M303412 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種散熱裝置，特別是一種藉由銲 點之設計與發熱元件結合之散熱裝置。 【先前技術】 隨著電腦資訊等高科技產業的迅速發展，電腦内部 之電子元件，如中央處理單元（Central Processing Unit，CPU )、硬碟機（Hard Disk Drive，HDD )等處理 資料速度也越來越高。且電子元件的體積趨於微型化， 使得單位面積上的密集度也越來越高，相關電子元件所 產生之熱量亦隨之增加，如果熱量不及時排出的話，過 高的溫度將導致電子元件過熱，而嚴重影響到電腦設備 進行運作功能時的穩定性及效率，亦造成電子元件的壽 命縮短，因此必須於電腦裝置内部裝設適當的散熱裝 置，以協助電子元件進行散熱並降低溫度。 習知技術之散熱裝置，如散熱鰭片，係以黏膠黏設 於發熱元件上，以使散熱裝置以大面積範圍與發熱元件 相互結合，如此將可快速地逸散發熱元件運作時所產生 的大量熱能。另外，亦可於發熱元件之機體上開設固定 孔，並以螺絲等固定元件將散熱裝置固定於發熱元件 上，以有效達到發散發熱元件產生之熱量的目的。 由於發熱元件之整體溫度於進行運作時將快速上 升，停止運作後溫度立即下降，而使用黏膠材料做為發 5 M303412 熱=„裝置之結合介質，其黏膠本身將因長期處 溫環境及兩者之熱膨脹係數的不同，而產生老化疲 勞9見象$致散熱元件無法穩固地貼覆於發熱元件， 進而發生脫落的問題。 且目‘所見之電子元件的體積越趨微小，於微型 發熱元件之殼體上開設固定孔，使得微型發熱元件之彈 裕度降低而4成應力集中的問題，導致微型發執元件 極易遭受應力破壞，致使使用壽命大幅縮短。’”、 【新型内容】 目的在於提供一種散熱 裝置以黏膠材料或是於 將散熱裝置與發熱元件 容易脫落及發熱元件使 鑒於以上的問題，本創作之 衣置，藉以改良先前技術之散熱 赉熱元件上開設固定孔之方式， 相互結合，導致習用之散熱裴置 用壽命縮短的問題。 +剧作所揭露之散熱裝 …且 诉應用於一贫现兀件， =熱，設置於一電路板上，其中發熱元件之二 ，對應於接合部之另一側設有至少-接 ^賴^散熱農置包括有—主體、—第—連結部、 一：一連結部’其中散熱褒置之主 件之表面上，用以盥恭也—址 知…、凡 /、孓…、兀件進行熱交換，且第一連結 部係自主體對應於接人邱 、口 銲接结合，而n L 側延伸並與接合部 、部係自主體對應於第—連結部之 M303412 另一侧延伸而成，用以與電路板銲接結合。 本創作之功效在於藉由散熱裝置 熱元件相互銲接結合， U料 政…、衣置與發熱元件穩固地 不脫落，無須於發熱^件上開設固Μ洞， #用2下, 不到作之放熱裝置於長時間 使用之下，亦不易與發熱元件脫離。 以上之關於本新型内容之說明及以下之實施 之說明係用㈣範與解釋本新叙原理提. 型之專利申請範圍更進一步之解釋。 Μ、本新 【實施方式】 為使對本新型的目的、構造、特徵、及其功能有進 —步的瞭解’兹配合實施例詳細說明如下。 卜、3本創作所揭露之散熱裝置，在以下本創作的詳 將以散熱鰭片做為本創作之最佳實施例。然 ^所附圖式僅提供參考與說日㈣，並非用職制本創、 ^第1圖」至「第3Β圖」所示，本創作所揭$ 貫施例之散熱裝f _係應用於一設置於電路 倍二土之發熱元件谓，本創作所述之發熱元件200 二衣设於電子設備中且散發高熱能之電子元件，例如 Ί乳化物半導體（Metal。仙伽，Μ 斤以成之微型電子元件，其發熱元件200之一側設有一 M303412 接，部210，而對應於接合部21〇之發熱元件另一 側設有至少-接腳22〇。本創作之散熱裝置】⑽包括有 -主體110、-第一連結部12〇、及一第二連結部咖， 其令主體110係設置於發熱元件細之表面上，以大面 積範圍與發熱元件200相互接觸並進行熱交換，而可快 速逸散發熱元件200所產生之大量熱能，且自主體11〇 對應於接合部21〇之—側所延伸形成之第—連結部 120, ^用以與發熱元件2〇〇之接合部21〇相互銲接結 合，而第二連結部13〇係自主體11〇對應於第一連結部 120之另一侧延伸而成，並與電路板3〇〇銲接結合，°以 使散熱裝i 1GG穩固地結合於發熱^件2⑽上而不脫 落。 請繼續參閱「第i圖」至「第3B圖」，其中於散熱 裝置100之主體110與發熱元件2〇〇之間更塗佈有一黏 性材料400’以使散熱裝置100與發熱元件2〇〇更穩'固 地相互結合，而本創作所揭露之黏性材料4 〇 〇係為二散 熱貧，將更加提升散熱裝置1〇〇逸散發熱元件2〇〇熱量 之效果。 μ 斤如「第4圖」至「第6Β圖」所示，本創作所揭露 之第二實施例之散熱裝置100係應用於一設置於電路 板300上之發熱元件2〇〇，本創作所述之發熱元件 係指裝設於電子設備中且散發高熱能之電子元件，例如 金屬氧化物半導體（Metal oxide Semiconductor，M〇s ) M303412 所製成之微型電子元件，其發熱元件2〇〇之一側設有一 接合部210，而對應於接合部21〇之發熱元件另一 側設有至少-接腳細。本創作之散熱裝置⑽包括有 -主體no、-第-連結部120、及一第二連結部13〇, 其中主體110係設置於發熱元件200之表面上，以大面 積靶圍與發熱兀件200相互接觸並進行熱交換，而可快 速逸散發熱元件200所產生之大量熱能，且自主體ιι〇 對應於接合部210之一側所延伸形成之第一連站部 wo，係用以與發熱元件200之接合部21〇相互銲=二 合，而第二連結部130係自主體11〇對應於第一連結部 120之另一侧延伸而成，在不影響發熱元件之訊號 傳輸的前提之下，第二連結部13〇與發熱元件2〇〇之其 中一接腳220相互銲接結合，以使散熱裝置1〇〇穩固地 結合於發熱元件200上而不脫落。且，更可於散熱裝置 100之主體110與發熱元件2〇〇之間塗佈一黏性材料 7〇,而本創作之黏性材料400係為一散熱膏，將更加 提升政熱I置100之結合性及逸散發熱元件2⑼熱量之 效果。 與習用之散熱裝置相較，本創作所揭露之散熱裝置 係利用兩連結部與發熱元件銲接結合，以使散熱裝置與 發熱兀件穩固地結合，不須於發熱元件上開設固定孔 洞，且散熱裝置不易脫落。 雖然本創作之貫施例揭露如上所述，然並非用以限 9 M303412 定本創作4壬何熟習相關技藝者，在不脫離本創作之 神和辄圍π，舉凡依本創作中請範該述之形狀、構 造=徵及精神當可做些許之變更，因此本創作之專利 ^蒦耗圍須視本說明書所附之中請專利範圍所界定者M303412 VIII. New description: [New technical field] This creation is about a heat sink, especially a heat sink combined with a heating element by the design of the solder joint. [Prior Art] With the rapid development of high-tech industries such as computer information, the electronic components inside the computer, such as the Central Processing Unit (CPU), Hard Disk Drive (HDD), etc. The higher it is. Moreover, the volume of the electronic components tends to be miniaturized, so that the density per unit area is also higher and higher, and the heat generated by the related electronic components is also increased. If the heat is not discharged in time, the excessive temperature will cause the electronic components. Overheating, which seriously affects the stability and efficiency of computer equipment during operation, and also shortens the life of electronic components. Therefore, appropriate heat sinks must be installed inside the computer equipment to help the electronic components dissipate heat and lower the temperature. The heat dissipating device of the prior art, such as the heat dissipating fin, is adhered to the heating element by adhesive, so that the heat dissipating device is combined with the heating element in a large area, so that the heat generating element can be quickly dissipated and generated when the heating element is operated. A lot of heat. In addition, a fixing hole may be formed in the body of the heating element, and the heat dissipating device may be fixed to the heating element by a fixing member such as a screw to effectively dissipate heat generated by the heating element. Since the overall temperature of the heating element will rise rapidly during operation, the temperature immediately drops after the operation is stopped, and the adhesive material is used as the bonding medium of the 5 M303412 heat=„device, and the adhesive itself will be due to the long-term temperature environment and The difference in thermal expansion coefficient between the two causes aging fatigue. 9 The heat-dissipating component cannot be firmly attached to the heating element, and the problem of falling off occurs. The volume of the electronic component seen in the eye is smaller and smaller. A fixing hole is formed in the shell of the component, so that the elastic margin of the micro-heating component is lowered and the stress concentration is 40%, which causes the micro-issuing component to be easily damaged by stress, resulting in a greatly shortened service life. '", [New content] The purpose of the present invention is to provide a heat dissipating device for adhesive material or to easily dissipate the heat dissipating device and the heat generating component and to heat the component. In view of the above problems, the garment of the present invention is modified to provide a fixing hole in the heat dissipating heat element of the prior art. The way, combined with each other, leads to the problem of shortening the life of the conventional heat dissipation device. +The heat sink that is exposed in the drama...and the complaint is applied to a poor condition, = heat, placed on a circuit board, wherein the second of the heating elements corresponds to the other side of the joint with at least ^The heat-dissipating farm includes the main body, the first-connecting part, and the other: a connecting part on the surface of the main part of the heat-dissipating device, for the purpose of 盥 也 — 址 址 址 、 、 、 、 、 、 、 、 、 、 、 、 、 The heat exchange is performed, and the first connecting portion is joined to the other side from the main body corresponding to the joint, and the n L side is extended and the joint portion and the portion are extended from the other side of the M303412 corresponding to the first connecting portion. For welding with circuit boards. The effect of this creation is that the heat elements of the heat sink are welded to each other, and the U-materials, the clothes and the heating elements are not detached stably, and it is not necessary to open a solid hole in the heat-generating parts. The heat release device is also not easily detached from the heat generating component under long-term use. The above description of the novel content and the following description of the implementation of the invention are based on (4) and explain the scope of the patent application.实施 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本Bu, 3 The heat sink disclosed in this creation, in the following details of the creation of the heat sink fins as the best embodiment of the creation. However, the figure is only for reference and day (4), not for the purpose of the creation, ^1 to "3", the creation of the heat dissipation device f _ is applied to A heating element disposed in the circuit of the second earth, the heating element 200 of the present invention is provided in an electronic device and emits high-heat electronic components, such as a bismuth emulsion semiconductor (Metal. The microelectronic component has one M303412 connection portion 210 on one side of the heating element 200, and at least a pin 22〇 on the other side of the heating element corresponding to the joint portion 21〇. The heat dissipation device of the present invention (10) includes The main body 110, the first connecting portion 12A, and the second connecting portion are disposed on the thin surface of the heat generating component to contact the heat generating component 200 in a large area and exchange heat. Moreover, a large amount of thermal energy generated by the heating element 200 can be quickly dissipated, and the first connecting portion 120 formed from the main body 11 〇 corresponding to the side of the joint portion 21 , is used for the joint portion with the heating element 2 21〇 is welded to each other, and the second joint 13 The raft is formed from the main body 11 〇 corresponding to the other side of the first joint portion 120 and is welded to the circuit board 3 so that the heat sink i 1GG is firmly coupled to the heat generating member 2 (10) without falling off. Please continue to refer to "i" to "3B", wherein a viscous material 400' is further applied between the main body 110 of the heat sink 100 and the heat generating component 2'' to enable the heat sink 100 and the heat generating component 2 〇〇 稳 ' 固 固 固 固 固 固 固 固 固 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , As shown in FIG. 4 to FIG. 6 , the heat dissipating device 100 of the second embodiment disclosed in the present application is applied to a heat generating component 2 disposed on the circuit board 300. The component refers to an electronic component that is mounted in an electronic device and emits high thermal energy, such as a microelectronic component made of a metal oxide semiconductor (M〇s) M303412, and one side of the heating element 2 There is a joint 210, which corresponds to the joint The other side of the heating element of the joint portion 21 is provided with at least a thin pin. The heat sink (10) of the present invention includes a main body no, a first connecting portion 120, and a second connecting portion 13, wherein the main body 110 is The heat generating component 200 is disposed on the surface of the heat generating component 200 to contact the heat generating component 200 to exchange heat with each other, so that a large amount of heat energy generated by the heat generating component 200 can be quickly dissipated, and the main body ι corresponds to the joint portion 210. The first connecting portion wo formed on one side is used for mutual welding with the joint portion 21 of the heat generating component 200, and the second connecting portion 130 is corresponding to the first connecting portion 120 from the main body 11〇. The other side is extended, and the second connecting portion 13〇 and one of the pins 220 of the heating element 2 are welded to each other without affecting the signal transmission of the heating element, so that the heat sink 1〇〇 It is firmly bonded to the heat generating component 200 without falling off. Moreover, a viscous material 7 涂布 can be applied between the main body 110 of the heat dissipating device 100 and the heating element 2 〇, and the viscous material 400 of the present invention is a thermal grease, which will further enhance the political heat. The combination and the effect of dissipating the heat of the heating element 2 (9). Compared with the conventional heat dissipating device, the heat dissipating device disclosed in the present invention uses two connecting portions to be welded and combined with the heat generating component, so that the heat dissipating device and the heat generating device are firmly combined, and the fixing hole is not required to be formed on the heating element, and the heat dissipating is not required. The device is not easy to fall off. Although the application of this creation is as described above, it is not intended to limit the creation of 4 M303412. If you are familiar with the relevant art, you should not be divorced from the creation of the god and the π π, Shape, structure = levy and spirit can be changed a little, so the patent of this creation must be defined by the scope of the patent attached to this specification.
為準D 【圖式簡單說明】 ^1圖為本創作第—實施例之分解示意圖； :圖為本創作第一實施例之立體示意圖； =3 Α圖為本創作第一實施例之側視圖； =B圖為本創作第一實施例之側視圖； :4圖為本創作第二實施例之分解示意圖； =5圖為本創作第二實施例 之立體示意圖；The following is a schematic view of the first embodiment of the creation; the figure is a perspective view of the first embodiment of the creation; =B is a side view of the first embodiment of the creation; 4 is an exploded view of the second embodiment of the creation; =5 is a perspective view of the second embodiment of the creation;
:6A圖為本創作第二實施例之侧視圖；以及 弟6B圖為本創作第二實 100 110 120 130 2〇〇 210 220 300 主要元件符號說明】 散熱裝置 主體 第一連結部 第二連結部 發熱元件 接合部 接腳 電路板 10 M303412 400 黏性材料6A is a side view of the second embodiment of the creation; and the second part of the creation is the second real 100 110 120 130 2〇〇210 220 300 main component symbol description] heat sink main body first joint second joint Heating element joint pin circuit board 10 M303412 400 Adhesive material
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