item i of Liganwei is further placed on the circuit board of the body, wherein the position of the detection unit on the base is = and the position of the hole is broken. Corresponding to the memory module test in the circuit board:::Leiweiwei, item 1, and the conductive member in the basin is a conductive adhesive. The memory module test fixture, further 12 M327525 includes at least a pressing member, which is disposed on the cover body and is oppositely attached to the front surface of the body, and the bean is placed on the body „ τ < β body opening In the case of color, please refer to (4) Difficulty, and the outer surface of the pressed piece is provided with an external threaded portion and the cover body, the 対-through the inside of the cover body, and The pressing member can be assembled on the cover body by the external thread of the inner screw hole portion. In the case of the memory module test method described in claim 4, the press member comprises: 〃 〃 ^ a support rod having a rod body and a rod having a diameter smaller than the rod body a seat body having a large diameter, and a top end ring of the rod body is provided with a groove 1 and a bottom plate, and is coupled to the bottom of the seat body; a resilient member is sleeved on the rod body and is supported by the seat body below Limiting without deviating from the rod; ▲ - The cylinder ' has a hollow outer and outer surface with a male threaded portion, and - (C) (4) has a hole diameter to allow the top end of the branch to pass through, wherein The support rod and the elastic member are received in the column body, and the top end of the support rod passes through the through hole, and the bottom of the column body is combined with the chassis, so that the support rod and the elastic member are mostly accommodated in the column body. The top of the rod is exposed outside the column; and a positioning member is embedded in the groove to fix the top end of the support rod to the column. The memory module test fixture, wherein the pressed component is more The utility model comprises a ring body having an internal thread portion for screwing 13 • M327525 on the threaded portion outside the column and being disposed at the top end of the column body. 8. The memory according to the first item The module test fixture further includes a fastening member having a latch pivotally connected to the front end of the cover body for rotating at a small angle with respect to the cover body. The memory module of the item, the r.r;f:rr first bump and the second bump, and the two bumps are placed in the third:::1: two perforations, and the card portion The protrusions and the ridges I are provided, and the perforations of the slanting portions corresponding to the first and second slabs are provided with end portions through which the through holes are formed and the through holes are made to make the 挚 可 = = 10 and In the memory module test method described in the broad item, the body is provided with an end joint at the end position for engaging the retaining member, and the hook body is provided with a hook portion in front of the body of the sea. When the cover body; the end phase = the first position, the hook portion is fastened to the connection: the second front is used to restrain the cover body and the body from being maintained at the first position,
TW96210668U 2007-06-29 2007-06-29 Testing tool of memory module TWM327525U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI808976B (en) * 2018-04-18 2023-07-21 台灣福雷電子股份有限公司 Test apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI808976B (en) * 2018-04-18 2023-07-21 台灣福雷電子股份有限公司 Test apparatus

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