•M324160 八、新型說明： 【新型所屬之技術領域】 、本創作係有關一種照明裳置，尤指-種以發光二極體 為發光元件之照明裝置組合結構。 【先前技術】 由於發光二極體具有體積輕巧、反應速度快及益 等優勢，漸漸被應用在照明應用上，雖然發光二極體在發 展初期上，曾面臨其發光亮度不足的窘境，但在近來轉 及新型技術的引領之下，發光二極體的發光效率已經有長 足的進步’甚至可以嫂美傳統的照明元件亮度，逐漸 取代目前照明設備的趨勢。 就目前而言，以發光二極體為發光源的燈具，其設計 上多數係以單顆之高功率發光二極體作為發光主體，並 裝於欲照明之區域，雖然單顆的高功率發光二極體足 供照明亮度所需，但以發光二極體為發光源的照明燈具為 了能夠適用原來的照明燈具所具有的燈座，因此仍是按昭 傳統的照明燈具的結構設計，以便於結合原有的照明燈座' ，以固定於照明區域的上方。• M324160 VIII. New description: [New technical field] This creation is related to a lighting arrangement, especially a lighting device combination structure in which a light-emitting diode is used as a light-emitting element. [Prior Art] Since the light-emitting diode has the advantages of light weight, fast response speed and benefit, it is gradually applied to lighting applications. Although the light-emitting diode has faced the dilemma of insufficient light-emitting brightness in the early stage of development, Recently, with the introduction of new technologies, the luminous efficiency of light-emitting diodes has made great progress. It can even rival the brightness of traditional lighting components and gradually replace the current trend of lighting equipment. At present, most of the lamps with light-emitting diodes as the light source are designed with a single high-power light-emitting diode as the light-emitting body, and are installed in the area to be illuminated, although a single high-power light The diode is sufficient for illumination brightness, but the illumination lamp with the light-emitting diode as the illumination source is designed to be suitable for the original lamp, so it is still designed according to the structure of the traditional lighting fixture. Combined with the original lighting base' to be fixed above the lighting area.
义然而，由於利用傳統的照明燈具所使用的發光元件與 發光二極體的原理及體積差異甚大，因此利用原有昭明燈 具設計反而浪費燈具空間及製造成本，相對削弱1原本= ^優勢，致使之後習知的發光二極體的設計捨棄原來的 傳統照明型態’將以發光二極體為發光元件的照明裝置設 計成更為薄形化及簡易化，使其製造上更為便利及節省Z 5 • M324160 本0 但就上述的以發光二極體為發光元件的照明燈具板裝 結構中’為了配合提供發光二極體所需的散熱元件，因此 必須經由黏膠或焊接製程進行組震，除了削弱該燈具在組 裝製程上的效率外，所使用的黏材亦有造成環境污染的隱 憂此燈具組裝結構的缺點成為熟知此技藝人士欲解決 之問題。 【新型内容】 針對上述之缺失，本創作之主要目的在於提供一種且 構：LED燈具組合結構，藉由以模組化組裝 LE=具，除了提昇該燈具組裝效率外，更經由模組化組 土。構:避免使用具有環境污染隱憂之焊材，使其燈具結 構更具環保性及節省成本。 组人之目的’本創作係主要提供-種⑽燈具 触口、、、口構’係主要包括一散熱板，該散熱板 體之複數穿槽，於該散熱板上貼附一基板，該基板上言 = 穿孔，恰對應於該散熱板之穿槽位置，於基板上設有 電一=件’且於基板上設有金屬導線，並與該發先3 妾另於该些穿槽内分別容設絕緣管套，該些管套 板It別穿設金屬螺柱，該些金屬螺柱分別與穿㈣該基 1反=、緣板中之鎖固元件相互旋接，固定該基板於散敎板 亥些鎖固元件與金屬導線電性連接，以作為該發 亢70件之電極。 【實施方式】 M324160 么么將本創作之内谷配合圖式來加以說明·· 如第一圖所示，係為本創作之立體結構分解示意圖。 如圖所示，本創作之燈具結構係主要包括一散熱板i，該 散熱板1係由高導熱材質所構成，於該散熱板丨上設有貫 牙板體之複數穿槽11，且鄰近於該些穿槽u之周緣分別設 有鎖固孔12;於該散熱板丨上設有一基板2，該基板2係 為絕緣體，於該基板2板面中央位置設有一發光元件3， 於本貝施例中该發光元件3係為發光二極體，且於該基板 2之兩端亦分別設有穿孔21，該些穿孔21周緣分別設有金 羼導線22，該些金屬導線22係與該發光元件3形成電性連 接，另該基板2與該散熱板1相對應接合後，該基板2之 穿孔21恰對應於該散熱板丨之穿槽丨丨，並於該基板2之兩 側對角位置上分別具有缺口 23，致使該基板2對應貼合於 孩放熱板1上後，該些缺口 22使散熱板1之該些鎖固孔a 外露。 續參閱第一圖。而於該散熱板丨之複數穿槽u内分別 汉有一中空絕緣管套4，其中於本實施例中該些絕緣管套 4係同時連接於一固定板5上，該絕緣管套4與該固定板 5係可為一體構成，以將該些絕緣管套4同時置入該散熱 板1之複數穿槽11内，且該固定板5之兩侧對角端位置分 別具有缺口 51，使該固定板5貼附於該散熱板1後，經由 该些缺口 51避免阻擋該些鎖固孔12 ;另於該固定板5下方 設有一絕緣板6，該絕緣板6之形狀恰與該固定板5相對 應，於該絕緣板6上設有複數穿孔61，恰對應與該固定板 M324160 5上所連接之絕緣管套4，同時於該絕緣板6之兩側位置 對角位置分別設有缺口62，該些缺口62恰對應於該鎖固孔 12位置；另於該些穿孔61分別穿設一金屬螺柱7，其中該 金屬螺柱7係呈中空狀，且該金屬螺柱7内部設有螺紋， 並咸盈屬螺柱7容設於該絕緣管套4内部；該基板2上之 穿孔21係分別對應穿設一鎖固元件8，該鎖固元件8係為 一金屬螺絲，並與容設於該絕緣管套4之金屬螺柱7相互 旋接’致使將基板2及絕緣板6鎖固於該散熱板}之上下 兩板面上，同時設於基板2上之金屬導線22與該些鎖固元 件8及金屬螺柱7形成電性連接，如第三圖之、组合剖視圖 所不’使該些鎖固元件8及金屬螺柱7實質成為電極，以However, since the principle and volume of the light-emitting elements and the light-emitting diodes used in the conventional lighting fixtures are very different, the original Zhaoming lighting design wastes the space and manufacturing cost of the lighting, and relatively weakens the original one. After that, the design of the conventional light-emitting diodes abandons the original conventional lighting pattern. The lighting device with the light-emitting diode as the light-emitting element is designed to be thinner and more simplified, making it more convenient and economical to manufacture. Z 5 • M324160 本0 However, in the above-mentioned lighting fixture board structure with light-emitting diodes as light-emitting elements, in order to match the heat-dissipating components required to provide the light-emitting diodes, it is necessary to perform group vibration via glue or welding process. In addition to weakening the efficiency of the luminaire in the assembly process, the viscous material used also has the potential to cause environmental pollution. The shortcomings of the luminaire assembly structure become well known to those skilled in the art. [New content] In view of the above-mentioned shortcomings, the main purpose of this creation is to provide a combination structure of LED lamps. By modularly assembling LE=tools, in addition to improving the assembly efficiency of the lamps, it is also through modular groups. earth. Structure: Avoid the use of welding consumables with environmental pollution, making the structure of the lamp more environmentally friendly and cost-effective. The purpose of the group is to provide a substrate (10), and the mouth structure mainly includes a heat dissipation plate. The plurality of heat dissipation plates are grooved, and a substrate is attached to the heat dissipation plate.上言 = perforation, corresponding to the slot position of the heat sink, is provided with a power on the substrate and is provided with a metal wire on the substrate, and is respectively associated with the first 3 and the other The insulating sleeves are disposed, and the sleeves are not threaded with metal studs, and the metal studs are respectively screwed to the base member 1 and the locking members in the edge plate are screwed to each other to fix the substrate. The locking elements of the slab are electrically connected to the metal wires to serve as the electrodes of the hair piece. [Embodiment] M324160 will explain the inner valley of the creation with the schema. · As shown in the first figure, it is a schematic diagram of the three-dimensional structure of the creation. As shown in the figure, the luminaire structure of the present invention mainly comprises a heat dissipating plate i, which is composed of a high thermal conductive material, and a plurality of through slots 11 of the severing plate body are arranged on the heat dissipating plate ,, and adjacent thereto A locking hole 12 is disposed on each of the periphery of the slot u; a substrate 2 is disposed on the heat sink board, and the substrate 2 is an insulator, and a light-emitting component 3 is disposed at a central position of the board surface of the substrate 2, In the example of the embodiment, the light-emitting element 3 is a light-emitting diode, and the two ends of the substrate 2 are respectively provided with a through hole 21, and the periphery of the through-hole 21 is respectively provided with a metal wire 22, and the metal wires 22 are The light-emitting element 3 is electrically connected. After the substrate 2 is bonded to the heat-dissipating plate 1, the through-hole 21 of the substrate 2 corresponds to the through-groove of the heat-dissipating plate, and is on both sides of the substrate 2. The notches 23 are respectively disposed at the diagonal positions, so that the notches 22 expose the locking holes a of the heat dissipation plate 1 after the substrate 2 is correspondingly attached to the child heat release plate 1. Continue to the first picture. In the plurality of slots u of the heat sink, there is a hollow insulating sleeve 4, wherein in the embodiment, the insulating sleeves 4 are simultaneously connected to a fixing plate 5, the insulating sleeve 4 and the The fixing plate 5 can be integrally formed, and the insulating sleeves 4 are simultaneously inserted into the plurality of slots 11 of the heat dissipating plate 1 , and the diagonal end positions of the fixing plates 5 respectively have notches 51, so that the fixing plate 5 After the fixing plate 5 is attached to the heat dissipating plate 1 , the locking holes 12 are prevented from being blocked by the notches 51; and an insulating plate 6 is disposed under the fixing plate 5 , and the insulating plate 6 is shaped like the fixing plate Correspondingly, the insulating plate 6 is provided with a plurality of through holes 61 corresponding to the insulating sleeves 4 connected to the fixing plate M324160 5, and at the same time, the diagonal positions of the insulating plates 6 are respectively provided with gaps. 62, the notches 62 correspond to the position of the locking hole 12; and the metal studs 7 are respectively disposed on the through holes 61, wherein the metal studs 7 are hollow, and the metal studs 7 are internally provided Threaded, and the stabilizing stud 7 is accommodated inside the insulating sleeve 4; the perforation 21 on the substrate 2 A locking component 8 is attached to the locking component 8 , which is a metal screw and is screwed to the metal stud 7 of the insulating sleeve 4 to lock the substrate 2 and the insulating plate 6 . The metal wires 22 disposed on the substrate 2 are electrically connected to the locking elements 8 and the metal studs 7 on the lower surface of the heat dissipating plate, as shown in the third figure. The locking elements 8 and the metal studs 7 are substantially made into electrodes,
自外界將電流導至該基板2上，提供設於該基板2上之發 光元件3所需之電力。 X 請參閱第三圖及第四圖，係分別為應用結構分解圖及 組合完成圖。如圖所示’當前述之基板2固定於該散熱板 1後’於該散熱板1之上端面鎖接一罩體9，以罩設於组 裝於散熱板1上之發光元件3，使該發光元件3所產生之 光線經由該罩體9擴散出去，而該罩體9係利用複數鎖固 元件8a自散熱板1底部穿設該些鎖固孔12與該罩體9相互 旋接，將該罩體9固定於該散熱板1之上端面上，其組合 完成圖如第四圖所示。 惟以上所述之實施方式，是為較佳之實施實例，當不 能以此限定本創作實施範圍’若依本創作申請專利範圍及 說明書内容所作之等效變化或修飾，皆應屬本創作下述之 M324160 專利涵蓋範圍。 【圖式簡單說明】 第一圖、係為本創作之立體結構分解示意圖。 第二圖、係為本創作之組合剖視圖。 第三圖、係為本創作之應用結構分解圖。 第四圖、係為本創作之組合完成圖。 ^【主要元件符號說明】 、散熱板1 穿槽11 ⑩鎖固孔12 基板2 穿孔21 金屬導線22 缺口 23、51、62 發光元件3 絕緣管套4 固定板5 絕緣板6 穿孔61 金屬螺柱7 鎖固元件8、8a -罩體ΘThe current is conducted from the outside to the substrate 2 to supply the electric power required for the light-emitting element 3 provided on the substrate 2. X Please refer to the third and fourth figures, which are the exploded view of the application structure and the combined completion diagram. As shown in the figure, after the substrate 2 is fixed to the heat dissipation plate 1, a cover 9 is locked on the upper surface of the heat dissipation plate 1 to cover the light-emitting element 3 assembled on the heat dissipation plate 1. The light generated by the light-emitting element 3 is diffused through the cover body 9 , and the cover body 9 is screwed to the cover body 9 from the bottom of the heat dissipation plate 1 through the plurality of locking elements 8 a. The cover body 9 is fixed on the upper end surface of the heat dissipation plate 1, and the combined completion diagram is as shown in the fourth figure. However, the above-mentioned embodiments are preferred embodiments, and the scope of the present invention cannot be limited thereto. If the equivalent changes or modifications made in accordance with the scope of the patent application and the contents of the specification are the following The coverage of the M324160 patent. [Simple description of the diagram] The first diagram is a schematic diagram of the three-dimensional structure of the creation. The second figure is a sectional view of the combination of the creations. The third figure is an exploded view of the application structure of the creation. The fourth picture is a combination of the creation of the creation. ^[Main component symbol description], heat sink 1 through slot 11 10 locking hole 12 substrate 2 perforated 21 metal wire 22 notch 23, 51, 62 light-emitting element 3 insulating sleeve 4 fixing plate 5 insulating plate 6 perforated 61 metal stud 7 Locking elements 8, 8a - cover Θ