CN102651954B - 散热器及其卡扣装置 - Google Patents

散热器及其卡扣装置 Download PDF

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Publication number
CN102651954B
CN102651954B CN201110044251.6A CN201110044251A CN102651954B CN 102651954 B CN102651954 B CN 102651954B CN 201110044251 A CN201110044251 A CN 201110044251A CN 102651954 B CN102651954 B CN 102651954B
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China
Prior art keywords
radiator
circuit board
fastener
fixed
clamping part
Prior art date
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Expired - Fee Related
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CN201110044251.6A
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English (en)
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CN102651954A (zh
Inventor
刘磊
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Dongguan Rende Electronic Technology Co Ltd
Original Assignee
Yun Chuan Intellectual Property Services Co Ltd Of Zhongshan City
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yun Chuan Intellectual Property Services Co Ltd Of Zhongshan City filed Critical Yun Chuan Intellectual Property Services Co Ltd Of Zhongshan City
Priority to CN201110044251.6A priority Critical patent/CN102651954B/zh
Priority to TW100106575A priority patent/TW201235573A/zh
Priority to US13/076,464 priority patent/US20120211196A1/en
Publication of CN102651954A publication Critical patent/CN102651954A/zh
Application granted granted Critical
Publication of CN102651954B publication Critical patent/CN102651954B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling, Air Intake And Gas Exhaust, And Fuel Tank Arrangements In Propulsion Units (AREA)

Abstract

一种散热器，包括一底座、一固定于底座的固定件、一枢设于固定件的枢转件以及一设置于枢转件上的卡扣件，卡扣件的两端分别设置一第一卡扣部及一第二卡扣部，所述第一卡扣部及第二卡扣部分别用来将散热器固定于不同的电路板。本发明还提供一种散热器的卡扣装置。相较现有技术，本发明散热器的卡扣件通过枢转件枢接于散热器的底座进而可改变散热器的固定方式，可以适用于不同的电路板。

Description

散热器及其卡扣装置
技术领域
本发明涉及一种散热器及其卡扣装置。
背景技术
在电路板上常会需要用到散热器来辅助散热，散热器的固定方式一般只适用于一种安装环境，而不能在其它安装环境中使用，这样会使散热器的使用环境受到限制。
发明内容
鉴于以上内容，有必要提供一种具有多种固定方式的散热器及其卡扣装置。
一种散热器，包括一底座、一固定于底座的固定件、一枢设于固定件的枢转件以及一设置于枢转件上的卡扣件，卡扣件的两端分别设置一第一卡扣部及一第二卡扣部，所述第一卡扣部及第二卡扣部分别用来将散热器固定于不同的电路板，需要将散热器固定于一开设有固定孔的第一电路板时，枢转枢转件使卡扣件的第一卡扣部朝向第一电路板并穿入第一电路板的固定孔内，弹性卡榫穿过第一电路板的固定孔后弹性回复卡挡于第一电路板，进而将散热器固定于第一电路板，需要将散热器固定于一开设有钩扣部的第二电路板时，枢转枢转件使卡扣件的第二卡扣部朝向第二电路板并使第二卡扣部的卡钩钩扣于第二电路板的钩扣部，进而将散热器固定于第二电路板。
相较现有技术，本发明散热器的卡扣件通过枢转件枢接于散热器的底座进而可改变散热器的固定方式，可以适用于不同的电路板。
附图说明
下面参照附图结合具体实施方式对本发明作进一步的描述。
图1为本发明散热器的较佳实施方式的立体分解图。
图2为本发明散热器固定于一第一电路板上的示意图。
图3为图2的局部剖视图。
图4为本发明散热器固定于一第二电路板上的示意图。
图5为图4的局部剖视图。
主要元件符号说明
第一电路板100
固定孔102
第二电路板200
钩扣部202
底座10
散热鳍片12
固定件20
固定部21
臂部22
枢孔221
枢转件30
通孔32
枢轴34
弹性元件40
卡扣件50
杆部51
第一卡扣部52
弹性卡榫522
第二卡扣部54
卡钩542
具体实施方式
请参阅图1，本发明散热器的较佳实施方式用于固定于一电路板上对电子元件进行散热。该散热器包括一底座10，底座10上设有若干散热鳍片12。底座10的相对的两侧各设置一卡扣装置，每一卡扣装置包括一固定于底座10的固定件20、一枢转件30、两弹性元件40及一卡扣件50。本实施方式中，弹性元件40为弹簧。
该固定件20大致呈U形，其包括一固定于底座10的固定部21及两平行的臂部22，每一臂部22于相对的一侧开设一枢孔221。
枢转件30大致呈方形，其中央开设一通孔32。枢转件30的相对的两侧分别向外凸设一枢轴34。
卡扣件50呈哑铃状，其包括一圆柱状的杆部51及分别设置于该杆部51两端的一第一卡扣部52及一第二卡扣部54。第一卡扣部52及第二卡扣部54与杆部51的两端之间可以通过螺纹锁固或者粘接的方式进行固定。可以理解，第一卡扣部52及第二卡扣部54之中的一个可以和杆部51一体形成，另外一个可以通过螺纹锁固或者粘接的方式与杆部51之间进行固定。第一卡扣部52的末端设有若干伞骨状发散的弹性卡榫522。第二卡扣部54的末端设置一卡钩542。
组装时，将卡扣件50的杆部51穿设于枢转件30的通孔32内，两弹性元件40套设于卡扣件50的杆部51并分别位于枢转件30的两侧。枢转件30的两枢轴34分别枢设于固定件20的两枢孔221内以将枢转件30枢转连接于固定件20。
请一并参阅图2及图3，需要将散热器固定于一开设有固定孔102的第一电路板100时，枢转枢转件30使卡扣件50的第一卡扣部52朝向第一电路板100并穿入第一电路板100的固定孔102内，弹性卡榫522穿过第一电路板100的固定孔102后弹性回复卡挡于第一电路板100，进而将散热器固定于第一电路板100。
请一并参阅图4及图5，需要将散热器固定于一开设有钩扣部202的第二电路板200时，枢转枢转件30使卡扣件50的第二卡扣部54朝向第二电路板200并使第二卡扣部54的卡钩542钩扣于第二电路板200的钩扣部202，进而将散热器固定于第二电路板200。
本发明散热器的卡扣件通过枢转件30枢接于散热器的底座10进而可改变散热器的固定方式，可以适用于不同的电路板。

Claims (3)

1.一种散热器，包括一底座、一固定于底座的固定件、一枢设于固定件的枢转件以及一设置于枢转件上的卡扣件，卡扣件的两端分别设置一第一卡扣部及一第二卡扣部，所述第一卡扣部及第二卡扣部分别用来将散热器固定于不同的电路板，需要将散热器固定于一开设有固定孔的第一电路板时，枢转枢转件使卡扣件的第一卡扣部朝向第一电路板并穿入第一电路板的固定孔内，弹性卡榫穿过第一电路板的固定孔后弹性回复卡挡于第一电路板，进而将散热器固定于第一电路板，需要将散热器固定于一开设有钩扣部的第二电路板时，枢转枢转件使卡扣件的第二卡扣部朝向第二电路板并使第二卡扣部的卡钩钩扣于第二电路板的钩扣部，进而将散热器固定于第二电路板。
2.如权利要求1所述的散热器，其特征在于：所述卡扣件滑动穿设于所述枢转件。
3.如权利要求2所述的散热器，其特征在于：所述卡扣件与所述枢转件之间设有若干弹性元件。
CN201110044251.6A 2011-02-23 2011-02-23 散热器及其卡扣装置 Expired - Fee Related CN102651954B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201110044251.6A CN102651954B (zh) 2011-02-23 2011-02-23 散热器及其卡扣装置
TW100106575A TW201235573A (en) 2011-02-23 2011-03-01 Heat dissipation device and locking apparatus of the same
US13/076,464 US20120211196A1 (en) 2011-02-23 2011-03-31 Heat dissipation assembly and latch apparatus of the same

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Application Number Priority Date Filing Date Title
CN201110044251.6A CN102651954B (zh) 2011-02-23 2011-02-23 散热器及其卡扣装置

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CN102651954B true CN102651954B (zh) 2016-05-04

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104080310B (zh) * 2013-03-27 2017-04-12 奇鋐科技股份有限公司 散热装置组合结构
JP7115032B2 (ja) * 2018-05-24 2022-08-09 富士通株式会社 基板
CN114863957B (zh) * 2021-02-03 2023-07-25 宇瞻科技股份有限公司 散热模块及储存装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7518874B2 (en) * 2007-08-10 2009-04-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6055159A (en) * 1999-08-20 2000-04-25 Compal Electronics, Inc. Heat dissipating module for a heat generating electronic component
KR100457220B1 (ko) * 2002-02-27 2004-11-16 잘만테크 주식회사 칩셋 냉각용 히트싱크장치
US7239518B2 (en) * 2005-11-01 2007-07-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Universal locking device for heat sink

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7518874B2 (en) * 2007-08-10 2009-04-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly

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CN102651954A (zh) 2012-08-29
TW201235573A (en) 2012-09-01
US20120211196A1 (en) 2012-08-23

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