M3 02042 . 八、新型說明： 【新型所屬之技術領域】 本創作係與間隔物有關，特別是關於一種載具間隔物。 【先前技術】 -5 間隔物的使用範圍極廣，例如：於液晶顯示器生產線 上承載玻璃基板的使用場合，其原理主要是將一間隔物設 置於一玻璃基板底侧或玻璃基板之間，藉由間隔物承載玻 t 璃基板，可於生產線輸送期間達到保護玻璃基板的目的。 然而，玻璃基板經過加工後，其於邊緣會電性連接有 1〇複數個排線以及複數電路板，習用間隔物係為板體，無法 對電路板進行限位，在生產線上的輸送期間，容易使電路 板，位移晃動而拉扯排線導致毀損；再者，當玻璃基板以 堆豐方式存放時，習用間隔物與玻璃基板之間為相互貼合 而接觸面積大，使得間隔物與玻璃基板之間因靜電吸附的 籲15 #用而黏在一起’造成位於下方之玻璃基板因碰撞而毀損。 【新型内容】 本創作之主要目的在於提供—種載具間隔物 於生產線運作_達到保護被承載物之特色。M3 02042 . VIII. New description: [New technical field] This creation is related to spacers, especially for a carrier spacer. [Prior Art] -5 The use of spacers is extremely wide. For example, in the case of using a glass substrate on a liquid crystal display production line, the principle is mainly to place a spacer on the bottom side of a glass substrate or between glass substrates. The glass substrate is carried by the spacer, and the glass substrate can be protected during the transportation of the production line. However, after the glass substrate is processed, a plurality of wires and a plurality of circuit boards are electrically connected to the edge, and the conventional spacer is a plate body, and the circuit board cannot be limited, during the transportation on the production line. It is easy to cause the circuit board to sway and pull the cable to cause damage. Further, when the glass substrate is stored in a stack, the conventional spacer and the glass substrate are bonded to each other and the contact area is large, so that the spacer and the glass substrate are arranged. The adhesion between the two surfaces due to electrostatic adsorption is caused by the collision of the glass substrate located below. [New content] The main purpose of this creation is to provide a carrier spacer to operate on the production line _ to achieve the characteristics of the protected carrier.
其具有 3以 3以支撐生產線 :該載具間隔物中央具有—承 一環形凹陷區，其中該承载區 ;藉此，本創作具有於生產線 並兼具有降低靜電u及 4 M302042 附效應的作用。 【實施方式】 為了詳細說明本創作之結構、特徵及功效，以下茲舉 5四較佳實施例並配合圖式，說明如下： 請茶閱第一圖至第五圖，其為本創作載具間隔物（1〇) 的第一較佳實施例，主要是應用於生產線上，放置於被承 載物的底侧或是二被承載物之間，用以支撐生產線上的被 承載物並避免被承載物產生損傷。 1〇 ^本創作之載具間隔物（10)為高倍數發泡材料，由選自以 聚乙烯(Polyethylene ; PE)、聚婦烴(P〇ly〇lefine ; p〇)、聚丙 烯(Polypropylene ; PP)、聚笨乙烯(p〇1卿rene ; ps)、聚氨 酯（Polyurethane ; PU)或乙烯-乙酸乙烯酯（Ethylene_vinylIt has 3 to 3 to support the production line: the center of the carrier spacer has an annular recessed area, wherein the carrying area; thereby, the creation has a function of reducing the static electricity u and 4 M302042 . [Embodiment] In order to explain the structure, features and effects of the present invention in detail, the following description of the preferred embodiment and the accompanying drawings are as follows: Please read the first to fifth figures, which are the creative vehicles. The first preferred embodiment of the spacer (1〇) is mainly applied to the production line, placed on the bottom side of the carried object or between the two supported objects, to support the carried object on the production line and avoid being The load is damaged. 1〇^ The carrier spacer (10) is a high-expansion foam material selected from the group consisting of polyethylene (PE), polyglycol (P〇ly〇lefine; p〇), and polypropylene (Polypropylene). ; PP), polystyrene (p〇1 rene; ps), polyurethane (PU) or ethylene-vinyl acetate (Ethylene_vinyl)
Ac^ate ; EVA)所製成且發泡程度為介於3〇%至8〇%之間， 15本貝施例則以聚乙細(Polyethylene ; PE)為例。 該載具間隔物(10)於中央具有—承載區（11)，該承載區 (11)的周圍具有一環形凹陷區（12)，其中該承載區（11)的厚 度大於该凹陷區（12)的厚度。該載具間隔物（1〇)的内部具有 複數個氣孔(13)，用以提供緩衝減震的作用。該載具間隔物 20 (1〇)具有四夾持孔（14)以及複數個穿孔（15)，該四夾持孔（14) 設於該承載區（11)的中央位置且該夾持孔的直徑大於該穿 孔的直徑，用以供一自動化生產夾具(未顯示)挾持該載且間 隔物⑽，、該等穿孔(15)分別貫穿該載具間隔物（1〇)的頂面 及底面，並呈矩陣式排列而概呈均勻地分布於該承载區 5 M302042 (11)’此外’各这穿孔(15)於兩端緣分別形成一導圓角（Mi)。 凊參閱第二圖及第四圖，其為本創作載具間隔物（1〇) 的一種實施方式，其用以承載一玻璃基板(2〇)，該玻璃基板 (20)邊緣裝設有複數個排線(21)以及複數個電路板(22);其 5中，該承載區（11)用以承載該玻璃基板(20)，該玻璃基板(20) 可貼合於該承載區（11)的頂面並形成摩擦力，防止該玻璃基 板(20)發生位移，同時，該等穿孔(15)内存留有空氣而破壞 該載具間隔物（1〇)與該玻璃基板(2〇)之間的真空狀態，以降 低該載具間隔物（10)與該玻璃基板(20)之間的靜電吸附作 10用，此外，由於發泡材料相較於該玻璃基板(20)軟，具有吸 晨之作用且不會割傷該玻璃基板(2〇)。該凹陷區（12)用以放 置該電路板(22)，防止該電路板(22)因位移晃動而拉扯該等 排線(21)導致毀損。 :凊麥閱第五圖，其為本創作載具間隔物(1〇)的另一種實 15 =方式’其揭减堆疊方式承載二玻璃基板⑼）；藉此，同 樣能達到前述之功效而達到保護該載具間隔物⑽之目的。 心請參閱第六圖，其為本創作載具間隔物(3〇)的第二較佳 貫施例 >，其結構大致與第一較佳實施例相同，惟，其差異 ^於f载具間隔物(3〇)於承载區(32)具有紋路(則；藉 20 I接Si路(321)與該玻璃基板(2〇)間形成有空隙而 少接觸面％而降低靜電的產生。 〜明純U七圖，其為本創作載具間隔物㈣的第三較佳 广例’其結構大致與第—較佳實施例侧，惟，其差里 在於.錄具間隔物(4G)於環緣具有—擔止牆⑽，該擔止 6 M302042 膽(40)圍合環繞該載具間隔物(4〇)之凹陷區(4句；藉此，該 擋止牆(40)能更進步一對該電路板(22)進行限位，達 被承載物之目的。 ”叹 請參閱第八圖及第九圖，其為本創作載具間隔物⑽ ;的第四較佳實施例，其結構大致與第一較佳實施例相同， 惟，其差異在於，該載具間隔物（5〇)具有複數個凹陷區 (52) ’各該凹陷區⑽環繞於該承載區⑻外圍且相隔預定 距離’複數個第二承載區(56)形成於各該凹陷區(52)之間且 同樣具有複數個穿孔(58);如第十圖及第十一圖所示，藉 ^該載具間隔物(5〇)能應用於不同尺寸的承載物，其以』 寻f-承載區(56)支撐超出該承載區(54)的玻璃基板(2〇)， 同日^對位於該等凹陷區⑼其中之一的電路板(22)進行限 位’達到保護被承載物之目的，具有較佳之適用性。 15 20 物相由上述較佳實施例，本創作之載具間隔 物相較於習用者，具有以下特色·· 運用呈載區與凹陷區在高度位置上的不 接 尺相被抑獅㈣區的料，可朗於不同 尺寸的被承，在❹上具有錄適用性， 形成ξ衝tr 乍::發泡材料的特性減輕間隔物的重量並 办戚緩衝放果，具有緩衝吸震之特色。 7 M3 02042 五.本創作運用承載區表面的紋路，減少接觸面積而降 低靜電的產生。 藉此，本創作所提供之載具間隔物具有於生產線運作 期間達到保護被承載物之特色。 M3 02042 【圖式簡單說明】 第一圖為本創作第一較佳實施例之頂視圖。 第二圖為第一圖沿2-2剖面線之剖視圖。 第三圖為本創作第一較佳實施例於使用狀態之示意 5圖。 第四圖為第三圖沿4-4剖面線之剖視圖。 第五圖為本創作第一較佳實施例於另一使用狀態之示 意圖。 第六圖為本創作第二較佳實施例之結構示意圖。 ίο 第七圖為本創作第三較佳實施例之結構示意圖。 第八圖為本創作第四較佳實施例之頂視圖。 第九圖為第八圖沿9-9剖面線之剖視圖。 第十圖為本創作第四較佳實施例於使用狀態之示意 圖。 15 第十一圖本創作第四較佳實施例於另一使用狀態之示 意圖。 9 M3 02042 【主要元件符號說明】Ac^ate; EVA) is made and the degree of foaming is between 3〇% and 8%, and the 15th embodiment is exemplified by Polyethylene (PE). The carrier spacer (10) has a bearing area (11) at the center, and an annular recessed area (12) around the carrying area (11), wherein the carrying area (11) has a thickness greater than the recessed area (12) )thickness of. The carrier spacer (1〇) has a plurality of air holes (13) inside to provide cushioning and shock absorption. The carrier spacer 20 (1〇) has four clamping holes (14) and a plurality of perforations (15), and the four clamping holes (14) are disposed at a central position of the carrying area (11) and the clamping holes The diameter of the perforation is larger than the diameter of the perforation for an automated production fixture (not shown) to hold the carrier and the spacer (10), the perforations (15) respectively extending through the top and bottom surfaces of the carrier spacer (1) And arranged in a matrix and uniformly distributed in the carrying area 5 M302042 (11) 'In addition, each of the perforations (15) respectively form a rounded corner (Mi) at both end edges. Referring to the second and fourth figures, which is an embodiment of the inventive carrier spacer (1〇), which is used to carry a glass substrate (2〇), the edge of the glass substrate (20) is provided with a plurality of a wiring line (21) and a plurality of circuit boards (22); wherein the carrying area (11) is used to carry the glass substrate (20), and the glass substrate (20) can be attached to the carrying area (11) The top surface forms a frictional force to prevent displacement of the glass substrate (20), and at the same time, air is left in the perforations (15) to destroy the carrier spacer (1〇) and the glass substrate (2〇) a vacuum state between the carrier spacer (10) and the glass substrate (20) for reducing electrostatic adsorption, and further, since the foamed material is softer than the glass substrate (20), It absorbs the morning and does not cut the glass substrate (2〇). The recessed area (12) is for placing the circuit board (22) to prevent the circuit board (22) from being damaged by pulling the line (21) due to displacement and shaking. : The fifth picture of the buckwheat is the other 15=method of the creation of the spacer (1〇), which is a stacking method for carrying the two glass substrates (9); thereby, the same effect can be achieved. The purpose of protecting the carrier spacer (10) is achieved. Please refer to the sixth figure, which is a second preferred embodiment of the creation carrier spacer (3〇), and its structure is substantially the same as that of the first preferred embodiment, but the difference is The spacer (3 〇) has a grain in the carrying area (32) (there is a gap formed between the 20 I connected Si path (321) and the glass substrate (2 〇), and the contact surface % is reduced to reduce the generation of static electricity. ~Ming Chun U seven map, which is the third preferred example of the creation of the carrier spacer (4). Its structure is roughly the same as that of the first preferred embodiment. However, the difference lies in the recording spacer (4G). Having a wall (10) on the rim, the damper 6 M302042 biliary (40) encloses a recessed area surrounding the carrier spacer (4 ;) (4 sentences; thereby, the blocking wall (40) can be further A pair of the circuit board (22) is stepped to achieve the purpose of being carried. "Please refer to the eighth and ninth drawings, which are the fourth preferred embodiment of the creation carrier spacer (10); The structure is substantially the same as that of the first preferred embodiment, except that the carrier spacer (5〇) has a plurality of recessed regions (52). Each of the recessed regions (10) surrounds the periphery of the carrying region (8) and A plurality of second load-bearing regions (56) are formed between each of the recessed regions (52) and also have a plurality of perforations (58); as shown in the tenth and eleventh figures, The spacer (5〇) can be applied to different sizes of carriers, which support the glass substrate (2〇) beyond the bearing area (54) by the f-bearing area (56), and the same day is located in the depression The circuit board (22) of one of the zones (9) is subjected to the limit 'to achieve the purpose of protecting the carrier, and has good applicability. 15 20 Phases According to the above preferred embodiment, the spacer of the present invention is compared with The learner has the following characteristics: · The material of the lion (four) area in the height position of the loading area and the recessed area can be used for the different sizes of the bearing, and the applicability is formed on the raft. Tr tr tr 乍:: The characteristics of the foaming material reduce the weight of the spacer and handle the buffering effect, which has the characteristics of buffer shock absorption. 7 M3 02042 V. This creation uses the texture of the surface of the bearing area to reduce the contact area and reduce the static electricity. Produced. The carrier spacers provided by this creation are operated on the production line. During the period, the characteristics of the protected load are achieved. M3 02042 [Simplified description of the drawings] The first figure is a top view of the first preferred embodiment of the creation. The second figure is a cross-sectional view of the first figure taken along line 2-2. The three figures are schematic diagrams of the first preferred embodiment of the present invention in use. The fourth figure is a cross-sectional view of the third figure taken along line 4-4. The fifth figure is a first preferred embodiment of the present invention. Figure 6 is a schematic view showing the structure of the second preferred embodiment of the present invention. Figure 7 is a schematic view showing the structure of the third preferred embodiment of the present invention. The ninth view is a cross-sectional view of the eighth figure taken along line 9-9. The tenth figure is a schematic view of the fourth preferred embodiment of the present invention in use. 15 Eleventh Figure The fourth preferred embodiment of the present invention is shown in another use state. 9 M3 02042 [Description of main component symbols]
載具間隔物（10) 承載區（11) 凹陷區（12) 氣孔(13) 夾持孔(14) 穿孔(15) 導圓角（151) 玻璃基板(20) 排線(21) 電路板(22) 載具間隔物(30) 承載區(32) 紋路(321) 載具間隔物(40) 擋止牆(42) 凹陷區(44) 載具間隔物(50) 凹陷區（52) 承載區(54) 第二承載區(56) 穿孔(58) 10Carrier spacer (10) Bearing area (11) Recessed area (12) Air hole (13) Clamping hole (14) Perforation (15) Conduction fillet (151) Glass substrate (20) Cable (21) Circuit board ( 22) Carrier spacer (30) Bearing area (32) Texture (321) Carrier spacer (40) Stop wall (42) Depression area (44) Carrier spacer (50) Depression area (52) Carrying area (54) Second load zone (56) Perforation (58) 10