TWM311241U - Moving structure of heat-sink fan - Google Patents

Moving structure of heat-sink fan Download PDF

Info

Publication number
TWM311241U
TWM311241U TW95220141U TW95220141U TWM311241U TW M311241 U TWM311241 U TW M311241U TW 95220141 U TW95220141 U TW 95220141U TW 95220141 U TW95220141 U TW 95220141U TW M311241 U TWM311241 U TW M311241U
Authority
TW
Taiwan
Prior art keywords
opening
fan
moving
combined
cooling fan
Prior art date
Application number
TW95220141U
Other languages
English (en)
Chinese (zh)
Inventor
Yi-He Huang
Original Assignee
Cooler Master Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooler Master Co Ltd filed Critical Cooler Master Co Ltd
Priority to TW95220141U priority Critical patent/TWM311241U/zh
Publication of TWM311241U publication Critical patent/TWM311241U/zh
Priority to DE200720014784 priority patent/DE202007014784U1/de

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/58Cooling; Heating; Diminishing heat transfer
    • F04D29/582Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00Pumping installations or systems
    • F04D25/02Units comprising pumps and their driving means
    • F04D25/06Units comprising pumps and their driving means the pump being electrically driven
    • F04D25/0606Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
    • F04D25/0613Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/60Mounting; Assembling; Disassembling
    • F04D29/64Mounting; Assembling; Disassembling of axial pumps
    • F04D29/644Mounting; Assembling; Disassembling of axial pumps especially adapted for elastic fluid pumps
    • F04D29/646Mounting or removal of fans
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW95220141U 2006-11-15 2006-11-15 Moving structure of heat-sink fan TWM311241U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW95220141U TWM311241U (en) 2006-11-15 2006-11-15 Moving structure of heat-sink fan
DE200720014784 DE202007014784U1 (de) 2006-11-15 2007-10-23 Verschiebungsstruktur eines Netzteils

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95220141U TWM311241U (en) 2006-11-15 2006-11-15 Moving structure of heat-sink fan

Publications (1)

Publication Number Publication Date
TWM311241U true TWM311241U (en) 2007-05-01

Family

ID=38742379

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95220141U TWM311241U (en) 2006-11-15 2006-11-15 Moving structure of heat-sink fan

Country Status (2)

Country Link
DE (1) DE202007014784U1 (de)
TW (1) TWM311241U (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395540B (zh) * 2007-12-07 2013-05-01 Foxconn Tech Co Ltd 散熱裝置組合

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395540B (zh) * 2007-12-07 2013-05-01 Foxconn Tech Co Ltd 散熱裝置組合

Also Published As

Publication number Publication date
DE202007014784U1 (de) 2008-02-07

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees