M302 l9l4^W〇c/e 八、新型說明： 【新型所屬之技術領域】 本創作是有關於一種檢測晶圓盒(p0D)之晶圓固定 構(wafer lock)是否異常的裝置，且特別是有關於一種可偵 測不同種類晶圓盒的晶圓盒之晶圓固定機構檢測裝置。、 【先前技術】 半導體晶圓一般是藉由具有迷你環境的晶圓盒進行傳 送，特別是目前的晶圓隔離進出料技術已經因應〇13)11如 及更微細線寬製程需求而發展出所謂的標準化機械介面 (Standard Mechanical Interface，簡稱 SMIF)生產方式。在 常見的標準化機械介面中，晶圓通常是放置於晶舟内，再 由晶圓盒包覆晶舟，如此可達到具有最潔淨環境之空間， 同時可避免半導體基底的表面受到微粒、空氣等污染，使 這些aa圓在傳輸、儲存與製程期間是被完全隔離的。 圖1是習知的一種標準化機械介面(SMIF)晶圓盒與晶 圓的立體分解圖，圖2則是圖1之箭頭方向的晶圓盒之晶 圓固定機構與晶圓的組裝透視圖。 請參照圖1，習知的晶圓盒1〇〇包括一個底座1〇2與 一個蓋體104，蓋體104是覆蓋於底座1〇2上方且可扣鎖 地蓋合底座102。為了移動方便，前述蓋體1〇4的外面會 設有把手106。此外，在蓋體1〇4的内側會設有一個晶圓 固定機構108，用來防止固定晶圓盒1〇〇内部的晶圓。目 前的晶圓固定機構108具有固定於蓋體1〇4内壁的一個第 一結構件110、一個藉由活動支架（未繪示)連接至第一結構 M302W18/fdoc/e 件yo的第二結構件112矛口一個與第二結構件ii2結合並 向盍體1〇4中央凸出的固定件114，且於第二結構件112 的下端還有滑輪116。當裝有晶圓118的晶舟12()被放置 在曰^圓=1〇〇的底座102上’並將蓋體1〇4與底座1〇2扣 合時，前述晶圓固定機構1〇8會如圖2般作動。 請參照圖2，當蓋體104與底座1〇2扣合時，晶圓固 定機構108中的第二結構件112下端的滑輪116會被底座 102頂起，而藉著活動支架124的移動向載有晶圓的 晶舟120移動。如此一來，與第二結構件112結合的固定 件H4會被帶動而接近晶圓118，進而頂住晶圓118不使 其滑動。之後’可將裝有晶圓118的晶圓盒1〇〇進行傳輸、 儲存或者各項製程。 然而’晶圓盒内的晶圓固定機構如果沒有組裝好甚至 ，裝反時，容易打到晶圓而產生破片。因此亟需在使用晶 圓盒裝載晶圓之前，對晶圓盒内的晶圓固定機構進行檢 ’貝J。尤其疋當晶圓盒的改良曰新月異，常有同時使用不同 口又计規格之晶圓盒的情形，要如何將擁有不同晶圓固定機 構的晶圓盒之檢測整合於同一種檢測裝置，已成為標準化 機械介面(SMIF)生產方式的改良目標之一。 【新型内容】 本創作的目的就是在提供一種晶圓盒之晶圓固定機構 檢測裝置，可防止因晶圓固定機構異常所造成的破片問題。 本創作的再一目的是提供一種晶圓盒之晶圓固定機構 檢測裝置，可在單一裝置中檢測具有數種不同規格的晶圓 6 M3021148wf^ 盒之晶圓固定機構。 職本創作提出一種晶圓盒之晶圓固定機構(wafer lock)檢M302 l9l4^W〇c/e VIII. New description: [New technical field] This creation is about a device for detecting whether the wafer lock of the wafer cassette (p0D) is abnormal, and especially A wafer fixing mechanism detecting device for a wafer cassette that can detect different types of wafer cassettes. [Prior Art] Semiconductor wafers are generally transferred by a wafer cassette with a mini environment. In particular, the current wafer isolation input and discharge technology has developed so-called 13) 11 and more fine line width process requirements. Standardized Mechanical Interface (SMIF) production method. In the common standardized mechanical interface, the wafer is usually placed in the wafer boat, and then the wafer cassette is wrapped by the wafer cassette, so that the space with the cleanest environment can be achieved, and the surface of the semiconductor substrate can be prevented from being affected by particles, air, etc. Contamination makes these aa circles completely isolated during transmission, storage and processing. 1 is an exploded perspective view of a conventional standardized mechanical interface (SMIF) wafer cassette and a wafer, and FIG. 2 is an assembled perspective view of the wafer holding mechanism and wafer of the wafer cassette of FIG. Referring to FIG. 1, the conventional wafer cassette 1A includes a base 1〇2 and a cover 104. The cover 104 covers the base 1〇2 and snaps the base 102. For the convenience of movement, a handle 106 is provided on the outside of the cover body 1〇4. Further, a wafer fixing mechanism 108 is provided inside the cover 1〇4 for preventing the wafer inside the wafer cassette 1 from being fixed. The current wafer fixing mechanism 108 has a first structural member 110 fixed to the inner wall of the cover 1〇4, and a second structure connected to the first structure M302W18/fdoc/e member yo by a movable bracket (not shown). The member 112 has a fixing member 114 which is combined with the second structural member ii2 and protrudes toward the center of the body 1〇4, and has a pulley 116 at the lower end of the second structural member 112. When the wafer boat 12 () on which the wafer 118 is mounted is placed on the base 102 of the circle = 1 ' ' and the cover 1 〇 4 is engaged with the base 1 〇 2, the wafer fixing mechanism 1 〇 8 will act as shown in Figure 2. Referring to FIG. 2, when the cover 104 is engaged with the base 1 〇 2, the pulley 116 at the lower end of the second structural member 112 in the wafer fixing mechanism 108 is lifted by the base 102, and the movement of the movable bracket 124 is moved. The wafer boat 120 carrying the wafer moves. As a result, the fixture H4 coupled to the second structural member 112 is brought into proximity to the wafer 118, thereby holding the wafer 118 from sliding. Thereafter, the wafer cassette containing the wafer 118 can be transferred, stored, or processed. However, if the wafer fixing mechanism in the wafer cassette is not assembled or even mounted, it is easy to hit the wafer and generate fragments. Therefore, it is not necessary to inspect the wafer fixing mechanism in the wafer cassette before loading the wafer using the wafer cassette. Especially when the improvement of the wafer cassette is changing with each passing day, it is often the case that the wafer cassette with different sizes and specifications is used at the same time, how to integrate the detection of the wafer cassette with different wafer fixing mechanisms into the same detecting device. It has become one of the improvement goals of the standardized mechanical interface (SMIF) production method. [New Content] The purpose of this creation is to provide a wafer holder fixing mechanism detection device that can prevent fragmentation problems caused by abnormalities in the wafer fixing mechanism. A further object of the present invention is to provide a wafer cassette fixing mechanism detecting device capable of detecting a wafer fixing mechanism having a plurality of different specifications of a wafer 6 M3021148wf^ box in a single device. The job creation proposes a wafer lock inspection of the wafer cassette
Hi ’適於檢測不同規格的晶圓盒。這種檢測裝置包括 測台…個盒規格判別器、數個位置感測器組 控制電路。其中，檢測台可用以放置—個待檢測的 B曰^。MU盒規格姻H騎應於待檢靡晶圓盒的 2判定區域設置，並依據從前述判定區域所得到的結果 _ t二個狀訊號。位置_器_分卿來檢測至少一 晶圓盒’且各個位置偵測感測器組包括一個光源 ^ 個光源接收端。其中，光源發射端與光源接收 ^疋相對於待侧的晶圓盒的-個晶_定機構的位置配 ，’以檢測前述晶圓蚊機構的位置是否正常。控制電路 疋用以接收由晶圓纽格制H輸_判定訊號，並依昭 這，狀喊騎位置侧_驗巾的—組來進行晶圓 固疋機構的位置之檢測。 依照本創作的一實施例所述檢測裝置，上述裝置更包 括-個與位置偵測感測器組祕的警報單S，以^Hi' is suitable for detecting wafer cassettes of different specifications. The detecting device includes a measuring table, a box size discriminator, and a plurality of position sensor group control circuits. Among them, the test station can be used to place a B曰^ to be detected. The MU box specification should be set in the 2 determination area of the wafer cassette to be inspected, and based on the result obtained from the above determination area _ t two signals. The position detector _ is divided to detect at least one wafer cassette' and each position detecting sensor group includes a light source and a light source receiving end. Wherein, the light source emitting end and the light source receive a position relative to the position of the wafer box of the wafer cassette on the side to be detected to detect whether the position of the wafer mosquito mechanism is normal. The control circuit 疋 is configured to receive the H signal from the wafer, and to detect the position of the wafer fixing mechanism. According to an embodiment of the present invention, the device further includes an alarm list S with a position detection sensor group, to ^
定機構的位置異常時發出警報。 、BB 依照本創作的一實施例所述檢測裝置，上 格判別器與位置感測器組可裝設於檢測台上。日曰孤、 依妝本創作的一實施例所述檢測裝置， 器組包括雷射位移感測器。 a置感測 依照本創作的一實施例所述檢測裝置，上 規格判別H可侧定位㈣透絲或晚料判定^二 7 M3 02 的晶圓盒規格的鮮。另外’上述之晶圓盒規格判別器也 位置上的標誌、或條碼作為判定待檢測的晶圓盒規 依照本創作的一實施例所述檢測裝置，上述各個位置 债測感測器組的光源發射端與光源接收端是位於相對於 檢測的晶圓盒的晶圓固定機構之兩側之同一水平高度上。、 依照本創作的-實施例所述檢測褒置，上述ϋ 括一個設置於檢測台上的晶圓盒定位機構。、匕 本創作另提出-種晶圓盒之晶圓固定機構檢 ^同規格的晶圓盒。這種檢測裝置包括一個檢測 ^數個aaSI盒規格判別器、數個位置感測器組、一套押 制電路以及-顯示單元。其中，檢測台可 二 設置’並依據從這些判定區域所得到的結果 ;=_盒，且各位=== 二二與光源接收端 以认、日,θ门 1固日日8固疋機構的位置配置， &測曰曰_定機構的位置是否 接收由上述晶圓盒規格判別 =電路則疋用來 行晶圓固 ===，中的-組來進 控制電路，並根據被選擇的那組位置:== 對應的晶圓盒規格。 貝則4測时組顯不所 M302H， f.doc/e 依照本創作的另一實施例所述檢測裝置，上述裝置更 包，一個與位置偵測感測器組耦接的警報單元，以於晶圓 固定機構的位置異常時發出警報。 依照本創作的另一實施例所述檢測裝置，上述晶圓盒 規格判別器與位置感測器組可整合裝設於檢測台上。1 依照本創作的另一實施例所述檢測裝置，上述位 測為組包括雷射位移感測器。 依照本創作的另一實施例所述檢測裝置，上述之晶圓An alarm is issued when the position of the fixed mechanism is abnormal. BB According to one embodiment of the present invention, the detection device and the position sensor group can be mounted on the detection station. The detecting device according to an embodiment of the present invention is a laser displacement sensor. A sensing The measuring device according to an embodiment of the present invention, the upper specification discriminating H can be positioned side by side (4) through the wire or the late material determining ^ 2 7 M3 02 of the wafer cassette specifications. In addition, the above-mentioned wafer cassette size discriminator also has a position mark or a bar code as a detecting device for determining a wafer cassette to be inspected according to an embodiment of the present invention, and the light source of each of the above-mentioned position sensing sensor groups The transmitting end and the light source receiving end are located at the same level relative to both sides of the wafer fixing mechanism of the detected wafer cassette. According to the creation device of the present invention, the detection device includes a pod positioning mechanism disposed on the inspection table.匕 This creation also proposes a wafer cassette with a wafer cassette fixing mechanism for the same specification. The detecting device includes a plurality of aaSI box size discriminators, a plurality of position sensor groups, a set of latching circuits, and a display unit. Wherein, the test station can be set to 'and according to the results obtained from these determination areas; =_ box, and each bit === 22 and the light source receiving end to recognize, day, θ door 1 solid day 8 solid body mechanism Position configuration, & test _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The set of positions: == corresponding wafer cassette specifications. The detection device according to another embodiment of the present invention, the device further includes an alarm unit coupled to the position detection sensor group, An alarm is issued when the position of the wafer fixing mechanism is abnormal. According to another aspect of the present invention, the wafer cassette size discriminator and the position sensor group can be integrated and mounted on the detection stage. 1 In accordance with another embodiment of the present invention, the detection device comprises a laser displacement sensor. The detecting device according to another embodiment of the present invention, the wafer
盒規格剩ϋ可依判定位㈣透光度或顏色作為判定二檢 測的晶圓金規格的標準。另外，上述之晶圓盒規格判別器 =可依疋位置上的標誌、作為判定待檢測的晶圓盒規格的 標準。 依照本創作的另-實施例所述檢測裝置，上述各個位 置偵測_ H _光源騎端與絲接收端是位於相對於 待檢測的晶圓盒的晶圓固定機構之兩側之同—水平高度The remaining specifications of the box can be determined according to the judgment level (4) transmittance or color as the standard for determining the wafer gold specification for the second inspection. In addition, the above-described wafer cassette size discriminator = the mark on the position of the wafer cassette as the standard for determining the specification of the wafer cassette to be detected. According to another aspect of the present invention, the position detecting_H_light source riding end and the wire receiving end are located at the same level with respect to both sides of the wafer fixing mechanism of the wafer cassette to be inspected. height
依照本創作的另一實施例所述檢測裝置，上述妒置 包括一個設置於檢測台上的晶圓妓位機構。、 本創作因為在單一檢測裝置中先採用可判別晶圓In accordance with another embodiment of the present invention, the apparatus includes a wafer clamping mechanism disposed on the inspection station. This creation uses discriminable wafers in a single inspection device.
判別器，再依照判別出之晶圓盒規格來選用適合I 測器組，因此做到在單一裝置中檢測不同規; ==晶圓固定機構的目的。如此一來，不但能防 機構異常所造成的破片問題，還能節省檢剛 置的所需空間以及檢測時間。 9 M30219f^fd〇c/e ★為瓖本創作之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 【實施方式】 現將詳細描述本創作之實施例，其中在附圖中說明了 本創作的實例。而且在附圖和實施例中所使用的相同或類 似的元件付號是指相同或類似部分。此外，附圖為了簡化 而’又有按照精確的比例綠製。雖然本創作以下列實施例做 • 為解釋本創作的說明，但應瞭解這僅是作為實例而不是用 來限制本創作的結構。 第一實施例 圖3是依照本創作之第一實施例的一種晶圓盒之晶圓 ' ，定機構(wafer 1〇设)檢測裝置的立體圖，而圖4是圖3之 前頭方向的晶圓盒之晶圓固定機構與其檢測裝置在檢測時 的透視圖。 請先參照圖3,在這個實施例中的晶圓盒之晶圓固定 φ 機構檢測裝置30，包括一個檢測台300、一個晶圓盒規格 判別器302、數個位置感測器組3〇4與一套控制電路3〇6。 其中，每一位置偵測感測器組304包括一個光源發射端 3〇8a與一個光源接收端3〇8b，且光源發射端308a和光源 接收端308b的位置可互換。而位置感測器組3〇4譬如是雷 射位移感測器或其它適合的光源感測器組。為使圖3不會 過於複雜，於本圖中是以虛線構成的框線作為待檢測的^曰 圓盒所放置的位置310，而且如本圖所示，上述晶圓盒2 10 Μ302Μ» f.doc/e 格判別器302與位置感測器組3〇4可選擇直接裝設於檢測 台300上。此外，為了使待檢測的晶圓盒能固定在上述位 置310 ’可在檢測台300上設置一個晶圓盒定位機構312， 其樣式與結構除圖3所示以外尚可作其他變化或更動，而 不偈限於圖中所、纟會示。 5月同B守參照圖3與圖4，檢測台300可放置一個待檢 測的晶圓盒100(即圖3的位置31〇)，且在圖4中是以圖1 的晶圓盒1GG作為例子，但這並不代表本創作之晶圓固定 機構檢測裝置只能應用在檢測這種晶圓盒·。上述晶圓 ，規格判別1 302則對應於待檢測的晶觸的一個判 ^區域铜設置，並依據從判魏域姻所得到的結果輪 处了個判定訊號。舉例來說，㈣規格的晶圓盒之差里可 晶圓盒在某—塊區域是鏤空的、另一種晶圓 的’因此在這種情形下可採用這個差異區 Ϊϋ疋位置彻，並以判定位置铜的透光度作為判 測的晶圓盒規格的標準。另外，也可以依 同^某—構件的顏色來分辨不同規格的晶圓盒，例如^曰 100 108114 定件ΐιΓ^Λ1 ί1 G6)有可能具有不同的顏色，故可依固 顏务^或把手作為判定位置400，並以判定位置400的 "2為辨別待檢測的晶圓盒100規格的標準。 、 別用ΐί續參照圖3與圖4，各組位置感測器組304是八 山來檢测至少一種規格的晶圓盒，且同一組 、3〇8a與光源接收端3_是相對於待檢測的晶圓盒= 11 的-個晶圓固定機構108的位置配置，以檢測前述晶圓固 定機構108的位置是否正常。舉例來說，各個位置债 測器組304的光源發射端308a與光源接收端期b是⑽ 相對於待，測的晶圓盒100的晶圓固定機構1〇8之兩侧之 同一水平高度上。另外’控制電路遍是用以接收由 盒規格判別器302輸出的判定訊號，並依照這個判定訊號 選擇位置偵測感測器組3〇4中的一組來進行晶圓固定機^ 應的位置之檢測；例如，當待檢測的晶圓盒觸包含 -種規格與第二種規格時，由晶圓盒規關廳观輪 的判^訊號是指第-種規格的晶圓盒，則控制電路3〇6在 接收廷個判定訊號後，會將用來檢測第—種規格的那一组 =置制感測器組304打開，同時將用來檢測第二種規格 感測器組3G4關掉。前述打開與關掉位 川測器組之具體實例是：根據晶®盒規格判別哭 02 =的判定訊號自動提供％ ^的電源給相對應： =置感測益組304 ’並將其餘的位置感測器組则 ί成=其它的位置_器組輪出作動或是干擾= m 此外’在&個實施例巾，還包括-個與位置 =二304輕接的警報單元314，以於晶圓固定機 構108的位置異常時發出警報。 運作Hi’在日上述晶之晶圓__檢測褒置30 規才夂判別曰曰哭^之曰曰圓固定機構檢測裝置30將根據晶圓盒 曰頻I/ ϋ別晶圓盒規格’再以控制電路306依照 日日1、〇丨咖302所得的結果選擇數個位置偵測感測 12 M3 02 器組304中的一組來進行檢測，並以晶圓固定機構li4與 位置偵/則感測為組304的相對位置來判斷其位置是否正 常。當晶圓固定機構114位置異常時，檢測裝置3〇可發出 警報或通知線上人員進行故障排除。 第二實施例 —圖5是依照本創作之第二實施例的一種晶圓盒之晶圓 固定機構與其檢測裝置在檢測時的透視圖，其中仍以圖工 的晶圓盒100作為例子。 ° 明參照圖5，當所要檢測的晶圓盒種類超過兩種時， 可選擇採用數個晶圓盒規格判別器來辨別不同的晶圓盒規 格，舉例來說，假設待檢測的晶圓盒有四種規格，而且這 些晶圓盒有超過一個的判定區域5〇〇、5〇2，則至少要使用 兩個晶圓盒規格判別器504、5〇6，且如圖5所示，其中一 個晶圓盒夫見格判別器、506可選擇放置在晶圓盒1〇〇外的檢 貝J 口 300上’並對應於判定區域5〇2設置，而判定區域$⑽ 例如是晶圓盒1〇〇的把手或其他部位。 同理’ ^待檢測的晶圓盒有六種規格時，則最多需要 使二二個晶圓盒規格姻器，來判定應該採用位置偵測 1态組508中的哪一組來進行檢測；依此類推，可根據待 才双測的晶圓盒的種類來決定晶圓盒規格判別器的數目。 第三實施例 —圖6是依照本創作之第三實施例的一種晶圓盒之晶 固定機構檢測裝置的立體圖，且於本圖中使用與圖3相 的元件付號來表示相同的構件。 13 1^30219}^^ 請參照圖6，在這個實施例中的晶圓盒之晶圓 f〇f須裝置6G包括檢測台_、—個晶圓盒規格判別^ =2、數個位置感測器組604與一套控制電路3〇6。其中， =位置制感測H組6G4包括—個光源發射端刪&盘— 接收端6_。而本圖中是以虛線構成的框線作為 圓盒所放置的位置31〇。而且，當待檢測的晶圓 t體(請見圖1的1〇4)是透明蓋體時，可如本圖將上Ξ :圓„別器602與位置感測器組_裝設於位置 ’至可依所需’將晶圓盒規格判別器與位置感測 益組另以固定臂或支架設置於檢測台細外。而且， ^盒之晶圓固定機構檢測|置⑹還可具有—個減於 =電=306的顯示單元㈣，並根據被選擇的那一組位 置偵測感測器組6G4顯示所對應的晶圓盒規格。此外 =測台3GG上可設置晶圓盒定位機構312，且於位置偵測 感測器組604耦接一個警報單元314。 、 第四實施例 圖7是依照本鑛之第四實施例的—種晶圓盒之晶圓 固疋機構與其檢測裝置在檢測時的透視圖，且於本圖中使 用與圖4相同的元件符號來表示相同的構件。 =圖7,由於目前的晶圓盒製造廠可根據客戶要 求在B曰社上附上不同的標諸(mark)或者條碼_ c 以作為朋不_程所需制的晶圓盒義，目此本創作 可利用這-點來進行晶圓盒規格的酬；舉 曰 L盒蓋？104外側貼有條碼700，則可將條碼：曰〇 勺位置設為判定區域’並將晶圓盒規格判別器搬對應於 14 M3 02 l9^8vf.d〇c/e 條碼700設置。 处私不上所述’本創作之特色在於僅利用一個檢測梦晋# :二句測得不同種類與規格的晶圓盒。因 能防2 二，機構異常所造成的破片問題 的所需空間以及檢測時間。 ’知列衣置 雖然本創作已以較佳實施例揭露 創作:任何熟習此技藝者，在不脫縣創= 當可作些許之更動與潤飾，因此本創作之： 之申料職騎界定 … 【圖式簡單說明】 圖1疋習知的一種標準化機械介面正 圓的立體分解圖。 〗日日興日日 —Λ2,則是圖1之箭頭方向的晶圓盒之晶圓固定機構 (waferlock)與晶圓的組裝透視圖。 疋械構 固定機構施例的-種晶圓盒之晶圓 檢測:置的晶圓盒之晶圓固定機構與其 圖5是依照本創作之第二實 圓 固定機構與其檢測裝置在檢測時的透視圖種曰曰圓皿之曰曰圓 固定Hi依照本創作之第三實施例的一種晶圓盒之晶圓 口疋機構檢測裝置的立體圖。 固定^本創作之第四實施例的一種晶圓盒之晶圓 冓，、其^測裝置在檢測時的透視圖。 【主要元件符號說明】 30、60 :晶圓盒之晶圓固定機構檢測裝置 100 :晶圓盒 102 :底座 104 :蓋體 106 :把手 108 :晶圓固定機構 110 :第一結構件 112 :第二結構件 φ 114 :固定件 116 :滑輪 300 :檢測台 302、504、506、602 :晶圓盒規格判別器 304、508、604 :位置感測器組 306 :控制電路 308a、608a :光源發射端 308b、608b :光源接收端 310 :位置 • 312 :晶圓盒定位機構 314 ··警報單元 400、500、502 :判定區域 610 ··顯示單元 700 :條碼 16The discriminator selects the appropriate I-tester group according to the discriminant specification, so that different gauges can be detected in a single device; == The purpose of the wafer fixing mechanism. In this way, not only can the fragmentation caused by the abnormality of the mechanism be prevented, but also the space required for the inspection and the detection time can be saved. The above and other objects, features, and advantages of the present invention will become more apparent from the description of the appended claims. [Embodiment] An embodiment of the present creation will now be described in detail, in which an example of the present creation is illustrated in the accompanying drawings. Also, the same or similar component symbols used in the drawings and the embodiments refer to the same or similar parts. Moreover, the drawings have been made in a precise scale for the sake of simplicity. Although this creation is made with the following examples: • To explain the description of this creation, it should be understood that this is merely an example and is not intended to limit the structure of the creation. 3 is a perspective view of a wafer cassette wafer device and a wafer device in accordance with a first embodiment of the present invention, and FIG. 4 is a wafer in the front direction of FIG. A perspective view of the wafer holding mechanism of the cartridge and its detecting device at the time of detection. Referring to FIG. 3, the wafer mounting φ mechanism detecting device 30 of the wafer cassette in this embodiment includes a detecting station 300, a wafer cassette size discriminator 302, and a plurality of position sensor groups 3〇4. With a set of control circuits 3〇6. Each position detecting sensor group 304 includes a light source transmitting end 3〇8a and a light source receiving end 3〇8b, and the positions of the light source emitting end 308a and the light source receiving end 308b are interchangeable. The position sensor group 3 is, for example, a laser displacement sensor or other suitable light source sensor group. In order to make FIG. 3 not too complicated, the frame line formed by the broken line in the figure is taken as the position 310 where the round box to be detected is placed, and as shown in the figure, the above-mentioned wafer cassette 2 10 Μ 302 Μ » f The .doc/e discriminator 302 and the position sensor group 3〇4 can be directly mounted on the detection station 300. In addition, in order to enable the wafer cassette to be inspected to be fixed at the above position 310', a wafer cassette positioning mechanism 312 may be disposed on the inspection station 300, and the mode and structure may be changed or changed in addition to the one shown in FIG. It is not limited to what is shown in the figure. Referring to FIG. 3 and FIG. 4 in May, the inspection station 300 can place a wafer cassette 100 to be inspected (ie, position 31 of FIG. 3), and in FIG. 4, the wafer cassette 1GG of FIG. 1 is used. For example, this does not mean that the wafer fixing mechanism detection device of this creation can only be applied to the detection of such a wafer cassette. The wafer, the specification discriminant 1 302 corresponds to a copper region of the crystal contact to be detected, and a decision signal is obtained according to the result obtained from the Wei Ge marriage. For example, in the case of (4) the size of the wafer cassette, the wafer cassette can be hollowed out in another block area, so the position of the wafer can be used in this case. The transmittance of the position copper is determined as a criterion for determining the specification of the wafer cassette. In addition, you can also distinguish the wafer cassettes of different specifications according to the color of the components. For example, ^曰100 108114 ΐιΓ^Λ1 ί1 G6) It is possible to have different colors, so you can use the handle or the handle. As the determination position 400, "2 of the determination position 400 is a criterion for discriminating the specifications of the wafer cassette 100 to be detected. Referring to FIG. 3 and FIG. 4, each group of position sensor groups 304 is a mountain to detect at least one type of wafer cassette, and the same group, 3〇8a and the light source receiving end 3_ are opposite to each other. The position of the wafer holding mechanism 108 of the wafer cassette to be tested = 11 is configured to detect whether the position of the wafer fixing mechanism 108 is normal. For example, the light source emitting end 308a and the light source receiving end period b of each position detector group 304 are (10) at the same level as the sides of the wafer fixing mechanism 1〇8 of the wafer cassette 100 to be tested. . In addition, the control circuit is configured to receive the determination signal output by the box size discriminator 302, and select one of the position detection sensor groups 3 to 4 according to the determination signal to perform the position of the wafer fixing machine. For example, when the wafer cassette to be inspected includes a specification and a second specification, the discriminator signal of the wafer cassette regulation hall refers to the first type of wafer cassette, and then the control After receiving the decision signal, the circuit 3〇6 will open the set of sense sensor groups 304 for detecting the first specification, and will also detect the second type of sensor group 3G4. Drop it. The specific example of the above-mentioned opening and closing of the detector group is that the determination signal of crying 02 = according to the specification of the crystal box automatically supplies the power of % ^ to the corresponding: = sense sensing group 304 'and the remaining positions The sensor group is === other positions _ group turn-off or interference=m In addition, 'in the & embodiment towel, also includes - an alarm unit 314 connected to the position = two 304, in order to An alarm is issued when the position of the wafer fixing mechanism 108 is abnormal. Operation Hi' in the above-mentioned crystal wafer __ detection device 30 rules to determine the crying ^ 曰曰 round fixed mechanism detection device 30 will be based on the wafer cassette frequency I / screening wafer box specifications 're The control circuit 306 selects one of the plurality of position detection and sensing 12 M3 02 groups 304 according to the result obtained by the daily circuit 1, the coffee bean 302, and performs the detection by the wafer fixing mechanism li4 and the position detection/rear The relative position of the group 304 is sensed to determine whether its position is normal. When the position of the wafer fixing mechanism 114 is abnormal, the detecting device 3 can issue an alarm or notify the online personnel to perform troubleshooting. SECOND EMBODIMENT - Fig. 5 is a perspective view of a wafer cassette fixing mechanism of a wafer cassette and a detecting device thereof in accordance with a second embodiment of the present invention, wherein the wafer cassette 100 is still taken as an example. Referring to Figure 5, when there are more than two types of wafer cassettes to be tested, several wafer cassette size discriminators can be selected to distinguish different wafer cassette specifications. For example, suppose the wafer cassette to be tested. There are four specifications, and if there are more than one decision area 5〇〇, 5〇2 in these wafer cassettes, at least two wafer cassette size discriminators 504, 5〇6 are used, and as shown in Fig. 5, A wafer cassette discriminator, 506 can be selectively placed on the outside of the wafer cassette 1' and corresponding to the determination area 5〇2, and the determination area $(10) is, for example, a wafer cassette. 1〇〇 handle or other parts. Similarly, when there are six specifications for the wafer cassette to be inspected, it is necessary to make two or two wafer cassette specifications to determine which one of the position detection 1 state groups 508 should be used for detection; By analogy, the number of pod size discriminators can be determined according to the type of wafer cassette to be double tested. Third Embodiment Fig. 6 is a perspective view showing a crystal cell fixing mechanism detecting device of a wafer cassette in accordance with a third embodiment of the present invention, and the same components are denoted by the same reference numerals as those of Fig. 3 in the figure. 13 1^30219}^^ Referring to FIG. 6, the wafer cassette of the wafer cassette in this embodiment includes a detection station _, a wafer cassette specification discriminating ^=2, and a plurality of position senses. The detector group 604 is connected to a set of control circuits 3〇6. Wherein, the = position sensing H group 6G4 includes - a light source transmitting end deleting & disk - receiving end 6_. In the figure, the frame line formed by the broken line is used as the position where the round box is placed 31〇. Moreover, when the wafer t body to be inspected (see FIG. 1 and FIG. 1) is a transparent cover body, the upper layer can be mounted as shown in the figure: the round device 602 and the position sensor group _ are installed at the position. 'To the required one', the wafer cassette size discriminator and the position sensing benefit group are additionally placed on the inspection table by a fixed arm or a bracket. Moreover, the wafer fixing mechanism detection|setting (6) can also have- The display unit (4) is reduced to ============================================================================================= 312, and the position detecting sensor group 604 is coupled to an alarm unit 314. Fourth Embodiment FIG. 7 is a wafer cassette fixing mechanism and a detecting device thereof according to a fourth embodiment of the mine. A perspective view at the time of inspection, and the same component symbols as in Fig. 4 are used to denote the same components in this figure. = Fig. 7, since the current wafer cassette manufacturer can attach a different one to the company according to customer requirements. The mark or bar code _ c is used as a wafer box for the pen wan, which is the purpose of this creation. - Click to pay for the wafer cassette specifications; for the L box cover? 104 is attached with a barcode 700 on the outside, the bar code: the position of the spoon can be set as the determination area' and the cassette size discriminator can be moved to 14 M3 02 l9^8vf.d〇c/e Barcode 700 setting. The smuggling is not as described. 'The essence of this creation is that it only uses one test Mengjin#: two sentences to measure different types and specifications of the wafer cassette. 2 2, the space required for the fragmentation problem caused by the abnormality of the mechanism and the detection time. 'Ken Lie Suit Although this creation has been disclosed in the preferred embodiment: anyone who is familiar with this skill can not be off the county. Make some changes and retouching, so this creation: The definition of the application of the rider... [Simple diagram of the diagram] Figure 1 is a stereoscopic exploded view of a standardized mechanical interface circle. 〗 DAY DAY DAY - Λ 2, It is an assembled perspective view of the wafer locker and the wafer of the wafer cassette in the direction of the arrow in Fig. 1. The wafer inspection of the wafer cassette of the embodiment of the mechanical structure fixing mechanism: the wafer cassette placed The wafer fixing mechanism and FIG. 5 are the second real circle according to the present creation. The perspective view of the fixed mechanism and the detecting device at the time of detection is performed on the round plate of the round dish. According to the third embodiment of the present invention, a perspective view of the wafer port mechanism detecting device of the wafer cassette is provided. The wafer cassette of the wafer cassette of the fourth embodiment, and the perspective view of the detecting device during the detecting. [Main component symbol description] 30, 60: wafer cassette fixing mechanism detecting device 100: crystal Round box 102: base 104: cover body 106: handle 108: wafer fixing mechanism 110: first structural member 112: second structural member φ 114: fixing member 116: pulley 300: detection table 302, 504, 506, 602: The cassette specification discriminator 304, 508, 604: position sensor group 306: control circuit 308a, 608a: light source transmitting end 308b, 608b: light source receiving end 310: position • 312: wafer cassette positioning mechanism 314 · alarm Units 400, 500, 502: decision area 610 · display unit 700: bar code 16