TWM309769U - Electrical connector - Google Patents

Electrical connector Download PDF

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Publication number
TWM309769U
TWM309769U TW095213899U TW95213899U TWM309769U TW M309769 U TWM309769 U TW M309769U TW 095213899 U TW095213899 U TW 095213899U TW 95213899 U TW95213899 U TW 95213899U TW M309769 U TWM309769 U TW M309769U
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TW
Taiwan
Prior art keywords
electrical connector
insulating base
plate
lower cover
floating plate
Prior art date
Application number
TW095213899U
Other languages
English (en)
Inventor
Wen-Yi Xie
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW095213899U priority Critical patent/TWM309769U/zh
Publication of TWM309769U publication Critical patent/TWM309769U/zh
Priority to US11/890,859 priority patent/US7548422B2/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/82Coupling devices connected with low or zero insertion force
    • H01R12/85Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
    • H01R12/88Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Connecting Device With Holders (AREA)

Description

M309769 八、新型說明: 【新型所屬之技術領域】 本創作涉及-種電連接n,尤錢_種可枝^模祕能酬之電連接 器。 【先前技術】 及^成之電路中,電子封褒,譬如晶片模組,係 孓化包子讀μ了u在使用過程巾安全可靠, ,裝前必須進行測試。對晶片模組進行長_之高溫運作,可以使=在缺产之 ,片模組儘快失效’從而將有缺陷之晶片模組篩選出來淘汰掉,而通過測^之 B曰片核組独裝至電子終端產品舰_安全制, 連二 =於收容紐電賴組,《其雜連接至職電職簡其進行高 一請參考第-圖所示,習知之電連接器!,一般包括容設有複數導電端子(未 圖不)之絕緣基座20’、組設於絕緣基座2〇,上且可相對絕緣基座2〇,於導通位 和斷開位置之間轉換之浮板50,、置於絕緣基座2〇,和浮_,之間可驅動浮板5〇, 自導通位置向斷開位置回復之彈性裝置4〇’、樞接於絕緣基座2〇,一端之下蓋板 80’、枢軸連接于下蓋板8〇,與樞接端相對一端之上蓋板9〇,、連接于下蓋板阶 上之按壓板60,。其中’下蓋板8〇,和按壓板6〇,係通過樞軸1〇,來實現連接之,下 蓋板80’和按壓板60,相應設有收容樞軸1〇,之收容孔,將框細,置 連接下蓋板80,和按壓板60,。 、谷孔中以 使用時,首先將組設於印刷電路板(未圖示)上之電連接器丨,之上、 板90,、80,置於開啓位置,並將晶片模組(未圖示)置於浮板%,上;此時,導 電端子之接觸部尚未露出浮板50’,晶片模組和印刷電路板之間沒有形成電性導 通。然後,驅動上、下蓋板90,、80,和按壓板6〇,相對於 沈,此時,晶片模組之上表面抵接著按壓板6〇,,導電端子之接觸部開始穿過广 板50,和晶片模組上相應之導電元件(未圖示)對接。最後,通過上蓋板如,= 晶片模組鎖固於絕緣基座20,上,從而實現晶片模組和印刷電路板之間:電性連 接0 M309769 -晶片模組在工作時會釋放出大量熱量,過量之熱量會使晶片模組壽命縮 短’甚至燒壞晶片模組。故,必須在按壓板上安置與晶片模組接觸之散熱片, 爲y更好地達到政熱效果,通常還會在散熱片上固定一風扇。惟,隨著科技之 稍進步’大辨之晶賴域關來越叙,職導致切率找扇也日趨 私用’又風扇之功率通常與其高度成正比,可當風扇高度過高時,組裝或拆卸 電連接器極紐生風扇和電連接器之上^干涉之現象。 鑒於上述弊端,確有必要提供一種改進之電連接器,以克服上述電連接哭 之缺陷。 【新型内容】 本創作要解決之技術問題係提供一種可避免風扇與電連接 涉之電連接器。 τ 。爲本;I]作種可用於電性連接晶片模組至印刷電路板之電連接 益’其包括容設有複數導電端子之絕緣基座、組設於絕緣基座上且可相對絕 基座於導驗置和斷_置之_叙浮板、置魏絲齡雜之間可驅動 洋板自導驗置崎齡置_之雜裝置、樞接於輯基座—端之下蓋板、 樞軸連接于下蓋板與雛端姆—狀上紐、連射下蓋板上之碰板以及 固定轴,其中’上蓋板-相對之兩側邊緣處設有向上凸出用於固定風扇之支撐 柱。 相對于習知技術,本創倾連接器至少具有以下優點:風扇固定于上蓋板 之柱上’不_風紅高度,能滿足大功率晶賴組工作之需要。 【實施方式】 請參考第二、三圖所示,本創作電連接器!可用於電性連接晶片模組(未圖 W至印刷電路板(未圖示),其包括容設有複數導電端子(未圖示)之絕緣基座 1組設於絕緣基座2〇上且可相對絕緣基座2〇於導通位置和斷開位置之間轉換 之=板=、置於絕緣基座2〇和浮板5()之間可驅動浮板5()自導通位置向斷開位置 回復之彈縣置4G、樞接於絕緣基座20-端之下蓋板8G、樞軸連接于下蓋板8〇 與枢接端相對-端之上蓋板9〇、連接于下蓋板8〇上之按壓板6〇以及固定轴1〇。 絕緣基座20大致呈矩形構造,其包括底壁2〇〇、自底壁綱兩相對側上延之 M309769 樞接壁202和鎖固壁204,以及連接樞接壁2G2和鎖固壁綱之一對連接壁2〇6。 底壁200、樞接壁202、鎖固壁2〇4和-對連接壁2〇6共同圍設成一個容置空間 208 ’以谷置彈性裝置40和浮板5〇。貫穿絕緣基座2q之底壁2⑻設有複數呈矩陣 排列之端子槽(未圖示),導電端子對應收容於端子槽中。導電端子一端向下延 伸出絕緣基座20之底壁20〇以和印刷電路板上相應之導電元件(未圖示)電性連 接’另-端向上延伸爲置空間2〇8並于頂端形成接觸部(未標示),以和晶片模 組上相應之導電讀(未圖示)對接。絕緣基座2〇四角處設有凹槽2〇7以收容浮板 50 ° 浮板50爲可置於絕緣基座20之容置空間施中之薄板狀結構,其包括承接 鲁壁500和自承接壁500同向延伸之複數側壁5〇2,承接壁5〇〇和側壁5〇2共同圍設 成-個承載空間504,以承載晶片模組於其中。浮板5〇底部四角分別設有複數 鎖扣鈎508,鎖扣釣508可以卡扣於絕緣基座2〇上相應設置之凹槽2〇7中,從而 既可將浮板50可動組接於絕緣基座2〇上,又可以防止浮板5〇在彈菁如之彈力作 用下自絕緣基座20脫落。 浮板50和絕緣基座2〇之底獅〇之間設有彈性裝频,如彈簣等,可驅動 浮板50自導通位置向斷開位置自動回復。 下蓋板80係由_漏製紅巾錄架結構,其包括可樞㈣接於絕緣基 座2〇上之柩接邊和與枢接邊8〇2相對之安裝邊8〇6,連接枢接邊8〇2和安裝邊 806之連接邊807,由樞接邊802、安裝邊_以及連接邊圍成之中央開靖$ 四周相對凹設有承載部_,以承載散熱片(未標號)於其上,連接細7設有 收容固定軸10之孔。上蓋板90係由金屬片材製成,可以包覆于下蓋板8〇之外 側’其包括婦端902、和樞接端902姉之鎖固端,以及連接框接端卿和 鎖固端906之-對碰邊904,按壓邊9〇4中部設有向上凸出之驗固定風扇(未 標號)之支撐柱91。 按壓板60大致呈構造,其可通麵辦解分離地賴在下蓋板 80上,其也包括收容固定軸10之孔。在實際使用過程中,可以根據晶片模組之 外形和尺寸來選擇外形、尺寸合適之按壓板6〇。 固定軸10大致呈-圓柱體,其穿過按壓板60和下蓋板8〇上之對應之孔,從 M309769 而將按壓板60和下蓋板8〇緊密連接。 請繼續參考第三圖,組裝時,首先將浮板5〇置於收容有導電端子之絕緣基 座20之容置空間208中,㉟簣40置於浮板5〇和絕緣基座20之間,浮板5〇下端設 置之鎖扣鈎508扣持於絕緣基座2〇側壁上;其次,固定軸1〇穿過按壓板6〇和下 盍板80對狀孔巾,從而將按壓細組接于下蓋板8()上;織,將下蓋板雜 軸連接於絕緣基座20之鎖固壁2〇4 ;最後將上蓋板9〇連接于下蓋板8〇之安裝邊 806且上蓋板90了以相對于下蓋板8〇于開啓位置和閉合位置之間作方走轉運動。 使用時,首先將組設在印刷電路板上之電連接器i之上、下蓋板9〇、⑽置 於開啓位置,並將晶賴組置於浮板5G上,此時,導電端子之接觸部尚未露出 洋板50。然後,驅動上、下蓋板9〇、8G和按壓細^目賴緣基座2()轉動並下壓 置於汁板5GJi之晶模組抵接著按壓板⑼,導電端子穿過按壓_與晶片模組 上相應之,電元件對接,最後,通過上蓋板9轉晶片模組_於絕緣基獅 上’從而實現晶片模組和印刷電路板之電性連接。 本創作電連接器通過改變散熱片上風扇之安裝位置,解決了習知技術中, 當風扇高度過高時,風雜上蓋板絲城_鱗接 從而滿足了大功率晶片模組制之f要。 ^之問通’ 茜要指出的是,本創作電連接器的上蓋板向上凸出之用於固定 柱不局限於具有-固定高度,其也可根據風扇的高度需要適時調節。支牙 综上所述,本創作符合新型專利要件,爱依法提出專利申請。惟 軸㈣恤,編蓋於灯 【圖式簡單說明】 =一圖係一種習知電連接器之立體分解示意圖。 第二圖係本創作電連接器之立體分解示意圖。 第三圖係第二圖所示電連接器之組裝圖。 【主要元件符號説明】 固定軸 電連接器 M309769 絕緣基座 20 樞接壁 202 連接壁 206 容置空間 208 浮板 50 側壁 502 鎖扣鉤 508 下蓋板 80 才區接邊 802 安裝邊 806 上蓋板 90 按壓邊 904 支撐柱 91 底壁 200 鎖固壁 204 凹槽 207 彈性裝置 40 承接壁 500 承載空間 504 按壓板 60 承載部 800 開口 805 連接邊 807 柩接端 902 鎖固端 906

Claims (1)

  1. M309769 九、申請專利範圍: 1· 一種電連接器,可用於電性連接晶片模組至印刷電路板,其包括:容設 有複,導電端子之絕緣基座、組設於絕緣基座上之浮板、樞接於絕緣基座一端 1板樞軸連接于下蓋板之上蓋板,其中上蓋板兩侧邊緣處設有向上凸出 延伸用於固定風扇之支撐柱。 么2_如申請專利範圍第1項所述之電連接器,其中所述電連接器還設有置於絕 緣基座和浮板之間可驅動浮板自導通位置向斷開位置回復之彈性裝置。 3_如申凊專利範圍第1項所述之電連接器,其中所述電連接器進一步包括 φ連接于下蓋板上用於容置散熱片之按壓板。 4·如申睛專利範圍第1項所述之電連接器,其中所述浮板之下端設有複數鎖 扣釣’所述絕緣基座相應設有扣持鎖扣鈎之凹槽。 5·如申請專利範圍第3項所述之電連接器,其中所述下蓋板與按壓板係可分 離連接之。 6·如申請專利範圍第1項所述之電連接器,其中所述支撐柱具有伸縮性且可 固定於一定高度。
TW095213899U 2006-08-08 2006-08-08 Electrical connector TWM309769U (en)

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Application Number Priority Date Filing Date Title
TW095213899U TWM309769U (en) 2006-08-08 2006-08-08 Electrical connector
US11/890,859 US7548422B2 (en) 2006-08-08 2007-08-08 Socket having fan

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TW095213899U TWM309769U (en) 2006-08-08 2006-08-08 Electrical connector

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TWM309769U true TWM309769U (en) 2007-04-11

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US7030638B2 (en) * 2003-07-24 2006-04-18 Wells-Cti, Llc Method and device with variable resilience springs for testing integrated circuit packages
TWM275557U (en) * 2004-12-31 2005-09-11 Hon Hai Prec Ind Co Ltd Electrical connector
TWM275587U (en) * 2005-01-21 2005-09-11 Hon Hai Prec Ind Co Ltd Electrical connector assembly
CN100448117C (zh) * 2005-12-29 2008-12-31 富士康(昆山)电脑接插件有限公司 电连接器组件及用于该电连接器组件的电连接器

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US20080037220A1 (en) 2008-02-14

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