CN114743892B - Wafer box correction method and transport equipment of high-altitude buffer - Google Patents

Wafer box correction method and transport equipment of high-altitude buffer Download PDF

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Publication number
CN114743892B
CN114743892B CN202210337878.9A CN202210337878A CN114743892B CN 114743892 B CN114743892 B CN 114743892B CN 202210337878 A CN202210337878 A CN 202210337878A CN 114743892 B CN114743892 B CN 114743892B
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image
wafer box
processing system
vision processing
ohb
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CN114743892A (en
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缪峰
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Mifei Technology Shanghai Co ltd
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Mifei Technology Shanghai Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T1/00General purpose image data processing
    • G06T1/0014Image feed-back for automatic industrial control, e.g. robot with camera
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/70Determining position or orientation of objects or cameras
    • G06T7/73Determining position or orientation of objects or cameras using feature-based methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773Conveying cassettes, containers or carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733Overhead conveying
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30Computing systems specially adapted for manufacturing

Abstract

The invention provides a wafer box correction method and transportation equipment of an overhead buffer, which relate to the technical field of logistics transportation, wherein the wafer box correction method is used for the transportation equipment of the overhead buffer and comprises the following steps: the front and rear images of the wafer box are respectively shot by adopting a vision processing system, and the wafer box is determined to be in the correct direction according to the shot images; acquiring a preset detection angle of the vision processing system, and adjusting the detection angle of an image acquisition unit of the vision processing system according to the preset detection angle; acquiring the placement positions of the wafer cassettes on the OHB rack by adopting the adjusted vision processing system to obtain an acquired image; controlling a vision processing system to analyze the acquired image and determining the coordinate position of the wafer box on a coordinate system formed by the OHB rack; and adjusting and correcting the wafer box according to the coordinate position. The invention can carry out multi-aspect detection, improves the detection accuracy and reduces working errors.

Description

Wafer box correction method and transport equipment of high-altitude buffer
Technical Field
The invention relates to the technical field of wafer box transportation, in particular to a wafer box correction method and transportation equipment of an overhead buffer.
Background
The existing high-altitude Buffer comprises a wafer box, a bin code, a walking device, a track, a code reader and a bin detection sensor, when a transport vehicle is required to take and put the wafer box on an OHB (overhead Buffer) rack, the code reader on the transport vehicle can read the bin code information on the bin of the wafer box at first, and the bin code information on the bin of the wafer box is required to be taken and put. And then the library position detection sensor identifies the light beam reflected by the reflector, if the light beam is identified, the library position detection sensor indicates that the wafer box is not arranged on the library position, and if the light beam is not identified, the library position detection sensor indicates that the object exists on the library position.
However, the sensor can only feed back whether the OHB library has a wafer cassette, and cannot determine whether the wafer cassette is in a normal state (for example, the wafer cassette is inclined or other articles are placed on the library, and the sensor cannot identify) and the wafer cassette has two directions and has a forward and a reverse direction, so that the sensor in the prior art cannot feed back the information. In addition, setting up the reflector panel on the high altitude buffer still has a plurality of drawbacks: the conveying track is provided with a plurality of reflectors to detect a plurality of wafer boxes at the same time, and the placement angle of each reflector can only be manually adjusted one by one, so that the operation complexity is increased; and the reflector can only detect whether there is or not, can not detect the gesture of wafer box. Moreover, each trolley for transporting the wafer box is additionally provided with a transmitting sensor, so that the wafer box can be smoothly detected.
Disclosure of Invention
Accordingly, in order to overcome the above-mentioned drawbacks of the prior art, the present invention provides a wafer cassette correction method and a transportation device for an overhead buffer.
In order to achieve the above object, the present invention provides a wafer cassette correction method for a transportation device of an overhead buffer, comprising: adopting a vision processing system to respectively shoot front and rear images of the wafer box, and determining that the wafer box is in the correct direction according to the shot images; acquiring a preset detection angle of the vision processing system, and adjusting the detection angle of an image acquisition unit of the vision processing system according to the preset detection angle; acquiring the placement positions of the wafer cassettes on the OHB placement frame by adopting the adjusted vision processing system to obtain an acquired image; controlling the vision processing system to analyze the acquired image and determining the coordinate position of the wafer box on a coordinate system formed by the OHB rack; and adjusting and correcting the wafer box according to the coordinate position.
In one embodiment, the capturing front and rear images of the wafer cassette with the vision processing system, respectively, determines that the wafer cassette is in a correct direction according to the captured images, includes: respectively acquiring a theoretical front image and a theoretical rear image of the wafer box, and extracting features of the two images by adopting a feature extraction method to obtain theoretical features; extracting image characteristics of the shot image to obtain current characteristics; comparing the theoretical characteristics with the current characteristics, and determining a current front image and a current back image corresponding to the wafer box; and adjusting the wafer box according to the current front image and the current back image to enable the wafer box to be in the correct direction.
In one embodiment, the adjusting the detection angle of the image acquisition unit of the vision processing system according to the preset detection angle includes: acquiring shelf images of the OHB rack acquired by the vision processing system, and determining the horizontal angle of the OHB rack according to a gravity sensor; and generating an adjustment angle of the image acquisition unit according to the horizontal angle, the preset detection angle and the shelf image.
In one embodiment, the generating the adjustment angle of the image acquisition unit according to the horizontal angle, the preset detection angle and the shelf image includes: determining a first angle between the image acquisition unit and the OHB carriage according to the shelf image; determining a second angle between the image acquisition unit and the ground according to the horizontal angle and the first angle; and adjusting the second angle according to the preset detection angle to generate an adjustment angle of the image acquisition unit.
In one embodiment, the controlling the vision processing system to analyze the acquired image to determine a coordinate position of the wafer cassette on a coordinate system formed by the OHB rack includes: controlling the vision processing system to analyze the acquired image and determining a coordinate origin of the wafer box on a coordinate system formed by the OHB rack; analyzing coordinate parameters on the acquired image according to the preset detection angle; and determining the coordinate position of the wafer box on a coordinate system formed by the OHB rack according to the coordinate origin and the coordinate parameter.
The utility model provides a transportation equipment of high altitude buffer, its characterized in that includes two OHB racks and sets up the track between two OHB racks tops, install the walking ware rather than looks adaptation on the track, the bottom position fixed mounting of walking ware has the walking base plate, the top of walking base plate is close to two the vision processing system is all installed to the both sides position of OHB rack, wherein, vision processing system is foretell vision processing system.
In one embodiment, the vision processing system comprises a first bracket, a second bracket and an image collector, wherein the second bracket is of a concave structure, the first bracket is of a square frame structure, the image collector is fixedly arranged on the inner wall of the first bracket, the second bracket is fixed on the top of the walking substrate, and the first bracket and the inner walls of the two sides of the second bracket form a running fit.
In one embodiment, the image collector comprises a light source, an image collection unit, an image processing unit, and a communication unit.
In one embodiment, the OHB rack comprises an aluminum profile frame and a library bay, the top of which is used to house a wafer cassette.
In one embodiment, the walking device comprises a rotating shaft fixed in the middle of the top of the walking substrate, a speed reducer and a servo motor are respectively fixed on the two rotating shafts, the speed reducer is connected with an output shaft of the servo motor, and driving wheels matched with the tracks are arranged at two ends of the output shaft of the speed reducer.
Compared with the prior art, the invention has the advantages that: the vision processing system is adopted to shoot the wafer box positioned on the conveying trolley, and the position and the like of the wafer box are determined or adjusted according to the shot image, so that the conveyed wafer box can be correctly identified, the follow-up storage in a wafer box storage warehouse (storage) can be ensured to be fast and convenient, meanwhile, the whole device can be used for carrying out multi-aspect detection, the detection accuracy is improved, and the working errors are reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an enlarged view of a box selection in FIG. 1;
FIG. 3 is a schematic diagram of the overall top view of the present invention;
FIG. 4 is a schematic diagram of the overall side view of the present invention;
fig. 5 is a flowchart of the wafer cassette correction method of the present invention.
Detailed Description
Embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.
Other advantages and effects of the present disclosure will become readily apparent to those skilled in the art from the following disclosure, which describes embodiments of the present disclosure by way of specific examples. It will be apparent that the described embodiments are merely some, but not all embodiments of the present disclosure. The disclosure may be embodied or practiced in other different specific embodiments, and details within the subject specification may be modified or changed from various points of view and applications without departing from the spirit of the disclosure. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art without inventive effort, based on the embodiments in this disclosure are intended to be within the scope of this disclosure.
It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present disclosure, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, an apparatus may be implemented and/or a method practiced using any number of the aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concepts of the disclosure by way of illustration, and only the components related to the disclosure are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
In addition, in the following description, specific details are provided in order to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects may be practiced without these specific details.
As shown in fig. 1-4, the embodiment of the disclosure provides a transportation device for an overhead buffer, which includes two OHB racks 7 and a track 8 disposed between tops of the two OHB racks 7 and providing a walking path, on which a walking device 1 adapted to the track 8 is mounted, the walking device 1 is used for driving the whole detection device to move, a walking substrate 4 is fixedly mounted at a bottom position of the walking device 1, the walking substrate 4 is a reference part for mounting each element, and vision processing systems 5 are mounted at two side positions of the top of the walking substrate 4, which are close to the two OHB racks 7.
In one embodiment, the vision processing system 5 comprises a first bracket 6, a second bracket 3 and an image collector, wherein the second bracket 3 is in a concave structure, the first bracket 6 is in a square frame structure, the image collector is fixedly arranged on the inner wall of the first bracket 6, the second bracket 3 is fixed on the top of the traveling substrate 4, and the first bracket 6 is in rotating fit with the inner walls of the two sides of the second bracket 3, so that the first bracket 6 turns over to adjust the image collection angle of the image collector and drive the collection range; the first bracket 6 and the second bracket 3 can form a running fit through a gear joint, so that the first bracket 6 is convenient for keeping the first bracket 6 and the second bracket 3 relatively static under the action of no external force.
In one embodiment, the image collector comprises a light source, an image collecting unit, an image processing unit, a communication unit and the like. The light source may be various bulbs, etc. The image acquisition unit is a camera, the camera acquires images of finished products or positions of the finished products, the acquired images are fed back to the image processing unit, the image processing unit performs recognition analysis on the images, then a corresponding processing mode is selected, the processing mode is fed back to the corresponding controller, and the corresponding controller controls the corresponding unit to act.
In one embodiment, the OHB rack 7 comprises an aluminum profile frame and a library bay, the top of which is used to house the wafer cassettes 2, the size of the OHB rack 7 being made according to the size of the place, which is described in addition here, the place bay may be replaced by a placement slot.
In one embodiment, the walker 1 comprises a rotating shaft fixed in the middle of the top of the walking substrate 4, two rotating shafts are respectively fixed with a speed reducer and a servo motor, the speed reducer is connected with the output shaft of the servo motor, two ends of the output shaft of the speed reducer are provided with driving wheels matched with the track 8, and two independent servo motors are used as power, so that the walker is convenient to maintain, and the walker is convenient to maintain and replace because no too many compact sundries exist.
As shown in fig. 5, an embodiment of the present disclosure further provides a wafer cassette correction method, which is used on a transportation device of an overhead buffer, and includes:
and step 501, respectively shooting front and rear images of the wafer box by adopting a vision processing system, and determining that the wafer box is in a correct direction according to the shot images.
The transportation equipment adopts a vision processing system to shoot the front and back images of the wafer box respectively, and the wafer box is determined to be in the correct direction according to the shot images. The vision processing system of the transport device is located above the wafer cassette and can capture either a front image or a rear image of the wafer cassette. When the wafer cassette is stored in the storage library, the direction of the wafer cassette needs to be determined, so that the storage library can be ensured to accurately store the wafer cassette. The transportation equipment can shoot front and back images above a wafer box, and the direction of the wafer box is determined by identifying the characteristics of the front and back images and comparing the characteristics of the theoretical images. When the direction of the wafer cassette is determined to be incorrect, the transport device may generate an adjustment instruction for adjusting the wafer cassette according to a deviation between the front and rear images of the wafer cassette and the theoretical image. The adjusting instruction can be sent to the moving trolley where the wafer box is located by the conveying equipment, and the bearing platform of the moving trolley for bearing the wafer box can rotate according to the adjusting instruction, so that the wafer box is guaranteed to be in the correct direction. The load-bearing platform can be provided with a garage position plate.
Step 502, obtaining a preset detection angle of the vision processing system, and adjusting the detection angle of the image acquisition unit of the vision processing system according to the preset detection angle.
The transportation equipment acquires a preset detection angle of the vision processing system, and adjusts the detection angle of the image acquisition unit of the vision processing system according to the preset detection angle. The preset detection angle can be automatically calculated by the system, and can be calculated according to the conveying type of the mobile trolley, the size of the OHB rack 7 and the like, and the preset detection angle is the angle with the most characteristic of shooting the wafer box, so that the accuracy of analysis is improved in subsequent analysis. The transportation equipment can adjust the detection angle of the image acquisition unit of the vision processing system only according to the preset detection angle; the transport device can also adjust the detection angle of the image acquisition unit of the vision processing system according to preset detection angles, relevant parameters of the OHB carriage 7, etc.
And step 503, acquiring the placement positions of the wafer cassettes on the OHB rack by adopting the adjusted vision processing system to obtain an acquired image.
The transport equipment adopts the adjusted vision processing system to collect the placement positions of the wafer boxes on the OHB placing rack, and a collected image is obtained. The transportation equipment adjusts the angle of an image acquisition unit of the vision processing system, namely the transportation equipment adjusts the shooting angle of a camera of the vision processing system; in one embodiment, the transportation device also adjusts the acquisition parameters of the camera, so as to ensure the definition degree and the quality of the image.
In step 504, the vision processing system is controlled to analyze the acquired image to determine a coordinate position of the wafer cassette on a coordinate system formed by the OHB placement frame.
The transport equipment controls the vision processing system to analyze the acquired images and determine the coordinate position of the wafer cassette on a coordinate system formed by the OHB placement frame.
And 505, adjusting and correcting the wafer box according to the coordinate position.
The transport device generates a correction instruction for adjusting and correcting the wafer box according to the coordinate position. The correction instruction can be sent to the mobile trolley where the wafer box is located by the conveying equipment, and the carrying platform of the mobile trolley carrying the wafer box can rotate or lift according to the adjustment instruction, so that the wafer box is guaranteed to be in a correct position. The bottom of the bearing platform is provided with a plurality of struts, and each strut can be lifted respectively, so that the local lifting of the bearing platform is realized. Each post may be a lead screw assembly.
According to the device and the method, the vision processing system is adopted to shoot the wafer box on the conveying trolley, the position of the wafer box is determined or adjusted according to the shot image, and the like, so that the conveyed wafer box can be accurately identified, the follow-up rapid and convenient storage in the wafer box storage warehouse (storage) is ensured, meanwhile, the whole device can be used for carrying out multi-aspect detection, the detection accuracy is improved, and the working errors are reduced.
In one embodiment, the visual processing system is used to capture front and rear images of the wafer cassette, and determining that the wafer cassette is in the correct orientation based on the captured images, including: respectively acquiring a theoretical front image and a theoretical rear image of the wafer box, and extracting features of the two images by adopting a feature extraction method to obtain theoretical features; extracting image characteristics of the shot image to obtain current characteristics; comparing the theoretical characteristics with the current characteristics, and determining a current front image and a current rear image corresponding to the wafer box; and adjusting the wafer box according to the current front image and the current back image to enable the wafer box to be in the correct direction.
The transportation equipment respectively acquires a theoretical front image and a theoretical rear image of the wafer box, and adopts a feature extraction method to extract features of the two images so as to obtain theoretical features. The transport device shoots images in front of and behind the wafer cassette respectively, resulting in two different shot images. And the vision processing system respectively extracts image characteristics of the two shot images to obtain current characteristics.
The vision processing system compares the theoretical characteristics with the current characteristics and determines a current front image and a current back image corresponding to the wafer box. The vision processing system can determine a current front image and a current back image corresponding to the wafer box by calculating the similarity of theoretical features and current features; the vision processing system can also conduct one-to-one overlapping comparison on the theoretical characteristics and the current characteristics, and when the overlapped characteristic values reach the preset values, the current front image and the current back image corresponding to the wafer box are determined. The vision processing image adjusts the wafer box according to the current front image and the current back image, so that the wafer box is in the correct direction.
In one embodiment, adjusting the detection angle of the image acquisition unit of the vision processing system according to the preset detection angle includes: acquiring shelf images of the OHB rack acquired by the vision processing system, and determining the horizontal angle of the OHB rack according to the gravity sensor; and generating an adjustment angle of the image acquisition unit according to the horizontal angle, the preset detection angle and the shelf image.
The transportation equipment acquires shelf images of the OHB rack acquired by the vision processing system, and determines the horizontal angle of the OHB rack according to the gravity sensor. The gravity sensor is arranged on the OHB rack and performs data transmission with the vision processing system through the communication unit. And the transportation equipment generates an adjustment angle of the image acquisition unit according to the horizontal angle, the preset detection angle and the shelf image.
In one embodiment, generating the adjustment angle of the image acquisition unit according to the horizontal angle, the preset detection angle and the shelf image includes: determining a first angle between the image acquisition unit and the OHB rack according to the shelf image; determining a second angle between the image acquisition unit and the ground according to the horizontal angle and the first angle; and adjusting the second angle according to the preset detection angle to generate an adjustment angle of the image acquisition unit.
The image processing unit of the vision processing system may be a chip with an arithmetic function, such as FPGA, CPU, GPU. The image processing unit determines a first angle between the image acquisition unit and the OHB rack according to the shelf image. The image processing unit determines a second angle between the image acquisition unit and the ground according to the horizontal angle and the first angle. The image processing unit adjusts the second angle according to the preset detection angle, and generates an adjustment angle of the image acquisition unit.
In one embodiment, controlling the vision processing system to analyze the acquired image to determine a coordinate position of the wafer cassette on a coordinate system formed by the OHB gantry comprises: the vision processing system is controlled to analyze the acquired image, and a coordinate origin of the wafer box on a coordinate system formed by the OHB rack is determined; analyzing and collecting coordinate parameters on the image according to a preset detection angle; and determining the coordinate position of the wafer box on a coordinate system formed by the OHB rack according to the coordinate origin and the coordinate parameters.
The image processing unit of the transport equipment control vision processing system analyzes the acquired images and determines the origin of coordinates of the wafer cassette on a coordinate system formed by the OHB placement frame. The image processing unit analyzes and collects coordinate parameters on the image according to a preset detection angle, wherein the coordinate parameters comprise parameter values of the wafer box in three directions of xyz in a coordinate system. The image processing unit determines the coordinate position of the wafer cassette on a coordinate system formed by the OHB rack according to the coordinate origin and the coordinate parameters.
In one embodiment, the image processing unit adopts a vision processing system to respectively shoot front and rear images of the wafer box, and when the overlapping degree of the acquired front and rear images of the wafer box and the theoretical image is smaller than a preset value, the image processing unit judges that the wafer box is not present or an obstacle is present in the area. The image processing unit generates warning information according to the judging result.
The foregoing is merely specific embodiments of the disclosure, but the protection scope of the disclosure is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the disclosure are intended to be covered by the protection scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims (9)

1. A wafer cassette correction method for use in a transport facility for an overhead buffer, comprising:
adopting a vision processing system to respectively shoot front and rear images of the wafer box, and determining that the wafer box is in the correct direction according to the shot images; when the direction of the wafer box is determined to be incorrect, generating an adjusting instruction for adjusting the wafer box according to the deviation between the front and back images of the wafer box and the theoretical image; the adjusting instruction is sent to a mobile trolley where the wafer box is located, and a bearing platform of the mobile trolley for bearing the wafer box rotates according to the adjusting instruction, so that the wafer box is ensured to be in a correct direction;
acquiring a preset detection angle of the vision processing system, and adjusting the detection angle of an image acquisition unit of the vision processing system according to the preset detection angle; wherein, adjusting the detection angle of the image acquisition unit of the vision processing system according to the preset detection angle includes: acquiring shelf images of the OHB rack acquired by the vision processing system, and determining the horizontal angle of the OHB rack according to a gravity sensor; generating an adjustment angle of the image acquisition unit according to the horizontal angle, the preset detection angle and the shelf image;
acquiring the placement positions of the wafer cassettes on the OHB placement frame by adopting the adjusted vision processing system to obtain an acquired image;
controlling the vision processing system to analyze the acquired image and determining the coordinate position of the wafer box on a coordinate system formed by the OHB rack;
and adjusting and correcting the wafer box according to the coordinate position.
2. The method of claim 1, wherein capturing front and rear images of the wafer cassette with the vision processing system, respectively, and determining that the wafer cassette is in the correct orientation based on the captured images comprises:
respectively acquiring a theoretical front image and a theoretical rear image of the wafer box, and extracting features of the two images by adopting a feature extraction method to obtain theoretical features;
extracting image characteristics of the shot image to obtain current characteristics;
comparing the theoretical characteristics with the current characteristics, and determining a current front image and a current back image corresponding to the wafer box;
and adjusting the wafer box according to the current front image and the current back image to enable the wafer box to be in the correct direction.
3. The method of claim 1, wherein the generating the adjustment angle of the image acquisition unit from the horizontal angle, the preset detection angle, and the shelf image comprises:
determining a first angle between the image acquisition unit and the OHB carriage according to the shelf image;
determining a second angle between the image acquisition unit and the ground according to the horizontal angle and the first angle;
and adjusting the second angle according to the preset detection angle to generate an adjustment angle of the image acquisition unit.
4. The method of claim 1, wherein the controlling the vision processing system to analyze the acquired image to determine a coordinate position of the wafer cassette on a coordinate system formed by the OHB rack comprises:
controlling the vision processing system to analyze the acquired image and determining a coordinate origin of the wafer box on a coordinate system formed by the OHB rack;
analyzing coordinate parameters on the acquired image according to the preset detection angle;
and determining the coordinate position of the wafer box on a coordinate system formed by the OHB rack according to the coordinate origin and the coordinate parameter.
5. The transportation equipment of the high-altitude buffer is characterized by comprising two OHB (overhead head) racks and a track arranged between the tops of the two OHB racks, wherein a walking device matched with the track is arranged on the track, a walking substrate is fixedly arranged at the bottom of the walking device, a vision processing system is arranged at the top of the walking substrate and close to the two sides of the two OHB racks,
wherein the vision processing system performs the wafer cassette correction method of any one of claims 1-4.
6. The transport apparatus as recited in claim 5, wherein: the vision processing system comprises a first support, a second support and an image collector, wherein the second support is of a concave structure, the first support is of a square frame structure, the image collector is fixedly arranged on the inner wall of the first support, the second support is fixed at the top of the walking substrate, and the first support and the inner walls of the two sides of the second support form a running fit.
7. The transport apparatus of claim 6, wherein: the image collector comprises a light source, an image collecting unit, an image processing unit and a communication unit.
8. The transport apparatus as recited in claim 5, wherein: the OHB rack comprises an aluminum profile frame and a warehouse location plate, and the top of the warehouse location plate is used for placing the wafer box.
9. The transport apparatus as recited in claim 5, wherein: the walking device comprises a rotating shaft fixed in the middle of the top of a walking substrate, a speed reducer and a servo motor are respectively fixed on the two rotating shafts, the speed reducer is connected with an output shaft of the servo motor, and driving wheels matched with the tracks are arranged at two ends of the output shaft of the speed reducer.
CN202210337878.9A 2022-04-01 2022-04-01 Wafer box correction method and transport equipment of high-altitude buffer Active CN114743892B (en)

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