M302222 八、新型說明： 【新型所屬之技彳标領域】 本創作是有關於一種印刷電路軟硬複合板結構改 良，尤指一種可使軟硬複合板具有較佳之使用特性’ 並同時達到易於製作及大幅降低軟硬複合板之製作成 本者。 【先前技#?】 按，一般之軟硬複合印刷電路板，其軟板部分係 包括有一絕緣基材，該絕緣基材可使用聚乙醯氨 (polymide，PI)、聚酯（polyester，PET)、聚 2,6-奈二甲 酸乙二醋（polyethylene_2,6-naphthalatc，PEN)或聚硫化 亞苯（polyphenylene sulfide，PPS)…等化學材料；一銅 箔及鍍銅線路層，係以顯影蝕刻方式形成，並與絕緣 基材之一面黏合；一覆蓋層，該覆蓋層可使用PI、PET 材質之Coverlay或綠漆油墨，係形成覆蓋於該鑛銅層 及絕緣基材表面；裸露於覆蓋層及硬板區之銅線路， 可以鐘鎳金、鍵錫、鑛銀等表面處理。藉以構成一軟 硬複合印刷電路板之軟板結構。 但是以上述之結軟板構而言，不但製作程序繁 複’且若絕緣基材以聚酯（polyester，PET)、聚2,6-奈 二甲酸乙二酯（p〇lyethylene-2,6-naphthalatc，PEN)或聚 硫化亞苯（polyphenylene sulfide，PPS)作為材料時，其 M3 02222 進行顯影㈣製程之可靠性較差，因此，為求顯 刻製程之可靠性，其絕绫其好如比杜 、〜敍 非I /、七緣基材一般皆使用聚乙醉 (p〇lymide ’ PI)為材料，故，使得製作成本增加。 【新型内容】 本創作之主要目的係在於，可藉由以至少一表面 設置覆蓋層之玻璃纖維布基板（FR4)構成之軟板單 元，使軟硬複合板具有較佳之使㈣性，並同時達二 易於製作及大幅降低軟硬複合板之製作成本。 為達上述之目的，本創作係一種印刷電路軟硬複 合板，構改良’包含-軟板單元係具有至少—表面設 置覆蓋層之玻璃纖維布基板（FR4);設置於覆蓋層上之 結合層；以及至少設於軟板單元—側之硬板單^，該 硬板單元具有-層疊於結合層上之硬基板，該硬基板 之-面係具有多數覆蓋有防焊油墨之導體，且硬基板 上儀具有多數貫穿硬板單元、結合層及軟板單元之穿 孔，該穿孔之二端孔緣及内孔壁係延伸設有一導通部。 【實施方式】 請參閱『第1圖』所示，係本創作第一實施例之 剖面狀態示意圖。如圖所示：本創作係一種印刷電路 軟硬複合板結構改良’其至少係由一軟板單元i、結 合層2以及硬板單元3、3a所構成，可使軟硬複合板 M302222 具有較佳之使用特性’並同時達到易於製作及大幅降 低軟硬複合板之製作成本。 上述所提之軟板單元丨係具有一玻璃纖維布基板 (FR4)11，該玻璃纖維布基板u之厚度係介於 0.05mm〜0.5mm之間，且該玻璃纖維布基板u之二表 面係設有覆蓋層12、12a，該覆蓋層12、12a至少係由 聚乙醯氨（PI)材質薄膜、防焊油墨及膠片所構成，且該 覆蓋層12、12a係局部、全部或向内延伸〇〜5〇mm覆 蓋於玻璃纖維布基板11上，並於該玻璃纖維布基板 11與覆蓋層12、12a之間係具有多數導體13,該多數 導體13係可為銅或鍵銅。 該結合層2係設置於上述軟板單元之覆蓋層12、 12a上，该結合層2係可為純膠（B〇NDING FILM或 BONDING SHEET)或玻璃纖維布膠片（pREpREG)。 該硬板單元3、3a至少設於上述軟板單元丨之二 側，該硬板單元3、3a係具有一層疊於結合層2上之 硬基板31、31a，該硬基板31、31a可為FR4、FR5、 CEM3及一般印刷電路板材質，且該硬基板31、Ma 之一面上係具有多數為銅或錢銅導體32、32a，該導 體32、32a係覆蓋有防焊油墨33、33a，且該硬基板 31、31a上係具有多數貫穿硬板單元3、3a、結合層2 及軟板單元1之穿孔34、34a，該穿孔34、34a之二端 孔緣及内孔壁係延伸設有一導通部35、35a，該導通 M302222 部35、35a係可為銅或鍍銅。如是，藉由上述之結構 構成一全新之印刷電路軟硬複合板結構改良。 請參閱『第2圖』所示，係本創作第二實施例之 剖面狀態示意圖。如圖所示：本創作軟板單元1之玻 璃纖維布基板11二面係可分別設置一覆蓋層12、 12a，該覆蓋^ 12、12a係可局部或全部覆蓋於玻璃纖 維布基板11上，而該玻璃纖維布基板11與覆蓋層12、 12a之間係具有多數導體13，且該覆蓋層i2、i2a上 係分別設置結合層2，並於該軟板單元丨之一側（可依 所需選擇左侧或右側）設置一硬板單元3，該硬板單元 3係具有一層疊於結合層2上之硬基板31、31a，且該 硬基板31、31a之一面上係具有多數為銅或鍍銅導體 32，該導體32係覆蓋有防焊油墨33，且該硬基板31 上係具有多數貫穿硬板單元3、結合層2及軟板單元j 之牙孔34，該穿孔34之二端孔緣及内孔壁係延伸設 有一導通部35，如此，構成另一型態之軟硬複合板， 以符合實際使用時之所需。 請參閱『第3圖』所示，係本創作第三實施例之 口’J面狀態示意圖。如圖所示：本創作軟板單元1之玻 璃纖維布基板11二面係可分別設置一覆蓋層i 2、 Ua’該覆蓋層12、12a係可局部或全部覆蓋於玻璃纖 維布基板11上，而該玻璃纖維布基板u與覆蓋層12、 12a之間係具有多數導體13，且該覆蓋層12之一面上 M3 02222 係具有一結合層2，並於該軟板單元1之一側（可依所 需選擇左侧或右侧）設置一硬板單元3，該硬板單元3 係具有一層疊於結合層2上之硬基板31，且該硬基板 31之一面上係具有多數為銅或鍍銅導體32,該導體 32係覆蓋有防焊油墨33，且該硬基板31上係具有多 數貫穿硬板單元3、結合層2及軟板單元1之穿孔34, 該穿孔34之二端孔緣及内孔壁係延伸設有一導通部 35，如此，構成另一型態之軟硬複合板，以符合實際 使用時之所需。 請參閱『第4圖』所示，係本創作第四實施例之 剖面狀恶示意圖。如圖所示：本創作軟板單元1之玻 璃纖維布基板11二面係可分別設置一覆蓋層12、 12a，該覆蓋層12、12a係可局部或全部覆蓋於玻璃纖 維布基板Π上，而該玻璃纖維布基板U與覆蓋層12、 12a之間係具有多數導體13，且該覆蓋層12之一面上 係具有一結合層2，並於該軟板單元丨之二側分別設 置一硬板單元3、3a，而該硬板單元3、3a係具有一層 疊於結合層2上之硬基板31，各硬基板31之一面上 係具有多數為銅或鍍銅導體32、32a，該導體32、32a 係覆蓋有防焊油墨33、33a，且該硬基板31上係具有 夕數貝牙硬板單元3、3a、結合層2及軟板單元1之 牙孔34、34a ’該穿孔34、34a之二端孔緣及内孔壁係 延伸設有一導通部35、35a，如此，構成另一型態之 M3 02222 軟硬複合板，以符合實際使用時之所需。 綜上所述，本創作印刷電路軟硬複合板結構改良 可有效改善習用之種種缺點，可藉由以至少一表面設 置覆蓋層之破璃纖維布基板（FR4)構成之軟板單元，使 軟硬複合板具有較佳之使用特性，並同時達到易於製 作及大幅降低軟硬複合板之製作成本，進而使本創作 之f生能更進步、更實用、更符合使用者之所須，確 已符合創作專利申請之要件，爰依法提出專利申請。 惟以上所述者，僅為本創作之較佳實施例而已， 當不能以此限定本創作實施之範圍；故，凡依 申，：利範圍及創作說明書内容所: 化與修飾’皆應仍屬本創作專利涵蓋之範圍内。" M3 02222 【圖式簡單說明】 S 1圖係本創作第—實施例之剖面狀態示意圖。 第2圖，係本創作第二實施例之剖面狀態示意圖。 第3圖’係本創作第三實施例之剖面狀態示意圖。 第4圖，係本創作第四實施例之剖面狀態示意圖。 【主要元件符號說明】 軟板單元1 玻璃纖維布基板11 覆蓋層12、12a 導體13 結合層2 硬板單元3、3a 硬基板31、31a 導體32、32a 防焊油墨33、33a 穿孔34、34a 導通部35、35aM302222 VIII. New description: [New technology belongs to the standard field] This creation is about a kind of improvement of the soft and hard composite board structure of printed circuit, especially a kind of soft and hard composite board which has better use characteristics' and at the same time easy to make And significantly reduce the production cost of soft and hard composite panels. [Previous technology #?] According to the general soft and hard composite printed circuit board, the soft board part includes an insulating substrate, which can use polymide (PI), polyester (polyester, PET). ), chemical materials such as polyethylene-2,6-naphthalatc (PEN) or polyphenylene sulfide (PPS); a copper foil and copper-plated circuit layer for development The etching method is formed and adhered to one surface of the insulating substrate; a covering layer can be formed by using a coverlay or a green lacquer ink of PI or PET to cover the surface of the copper ore and the insulating substrate; The copper circuit of the layer and the hard plate area can be surface treated with nickel nickel, key tin, ore silver. Thereby forming a soft board structure of a soft and hard composite printed circuit board. However, in terms of the above-mentioned soft board structure, not only the manufacturing process is complicated, but if the insulating substrate is made of polyester (PET), polyethylene-2,6-naphthalate (p-lyethylene-2,6- When naphthalatc, PEN) or polyphenylene sulfide (PPS) is used as the material, the reliability of M3 02222 for development (4) is poor. Therefore, in order to find the reliability of the process, it is better than Dudu. , ~ Syrian I /, seven-edge substrate generally use polyether (p〇lymide 'PI) as a material, so the production costs increase. [New content] The main purpose of the present invention is to make the soft and hard composite board have better (four) properties by using a soft fiber unit composed of a glass fiber cloth substrate (FR4) having at least one surface covering layer. D2 is easy to manufacture and greatly reduces the manufacturing cost of soft and hard composite panels. For the above purposes, the present invention is a printed circuit soft and hard composite board, which is modified to include a fiberglass cloth substrate (FR4) having at least a surface covering layer and a bonding layer disposed on the covering layer. And a hard board unit disposed at least on the side of the flexible board unit, the hard board unit having a hard substrate laminated on the bonding layer, the surface of the hard substrate having a plurality of conductors covered with solder resist ink, and hard The substrate has a plurality of through holes extending through the hard plate unit, the bonding layer and the soft board unit, and the two end holes and the inner hole wall of the through hole are extended with a conducting portion. [Embodiment] Please refer to Fig. 1 for a schematic view of the cross-sectional state of the first embodiment of the present invention. As shown in the figure: This creation is a kind of improvement of the soft and hard composite board structure of printed circuit. It is composed of at least one soft board unit i, bonding layer 2 and hard board unit 3, 3a, which can make the soft and hard composite board M302222 Good use characteristics 'At the same time, it is easy to manufacture and greatly reduce the production cost of soft and hard composite boards. The soft board unit described above has a glass fiber cloth substrate (FR4) 11 having a thickness of between 0.05 mm and 0.5 mm, and the surface of the glass fiber cloth substrate u is A cover layer 12, 12a is provided, the cover layer 12, 12a is at least composed of a film of polyethylene phthalamide (PI), solder resist ink and film, and the cover layer 12, 12a is partially, wholly or inwardly extended. 〇~5〇mm covers the glass fiber cloth substrate 11, and a plurality of conductors 13 are provided between the glass fiber cloth substrate 11 and the cover layers 12 and 12a. The plurality of conductors 13 may be copper or copper. The bonding layer 2 is disposed on the cover layers 12, 12a of the soft board unit, and the bonding layer 2 may be pure rubber (B〇NDING FILM or BONDING SHEET) or glass fiber cloth film (pREpREG). The hard board units 3, 3a are disposed on at least two sides of the flexible board unit ,, and the hard board units 3, 3a have a hard substrate 31, 31a laminated on the bonding layer 2, and the hard boards 31, 31a may be FR4, FR5, CEM3 and general printed circuit board materials, and one of the hard substrates 31, Ma has a plurality of copper or copper conductors 32, 32a on one side, and the conductors 32, 32a are covered with solder resist inks 33, 33a, The hard substrate 31, 31a has a plurality of through holes 34, 34a extending through the hard plate unit 3, 3a, the bonding layer 2 and the flexible board unit 1. The two end holes and the inner hole wall of the through holes 34, 34a are extended. There is a conductive portion 35, 35a, which may be copper or copper plated. If so, the above structure constitutes a new printed circuit soft and hard composite board structure improvement. Referring to Fig. 2, there is shown a schematic sectional view of the second embodiment of the present invention. As shown in the figure, a cover layer 12, 12a may be respectively disposed on the two sides of the glass fiber cloth substrate 11 of the present flexible board unit 1, and the cover 12, 12a may be partially or completely covered on the glass fiber cloth substrate 11, A plurality of conductors 13 are disposed between the glass fiber cloth substrate 11 and the cover layers 12 and 12a, and the bonding layer 2 is disposed on the cover layers i2 and i2a, respectively, and is disposed on one side of the flexible board unit. A hard board unit 3 is disposed on the left side or the right side, and the hard board unit 3 has a hard substrate 31, 31a laminated on the bonding layer 2, and the hard substrate 31, 31a has a majority of copper on one side. Or a copper-plated conductor 32, the conductor 32 is covered with a solder resist ink 33, and the hard substrate 31 has a plurality of dental holes 34 extending through the hard plate unit 3, the bonding layer 2 and the soft board unit j, and the second hole 34 The end hole edge and the inner hole wall are extended with a conducting portion 35, thus constituting another type of soft and hard composite plate to meet the needs of actual use. Please refer to the "Fig. 3", which is a schematic view of the state of the mouth of the third embodiment of the present creation. As shown in the figure: the glass fiber cloth substrate 11 of the present flexible board unit 1 can be respectively provided with a cover layer i 2, Ua'. The cover layers 12, 12a can partially or completely cover the glass fiber cloth substrate 11 And the glass fiber cloth substrate u and the cover layer 12, 12a have a plurality of conductors 13, and one surface of the cover layer 12 has a bonding layer 2 on one side of the cover layer 12, and is on one side of the flexible board unit 1 ( A hard board unit 3 having a hard substrate 31 laminated on the bonding layer 2 and having a majority of copper on one side of the hard board 31 may be disposed on the left side or the right side. Or a copper-plated conductor 32, the conductor 32 is covered with a solder resist ink 33, and the hard substrate 31 has a plurality of through holes 34 extending through the hard board unit 3, the bonding layer 2 and the flexible board unit 1, the two ends of the through hole 34 The hole edge and the inner hole wall are extended with a conducting portion 35, thus constituting another type of soft and hard composite plate to meet the needs of actual use. Please refer to Fig. 4, which is a cross-sectional view of the fourth embodiment of the present invention. As shown in the figure, a cover layer 12, 12a may be respectively disposed on the two sides of the glass fiber cloth substrate 11 of the original flexible board unit 1, and the cover layers 12, 12a may be partially or completely covered on the glass fiber cloth substrate. A plurality of conductors 13 are disposed between the glass fiber cloth substrate U and the cover layers 12 and 12a, and a cover layer 2 is disposed on one side of the cover layer 12, and a hard layer is respectively disposed on two sides of the flexible board unit The board unit 3, 3a, and the hard board unit 3, 3a has a hard substrate 31 laminated on the bonding layer 2, and each of the hard substrates 31 has a plurality of copper or copper-plated conductors 32, 32a on one side thereof. 32, 32a are covered with solder resist inks 33, 33a, and the hard substrate 31 is provided with scalloped hard plate units 3, 3a, bonding layer 2 and the apertures 34, 34a of the soft board unit 1 'the perforations 34 The two end hole edges of the 34a and the inner hole wall are extended with a conducting portion 35, 35a. Thus, another type of M3 02222 soft and hard composite plate is formed to meet the needs of actual use. In summary, the improved structure of the soft and hard composite board of the printed circuit can effectively improve various disadvantages of the conventional use, and can be softened by a soft board unit composed of a glass fiber cloth substrate (FR4) provided with at least one surface covering layer. The hard composite board has better use characteristics, and at the same time, it is easy to manufacture and greatly reduce the manufacturing cost of the soft and hard composite board, so that the creation of the creation can be more advanced, more practical, and more suitable for the user. The requirements for the creation of a patent application shall be filed in accordance with the law. However, the above is only the preferred embodiment of the present invention, and it is not possible to limit the scope of the creation of the creation; therefore, the scope of the application, the scope of the profit and the content of the creation manual should be It is within the scope of this creation patent. " M3 02222 [Simplified illustration of the schema] The S 1 diagram is a schematic diagram of the cross-sectional state of the first embodiment of the present invention. Fig. 2 is a schematic cross-sectional view showing the second embodiment of the present invention. Fig. 3 is a schematic cross-sectional view showing the third embodiment of the present creation. Fig. 4 is a schematic cross-sectional view showing the fourth embodiment of the present invention. [Description of main component symbols] Soft board unit 1 Glass fiber cloth substrate 11 Cover layer 12, 12a Conductor 13 Bonding layer 2 Hard board unit 3, 3a Hard board 31, 31a Conductor 32, 32a Solder resist ink 33, 33a Perforation 34, 34a Conduction portions 35, 35a
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