CN111430263B - Semiconductor processing equipment and control method for loading wafer box thereof - Google Patents
Semiconductor processing equipment and control method for loading wafer box thereof Download PDFInfo
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- CN111430263B CN111430263B CN201910590449.0A CN201910590449A CN111430263B CN 111430263 B CN111430263 B CN 111430263B CN 201910590449 A CN201910590449 A CN 201910590449A CN 111430263 B CN111430263 B CN 111430263B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The invention provides semiconductor processing equipment and a control method for loading a wafer box. The type of the current wafer box on the loading platform is identified by the wafer box identification device, and whether the loading platform is regulated to be in an idle state or not is automatically controlled by the data analysis module according to the type information of the current wafer box. The semiconductor processing equipment can effectively control the loading process of the wafer box, and avoids the problem that different types of wafers are polluted when the same semiconductor processing equipment is used.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a semiconductor processing device and a control method for loading a wafer cassette.
Background
In the semiconductor field, it is often necessary to process wafers using semiconductor processing equipment. Also, the same semiconductor processing equipment is typically used for different types of wafers (different types of wafers, for example, different thin film materials on the wafers), i.e., different types of wafers may be processed by the same semiconductor processing equipment.
When different types of wafers are processed by the same semiconductor processing equipment, it often happens that processing residues generated by processing the previous type of wafer remain in the semiconductor processing equipment, and at this time, if the next different type of wafer is directly processed, the different type of wafer is easily polluted.
Disclosure of Invention
The invention aims to provide semiconductor processing equipment to solve the problem that different types of wafers cannot be effectively controlled by the conventional semiconductor processing equipment and are easily polluted.
In order to solve the above technical problems, the present invention provides a semiconductor processing apparatus, comprising:
at least one loading platform for loading the wafer cassette;
a wafer cassette recognition device for recognizing the type of the current wafer cassette placed on the loading table; and the data analysis module is connected with the wafer box recognition device and used for receiving the type information of the current wafer box and indicating whether the loading platform is regulated and controlled to be in an idle state after the current wafer box is downloaded according to the type information of the current wafer box.
Optionally, the data analysis module is further configured to determine whether the current wafer cassette is a wafer cassette of a predetermined type;
if the current wafer box is a wafer box of a preset type, the data analysis module indicates that the loading platform is regulated to be in an idle state; if the current wafer box is a wafer box of a non-predetermined type, the loading platform is kept in an uploading state;
or, if the current wafer cassette is a predetermined type of wafer cassette, before the next wafer cassette to be loaded is loaded, the data analysis module is further configured to determine whether the type of the current wafer cassette is the same as that of the next wafer cassette to be loaded; if the types of the wafer boxes are different, the data analysis module indicates that the loading platform is regulated to be in an idle state; if the types of the cassettes are the same, the loading table is maintained in an uploadable state to continue uploading a next cassette to be loaded after downloading the current cassette.
Optionally, before the next wafer cassette to be loaded is loaded, the data analysis module is further configured to determine whether the type of the current wafer cassette is the same as the type of the next wafer cassette to be loaded;
if the types of the wafer boxes are different, the data analysis module is used for indicating that the loading platform is regulated to be in an idle state; if the types of the wafer boxes are the same, the loading platform is kept in an uploading state so as to continuously upload a next wafer box to be loaded after downloading the current wafer box;
or if the types of the wafer boxes are different, the data analysis module is further used for further judging whether the current wafer box is a wafer box of a preset type; if yes, the data analysis module indicates that the loading platform is regulated to be in an idle state; if not, the loading platform is kept in an uploading state so as to continue to upload the next wafer box to be loaded after the current wafer box is downloaded.
Optionally, the data analysis module is further configured to receive type information of a next wafer cassette to be loaded, which is input by a person or sent by a production management and control system.
Optionally, the type information of the wafer cassette includes an identification part of the wafer cassette having different colors; and the wafer box recognition device comprises a color sensor for acquiring the color of the recognition part of the wafer box.
Optionally, different types of cassettes have different handles, and the cassette recognition device is configured to recognize the handle of the cassette to obtain the type of the cassette.
Optionally, different types of cassettes have handles with different colors, and the cassette recognition device is used for recognizing the color of the handle of the cassette;
or, different types of cassettes have handles of different shapes, and the cassette recognition device is used for recognizing the shape of the handle of the cassette.
Optionally, a thimble is arranged on the loading platform, and the thimble is arranged on the table top of the loading platform in a lifting manner; when the loading platform is in an idle state, the ejector pin rises and protrudes out of the table surface of the loading platform.
Optionally, the semiconductor processing apparatus has at least two loading stations, and each loading station is correspondingly provided with the wafer cassette identification device.
Optionally, the semiconductor processing apparatus further comprises a process chamber and a cleaning device, wherein the cleaning device is used for cleaning the process chamber.
Another object of the present invention is to provide a method for controlling loading of a wafer cassette in a semiconductor processing apparatus, comprising:
identifying the type of the current wafer box placed on the loading platform by using a wafer box identification device, and sending the type information of the current wafer box to a data analysis module;
and the data analysis module indicates whether the loading platform is regulated to be in an idle state after the current wafer box is downloaded according to the type information of the current wafer box.
Optionally, the method for indicating whether the loading platform is regulated to the idle state according to the type information of the current wafer cassette includes:
the data analysis module judges whether the current wafer box is a wafer box of a preset type;
if not, the data analysis module does not generate vacant indication information;
if yes, the data analysis module generates vacant indication information to indicate that the loading platform is vacant.
Optionally, the method for indicating whether the loading table is controlled to be in the idle state according to the type information of the current wafer cassette includes:
the data analysis module judges whether the current wafer box is a wafer box of a preset type;
if not, the data analysis module does not generate vacant indication information, so that the loading platform continues to upload the next wafer box to be loaded after downloading the current wafer box;
if yes, the data analysis module further judges whether the types of the current wafer box and the next wafer box to be loaded are the same; if the data are the same, the data analysis module does not generate vacant indication information; and if the data are different, the data analysis module generates vacant indication information to indicate that the loading platform is vacant.
Optionally, the method for indicating whether the loading platform is regulated to the idle state according to the type information of the current wafer cassette includes:
the data analysis module judges whether the type of the current wafer box is the same as the type of the wafer box to be loaded;
if the current wafer box is the same as the wafer box to be loaded, the data analysis module does not generate vacant indication information so that the loading platform continues to upload the next wafer box to be loaded after downloading the current wafer box;
and if the data are different, the data analysis module generates vacant indication information to indicate that the loading platform is vacant.
Optionally, the method for indicating whether the loading platform is regulated to the idle state according to the type information of the current wafer cassette includes:
the data analysis module judges whether the type of the current wafer box is the same as that of the wafer box to be loaded;
if the current wafer box is the same as the wafer box to be loaded, the data analysis module does not generate vacant indication information so that the loading platform continues to upload the next wafer box to be loaded after downloading the current wafer box;
if the current wafer cassette is different from the preset wafer cassette, the data analysis module further judges whether the current wafer cassette is the preset wafer cassette; if not, the data analysis module does not generate vacant indication information, so that the loading platform continues to upload the next wafer box to be loaded after downloading the current wafer box; if yes, the data analysis module generates vacant indication information to indicate that the loading platform is vacant.
Optionally, the method indicates that the loading platform is empty, and after the empty predetermined time period, further includes: and releasing the vacant state of the loading platform so as to enable the loading platform to be in a loadable state.
Optionally, when the loading platform is in an empty state, the method further includes:
and cleaning the process chamber of the semiconductor processing equipment by using the cleaning device.
Optionally, the semiconductor processing apparatus has at least two loading stations, and each loading station is correspondingly provided with a wafer cassette identification device.
Optionally, when a part of the loading tables is loaded with wafer cassettes of the same type, and another part of the loading tables is not loaded with wafer cassettes, the data analysis module further indicates whether another part of the loading tables is controlled to be in an idle state according to the types of wafer cassettes on the part of the loading tables.
Optionally, the method for indicating whether the other partial loading platform is regulated to be in the idle state according to the type of the wafer cassette on the partial loading platform comprises the following steps:
judging whether the types of the wafer boxes on the partial loading platform are the same as the types of the wafer boxes to be loaded or not by using the data analysis module;
if the data are the same as the preset data, the data analysis module does not generate vacant indication information, and the other part of the loading platform is used for loading the next wafer box to be loaded;
and if the two loading platforms are different, the data analysis module generates vacant indication information to indicate that the other part of the loading platforms are vacant.
In the semiconductor processing equipment provided by the invention, the type of the current wafer box on the loading platform is identified by the wafer box identification device so as to obtain the type information of the current wafer box, and the data analysis module is used for automatically controlling whether the loading platform is regulated to be in an idle state or not according to the type information of the current wafer box. Therefore, the semiconductor processing equipment can more effectively control the loading process of the wafer box based on the automatic process of wafer box identification-regulation, and is beneficial to ensuring that wafers of different types cannot be polluted when the same semiconductor processing equipment is utilized.
Furthermore, the data analysis module can be used for automatically controlling the vacant time period of the loading platform. Compared with the method for manually controlling the idle time of the loading platform, the automatic control can more effectively ensure the idle time of the loading platform and ensure that different types of wafers cannot be polluted in the same semiconductor processing equipment.
In addition, for a plurality of loading platforms in the semiconductor processing equipment, the data analysis module can be used for further controlling the state of each loading platform so as to ensure that the plurality of loading platforms in the same semiconductor processing equipment simultaneously bear the same type of wafer cassettes, thereby avoiding different types of wafer cassettes from being simultaneously placed in the same semiconductor processing equipment.
Drawings
FIG. 1 is a schematic diagram of a semiconductor processing apparatus according to a first embodiment of the present invention;
fig. 2 is a flowchart illustrating a method for controlling loading of a wafer cassette in a semiconductor processing apparatus according to a first embodiment of the present invention;
fig. 3 is a flowchart illustrating a method for controlling loading of a wafer cassette in a semiconductor processing apparatus according to a second embodiment of the present invention;
fig. 4 is a flowchart illustrating a method for controlling loading of a wafer cassette in a semiconductor processing apparatus according to a third embodiment of the present invention;
fig. 5 is a flowchart illustrating a method for controlling loading of a wafer cassette in a semiconductor processing apparatus according to a fourth embodiment of the present invention;
fig. 6 is a flowchart illustrating a method for controlling loading of a wafer cassette in a semiconductor processing apparatus according to a fifth embodiment of the present invention.
Wherein the reference numbers are as follows:
100-a loading table;
110-a thimble device;
120-solenoid valve;
200-a wafer box;
210-a handle;
300-wafer cassette recognition means;
400-a data analysis module;
500-a photosensor;
600-gas cylinder supply means;
700-a signal amplification module;
800-power supply module.
Detailed Description
The semiconductor processing equipment and the control method for loading the wafer cassette thereof according to the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Example one
Fig. 1 is a schematic structural diagram of a semiconductor processing apparatus according to a first embodiment of the present invention, as shown in fig. 1, the semiconductor processing apparatus includes:
at least one loading platform 100 for carrying a wafer cassette 200;
a wafer cassette recognition device 300 for recognizing the type of the current wafer cassette placed on the loading station 100;
and a data analysis module 400 connected to the wafer cassette recognition device 300, configured to receive the type information of the current wafer cassette, and instruct the loading platform 100 whether to adjust the current wafer cassette to an idle state according to the type information of the current wafer cassette.
Wherein, according to the type information of the current wafer cassette, it is indicated whether the loading platform 100 is regulated to be in an idle state, which specifically includes: if the current wafer cassette is a predetermined type of wafer cassette (e.g., a wafer cassette loaded with wafers that are prone to generate contaminants), the loading table 100 may be controlled to be in an idle state to prevent the next wafer cassette to be loaded from being loaded onto the loading table 100, so as to prevent the wafers in the next wafer cassette to be loaded from being contaminated. Based on this, the data analysis module 400 is further configured to determine whether the current wafer cassette is a predetermined type of wafer cassette.
Or, when the type of the wafer cassette to be loaded is different from that of the current wafer cassette, the loading table 100 is controlled to be in an idle state, so as to avoid the problem that different wafers are polluted. Accordingly, before uploading the next wafer cassette to be loaded, the data analysis module 400 is further configured to determine whether the type of the current wafer cassette is the same as that of the next wafer cassette to be loaded.
It should be noted that the type information of the current wafer cassette is obtained by the wafer cassette recognition device 300, and further sent to the data analysis module 400. And, the type information of the next wafer cassette to be loaded may be inputted to the data analysis module 400 by personnel, for example, or the type information of the next wafer cassette to be loaded may be transmitted to the data analysis module 400 by the production management and control system (it is understood that the data analysis module 400 is also electrically connected to the production management and control system). That is, the data analysis module 400 may be further configured to receive type information of a next wafer cassette to be loaded, which is input by a person or sent by a production management and control system, so that the data analysis module 400 may collect the type information of the current wafer cassette and the type information of the next wafer cassette to be loaded, and may further compare/determine whether the types of the current wafer cassette and the next wafer cassette to be loaded are the same.
Further, the loading platform 100 may be left vacant for a predetermined period of time, which is equivalent to that the semiconductor processing equipment can be left vacant for a predetermined period of time, in the process, the processing equipment may clean the residual contaminants, and further, after the loading platform 100 is left vacant for a predetermined period of time and the vacant state is released, the wafer in the wafer cassette to be subsequently loaded may be effectively prevented from being affected. It is considered that, in this embodiment, the data analysis module 400 can be used to control whether the loading platform 100 is empty and the empty time thereof, so as to ensure the empty time of the semiconductor processing equipment.
On the contrary, if the current wafer cassette is a non-predetermined type of wafer cassette (for example, the current wafer cassette does not generate contaminants during the processing), the loading table 100 may be in an uploadable state, so that the subsequent wafer cassette may be continuously uploaded; and, when the type of the next and current wafer cassettes is the same, the loading table 100 can be also made in the uploadable state.
Specifically, when the loading table 100 is in an empty state, the wafer cassette cannot be loaded on the loading table 100, and in this case, for example: the loading stage 100 is not allowed to meet the uploading condition, or the loading stage 100 is not allowed to receive an uploading instruction, etc., so that the subsequent wafer cassette uploading is prohibited. And, when the loading station 100 is in the uploadable state, for example: the loading station 100 meets the uploading condition and can receive an uploading instruction to prepare to perform the uploading process of the wafer cassette in real time.
In an optional scheme, a thimble device 110 is disposed on the loading platform 100, and a thimble of the thimble device 110 is arranged on a table top of the loading platform 100 in a lifting manner. For example, when the thimble of the thimble device 110 is in a raised state, the thimble protrudes from the table surface of the loading table 100; when the ejector pin of the ejector pin device 110 is in a descending state, the ejector pin is embedded into the loading platform 100. Further, the ejector pin device 110 further includes an air cylinder for controlling the ejector pin to ascend or descend.
In this embodiment, when the loading platform 100 is in an empty state, the cylinder of the thimble device 110 drives the thimble to ascend, so that the loading platform 100 does not meet the uploading condition, and further does not receive the uploading instruction. On the contrary, when the loading platform 100 is in the uploading-capable state, the thimble of the thimble device 110 is in the descending state, so that the loading platform 100 meets the uploading condition. That is, it can be understood that the data analysis module 400 further controls the state of the loading platform 100 by controlling the raising or lowering of the thimble in the thimble device 100.
With continued reference to fig. 1, a gas delivery line and solenoid valve 120 are also provided in the loading station 100. One end of the gas delivery pipe is connected to the cylinder, the other end of the gas delivery pipe is connected to a gas supply device 600, and the solenoid valve 120 is disposed on the gas delivery pipe to further control the cylinder.
In this embodiment, the solenoid valve 120 is connected to the data analysis module 400. Specifically, the data analysis module 400 receives the type information of the wafer cassette, and may or may not generate the vacancy indication information according to the type information of the current wafer cassette. When the data analysis module 400 generates the idle indication information, the idle indication information may be further sent to the electromagnetic valve 120 to control the on/off of the electromagnetic valve 120, so as to control the state of the ejector pin in the ejector pin device 110, thereby achieving the purpose of regulating and controlling the state of the loading platform 100.
In an optional scheme, a signal amplification module 700 is further disposed between the data analysis module 400 and the loading station 100, and the indication information sent by the data analysis module 400 can be further transmitted to the loading station 100 after being amplified by the signal amplification module 700.
Further, the semiconductor processing apparatus further includes: a power supply module 800 for supplying power to the data analysis module 400. Of course, the power supply module 800 may also be used to supply power to the solenoid valve 120, etc.
As described above, the data analysis module 400 regulates the state of the loading station 100 according to the current type of the wafer cassette. Wherein different types of cassettes are used to load different wafers, or it can be understood that different wafers are loaded in different cassettes. Based on this, i.e., equivalently, the data analysis module 400 regulates the status of the loading station 100 according to the type of the current wafer.
Specifically, the wafer cassette 200 has an identification part, and the wafer cassette identification apparatus 300 may identify the type of the wafer cassette 200 by identifying the identification part of the wafer cassette 200. More specifically, the identification portion of the wafer cassette 200 is, for example: the shell color of the wafer box; or the outer topography of the wafer box, etc.
For example, the wafer cassette handle 210 is used as an identification part for explaining, that is, the handle 210 is different between different types of wafer cassettes, and the wafer cassette identification apparatus 300 identifies the wafer cassette handle 210 to acquire the type of the wafer cassette 200. In particular, different types of wafer cassettes have different colored handles 210, and in this case, the wafer cassette identification apparatus 300 may further include a color sensor for identifying the color of the handle 210 of the wafer cassette. Of course, the shape of the handle may be different between different types of cassettes, and in this case, the cassette recognition apparatus 300 may further include an image sensor for recognizing the shape of the handle of the cassette.
Further, the semiconductor processing apparatus may further include: a photo sensor 500 for sensing whether a wafer cassette is present on the loading table 100.
In this embodiment, since different wafers are loaded into different cassettes 200, the type of the wafer can be reflected by identifying the type of the cassette 200. Among them, the types of wafers can be divided into: wafers of a predetermined type and wafers of a non-predetermined type. The predetermined types of wafers are, for example: when the wafer is processed, contaminants that contaminate other wafers remain in the semiconductor processing equipment. In contrast, the wafers of the non-predetermined type are, for example: when the wafer is processed, no pollutant which can pollute other wafers is left in the semiconductor processing equipment.
For example, the predetermined type of wafer is a wafer exposed with a copper thin film, and when semiconductor processing equipment processes the wafer exposed with the copper thin film, copper ions are likely to remain in the processing equipment, and the remaining copper ions are likely to contaminate other thin films. And the wafers of the non-predetermined types are, for example: when the wafer with the exposed aluminum film is processed by semiconductor processing equipment, even if aluminum ions remain in the processing equipment, the remaining aluminum ions do not affect other wafers.
That is, in particular embodiments, the semiconductor processing equipment may be used to process wafers that have been exposed to copper films and wafers that have been exposed to aluminum films. The wafers exposed with the copper films are loaded in the wafer boxes of the preset type, and the wafers exposed with the aluminum films are loaded in the wafer boxes of the non-preset type.
Further, the semiconductor processing apparatus includes: the cleaning device is used for removing residual substances in the process chamber.
As described above, after the semiconductor processing equipment processes the predetermined wafer, the contamination substances may remain in the process chamber, so that the cleaning device may be used to clean the process chamber during the period of time when the loading platform 100 is empty. Therefore, when the empty state of the loading platform 100 is subsequently released and the next wafer cassette is loaded for processing, the wafer in the next wafer cassette can be prevented from being polluted.
Specifically, when the pollutant generated by processing the predetermined wafer is gas, the cleaning device includes, for example, an air pumping device; alternatively, when the contaminant generated by processing the predetermined wafer is liquid, the cleaning device may include a cleaning device, for example.
With continued reference to fig. 1, in this embodiment, the semiconductor processing tool has at least two load stations 100, two of which are illustrated in fig. 1. Wherein, each loading platform 100 is provided with a thimble device 110. And, each loading station 100 is provided with a corresponding wafer recognition device 300 for recognizing the type of the wafer cassette on each loading station 100 one by one.
The type information of the wafer cassette generated by each wafer cassette recognition device 300 is transmitted to the data analysis module 400. The data analysis module 400 is further configured to compare the type information of the current wafer cassette carried on each loading platform 100, and when the types of the current wafer cassettes carried on the loading platforms 100 of the same semiconductor processing apparatus are different, the data analysis module 400 may generate an error report.
Alternatively, it can be understood that, when a wafer cassette is loaded on a part of the loading tables 100, the data analysis module 400 may further indicate whether another part of the loading tables 100 not loaded with a wafer cassette is controlled to be in an empty state according to the type information of the current wafer cassette on the part of the loading tables 100.
Specifically, among the plurality of loading stations, a part of the loading stations 100 is loaded with a wafer cassette, and another part of the loading stations 100 is in an empty state (i.e., not loaded with a wafer cassette), and at this time, the data analysis module 400 is further configured to determine whether the type of the current wafer cassette is the same as that of a wafer cassette to be loaded into the same semiconductor processing apparatus; if the types are the same, regulating the other part of the unloaded loading platform 100 to be in an uploading state so as to continuously upload the wafer boxes of the same type; if the types are different, another part of the empty loading table 100 is controlled to be in an empty state, so as to prevent different wafer boxes from being loaded in the same semiconductor processing equipment. Namely, the problems that different wafer boxes are loaded in the same semiconductor processing equipment, the wafers are prevented from being processed by mistake, and the different wafers are polluted by each other are avoided.
Based on the semiconductor processing apparatus as described above, a method for controlling the semiconductor processing apparatus in this embodiment when the wafer cassette is loaded will be described in detail below.
Fig. 2 is a flowchart illustrating a method for controlling a wafer cassette loading of a semiconductor processing apparatus according to a first embodiment of the present invention. As shown in fig. 1 and 2, the control method includes the following processes.
First, the type of the current wafer cassette placed on the loading table 100 is recognized by the cassette recognition apparatus 300, and the type information of the current wafer cassette is transmitted to the data analysis module 400. In this embodiment, the photoelectric sensor 500 is also used to sense whether a wafer cassette is placed on the loading table 100.
Next, the data analysis module 400 receives the type information of the current wafer cassette and determines whether the current wafer cassette is a predetermined type of wafer cassette.
If the current wafer cassette is a wafer cassette of a predetermined type, the data analysis module 400 may generate vacancy indication information and send the vacancy indication information to the loading station 100, so as to indicate that the loading station 100 is regulated to a vacancy state after the current wafer cassette is downloaded.
In this embodiment, the empty indication information is sent to the electromagnetic valve 120 of the loading platform 100, so as to control the opening of the electromagnetic valve 120 and drive the thimble of the thimble device 100 to ascend, thereby regulating and controlling the loading platform 100 to be in an empty state.
Specifically, the loading station 100 may be left empty for a predetermined period of time, and the process chamber of the semiconductor processing apparatus may be cleaned by the cleaning device during the empty predetermined period of time to remove the contaminants from the process chamber. And after a predetermined period of time, releasing the loading table 100 from the vacant state to continue uploading the next wafer cassette onto the loading table 100.
If the current wafer cassette is not the predetermined type of wafer cassette, the data analysis module 400 does not generate the vacancy indication information, and the loading station 100 continues to maintain the uploadable state. When there is a wafer cassette to be loaded, the next wafer cassette to be loaded is continuously uploaded onto the loading table 100, and the above-mentioned identification-judgment-regulation loop process is continuously performed.
Example two
In this embodiment, compared with the first embodiment, in this embodiment, if the current wafer cassette is a predetermined type of wafer cassette, before uploading the next wafer cassette, the data analysis module further determines whether the types of the current wafer cassette and the next wafer cassette to be loaded are the same; if the current wafer box is the same as the wafer box to be loaded, the data analysis module does not generate vacant indication information so that the loading platform continues to upload the next wafer box to be loaded after downloading the current wafer box; and if the two loading platforms are different, the data analysis module generates vacant indication information to indicate that the loading platform is vacant.
Fig. 3 is a flowchart illustrating a method for controlling a loading of a wafer cassette in semiconductor processing equipment according to a second embodiment of the present invention, and referring to fig. 1 and 3, in this embodiment, if a current wafer cassette is a predetermined type of wafer cassette, the data analysis module 400 further refers to type information of a next wafer cassette to be loaded to indicate whether the loading platform 100 needs to be controlled to be in an idle state after the current wafer cassette is loaded.
Specifically, if the current wafer cassette is a wafer cassette of a predetermined type, the data analysis module 400 further determines whether the type of the current wafer cassette is the same as that of the next wafer cassette to be loaded before the next wafer cassette to be loaded is loaded.
If the type of the current wafer cassette is the same as that of the wafer cassette to be loaded, the data analysis module 400 does not generate the vacancy indication information. That is, the same type of cassettes are loaded with the same wafers, and even if the current cassette is a predetermined type of cassette, there is no problem of cross contamination between the same wafers, so that the loading table 100 can be continuously maintained in an uploadable state to continuously upload a cassette to be loaded next after the current cassette is downloaded.
If the type of the current wafer cassette is different from that of the next wafer cassette to be loaded, the data analysis module 400 generates idle indication information to indicate that the loading table 100 is controlled to be in an idle state after the current wafer cassette is loaded. Thus, the loading table 100 does not load the wafer cassette to be loaded during the idle period.
It should be noted that, as described in the first embodiment, the data analysis module 400 may be further configured to receive type information of a next wafer cassette to be loaded, which is input by a person or sent by a production management and control system, so that the data analysis module 400 can collect the type information of the current wafer cassette and the next wafer cassette to be loaded, and further perform a comparison/determination process.
With continued reference to fig. 3, if the current cassette is not a predetermined type of cassette, the data analysis module 400 does not generate empty indication information, similar to the embodiment, at which time the loading station 100 continues to remain in an uploadable state.
EXAMPLE III
The embodiment provides a further control method for loading a wafer cassette. The difference from the first embodiment is that, in the present embodiment, the method for indicating whether the loading platform is controlled to be in the idle state according to the type information of the current wafer cassette includes: and comparing the current wafer box with the next wafer box to be loaded so as to further judge whether the state of the loading platform needs to be regulated.
Fig. 4 is a flowchart illustrating a method for controlling loading of a wafer cassette in a semiconductor processing apparatus according to a third embodiment of the present invention. Referring to fig. 4, in this embodiment, after the data analysis module 400 receives the type information of the current wafer cassette, it further determines whether the type of the current wafer cassette is the same as the type of the next wafer cassette to be loaded.
If the types of the wafers are the same, the data analysis module 400 does not generate the vacancy indication information, and the loading platform 100 remains in the uploadable state after downloading the current wafer cassette, and can continue to upload the next wafer cassette to be loaded onto the loading platform 100.
If the types are different, the data analysis module 400 generates vacancy indicating information to indicate that the loading platform 100 regulates a vacancy state after downloading the current wafer cassette.
Thereafter, similar to the embodiment, the loading station 100 may be left empty for a predetermined period of time, during which the process chamber of the semiconductor processing apparatus is cleaned using the cleaning device; then, the vacant state is released, and the next cassette is uploaded, and the monitoring process as described above is continued.
Example four
Compared with the third embodiment, in the method for controlling loading of a wafer cassette according to the third embodiment, when it is determined that the current wafer cassette and the next wafer cassette to be loaded are different in type, it is further determined whether the current wafer cassette is a predetermined type of wafer cassette, so as to indicate whether the loading table is regulated to be in an idle state according to the type of the current wafer cassette.
Fig. 5 is a flowchart illustrating a method for controlling a wafer cassette loading of a semiconductor processing apparatus according to a fourth embodiment of the present invention. Referring specifically to fig. 5, the control method in the present embodiment includes the following processes.
The data analysis module 400 determines whether the types of the current wafer cassette and the next wafer cassette to be loaded are the same after receiving the type information of the current wafer cassette.
When the types are the same, the data analysis module 400 does not generate the vacancy indication information, and the loading station 100 remains in the uploadable state after downloading the current wafer cassette and can continue to upload the next wafer cassette onto the loading station 100, similar to the third embodiment.
When the types are different, the data analysis module 400 further determines whether the current wafer cassette is a predetermined type of wafer cassette.
If the type of the wafer cassette is not the predetermined type, it means that after the wafer in the current wafer cassette is processed, there is no material left in the semiconductor processing equipment that may contaminate the next wafer, and therefore, the data analysis module 400 may not generate the vacancy indication information to continue uploading the next wafer cassette.
If the wafer cassette is of a predetermined type, in order to avoid contamination to a next different type of wafer, the data analysis module 400 generates vacancy indication information to indicate that the loading station 100 is vacant for a predetermined period of time after downloading the current wafer cassette.
EXAMPLE five
The control method in the above embodiment is a control method for the same loading table, and is different from the control method in the above embodiment in that the control method in the present embodiment is a control method for a plurality of loading tables in a semiconductor processing apparatus.
Specifically, the semiconductor processing apparatus in this embodiment has at least two loading stations 100, and some of the loading stations carry the same type of wafer cassette and another part of the loading stations are empty (i.e., another part of the loading stations do not carry a wafer cassette). At this time, the data analysis module 400 may be utilized to indicate whether the other part of the loading stations is empty according to the type of the wafer cassette on the part of the loading stations, so as to determine whether the other part of the loading stations can upload a next wafer cassette to be loaded. The control method in the present embodiment is described in detail below with reference to the drawings.
Fig. 6 is a flowchart illustrating a method for controlling loading of a wafer cassette in a semiconductor processing apparatus according to a fifth embodiment of the present invention. Referring to fig. 1 and 6, in the method for controlling the wafer cassette loaded in the present embodiment, the other part of the susceptor is controlled.
First, the type of the current wafer cassette carried on the partial loading station is identified using the cassette identifying apparatus 300.
Next, the data analysis module 400 receives the type information of the current wafer cassette loaded on the partial loading platform, and determines whether the types of the wafer cassette on the partial loading platform and the wafer cassette to be loaded are the same.
If the information is the same, the data analysis module 400 does not generate the empty indication information, and the other part of the loading table is used for loading the next wafer cassette to be loaded, so that the types of the wafer cassettes on the part of the loading table and the wafer cassettes on the other part of the loading table are the same.
If the difference is positive, the data analysis module 400 generates empty indication information to indicate that the other part of the loading platforms are empty, so that different types of wafer cassettes can be prevented from being loaded in different semiconductor processing apparatuses.
In summary, in the semiconductor processing apparatus provided by the present invention, the wafer cassette recognition device can obtain the type information of the current wafer cassette on the loading platform, and the data analysis module can further indicate whether the loading platform can continue to upload the next wafer cassette after downloading the current wafer cassette. Namely, the semiconductor processing equipment can realize the automatic control of the loading process of the wafer box.
Particularly, the semiconductor processing equipment provided by the invention can further control the vacant time of the loading platform by using the data analysis module, namely, the vacant time period of the loading platform of the control device can be automatically controlled. Compared with the idle time period of the manual control loading platform, the automatic control can more effectively ensure that the loading platform is idle for a long enough time, the problem that the idle time cannot be ensured due to neglect of personnel in the manual control process can be prevented, and then the wafers of different types can be effectively prevented from being polluted in the same semiconductor processing equipment.
It should be noted that, in the present specification, the embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other. Also, while the present invention has been described with reference to the preferred embodiments, the embodiments are not intended to be limiting. It will be apparent to those skilled in the art from this disclosure that many changes and modifications can be made, or equivalents modified, in the embodiments of the invention without departing from the scope of the invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the protection scope of the technical solution of the present invention, unless the content of the technical solution of the present invention is departed from.
It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to limit the scope of the present invention. It must be noted that, as used herein and in the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. For example, reference to "a step" or "an apparatus" means a reference to one or more steps or apparatuses and may include sub-steps as well as sub-apparatuses. All conjunctions used should be understood in the broadest sense. And, the word "or" should be understood to have the definition of a logical "or" rather than the definition of a logical "exclusive or" unless the context clearly dictates otherwise. Further, implementation of the methods and/or apparatus of embodiments of the present invention may include performing the selected task manually, automatically, or in combination.
Claims (9)
1. A semiconductor processing apparatus, comprising:
at least one loading platform for loading the wafer cassette;
a wafer cassette recognition device for recognizing the type of the current wafer cassette placed on the loading table;
the data analysis module is connected with the wafer box identification device and used for receiving the type information of the current wafer box and judging whether the current wafer box is a wafer box of a preset type;
if not, the data analysis module does not generate vacant indication information;
if so, the data analysis module is also used for judging whether the types of the current wafer box and the next wafer box to be loaded are the same; if the current wafer box is the same as the wafer box to be loaded, the data analysis module does not generate vacant indication information so that the loading platform continues to upload the next wafer box to be loaded after downloading the current wafer box; and if the two loading platforms are different, the data analysis module generates vacant indication information to indicate that the loading platform is vacant.
2. The semiconductor processing apparatus of claim 1, wherein the data analysis module is further configured to receive type information of a next wafer cassette to be loaded sent by personnel input or a production management and control system.
3. The semiconductor processing apparatus according to claim 1, wherein the type information of the wafer cassette includes an identification part of the wafer cassette having different colors;
and the wafer box recognition device comprises a color sensor for acquiring the color of the recognition part of the wafer box.
4. The semiconductor processing apparatus according to claim 1, wherein the type information of the pod comprises that the pods have different handles, and the pod identification means is configured to identify the handles of the pods to obtain the type information of the pods.
5. The semiconductor processing apparatus according to claim 4, wherein different types of cassettes have different colored handles, and the cassette recognition device is configured to recognize the color of the handle of the cassette;
or, different types of cassettes have handles of different shapes, and the cassette recognition device is used for recognizing the shape of the handle of the cassette.
6. The semiconductor processing apparatus according to claim 1, wherein the loading platform is provided with a thimble, and the thimble is arranged on a table surface of the loading platform in a lifting manner; when the loading platform is in an idle state, the ejector pin rises and protrudes out of the table surface of the loading platform.
7. The semiconductor processing apparatus according to claim 1, wherein the semiconductor processing apparatus has at least two loading stations, each of which is provided with the wafer cassette recognition device.
8. The semiconductor processing apparatus of claim 1, further comprising a process chamber and a cleaning device for cleaning the process chamber.
9. A method for controlling a wafer cassette loaded on a semiconductor processing device, comprising:
identifying the type of the current wafer box placed on the loading platform by using a wafer box identification device, and sending the type information of the current wafer box to a data analysis module;
the data analysis module indicates whether the loading platform is regulated to be in an idle state after the current wafer box is downloaded according to the type information of the current wafer box;
the method for indicating whether the loading platform is regulated to be in the vacant state or not according to the type information of the current wafer box comprises the following steps:
the data analysis module judges whether the current wafer box is a wafer box of a preset type;
if not, the data analysis module does not generate vacant indication information;
if yes, the data analysis module further judges whether the types of the current wafer box and the next wafer box to be loaded are the same; if the current wafer box is the same as the wafer box to be loaded, the data analysis module does not generate vacant indication information so that the loading platform continues to upload the next wafer box to be loaded after downloading the current wafer box; and if the data are different, the data analysis module generates vacant indication information to indicate that the loading platform is vacant.
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| TWM302118U (en) * | 2006-06-15 | 2006-12-01 | United Microelectronics Corp | Detection apparatus of wafer lock of pod |
| CN102412174A (en) * | 2011-11-28 | 2012-04-11 | 上海华力微电子有限公司 | Pollution control method and device in semiconductor chip manufacture |
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