M301957 八、新型說明： 【新型所屬之技術領域】 本新型是關於一種橋接元件，特別是一種具環凹槽之 螺母等橋接元件。 5【先前技術】 目前常用的表面安裝法在將電路祖關元件焊接於一印 刷電路板的過程中，多係以一吸嘴抽氣產生負壓，藉以吸 附該元件，並於對正預定焊接位置後，釋放至印刷電路板 上，再將業已放置諸多元件之印刷電路板經由錫爐焊固， 10將各元件以此表面黏著法而焊接至電路板。 但對於本身形成有穿孔、會漏氣的元件，如圖1所示 的螺母3 ’其包括環狀側壁32，及由環狀側壁32所界定出 之穿孔30,吸嘴即便是接近螺每3頂面抽氣，但因穿孔3〇 之浪露仍無從形成負壓。故在當時是採用於螺母3頂面加 15裝軟貝頂塞33的結構，藉0封閉該穿孔30，供吸嘴吸 持而搬移，_然可達成吸持、對位及焊接的目⑽，但是軟 質頂塞33受力易變形，不易順利塞入螺孔中，且焊接完必 而以人力拔除’不僅不方便，更擔心部分軟質橡膠剝落而 在電路板上留下殘屑。 '〇 申請人故在中華民國新型專利第500197號中揭露一 種「具盲孔之螺母」，如圖2所示，此螺母4具有一供焊接 之底壁41，用以與一印刷電路，板5連結，自底壁41之周 緣向上延伸有一環狀側壁42，底壁41與環狀侧壁42相配 ^疋盲孔40，且環狀側壁42之内壁形成有一内螺紋 M301957 43，供螺絲螺入連結。由於盲孔之密閉設計，因此作業時， 不必額外加裝習知的軟質頂塞，便可直接以一自動吸嘴抵 住％狀側壁42之頂面，對盲孔4〇抽氣產生負壓，同樣達 成易吸持、對位、焊接的目的。 如圖3所示’亦有人對習知螺母3作另一改進：在該 螺母3環狀側壁32接近底壁31端緣以徑向内縮設有一吃 錫部34 ’於焊錫時，錫料35會因毛細現象爬錫而伸入吃 錫部34 ’使其焊固定位更加的穩固。 而上述各種螺母3、4亦常被用於如圖4所示電路板 10 15 5,用以固定散熱鰭片52的位置，以確保散熱鰭片52能迫 緊貼合於例如一積體電路元件51的表面，而順利將積體電 路7G件51所發熱能導出；是以，若能進一步增加螺母本身 之散熱能力，更能額外達成辅佐散熱之功效。 此外上述橋接元件也可能為如圖5所示之間隔器6, 同樣具有一底壁61與環繞側壁62且由此界定出一穿孔 6〇’底壁61可供焊接至電路板5上，並讓穿孔⑼對應電 路板上之定位孔50’在間隔器·6焊接妥當後，將可使用一 螺栓7卜連續穿過例如-散熱韓片7的通孔7〇，以及穿孔 60與定位孔5G，而螺合於電路板5下方的螺帽72。藉由 間隔器6而保持散熱鰭片7與電路板5之間距。 承上所述，一方面金屬材料成本高張，另方面電子業 界輕薄短小之潮流，在在要求電子元件縮小體積、重量斑 用料；尤其積體電路技術進步，元件處理能力^ 同步提高，電路之散熱效果更成為容許積體電路進:步集 20 M301957 積化之限制。換言之，如何有效降低螺母、間隔器等橋接 元件重量、並增進散熱效能，無疑是值得關注之研發方向。 【新型内容】 因此，本新型的主要目的，即在於提供一種耗材極少 5之具裱凹槽橋接元件，有效增加可供回收的下腳料，節约 製程中金屬材料之使用。 本新型之另一目的，在提供一種重量極輕之具環凹槽 橋接元件，讓採用此元件之電子產品重量隨之進一步減輕。 本新型之又一目的，在提供一種具有較大表面積具環 10凹槽橋接元件，藉助於金屬材f之良好導熱特性，提供使 用者進一步之散熱效能。 ’ 於是’本新型之具環凹槽橋接元件，具有一供與一印 刷電路板焊接結合之底壁，自該底壁之周緣向上延伸有一 環繞側壁，該底壁與該側壁共同界定有一盲孔，且該側壁 15形成該盲孔之内側形成有一供一螺絲連結之螺紋，其特徵 在於：該側壁具有一遠離該底壁之頂面，且該側壁相反於 該内侧之外側，凹陷形成有一自一與該頂面保持一預定距 離處向該底壁延伸達超過該側壁高度一半距離之徑向限縮 環凹槽。 20 藉由環凹槽之設計，製造_母過程中切削去除之下腳 料增多’可供回收而獲得利潤；螺母重量隨之減輕，符人 電子業潮流趨勢；尤其製成之螺母外表面積被有效增大， 使其具有更佳之散熱效果。i 【實施方式】 M301957 本新型刖述及其它技術内容、特點與功效，以下配合 一實施例的洋細說明及參照參考圖示，將可清楚的呈現. 其中與前案相同之部件’將延用相同或類似編號。 本新型具環凹槽橋接元件的第一較佳實施例如圖6所 5示，是利用一導熱良好金屬例如銅材所製成之螺母，同樣 具有一底壁11，用以與一印刷電路板5上之焊墊焊接連 結，自底壁11周緣向上延伸有一環狀側壁12，底壁i丨與 環狀側壁12相配合界定出一盲孔1〇,且侧壁12形成有盲 孔10之内側具有-内敎13，可供—螺關合連結。為 便於說明，並定義侧壁12在遠離底壁116〇端面為一頂面 12卜在本例中頂® i 2 i係以圓形為例，且其外徑大致等於 底壁11的外徑。 15 ❿ 在環狀侧壁12的外側面1;2〇,從離頂面121 一預定足 離的位置開始’凹設有一道環四槽2，且環凹槽2之總I 度更達側壁的-半以上’本例中’為使散熱效果大幅提升 在車床切削過程中’係以從外側向内車削出兩道凹環2 為例’並且在兩道凹環20間保留有一未切削之凸環緣η 此凸環緣21之外徑也因此大致等於頂面ΐ2ι和底壁^ ^ 外徑；藉此凸環緣21將環凹槽2分隔為上下兩段凹環^ 由於此螺母i之外表面變為頂面121、外侧面12〇、凸環轉 U上下側面、凹環2G部份等之面積加總，總表面積大柄 增大，使得散熱效能大幅提升。 ίο位^在本财’側壁頂面121從接近外側位置朝向盲巩 ，更切削出-傾斜之導角，—方面保留適當之頂面 20 M301957 121寬度，確保螺母i可順利被表面安裝技術之吸嘴吸取 搬移，另方面藉由導角之導引，讓操作人員將螺柱鎖入焊 接完畢的螺母1過程順利。如此，不僅可切削出大量下腳 料供回收，並且有效減輕螺母1重量，更能增大其表面積 5而使其具有更佳之散熱效果，充分達成本案目的。 當然’上述環凹槽2並不限於兩凹環、亦可更多或更 少；元件不限於螺母、且外表不限於圓形；製造方法亦不 限於車削，而可考慮壓鑄、洗鑄成型等方式。 圖7是本新型具環凹槽橋接元件的第二較佳實施例， 10與前一較佳實施例不同的地方在於：本例之元件為壓鑄成 型之間隔器Γ ;且環狀側壁12,外側面120，凹限形成的環 凹槽2,僅有單-凹陷，因此，此過程中並不會有下腳料， 但仍能達成節省製程之用料等目的。 此外，在本例間隔器i，之底壁u，，除原有的本體11〇 固疋部111 ’，使得在間隔 ，可以固定部111，插入電 ’藉以大致確保間隔器1， 外，更由本體110,向下延伸出一 g 器Γ被搬移至印刷電路板5上時， 路板5上預先形成之固定孔5〇中， 在焊接前之定位。 綜上所述，太新创夕撼妓}从*先，1 .M301957 VIII. New description: [New technical field] The present invention relates to a bridging element, in particular to a bridging element such as a nut with a ring groove. 5 [Prior Art] At present, the commonly used surface mounting method in the process of soldering circuit ancestor components to a printed circuit board is to draw a negative pressure by suction with a nozzle, thereby absorbing the component and pre-welding the alignment. After the position, it is released onto the printed circuit board, and the printed circuit board on which many components have been placed is soldered through a soldering furnace, and the components are soldered to the circuit board by surface adhesion. However, for the component itself which is formed with perforations and leaks, the nut 3' shown in FIG. 1 includes an annular side wall 32, and a perforation 30 defined by the annular side wall 32, even if the nozzle is close to the screw every 3 The top surface is pumped, but there is still no negative pressure due to the perforation of the hole. Therefore, at the time, it was adopted on the top surface of the nut 3 and the structure of the soft shell top plug 33 was installed. The perforation 30 was closed by 0, and the suction nozzle was held by the suction and moved, so that the suction, alignment and welding were achieved (10). However, the soft top plug 33 is easily deformed by force, and it is not easy to be inserted into the screw hole smoothly, and it is not only inconvenient to remove it by welding, but it is also worried that some soft rubber peels off and leaves a residue on the circuit board. In the Republic of China, the new patent No. 500197 discloses a "nut with a blind hole". As shown in Fig. 2, the nut 4 has a bottom wall 41 for welding, and a printed circuit board. 5, a ring-shaped side wall 42 extends from the periphery of the bottom wall 41, the bottom wall 41 and the annular side wall 42 are matched with the blind hole 40, and the inner wall of the annular side wall 42 is formed with an internal thread M301957. Into the link. Due to the closed design of the blind hole, it is not necessary to additionally install a conventional soft plug, so that an automatic nozzle can directly abut against the top surface of the %-shaped side wall 42 to generate a negative pressure on the blind hole 4〇. , also achieve the purpose of easy to hold, match, and weld. As shown in FIG. 3, another modification of the conventional nut 3 is also made: when the annular side wall 32 of the nut 3 is close to the end edge of the bottom wall 31, a tin portion 34' is soldered in the radial direction, and the tin material is soldered. 35 will climb into the tin portion 34' due to capillary phenomenon and make the soldering position more stable. The above-mentioned various nuts 3, 4 are also commonly used in the circuit board 10 15 5 shown in FIG. 4 for fixing the position of the heat dissipation fins 52 to ensure that the heat dissipation fins 52 can be tightly attached to, for example, an integrated circuit. The surface of the component 51 is smoothly led out of the heat generated by the integrated circuit 7G 51; therefore, if the heat dissipation capability of the nut itself can be further increased, the effect of assisting heat dissipation can be additionally achieved. Furthermore, the bridging element may also be a spacer 6 as shown in FIG. 5, also having a bottom wall 61 and a surrounding side wall 62 and thereby defining a perforation 6'' bottom wall 61 for soldering to the circuit board 5, and After the perforation (9) corresponding to the positioning hole 50' on the circuit board is soldered to the spacer 6, the through hole 7 例如 of the heat sink Korean sheet 7 can be continuously used, and the through hole 60 and the positioning hole 5G can be used. And screwed to the nut 72 below the circuit board 5. The distance between the heat dissipation fins 7 and the circuit board 5 is maintained by the spacer 6. As mentioned above, on the one hand, the cost of metal materials is high, and the trend of the electronics industry is light and short, and the electronic components are required to reduce the volume and weight of materials; especially the advancement of integrated circuit technology, the component processing capability is improved synchronously, and the circuit is The heat dissipation effect is more limited to allow the integrated circuit to enter: step set 20 M301957 integration limit. In other words, how to effectively reduce the weight of bridging components such as nuts and spacers, and improve the heat dissipation performance is undoubtedly a research and development direction worthy of attention. [New content] Therefore, the main purpose of the present invention is to provide a grooved bridging element with few consumables, which effectively increases the scrap that can be recycled, and saves the use of metal materials in the process. Another object of the present invention is to provide an extremely lightweight, ring-groove bridging element that further reduces the weight of electronic components using such components. A further object of the present invention is to provide a grooved bridging element having a large surface area with a ring 10 which provides further heat dissipation by the user by virtue of the good thermal conductivity of the metal material f. The present invention has a ring groove bridging element having a bottom wall for soldering and bonding to a printed circuit board, and a peripheral wall extending upward from a periphery of the bottom wall, the bottom wall and the side wall jointly defining a blind hole And the side wall 15 is formed on the inner side of the blind hole to form a thread for connecting a screw, wherein the side wall has a top surface away from the bottom wall, and the side wall is opposite to the outer side of the inner side, and the recess is formed with a self. A radial constriction ring groove extending to the bottom wall a distance of more than half the height of the side wall at a predetermined distance from the top surface. 20 With the design of the ring groove, the manufacturing process is increased in the process of cutting and removing the material. The profit of the nut is reduced, and the weight of the nut is reduced. In particular, the outer surface area of the nut is effectively produced. Increase it to provide better heat dissipation. i [Embodiment] M301957 The description and other technical contents, features and functions of the present invention will be clearly described below with reference to the embodiment of the present invention and the reference drawings. The same components as the previous case will be extended. Use the same or similar number. A first preferred embodiment of the novel ring grooved bridging element, as shown in FIG. 6 and 5, is a nut made of a thermally conductive metal such as copper, and also has a bottom wall 11 for use with a printed circuit board. The soldering pad of 5 is welded, and an annular sidewall 12 extends upward from the periphery of the bottom wall 11. The bottom wall i丨 cooperates with the annular sidewall 12 to define a blind hole 1〇, and the sidewall 12 is formed with a blind hole 10 The inner side has an inner bore 13 which is available for screwing. For convenience of explanation, the side wall 12 is defined as a top surface 12 away from the bottom wall 116. In this example, the top® i 2 i is circular, and the outer diameter is substantially equal to the outer diameter of the bottom wall 11. . 15 ❿ at the outer side surface 1; 2〇 of the annular side wall 12, starting from a position away from the top surface 121 by a predetermined distance, a recessed four groove 2 is provided, and the total I degree of the ring groove 2 is more than the side wall - in the above-mentioned 'in this case, in order to greatly improve the heat dissipation effect during the lathe cutting process, the two concave rings 2 are turned from the outside to the inside as an example' and an uncut is left between the two concave rings 20. The outer edge of the convex ring θ is also substantially equal to the outer diameter of the top surface ΐ2ι and the bottom wall ^^; thereby the convex ring edge 21 divides the ring groove 2 into two upper and lower concave rings ^ due to this nut i The outer surface becomes the total area of the top surface 121, the outer side surface 12〇, the convex ring U upper and lower sides, the concave ring 2G portion, and the like, and the total surface area is increased by a large handle, so that the heat dissipation performance is greatly improved. Ίο bit ^ in the front of the 'wall side' 121 from the outer side towards the blind, more cutting-inclined lead angle, - retain the appropriate top surface 20 M301957 121 width, to ensure that the nut i can be successfully surface mounted technology The nozzle sucks and moves, and the guide is guided by the guide angle, so that the operator can lock the stud into the welded nut 1 smoothly. In this way, not only can a large amount of scraps be cut for recovery, but also the weight of the nut 1 can be effectively reduced, and the surface area 5 can be increased to have a better heat dissipation effect, and the purpose of the present invention is fully achieved. Of course, the above-mentioned ring groove 2 is not limited to two concave rings, and may be more or less; the component is not limited to a nut, and the appearance is not limited to a circular shape; the manufacturing method is not limited to turning, but may be considered for die casting, casting molding, and the like. the way. Figure 7 is a second preferred embodiment of the novel ring grooved bridging element, 10 differs from the previous preferred embodiment in that the component of this example is a die-cast spacer Γ; and an annular side wall 12, The outer side surface 120, the ring groove 2 formed by the concave limit, has only a single-recessed shape. Therefore, there is no scrap in the process, but the purpose of saving the process material can be achieved. In addition, in the spacer i of the present example, the bottom wall u of the original body 11 is fixed, so that the fixing portion 111 can be inserted at the interval, so that the spacer 1 can be substantially ensured. When the body 110 is downwardly extended, the position of the pre-formed hole 5 in the pre-formed hole 5 of the board 5 is transferred to the printed circuit board 5. In summary, too new creation 撼妓 撼妓} from * first, 1 .
表面積，增強散熱效果，達成前述所有Surface area, enhance heat dissipation, achieve all of the foregoing
M301957 皆仍屬本新型專利 明書内容所作簡單之等效變化為修飾 涵蓋之範圍。 【圖式簡單說明】 5 圖1是習知螺母焊固於電路板的立體示意圖； 圖2是第500197號新型專利之結構剖視示意圖； 圖3是另一習知底壁擴張螺帽之本新型螺母的第一 實施例立體示意圖； 圖4是圖1焊固於電路板的爆炸圖； 10 国 5疋一種習用間隔器之側面剖視示意圖，說明其與 電路板間之結合關係； 圖6疋本新型橋接元件第一較佳實施例之螺母焊固 於電路板的剖視示意圖；及 圖7是本新型橋接元件的第二實施例間隔器焊固於 15電路板的剖視示意圖。M301957 is still a simple equivalent change of the contents of this patent, which is covered by the modification. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic perspective view of a conventional nut welded to a circuit board; FIG. 2 is a schematic cross-sectional view of a novel patent No. 500197; FIG. 3 is a view of another conventional bottom wall expansion nut 3 is a perspective view of a first embodiment of a new type of nut; FIG. 4 is an exploded view of the circuit board of FIG. 1; a side cross-sectional view of a conventional spacer of the country, illustrating the relationship between the board and the circuit board; BRIEF DESCRIPTION OF THE DRAWINGS A cross-sectional view of a nut of a first preferred embodiment of the present bridging element soldered to a circuit board; and FIG. 7 is a cross-sectional view of a second embodiment of the bridging element of the present invention soldered to a 15 circuit board.