TWI476573B - Heat dissipating structure for laptop - Google Patents

Description

Thin pen power dissipation structure

The invention relates to a heat sink structure, in particular to a fixing structure in which a heat dissipating fin and a fan cover are combined by riveting, fitting or hot melt.

With the advancement of technology, many portable electronic products, such as notebook computers, are becoming more and more lightweight and thinner to meet the needs of users. It is well known that the central processing chip (CPU) inside the electronic product generates a large amount of heat energy to increase the temperature during operation. Therefore, after the electronic product is thinned, how to accumulate a large amount of heat in the wafer in an effective space It is the focus of active research and development of personnel in the technical field.

The conventional heat dissipation device 1 includes at least one heat dissipation base 10, a fan assembly 11, a heat dissipation fin assembly 12, and a heat dissipation tube 13. One end of the heat dissipation tube 13 is disposed in the receiving groove 100 of the heat dissipation base 10 , and the other end is disposed in the receiving groove 120 of the heat dissipation fin assembly 12 , and the fan assembly 11 is fixed to the heat dissipation fin assembly 12 . With the above structure, the heat dissipation base 10 is flatly attached to the heat-generating electronic chip, and the heat generated by the heat-dissipating base 10 is transmitted through the heat-dissipating base 10, transmitted to the heat-dissipating fin assembly 12 via the heat-dissipating tube 13, and then generated by the fan group 11. The airflow dissipates heat quickly.

The fan assembly 11 includes a fan cover 110 and a fan 111. The fan 111 is assembled in the fan cover 110. In addition, the fan pack 11 can be coupled to the heat sink fin assembly 12 by the fan cover 110. In the prior art, a tape 14 or an adhesive is adhered to the top surface of the fan cover 110 and the heat dissipation fin assembly 12 for fixing. Another way is to adhere to the top surface of the fan cover 110 and the bottom surface of the heat dissipation fin assembly 12 to fix the two, as shown in FIG.

However, since the tape 14 is generally not a good heat conductive material, it is inevitably used in the heat sink 1 to reduce the overall heat dissipation effect. On the other hand, the process of fixing the fan cover 110 and the heat sink fin assembly 12 by means of a tape or an adhesive cannot be automated and needs to be operated manually, which is disadvantageous for mass production.

Another conventional technique is to fix the fan cover 110 and the heat sink fin assembly 12 by soldering, and the two are fixed by welding, which is not only costly but also harmful to the environment and the human body.

Therefore, how to avoid using the tape or the adhesive without using the welding process can tightly combine the heat dissipation fin group and the fan cover, and at the same time facilitate automatic production and maintain good heat dissipation effect, which is the main purpose of the invention.

The object of the present invention is to provide a thin heat dissipation structure for a notebook, comprising: a heat sink fin assembly and a fan cover, which are riveted, fitted or thermally melted without using tape or soldering. Ways to combine.

The heat dissipation fin assembly is fastened to each other by a plurality of heat dissipation fins, and at least a portion of the heat dissipation fins have a first joint portion. Wherein, the first bonding portion may be a strip-shaped flat plate. The fan cover has a plurality of second joint portions, and the second joint portion is disposed on the fan cover surface and corresponds to the first combination The position of the part is set, and the second joint can select a protrusion, a slot or a combination thereof. The heat dissipation fin assembly is coupled to the fan cover by riveting, fitting or heat-melting the first joint portion with the second joint portion, respectively.

The thin heat dissipation structure for a thin notebook provided by the present invention no longer fixes the heat dissipation fin assembly and the fan cover with the tape used in the prior art, which can automate the process and save labor cost. At the same time, the tape with poor thermal conductivity is omitted, and the material of the fan cover is changed into a material with better thermal conductivity, and the heat dissipation effect can be greatly improved.

In order to make the above-mentioned objects, features and advantages of the present invention more comprehensible, the heat-dissipating structure for a thin-type notebook according to the present invention will be described in detail below with reference to the accompanying drawings.

As shown in FIG. 3, the thin heat dissipation structure for a thin notebook of the present invention includes a heat dissipation fin assembly 30 and a fan cover 31. The heat dissipation fin assembly is fastened to each other by a plurality of heat dissipation fins 305, and at least a portion of the heat dissipation fins have a first joint portion 3020. The fan cover has a plurality of second joint portions 312. The second joint portion 312 is disposed on the surface of the fan cover 31 and is disposed corresponding to the position of the first joint portion 3020.

The first bonding portion may be a strip-shaped flat plate, and the second bonding portion may select a protruding post, a slot or a combination thereof. The heat dissipation fin assembly 30 is coupled to the fan cover 31 by riveting, fitting, or heat-melting the first joint portion 3020 with the second joint portion 312, respectively. The embodiments of the heat sink fin assembly and the fan cover are as follows: Referring to FIG. 4A, a rear perspective view of the heat sink fin assembly 30 according to an embodiment of the present invention is shown. The heat dissipation fin assembly 30 of the embodiment is composed of a plurality of pieces The heat dissipation fins 305 are fastened to each other, and as shown in the drawing, the heat dissipation fin assembly 30 includes a second lower heat dissipation fin 303, a first lower heat dissipation fin 302 and an upper heat dissipation fin 301 from top to bottom.

Please refer to FIG. 4B , which is a partial enlarged view of the back surface of the heat dissipation fin assembly of the embodiment. The upper heat dissipation fin 301 and the first lower heat dissipation fin 302 form a first accommodating groove 300 to accommodate a heat pipe (not shown). The first and second lower heat dissipation fins 302 and 303 form a step 304 on the bottom surface of the heat dissipation fin assembly 30. Please refer to FIG. 4C , which is a partially enlarged view of the back surface of the heat dissipation fin assembly of the other embodiment. The first and second lower heat dissipation fins 302 and 303 form a second receiving groove 306 .

The step 304 and the receiving groove 306 can be used to receive the front end of the fan cover 31. The step 304 is such that the bottom surface of the fan cover 31 and the heat dissipation fin assembly 30 is substantially flat, which is convenient for subsequent adhesion to the heat-generating electronic component or for being conveniently disposed in the thin notebook. As can be seen from the above combined structure, the height of the step 304 is approximately equal to the thickness of the leading edge of the fan cover 31.

Referring to FIGS. 4B and 4C , in the embodiment, the first bonding portion is a strip-shaped flat plate 3020 extending from the bottom surface of the first lower heat-dissipating fins 302 and protruding from the side surface of the heat-dissipating fin assembly 30 . Each of the strip plates 3020 has a concave arc 3020a on each side.

Please refer to FIG. 4D again, which is also a partial enlarged view of the back of the heat dissipation fin assembly. It can be seen from the figure that a vertical gap of the step 304, that is, a row of sub-gaps 3030 is formed between the second lower fins 303. For another embodiment, referring to FIG. 4E, the horizontal plane of the step 304, that is, the first lower heat sink fin bottom surface 302, and the row gap 3030 intersection further include a row of the fitting grooves 3021 formed thereon.

Next, please refer to FIG. 5A, which is a perspective view of the back of the fan cover according to an embodiment of the present invention. A plurality of hooks 313 are provided around the fan cover 31 to fix a fan (not shown). As can be seen from the figure, a plurality of forks 311 are provided at the front edge of the fan cover 31.

Please refer to FIG. 5B , which is a partial enlarged view of the fan cover. As can be seen from the figure, the fork 311 can extend from the front edge of the fan cover 31 and be flush with the lower surface of the fan cover 31 to fit the heat dissipation fin assembly of FIG. 4D and be engaged with the second lower heat dissipation fin 303. The child gap is 3030.

Please refer to FIG. 5C, which is a partially enlarged view of the fan cover of another embodiment. The fork 311 of this embodiment also extends from the leading edge of the fan cover 31, but is positioned slightly lower than the lower surface of the fan cover 31 to engage the heat sink fin assembly of FIG. 4E and engages in the slot 3021. In order to prevent the fork 311 from being pulled out after being inserted into the sub-gap 3030, the width of the fork 311 and the size of the sub-gap 3030 are almost equal.

Referring to FIG. 5B again, in the embodiment, the second joint portion disposed on the upper surface of the fan cover 31 is a protrusion 312. The protrusions 312 may be a cylinder or a square cylinder, and the protrusions 312 and the protrusions are convex. A gap is formed between the pillars 312. In FIG. 5C, a fitting hole 3120 is formed in the side of each of the protrusions 312, so that the strips are respectively embedded in the fitting holes 3120 of the protrusions 312. In a preferred embodiment, referring to FIG. 5D, the top of the stud 312 has a first V-shaped score 3121. When riveting, the stud 312 is deformed from the first V-shaped notch and the strip-shaped flat plate. 3020 riveting.

When the heat dissipation fin assembly 30 is fixed to the fan cover 31, the fork 311 of the front edge of the fan cover 31 is inserted into the sub-gap 3030 by the step 304 of the bottom surface of the heat dissipation fin assembly 30, and then the protrusion 312 on the surface of the fan cover 31 is used. The strip plate 3020 of the heat sink fin assembly 30 is riveted.

In the embodiment of FIG. 3, an opening or a slot having a predetermined size is formed between each pair of strip-shaped flat plates 3020. By the concave arc 3020a of the strip-shaped flat plate 3020, the stud 312 is engaged from the bottom to the top. Then, a stamping process is performed to provide a force to deform the stud 312 and rive the strip plate 3020.

Other Embodiments Referring to Figures 6A-6D, different embodiments of the strip plate 3020 of the heat sink fin assembly 30 and the fan cover 31 are riveted. Referring to FIG. 6A, the strip-shaped flat plate 3020 is respectively inserted into the gap formed between the stud 312 and the stud 312. Similarly, after the external force is applied to the stud, the strip-shaped flat plate and the stud are riveted one by one. At this time, the concave arc 3020a on both sides of the strip-shaped flat plate 3020 is a gap formed by guiding the strip-shaped flat plate 3020 from the side of the protruding post 312 and inserting the two protruding posts 312.

In another embodiment, referring to FIG. 6B, the stud 312 is a quadrangular cylinder, and the strip plate 3020 is sandwiched between the two square cylinders. In this embodiment, the first lower fin 302 and the second lower fin 303 form a second accommodating groove 306, so that the leading edge of the fan cover 31 is placed in the second accommodating groove 306.

In another embodiment, the strip plate 3020 is embedded in the fitting hole 3120 of the stud 312, and may or may not pass through the fitting hole 3120, as shown in FIGS. 6C and 6D.

In another preferred embodiment, the heat sink fin assembly 30 can also be riveted from the fan cover 31 from top to bottom. At this time, the first joint portion 3020 is disposed on the bottom surface of the heat dissipation fin assembly, and the second joint portion is disposed on the upper surface of the fan cover. Please refer to FIG. 7 to FIG. 9 , which are different embodiments of the first and second joints.

First, referring to FIG. 7A , the first bonding portion of the heat dissipation fin assembly 30 is a strip-shaped flat plate 3020 and protruded from the bottom surface of the heat dissipation fin assembly 30 . At this time, the second joint portion provided on the surface of the fan cover 31 is a slot 314, so that the strip-shaped flat plate 3020 is inserted into the slot 314 from top to bottom.

7B-7C are schematic views showing the strip plate 3020 riveted to the slot 314. As can be seen from the figure, the second joint portion further includes two second V-shaped scores 315 respectively disposed on both sides of the slot 314. When the heat dissipation fin assembly 30 is riveted with the fan cover 31, the two sides of the slot 314 are The second V-shaped score 315 applies an external force to deform the side wall of the slot 314 to rive the front end of the strip plate 3020 to the slot 314. In addition, the front end of the strip plate 3020 fits the opening size of the slot 314, and is provided with a folded portion 3021, which may have two or three folds. The strip-shaped flat plate 3020 is extended by the heat-dissipating fin itself, and has a small thickness. When the slot 314 is inserted, a large gap is left between the slot 314 and the slot 314, and the riveting is not strong. Therefore, when the front end of the strip-shaped flat plate 3020 has the folded portion 3021, the gap after the insertion into the slot 314 can be reduced, and the lack of the above-described riveting can be improved.

For another embodiment, referring to FIGS. 8A-8C, the first bonding portion of the heat dissipation fin assembly 30 is also a strip-shaped flat plate 3020 protruding from the bottom of the heat dissipation fin assembly 30. However, the second joint portion of the fan cover 31 includes a slot 314 and a protrusion 312 adjacent to each of the protrusions 312. When riveting, the strip flat plate 3020 is also inserted into the slot 314 from top to bottom, and an external force is applied to the stud 312 to rive the heat sink fin assembly 30 with the fan cover 31.

In another embodiment of the present invention, please refer to FIGS. 9A-9C , wherein the step 304 is formed by the second lower fin 303 extending beyond the first lower fin 302 and formed on the side of the heat dissipation fin assembly 30 . The horizontal mask of step 304 has a row of through holes 3040. At this time, the second joint portion on the surface of the fan cover 31 is a plurality of protrusions 312 corresponding to the through holes 3040. When riveting, referring to FIGS. 9B and 9C, the stud 312 is inserted into the through hole 3040 from the bottom surface of the heat dissipating fin assembly 30, and protrudes from above the through hole 3040 by a precision mold, and biases the stud 312 to deform it.

In addition, in the embodiment of the present invention, the fan cover 31 is made of a material having better thermal conductivity and is prepared by mechanical processing, such as aluminum, aluminum alloy, galvanized steel or stainless steel or the like to greatly enhance the heat conduction effect. In combination with the process of the existing plastic fan cover, it can be processed by hot pressing. When the fan cover made of plastic material is joined by the second joint portion and the first joint portion of the heat sink fin assembly, the two are fixed by hot melt.

The thin heat dissipation assembly for a thin notebook provided by the embodiment of the invention has the following advantages:

(1) The combination of the fan cover and the heat sink fin assembly is more secure. Conventional techniques use tape to hold both, and when the tape loses its tackiness, it tends to loosen both, but the fan cover of the present invention is clearly difficult to separate from the heat sink fin assembly unless subjected to a very large external force.

(2) Combining the heat sink fin assembly with the fan cover without using tape or adhesive, is advantageous for process automation and mass production.

(3) The fan cover and the heat sink fin assembly are not welded together, which can save cost and is more environmentally friendly.

(4) Greatly improve the heat conduction effect. In addition to the tape having poor thermal conductivity, the heat dissipating component of the present invention can also be changed to a material having good thermal conductivity. When using a thin notebook or other portable electronic device with limited heat dissipation space, the heat dissipating component of the present invention obviously has a better heat dissipation effect.

The present invention has been described above by way of a preferred example, but it is not intended to limit the spirit of the invention and the inventive subject matter. Those who are familiar with the technology can easily understand and utilize other components or methods to produce the same effect. Modifications made without departing from the spirit and scope of the invention are intended to be included within the scope of the appended claims.

1. . . Conventional heat sink

10. . . Cooling base

100. . . Locating slot

11. . . Fan group

110. . . Fan cover

111. . . fan

12. . . Conventional heat sink fin assembly

120. . . Locating slot

13. . . Heat pipe

14. . . tape

3. . . Heat dissipation structure

30. . . Heat sink fin assembly

301. . . Upper heat sink fin

302. . . First lower heat sink fin

303. . . Second lower heat sink fin

300. . . First accommodating slot

304. . . Step

3030. . . Sub gap

3020. . . Strip plate

305. . . Heat sink fin

306. . . Second receiving slot

3020a. . . Concave arc

311. . . Fork

3021. . . Fitting groove

312. . . Tab

31. . . Fan cover

314. . . Slot

313. . . The hook

3121. . . First V-shaped nick

3120. . . Fitted hole

315. . . Second V-shaped nick

3021. . . Folding

3040. . . Through hole

Figure 1 is a perspective view of a conventional heat sink;

2 is a schematic view showing a combination of a heat sink fin group and a fan cover;

3 is a heat dissipation structure for a thin type notebook according to an embodiment of the present invention;

4A is a rear perspective view of a heat sink fin assembly according to an embodiment of the present invention;

4B is a partial enlarged view of a heat sink fin assembly according to an embodiment of the present invention;

4C is a partial enlarged view showing the back surface of a heat dissipating fin assembly according to another embodiment of the present invention;

4D and 4E are partial enlarged views of the steps of the heat dissipation fin assembly of the embodiment of the present invention;

Figure 5A is a perspective view showing the back of the fan cover of the embodiment of the present invention;

FIG. 5B is a partial enlarged view of the fan cover of the embodiment of the present invention; FIG.

Figure 5C is a partial enlarged view of another embodiment of the fan cover of the present invention;

Figure 5D shows an embodiment of a stud on the fan cover of the present invention;

6A-6D are perspective views showing different embodiments of the strip-shaped flat plate of the heat-dissipating fin assembly of the present invention and the stud of the fan cover;

7A-7C are schematic views showing a perspective view and a riveting process of another embodiment of the heat sink fin assembly and the fan cover of the present invention;

8A-8C are a perspective view and a riveting flow diagram of another embodiment of the heat sink fin assembly and the fan cover of the present invention; and

9A-9C are a perspective view and a riveting flow diagram of still another embodiment of the heat sink fin assembly and the fan cover of the present invention.

3. . . Heat dissipation structure

30. . . Heat sink fin assembly

31. . . Fan cover

301. . . Upper heat sink fin

302. . . First lower heat sink fin

313. . . The hook

3020. . . Strip plate

312. . . Tab

305. . . Heat sink fin

Claims (17)

A thin heat dissipation structure for a notebook, comprising: a heat dissipation fin assembly, wherein the heat dissipation fin assembly is fastened to each other by a plurality of heat dissipation fins, at least some of the heat dissipation fins have a first joint portion; and a fan cover a plurality of second joint portions, the second joint portions are disposed on the surface of the fan cover, and corresponding to the first joint portions, the first joint portions are respectively riveted with the second joint portions Or hot melt to bond the heat sink fin assembly to the fan shroud. The heat dissipation structure of claim 1, wherein each of the first joint portions is a strip-shaped flat plate, and each of the second joint portions is a protrusion, a slot or a combination thereof. The heat dissipation structure of the second aspect of the invention, wherein the first joint portion is a flat plate, and the second joint portion is a protrusion, the strip plates are respectively inserted into the protrusions and the protrusions A gap is formed between the two, and an external force is applied to the protrusions, so that the strips are riveted together with the protrusions. The heat dissipation structure of claim 3, wherein the protrusions may be a cylinder or a square cylinder, and each of the strips has a concave arc on both sides thereof, so that the strip is from the second The side edges of the studs are inserted into the gap formed by the studs from top to bottom. The heat dissipation structure of claim 3, wherein the tops of the plurality of pillars have a first V-shaped indentation for deforming the pillars from both sides of the V-shaped notch when riveting Riveted with the strip plate. The heat dissipation structure of claim 2, wherein when the first joint portion is a flat plate and the second joint portion is a protrusion, each of the protrusions has a fitting hole on a side thereof, so that The strip-shaped flat plates are respectively embedded in the fitting holes of the protruding columns and riveted. The heat dissipation structure of claim 2, wherein when the first bonding portions are strip-shaped flat plates, protruding on the bottom surface of the heat dissipation fin assembly, and the second bonding portion is a slot, riveting In the same time, the heat dissipating fin assembly is combined with the fan cover from top to bottom, and the strip plates are inserted into the slots, and external forces are applied to the two sides of the slots, so that the front ends of the strips are riveted. Fastened in these slots. The heat dissipation structure of claim 7, wherein the second joint portion further comprises two second V-shaped scores respectively disposed adjacent to the two sides of the slot, and the socket is made when riveted The side wall is deformed to be riveted to the strip plate. The heat dissipation structure of claim 2, wherein the first bonding portion is a strip-shaped flat plate, and is protruded from the bottom surface of the heat dissipating fin assembly, and the second bonding portion includes a slot and a protrusion, the slot is disposed adjacent to each of the protrusions, and when riveting, the heat dissipation fin assembly is The strip cover is inserted into the slots, and the strips are inserted into the slots, and an external force is applied to the protrusions to cause the strips to be riveted together with the protrusions. The heat dissipation structure according to claim 7 or 9, wherein the front ends of the strip-shaped flat plates are matched with the opening size of the slot, and a folded portion is provided. The heat dissipation structure of claim 1, wherein the heat dissipation fin assembly comprises a first lower heat dissipation fin and a second lower heat dissipation fin, and the first and second lower heat dissipation fins Form a step. The heat dissipation structure of claim 11, wherein the step is formed on a bottom surface of the heat dissipation fin assembly, and the vertical surface of the step forms a row of sub-gap, and the front edge of the fan cover is provided with a plurality of teeth a fork, when the heat sink fin assembly is coupled to the fan cover, the forks are engaged in the row gap. The heat dissipation structure of claim 12, wherein the first joint portion is a strip-shaped flat plate extending from the step horizontal plane and protruding from the first lower heat sink fin side. The heat dissipation structure of claim 12, wherein the step further comprises a row of inlay grooves formed in the step level and intersecting the row gap, the fan cover The fork is slightly lower The fan cover surface is engaged in the fitting groove. The heat dissipation structure of claim 11, wherein the step extends from the second lower heat dissipation fin, and the step has a row of through holes formed in a horizontal plane of the step, and the second joint portion is a The protruding posts are disposed on the fan cover corresponding to the through holes, and the protruding posts are respectively inserted into the through holes when combined. The heat dissipation structure according to claim 1, wherein the fan cover is made of a heat conductive material and is formed by mechanical processing. The heat dissipation structure according to claim 1, wherein the fan cover is made of a plastic material and is prepared by hot pressing.