M315941 八、新型說明： 【新型所屬之技術領域】 本創作屬陶瓷基板技術領域，特別係指一種具奈米化微結構之陶瓷 基板，以供設置功能性電子元件，具有減少工序而降低成本及提高元 件壽命及生產良率之功效。 【先前技術】 按，近年來國内半導體產業及資訊電子產業持續蓬勃成長，已成為 春我國產品出口的主力，如：個人電腦、滑鼠、掃描器、顯示器等，皆 • 在全球市場佔有首要地位。由於電子產品不斷的走向「輕薄短小」，連 π衫響其使用的各類元組件及加工設備的精度及尺寸也日趨要求嚴 苛，因此也促成了另一波製造技術上的革命，朝向超精密化、高密度 化、咼速化、知能化、微小化等方向發展，進而衍生出為廿一世紀產 (Next Generation Manufacturing / Technology)。相對以網版印刷為核心的厚膜製程，薄膜製程是採用與 參1C製作相同的半導體製程，兩者之間最大的差異就在於產生的膜厚。 以、、祠版印刷的製程製作的膜厚動軏5#m到鄉以上，而以勵或是 CVD等半導體相容製程產生的膜厚僅在〇· _之間，二者相 差10倍甚至100倍，這也是為何一般會以厚膜、薄膜來區分網版印刷 技術與半導_鋪_，而這也僅是取其料較的表相來分 別’事實上二者最大的差異還是在於成膜的製程技術。厚膜是利用已 製作好1··1的圖形的網框為母版，藉由刮刀麵油墨透過母版，直接 將圖案印刷在_基板上，再經由魏、燒結魏程而成。而薄膜則 5 M315941 是利用半導體採用已久的物理氣相沈積技術(PVD)，包括雜(Sputter Deposition)、蒸鍍(Evaporation)等製程’與化學氣相沈積技術(cvd) 來生成薄膜，由於這些製程並不像網版印刷具有區域選擇性的鍍膜特 性’所需的圖案通常需要經由事後的光微影姓刻(ph〇t〇Lith〇graphy) 技術來形成。正如1C等主動元件可藉由半導體製程技術製作高元件密 度複雜電路，薄膜型的被動整合元件，一樣是結合生成電阻層、介 電層、金屬層導電層的薄膜製程，與形成電阻、電容、電感圖案的光 身微影侧製程來製作。相較於需要高溫燒結的厚膜製程，薄膜製程多 可控餅_C的製程溫度以下’社可視所採用的基板雜來調整 製程，使得薄膜被動整合元件可因應不同的產品應用，製作在不同的 基板上。可選用的基板可涵蓋石夕晶片、氧化_兗基板、玻璃基板， 甚至CB #基板上，都可製作薄膜被動元件，這種雜也使得薄膜型的 整合被動元件可應用的範圍相當廣泛。M315941 VIII. New description: [New technical field] This creation belongs to the field of ceramic substrate technology, especially refers to a ceramic substrate with nano-structured microstructure for the provision of functional electronic components, which reduces the cost and reduces costs. Improve component life and production yield. [Prior Art] According to recent years, the domestic semiconductor industry and information electronics industry continue to grow vigorously, and have become the main force of spring China's product exports, such as: personal computers, mice, scanners, monitors, etc., all of which are in the global market. status. As electronic products continue to move toward "light, thin and short", even the precision and size of various types of components and processing equipment used by π-shirts are increasingly demanding, which has also contributed to another revolution in manufacturing technology. Precision, high-density, idling, knowledgeable, and miniaturized, and then derived from Next Generation Manufacturing / Technology. Compared with the thick film process with screen printing as the core, the thin film process uses the same semiconductor process as that of the reference 1C. The biggest difference between the two is the film thickness produced. The thickness of the film made by the process of printing on the stencil printing is 5#m to the middle of the town, and the film thickness generated by the semiconductor compatible process such as excitation or CVD is only between 〇· _, the difference between the two is 10 times or even 100 times, this is why it is generally thick film, film to distinguish between screen printing technology and semi-conducting _ shop _, and this is only to take advantage of the comparison of the table to separate 'the fact that the biggest difference between the two lies in Film forming process technology. The thick film is a master using a frame in which a pattern of 1··1 has been produced, and the pattern is printed on the _ substrate by the doctor blade ink through the master, and then formed by Wei and sintering. The film, 5 M315941, utilizes the long-standing physical vapor deposition (PVD) technology of semiconductors, including the process of sputtering (Sputter Deposition), evaporation (Evaporation), and chemical vapor deposition (cvd) to form thin films. These processes do not have the regioselective coating properties of screen printing. The pattern required is usually formed by post-mortem lithography techniques. Just as active components such as 1C can be used to fabricate high-density complex circuits by semiconductor process technology, and passive integrated components of thin film type, which are combined with thin film processes for forming resistive layers, dielectric layers, and metal layer conductive layers, and forming resistors, capacitors, Inductive pattern light body lithography side process to make. Compared with the thick film process that requires high-temperature sintering, the process temperature of the film control process can be adjusted to the following process, so that the passive integrated components of the film can be made differently according to different product applications. On the substrate. The optional substrate can cover the lithographic wafer, the oxidized 兖 substrate, the glass substrate, and even the CB # substrate, and the film passive components can be fabricated. This kind of impurity also makes the film-type integrated passive component applicable to a wide range.
然而基板的表面粗糙度應在Ra<〇.3/zm以下，尤其以製作電容 時’若粗紐過高，細介電層容易被底電極的突丘(則Μ)穿 透，形成娜或是造觸潰電壓過低的現象。_地，若是元件基板 表面粗難過高’在高頻時容易造成雜訊的升高，使高雜性降低， ^•疋基板選擇時需纽意的。以電阻為例：電阻碰積大小分為傳統 電阻器U電阻’由於電子成品大軸向_短小設計，對於内部 零件也自然要求輕小化，因此，廠商已逐漸縮小生產傳統電阻，全力 轉向生產晶片電阻。晶片電阻依製程方法不同，分為厚膜製程及薄膜 製程，台灣廠商目前大都_厚膜製程，關版印刷的技術將氧化物 6 M315941 印在氧化織板上，由於此技術穩定度低且溫·數輪，必彡胃 使用高溫燒結製程’因此成本較薄膜_來得高；薇商為降低= 將會往_製錄展。電阻!!為三大祕元件之〜也為電子電器產 -中重要電子讀’其主要魏為調節電路巾之電壓與電流。 .· 内廠商所生產之餘器大致可分為碳職阻、金屬韻输或 化膜電阻、陶莞電阻、可變電阻等四大類，其中陶究電阻包括 阻、晶片排阻、排列電阻等，而依製程不同又可區分為厚膜型^電 阻與薄麵_電_。厚卿随電_、將特殊導·塗料、介電 值絕緣性塗料、·性塗料印職單—或網路線圖於喊 經由-定溫度燒烤再切割而成；薄膜咖兗電_以真空健技術將 阻值均皱纷絲板上，_麵魄電阻具有精密度高、穩定性 高、電阻率可調範圍廣、溫度係數低等優勢，故為許多廠商積極發展 之方向。錄她_基板主要應用在_電阻上，作為電阻器中導 電性塗料之支撐體，製造_係採精純氧化銘陶莞基板印上高品質金 屬厚膜導體，外層塗上玻璃轴保護體，產生出均勻晶體的品質與穩定 =、’,加上所使用氧化軸技板具有耐高溫及敎之基材雛，故目 j尚”’、可替代。惟’由於喊基板的表面通常都不很平坦，欲於不平 坦的陶絲板上設置魏性電子元件，其結合賴顧度將不足，故 必需佐以其他的製程再封裝—次，如此除造成製程、成本之增加外， 封裝製程更會影響所製成電子元件的品質(如訊號傳導不良），產品整 杳率更疋無法提昇為其缺點，以上即為習用技術現存最大的缺失， 實為業者亟待克服的難題。 7 M315941 【新型内容】 本創作研創人鐾於月漢習用技術之缺失，積其多年實際從事電子科 技精选喊賴設計、製料業知識，經不斷研究、改良後，終有本 創作之研發成功，公諸於世。 緣是，本創作之主要目的即在提供一種「構裝元件陶曼基板」， 其主要包括有奈米化微結構之陶絲板，該陶莞基板具有預定數量的 容孔，容個之随基板上設置有功紐t子元件，前述容孔内填充 鲁有導電膠，導電膠與陶兗基板具有良好的附著性及導電性，可供後續 •電極凸塊或電極卿之用，同時兼具電子元件訊號轉導，預製的容 孔導電膠設計可使元件的後續構裝接腳工序減少而降低成本，該功能 性電子元件上具有-層保護層，除了保護電子元件外，亦保護電子元 件導線電極與容孔導轉的翻區’此將提高元件壽命及生產良率。 【實施方式】 為達成本創作前述目的之技術手段，兹列舉-實施例，並配合圖式 • 審查委貝可^之對本創作之結構、特徵及所達成之功效， - 獲致更佳之瞭解。 請參閱第-圖之本創作實施例剖_，_可知本創作主要包 括有奈米化微結構之陶变基板⑴【玻璃基板也可】，該奈米化微結構 之陶莞基板(1)主要係將陶竟粉【如氧化紹（侃）粉末】經粉碎、化 學助劑研磨至超微粉體顆粒，例如數十奈米的超微粉體顆粒。粉碎盘 研磨為粉體製程上不能缺少的-小步，粉碎常為研磨的先期工作，:戈 稱粗磨，研磨舣稱獲雜徑低於毫米之作業。雜碎言，粉碎機且 較多；對研磨言’則一般多以球磨為手段。對傳統喊粉末而言，粉 8 M315941 碎與研磨作業是獲得此一 言，粉碎與研磨作業可不—胡。但對新一代喊粉末而 凝聚體，或使構成粉末之Z *的目的’包括：打散凝聚體，減少 降低粉體粒徑，消除==成為終端粒子⑽一—必 適當粒度妹妓佈絲 ^在-㈣範肋，符合 β 1微、、、田粕末明顯可增加粉體的比表 看，粉碎二銳Γ的=、Γ溶劑間能均句混合，從物理角度來 /等，使粉料的比表面增加，因=自=^碎、破裂或磨出棱角 機械能轉變為表面能的能量轉化阶增加，所以說粉碎是一種 各項物理性〇 &〜θ 4。粉料的化學雜_到陶究的 成型财也=:°制保證，材料中的含雜質情況，對爾後燒結 辟。粒賴結構主躲定著坏_密度及盆However, the surface roughness of the substrate should be below Ra<3>z/zm, especially when making capacitors. If the thickness is too high, the fine dielectric layer is easily penetrated by the ridges of the bottom electrode to form Na or It is a phenomenon that the breakdown voltage is too low. _ ground, if the surface of the component substrate is too rough and high. At high frequencies, it is easy to cause noise increase, which will reduce the high noise. ^• 疋 The substrate needs to be selected. Take the resistance as an example: the size of the resistance bump is divided into the traditional resistor U resistance 'Because of the large axial length of the electronic product _ short design, the internal parts are also naturally required to be light and small, therefore, manufacturers have gradually reduced the production of traditional resistance, full force to production Wafer resistance. The chip resistors are divided into thick film process and thin film process according to different process methods. Taiwan manufacturers currently have a large-to-thick film process, and the technology of off-printing prints oxide 6 M315941 on the oxidized woven board. Due to the low stability and temperature of this technology. ·Several rounds, the high-temperature sintering process must be used in the stomach. Therefore, the cost is higher than that of the film; the Weishang is lower = it will go to the exhibition. Resistance!! For the three major components ~ also for the electrical and electronic products - the important electronic reading 'the main Wei is to adjust the voltage and current of the circuit towel. The residuals produced by the internal manufacturers can be roughly divided into four categories: carbon job resistance, metal rhyme transmission or chemical film resistance, ceramics resistance, and variable resistance. Among them, ceramic resistance includes resistance, wafer resistance, array resistance, etc. According to different process, it can be divided into thick film type ^ resistance and thin surface _ electricity _. Houqing with electricity _, special conductive coatings, dielectric value insulation coatings, · sexual paint printing job list - or network road map shouted through the - temperature barbecue and then cut; film coffee 兖 _ _ vacuum The technology has the advantages of high precision, high stability, wide adjustable resistivity and low temperature coefficient, so it is the direction of development of many manufacturers. Recording her _ substrate is mainly used in _resistance, as a support for conductive coatings in resistors, manufacturing _ series of pure oxidized Ming Tao Wan substrate printed with high-quality metal thick film conductor, the outer layer coated with glass shaft protector, Produce the quality and stability of the uniform crystal =, ', plus the use of the oxidation axis technology board with high temperature and enthalpy of the substrate, so the eye is still "', can be replaced. Only 'because the surface of the substrate is usually not Very flat, if you want to set up Wei-like electronic components on the uneven ceramic board, the combination will not be enough, so it must be re-packaged with other processes, so that in addition to the process and cost increase, the packaging process It will affect the quality of the electronic components produced (such as poor signal transmission), and the product rectification rate will not be able to improve its shortcomings. The above is the biggest missing of the existing technology, which is a difficult problem for the industry. 7 M315941 [ The new content] The founder of this creation is the lack of the use of technology in Yuehan, and has accumulated many years of experience in the selection of electronic technology, shouting design, material industry knowledge, after continuous research and improvement, there is a The research and development success is made public. The reason is that the main purpose of this creation is to provide a "construction component Tauman substrate", which mainly comprises a nano-structured micro-structured ceramic board, the ceramic board has A predetermined number of apertures are provided on the substrate with a functional t-sub-element, and the hole is filled with a conductive adhesive, and the conductive adhesive and the ceramic substrate have good adhesion and conductivity, and are available for subsequent electrode assembly. For block or electrode use, and also for electronic component signal transduction, the prefabricated hole-porous conductive adhesive design can reduce the cost of the subsequent component pin process of the component, and the functional electronic component has a layer of protective layer. In addition to protecting the electronic components, it also protects the lead wires of the electronic component and the turn-over of the vias. This will improve component life and production yield. [Embodiment] In order to achieve the above-mentioned technical means for the purpose of the present invention, it is to be understood that the structure, the features, and the effects achieved by the committee are reviewed. Please refer to the drawing of the first embodiment of the present invention, which can be seen that the present invention mainly includes a ceramic substrate having a nanostructured microstructure (1) [a glass substrate], and the nanostructured ceramic substrate (1) Mainly, the ceramic powder [such as oxidized Shao (侃) powder] is pulverized and chemically granulated to ultrafine powder particles, such as ultrafine powder particles of several tens of nanometers. Grinding disc Grinding is indispensable for the powder system - small step, crushing is often the preliminary work of grinding,: Ge said coarse grinding, grinding nickname to obtain a work with a diameter less than a millimeter. Miscellaneous, the pulverizer is more; for the grinding statement, it is generally done by ball milling. For the traditional shouting powder, the powder 8 M315941 crushing and grinding operation is the result of this, the crushing and grinding operations can not be - Hu. However, for the new generation of shouting powder, the purpose of condensing the body, or making the Z* of the powder, includes: breaking up the aggregate, reducing the particle size of the powder, eliminating == becoming the terminal particle (10) - the appropriate size of the sister silk ^ In the - (four) Fan rib, in line with the β 1 micro,, and Tian Hao end of the apparent increase in the ratio of the powder, the crushing of the two sharp = Γ, Γ Γ solvent can be mixed, from the physical point of view / etc. The specific surface area of the powder increases, because the energy conversion order of the mechanical energy converted into surface energy increases due to the breaking, cracking or grinding, so the pulverization is a physical 〇 & The chemical impurities of the powder _ to the ceramics of the molding money also =: ° system to ensure that the material contains impurities, after the sinter. The granular structure of the main body hides the bad _ density and basin
It 2^"' ^ π於早位體積中粒子的接觸點數與粒子半徑的平方成反 參比，因而粒子半徑減小，擴繼過程的速率明顯增大。另一 1 粒子越細，表面積越大，因而表面擴散的影響就增大，而表面鎌要 得多。況且，燒結速率是由驅動力、傳質速率及接觸面積 ，raix 嶋雜縣— 咖體難陶錄末加人適量溶_強力__攪拌絲狀 漿狀乳化銘用高卿浦加M，送入造粒喷嘴，嘴出到高溫乾燥塔中， 利用塔内高速熱流的熱空氣將造粒噴嘴噴出的槳狀氧她，瞬阶燥 成大小均勻之氧化雜子而㈣，絲龍之商品化_，粉^集 9 M315941 乃是關鍵偷，奈絲齡在线㈣和狀人體，造成健康危害 的問題，而的高溫方式，團雜集會使奈米粉财料變大，因 而失去奈米尺寸。在本法中，低溫製程收集奈米粉體，可以有效 的在低溫製程之下二次料域讀叙雜，_可財原來之奈 米粉體尺寸，並藉以猶絲雜f，純化氧化姆粒，依本法製成之 高純度氧化錄末’其雜質含量非常低，粉體粒徑亦小，具有優越的 物理及化學性質。再經添加有齡結劑後麵，以壓製成預定陶 兗基板外形，麵細的_是黏賴含量較低，只有萬之幾，不經 乾燥可以直接燒結成型’繩輯小，且可自動化生產。其係將前述 喷霧造粒完成之随粉粒置賴具中，如前述加人少量錢黏結劑， 在壓力機上加壓形成預絲狀_體，壓模成型的實技在外力的作 用下，顆粒在模具_互靠近，並借内摩擦力牢固地把各顆粒聯繫起 來’保持4的形狀’壓模成型之卫藝簡單，操作方便，周期短，效 率面，便於實現自統生產，此外，城魏大，尺寸精確，收縮小， 機械強度高，電性能也好為其優點。 本f作前述奈米化微結構之陶瓷基板（1)具有預定數量的容孔 (2)、’谷孔(2)側之陶瓷基板面上設置有功能性電子元件（3)【如電阻、 電感：電容···等功能性電子元件，其可為厚膜電子元件，也可為薄膜 電子元件，其製程視為何種電子元件而有不同，由於為習用技術，在 =不多贅言】，前述容孔(2)内填充有導電膠(4)【導電膠(4)可為銀膠、 $屬膠、玻璃導電膠、金屬氧化物膠等兼具導電及固定作用者，導電 與陶瓷基板(1)具有良好的附著性及導電性，可供後續電極凸塊 或電極接腳之用，同時兼具電子元件訊號的傳導，預製的容孔導電膠 M315941 設計可使元件的後續構裝接腳工序減少而降低成本】，以黏固前述功 能性電子70件(3)與陶甍基板⑴，除增加前述功能性電子元件⑶與陶 絲板⑴之附著力外，另兼具功能性電子元件⑶訊號的傳導，該功 月b性電子兀件(3)上具有-層保護層⑸，除了保護電子元件⑶外，亦 保護電子元件導線電極與容孔導電膠的接樞，此將提高元件壽命及 率，如此而構成完整構裝元件陶£基板，具有極佳的結合機械 強度【功能性電子元件⑶與陶絲板⑴藉導電膠⑷之黏結，可增加 二力能性電子70件(3)與陶錄板⑴之附著力】、良好的訊號傳導【功 •月匕性電子元件(3)藉導電膠⑷之黏結，訊號由導電膠⑷傳導，傳導性 屬佳】及製程良率【製程簡單，不良率可降低】功效。 本實施例之實施請參閱第二、三圖所示，導轉⑶之上方設有接 腳金屬⑹【如錫球等】，除了可以進行接屬⑹的焊球枯結或凸塊 電極之製作外’不而要再做任何其他封裝。如此隨著現代複雜電子系 .統對高可靠性、高性能、低價位和快速、輕便及小型化要求的不耻 升本創作可輕易將複雜系統集成在一個基板中實施【參閱第二圖】， 而達到前述的需求。 ▲ 請再參閱第四圖之本創作另一實施例剖面圖，本創作随基板⑴ 參之容孔⑵下端具有未斷裂之切割線⑺，在功能性電子元件承載製成 於陶瓷基板後’藉切割線⑺之設計，可將陶瓷基板由容孔⑵部斷裂， 再將斷裂，再處理，即形成左、右兩端具導電電極之電子元件使用， 同樣能提高產品賴械強度、良好軌號傳導能力及製程良率功效。 如此而達本創作設計目的，堪稱一實用之創作者。 ”’不上所述’本創作所揭露之一種「構裝元件陶竟基板」為昔 所無，亦未曾見於國内外公開之刊物上，理已具新賴性之專利要件， 又本創作確可摒除習用技術缺失，並達成設計目的，亦已充份符合新 型專利之「可供產業上利用之新型」專利要件，爰依法提出申請，謹 11 M315941 請貴審查委員惠予審查，並賜予本案專利，實感德便。 、所述者’僅為本創作之一較佳可行實施例而並非用以拘 雜，舉凡熟絲項縣人士，獅本_賴書及申請 【圖式簡轉t】 包辦摘叙私丨範圍内。 第一圖係本創作實施例剖面圖。 ^圖係摘作實施细韻（實施狀態）。 第二圖係本創作實施例實施狀態正面及侧面圖。 第四圖係本創作另一實施例剖面圖。 【主要元件符號說明】 (1) 陶瓷基板 (2) 容孔 • (3)功能性電子元件 (4) 導電膠 (5) 保護層 r (6)接腳金屬 _⑺切割線 12It 2^"' ^ π The number of contact points of the particles in the early volume is inversely proportional to the square of the particle radius, so the particle radius is reduced and the rate of the expansion process is significantly increased. The thinner the other 1 particle, the larger the surface area, so the effect of surface diffusion increases, and the surface is much more numerous. Moreover, the sintering rate is driven by the driving force, the mass transfer rate and the contact area. Raix is noisy county - the coffee body is difficult to be recorded at the end of the pot and the amount is dissolved. _ Strength __ Stirring filament-like emulsified emulsified with Gao Qing Pu Jia M, sent Into the granulation nozzle, the mouth is discharged into the high-temperature drying tower, and the hot air of the high-speed heat flow in the tower is used to spray the paddle-shaped oxygen from the granulation nozzle, and it is instantaneously dried into oxidized impurities of uniform size (4), commercialization of silk dragon _, powder ^ set 9 M315941 is the key to steal, Nai Siling online (four) and the human body, causing health hazards, and the high temperature method, the group of impurities will make the nano-powder material become larger, thus losing the nanometer size. In this method, the low-temperature process collects the nano-powder, which can effectively read the secondary material in the low-temperature process, and the original nano-powder size can be purified. The high-purity oxidation recorded by the method has a very low impurity content, a small particle size, and superior physical and chemical properties. After adding the ageing agent, it is pressed to form the shape of the predetermined ceramic substrate. The surface is thin. The content of the adhesive is low, only a few thousand, and can be directly sintered without drying. The rope is small and can be automated. produce. The above-mentioned spray granulation is completed with the powder granules, and a small amount of money binder is added as described above, and the pre-filament-like body is pressed on the press to form a pre-filament-like body. Next, the granules are close to each other in the mold _, and the particles are firmly linked by the internal friction force to 'maintain the shape of 4'. The molding process is simple, easy to operate, short in cycle, efficient in surface, and easy to realize self-production. In addition, the city Wei Da, the size is accurate, the shrinkage is small, the mechanical strength is high, and the electrical properties are also good. The ceramic substrate (1) having the above-mentioned nanostructured microstructure has a predetermined number of pores (2), and the ceramic substrate on the side of the valley hole (2) is provided with functional electronic components (3) [such as a resistor, Inductance: A functional electronic component such as a capacitor, which can be a thick-film electronic component or a thin-film electronic component. The process is different depending on the electronic component. Because it is a conventional technology, it is not a rumor. The above-mentioned hole (2) is filled with a conductive adhesive (4) [The conductive adhesive (4) can be a silver paste, a rubber, a glass conductive adhesive, a metal oxide paste, etc., and has a conductive and fixing effect, and a conductive and ceramic substrate. (1) It has good adhesion and conductivity, and can be used for subsequent electrode bumps or electrode pins, and also has the signal transmission of electronic components. The prefabricated hole-hole conductive adhesive M315941 is designed to make the subsequent components of the components The foot process is reduced to reduce the cost], in order to adhere the above-mentioned functional electronic 70 pieces (3) and the ceramic substrate (1), in addition to increasing the adhesion of the aforementioned functional electronic component (3) and the ceramic board (1), and also having functional electronic Element (3) signal transmission, the power month b-electronic component (3 Having a protective layer (5), in addition to protecting the electronic component (3), also protecting the armature of the electronic component wire electrode and the hole conductive paste, which will improve the life and rate of the component, thus forming a complete package component, Excellent mechanical strength [Functional electronic components (3) and ceramic board (1) bonded by conductive adhesive (4), can increase the adhesion of 70 energy (2) and ceramic recording board (1), good signal Conduction [gong·monthly electronic components (3) by conductive adhesive (4) bonding, signal conduction by conductive adhesive (4), conductivity is good] and process yield [simple process, low defect rate can be reduced] effect. For the implementation of this embodiment, please refer to the second and third figures. The lead metal (6) [such as solder balls] is placed above the transfer (3), in addition to the solder ball buckling or bump electrode fabrication. 'No need to do any other packaging. With the modern and complex electronic system, the high reliability, high performance, low price and fast, light and miniaturized requirements can easily integrate complex systems into one substrate. [Refer to the second figure] , and achieve the aforementioned needs. ▲ Please refer to the cross-sectional view of another embodiment of the fourth drawing. The creation has an unbroken cutting line (7) at the lower end of the hole (2) of the substrate (1), and is borrowed after the functional electronic component is mounted on the ceramic substrate. The design of the cutting line (7) can break the ceramic substrate from the hole (2), and then break and then process, that is, the electronic components with conductive electrodes on the left and right ends can be used to improve the product strength and good track number. Conductivity and process yield efficiency. This is the purpose of this creative design, can be called a practical creator. "There is no such thing as the "construction component ceramic substrate" disclosed in this creation. It has never been seen in public publications at home and abroad, and it has a new patent requirement. It can eliminate the lack of customary technology and achieve the design goal. It has also fully complied with the patent requirements for the new type of patents that can be used in the industry, and applied for it according to law. 11 M315941 Please review the review and give it to the case. Patent, real sense of virtue. The said person's is only one of the preferred and feasible examples of this creation and is not intended to be used for confession. For those who are familiar with the county, the lion's book and the application [simplified to t] Inside. The first figure is a cross-sectional view of the present embodiment. ^ The picture is abstracted to implement the fine rhyme (implementation state). The second drawing is a front view and a side view of the implementation state of the present embodiment. The fourth drawing is a cross-sectional view of another embodiment of the present creation. [Explanation of main component symbols] (1) Ceramic substrate (2) Holes • (3) Functional electronic components (4) Conductive adhesive (5) Protective layer r (6) Pin metal _ (7) Cutting line 12