M306683 — 八、新型說明： -【新型所屬之技術領域】 本創作涉及一種散熱器，尤指一種用於電子元件散熱 之組合式散熱器。 [先前技術】 積體電路技術之迅速提高引起了電腦產業之蓬勃發 展，如今電腦已經廣泛應用於各行各業，隨著應用需求之 不斷提高，要求電腦具有更加高效之性能。現在電腦之運 _ 行速度越來越快，由於電腦之運行速度主要取決於中央處 理器，因此中央處理器之運行速度也越來越快，但是對於 中央處理器這一類積體電路電子元件來說，運行速度越 快，其單位時間產生之熱量就越多，若不及時排出，就會 引起其溫度升高，導致其運行不穩定。業界均在中央處理 器表面安裝一散熱器輔助其散熱，隨著處理器不斷推出， 其所配用之散熱器也在不斷改良。現有之散熱器一般都為 _ 一體鑄造或一體擠壓成型，因受模具及擠壓設備之限制， 散熱鰭片之高度與散熱鰭片之間間距不能太小，散熱鰭片 之厚度也不能太薄，因此散熱器之體積與重量都較大，給 散熱器之安裝帶來了很多問題。並且這種工藝製作之散熱 器有效散熱面積有限，要想達到更好之散熱效果勢必提高 風扇之風量，而提高風扇之風量又會產生更大噪音。 【新型内容】 鑒於以上内容，有必要提供一種使用方便且能有效改 善散熱性能之組合式散熱器。 M306683 ^ 一種組合式散熱器，其具有一基座及複數設於該基座 ^ 上之散熱鰭片，每一散熱鰭片具有一散熱部，該基座上設 有複數插槽，該等散熱部之底部對應於該等插槽分別凸設 一插接部。 相對於習知技術，該組合式散熱器將基座與散熱鰭片 分開設置，在製造之過程中，可使該散熱鰭片具有較薄之 厚度，有效提高其散熱效率。且在測試過程中，若想改善 散熱器之性能，只需更換具有相同插接部之散熱鰭片即 * 可，無需拆卸整個散熱器，使該組合式散熱器結構簡單、 操作方便。 【實施方式】 請參閱圖1，本創作組合式散熱器之軚佳實施方式具 有一基座10及複數直立裝設於該基座10上之散熱鰭片 20 ° 該基座10呈一長方體，其具有一上表面11，該上表 • 面11上平行設置複數組插槽111，每組插槽111由水平間 隔設置之複數個長方形插槽1111組成，該插槽1111自該 上表面11垂直向下開設，且該插槽1111與該基座10之底 部不相貫通。 該散熱鰭片20直立於該基座10上，且相鄰兩散熱鰭 片20之間之距離小於該基座10上對應之相鄰兩組插槽 111之間之距離。每一散熱鰭片20具有一散熱部21，該 散熱部21為一直立之長方體。其中，該散熱部21也可為 其他形狀。該散熱部21底部對應於該基座10上之插槽 M306683 1111垂直向下凸設複數長方體插接部23，該插接部23之 -厚度小於該散熱部21之厚度。其中，每〜散熱鰭片20也 可由複數具有較小散熱部21之散熱縛片構成。 該基座10之下表面貼合於一電子元件上（圖未示）， 用於吸收該電子元件所產生之熱量，並將熱量藉由該插接 部23傳導至該散熱部21上，進而使熱量散發出去。在其 他實施方式中，該基座10上之插槽HU為一正方體插槽， 該散熱鰭片20上之插接部23對應於該正方體插槽設置為 ® —相應之正方體插接部。另外，該基座10上之插槽1111 也可為其他形狀，該散熱鰭片2〇上之插接部23也可為相 應的其他形狀。 請參閱圖2，組裝該組合式散熱器時，將每一散熱鰭 片20底部之插接部23順著該基座1〇上插槽111;1之方向， 垂直插入其相應之插槽1111中，使該插接部23與其對應 之每一插槽1111緊密接觸，並使該散熱鰭片20之底部與 _ 該基座1〇之上表面11充分接觸’形成一完整之組合式散 熱器。 請參閱圖3,在本實用新型組合式散熱器之另一種實 施方式中，該基座10上平行設置複數組插槽113，每一組 插槽113由平行設置之兩排插槽115組成，每排插槽115 由水平間隔設置之複數個插槽1115組成，該兩排插槽115 之間之距離小於該散熱部21之厚度。該散熱鰭片20之底 部對應於每組插槽113之兩排插槽115分別凸設兩排插接 部25，每一排插接部25對應於該插槽ms分別設有複數M306683 — VIII. New Description: - [New Technology Area] This creation relates to a heat sink, especially a combined heat sink for heat dissipation of electronic components. [Prior Art] The rapid development of integrated circuit technology has aroused the development of the computer industry. Today, computers have been widely used in various industries. As application requirements continue to increase, computers are required to have more efficient performance. Now the computer is running faster and faster. Since the running speed of the computer depends mainly on the central processing unit, the central processing unit runs faster and faster, but for the integrated circuit electronic components such as the central processing unit. The faster the running speed, the more heat it generates per unit time. If it is not discharged in time, it will cause its temperature to rise, resulting in unstable operation. The industry has installed a heat sink on the surface of the central processor to assist its heat dissipation. As the processor continues to be introduced, the heat sinks it uses are constantly being improved. The existing heat sinks are generally _ one-piece casting or one-piece extrusion. Due to the limitation of the mold and the extrusion equipment, the distance between the height of the heat-dissipating fins and the heat-dissipating fins should not be too small, and the thickness of the heat-dissipating fins should not be too large. Thin, so the size and weight of the radiator are large, which brings many problems to the installation of the radiator. Moreover, the effective heat dissipation area of the heat sink made by this process is limited. In order to achieve a better heat dissipation effect, the air volume of the fan is increased, and the air volume of the fan is increased to generate more noise. [New content] In view of the above, it is necessary to provide a combined heat sink that is easy to use and can effectively improve heat dissipation performance. M306683 ^ A combined heat sink having a base and a plurality of heat dissipating fins disposed on the base ^, each of the heat dissipating fins has a heat dissipating portion, the base is provided with a plurality of slots, the heat dissipating A plug portion is respectively protruded from the bottom of the portion corresponding to the slots. Compared with the prior art, the combined heat sink separates the base from the heat dissipation fins, and the heat dissipation fins can have a thin thickness during the manufacturing process, thereby effectively improving the heat dissipation efficiency. In the test process, if you want to improve the performance of the heat sink, you only need to replace the heat sink fins with the same plugs. It is not necessary to disassemble the entire heat sink, making the combined heat sink simple and easy to operate. [Embodiment] Referring to FIG. 1 , a preferred embodiment of the combined heat sink has a base 10 and a plurality of heat radiating fins 20 erected on the base 10 . The base 10 has a rectangular parallelepiped shape. It has an upper surface 11 on which a plurality of array slots 111 are arranged in parallel, each set of slots 111 being composed of a plurality of rectangular slots 1111 arranged horizontally, the slot 1111 being perpendicular to the upper surface 11 The downward opening is opened, and the slot 1111 does not penetrate with the bottom of the base 10. The heat dissipation fins 20 are erected on the base 10, and the distance between the adjacent two heat dissipation fins 20 is smaller than the distance between the corresponding two adjacent slots 111 on the base 10. Each of the heat dissipation fins 20 has a heat dissipating portion 21 which is a rectangular parallelepiped. The heat dissipating portion 21 may have other shapes. The bottom portion of the heat dissipating portion 21 corresponds to the slot M306683 1111 on the base 10, and a plurality of rectangular parallelepiped plug portions 23 are vertically protruded downward. The thickness of the plug portion 23 is smaller than the thickness of the heat dissipating portion 21. Each of the heat dissipation fins 20 may also be composed of a plurality of heat dissipation fins having a small heat dissipation portion 21. The lower surface of the pedestal 10 is attached to an electronic component (not shown) for absorbing the heat generated by the electronic component, and the heat is transmitted to the heat dissipation portion 21 through the plug portion 23, thereby Allow heat to escape. In other embodiments, the slot HU on the base 10 is a square slot, and the plug portion 23 on the heat sink fin 20 is disposed corresponding to the square slot as a corresponding square connector. In addition, the socket 1111 on the base 10 may have other shapes, and the insertion portion 23 on the heat dissipation fin 2 may have other shapes. Referring to FIG. 2, when the combined heat sink is assembled, the plug portion 23 at the bottom of each heat sink fin 20 is vertically inserted into the corresponding slot 1111 along the direction of the slot 1; The plug portion 23 is in close contact with each of the corresponding slots 1111, and the bottom of the heat dissipation fin 20 is in sufficient contact with the upper surface 11 of the base 1 to form a complete combined heat sink. . Referring to FIG. 3, in another embodiment of the combined heat sink of the present invention, a plurality of array slots 113 are disposed in parallel on the base 10, and each set of slots 113 is composed of two rows of slots 115 arranged in parallel. Each row of slots 115 is composed of a plurality of slots 1115 arranged horizontally, and the distance between the two rows of slots 115 is smaller than the thickness of the heat dissipating portion 21. The two rows of slots 115 corresponding to the two rows of slots 115 of each set of slots 113 are respectively provided with two rows of plug portions 25, and each row of plug portions 25 is respectively provided with a plurality of corresponding slots
M306683 結合部251。 20”= 他方式將該散熱籍片 === 合體貼合於—電子元件上，該散熱韓 片20/、該基座1〇可由鋁、銅或者其他散熱物質製成。 本創作組合式散熱器將該基座1〇與該散熱續片如分 開設置’在製造過財，可使該散熱則如具有較薄之 厚度，有效提高其散熱效率。且在測試過程中，若雄改善 該散熱器之性能，只需更換具有相同插接部23、之^ ，鰭片2G即可，無需拆卸整個散熱器，使該組合式散熱 器結構簡單、操作方便。 【圖式簡單說明】 圖1係本創作組合式散熱器較佳實施方式之立體分解圖。 圖2係本解組合錢熱ϋ較佳實施方紅讀組裝圖。 圖3係本創作組合式散熱器另—種實施方式之立體分解 圖。 【主要元件符號說明】 基座 10 插槽 111 插槽 1115 插槽 115 散熱部 21 插接部 25 上表面 11 插槽 1111 插槽 113 散熱鰭片 20 插接部 23 結合部 251M306683 joint portion 251. 20"= The method of bonding the heat-dissipating film === to the electronic component, the heat-dissipating Korean film 20/, the base 1〇 can be made of aluminum, copper or other heat-dissipating material. The pedestal 1 〇 and the heat-dissipating slab are disposed separately. In the manufacturing, the heat dissipation is such that the heat dissipation is thinner, thereby effectively improving the heat dissipation efficiency. Moreover, during the test, if the heat is improved, the heat dissipation is improved. The performance of the device can be replaced only by having the same plug-in portion 23, the fin 2G, and the entire heat sink is not required to be disassembled, so that the combined heat sink has a simple structure and convenient operation. [Simple diagram of the drawing] 3 is an exploded perspective view of a preferred embodiment of the present combined heat sink. Fig. 2 is a block diagram of the preferred embodiment of the present invention. Fig. 3 is a perspective exploded view of another embodiment of the combined heat sink of the present invention. Fig. [Description of main component symbols] Base 10 Slot 111 Slot 1115 Slot 115 Heat sink 21 Plug portion 25 Upper surface 11 Slot 1111 Slot 113 Heat sink fin 20 Plug portion 23 Joint portion 251