TWM311241U - Moving structure of heat-sink fan - Google Patents
Moving structure of heat-sink fan Download PDFInfo
- Publication number
- TWM311241U TWM311241U TW95220141U TW95220141U TWM311241U TW M311241 U TWM311241 U TW M311241U TW 95220141 U TW95220141 U TW 95220141U TW 95220141 U TW95220141 U TW 95220141U TW M311241 U TWM311241 U TW M311241U
- Authority
- TW
- Taiwan
- Prior art keywords
- opening
- fan
- moving
- combined
- cooling fan
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D25/0606—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
- F04D25/0613—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/60—Mounting; Assembling; Disassembling
- F04D29/64—Mounting; Assembling; Disassembling of axial pumps
- F04D29/644—Mounting; Assembling; Disassembling of axial pumps especially adapted for elastic fluid pumps
- F04D29/646—Mounting or removal of fans
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95220141U TWM311241U (en) | 2006-11-15 | 2006-11-15 | Moving structure of heat-sink fan |
DE200720014784 DE202007014784U1 (de) | 2006-11-15 | 2007-10-23 | Verschiebungsstruktur eines Netzteils |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95220141U TWM311241U (en) | 2006-11-15 | 2006-11-15 | Moving structure of heat-sink fan |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM311241U true TWM311241U (en) | 2007-05-01 |
Family
ID=38742379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95220141U TWM311241U (en) | 2006-11-15 | 2006-11-15 | Moving structure of heat-sink fan |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE202007014784U1 (de) |
TW (1) | TWM311241U (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI395540B (zh) * | 2007-12-07 | 2013-05-01 | Foxconn Tech Co Ltd | 散熱裝置組合 |
-
2006
- 2006-11-15 TW TW95220141U patent/TWM311241U/zh not_active IP Right Cessation
-
2007
- 2007-10-23 DE DE200720014784 patent/DE202007014784U1/de not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI395540B (zh) * | 2007-12-07 | 2013-05-01 | Foxconn Tech Co Ltd | 散熱裝置組合 |
Also Published As
Publication number | Publication date |
---|---|
DE202007014784U1 (de) | 2008-02-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |