M298163 八、新型說明： 【新型所屬之技術領域】 本創作為提供-種電子裝置之機箱散熱結構，尤指可輔助電 t置之㈣空氣與外部流通，且可達顺速排散熱空氣之機箱 政…、結構’措以避免因機箱内熱空氣的排出效率過低，致使電路 板以及電氣設備之使用壽命縮短的缺失。 一M298163 VIII. New Description: [New Technology Field] This creation is to provide a chassis heat dissipation structure for electronic devices, especially for the case of auxiliary air (4) air and external circulation, and can reach the speed of air cooling chassis. The government... structure measures to avoid the lack of efficient discharge of hot air in the chassis, resulting in a shortened service life of the circuit board and electrical equipment. One
【先前技術】 按^於近年來電腦科技的進步，電腦或個人電腦幾乎已成 -、母個豕庭的必備JL具’且由於電腦或個人電腦之便利性以及普 及化，使其有逐漸成為家家必備之電器用品的趨勢，也因此使得 所而處理之工作以及基本應具備的功能也亦逐漸複雜化及多 而為_日趨複雜之功，使得微處理晶狀頻率則需相 對美升方能順暢執行工作。 是以，當微處理晶片之處理頻率增加，職處理晶片於運作 ^斤產^熱能也相對增加，而驗免因高熱致使晶片毀損，而 驗微處理晶片的使用壽命，因此在各個微處理晶片上均設置有 散熱片’使微處理晶片所產生之熱能可傳導至散熱片上，但由於 數個微處理晶片所產生之熱能，均在機箱内部形成—聚集的熱空 亂’但僅_機箱後側裝設小型散熱風扇，以及於電子設備設置 ^風扇進讀熱，實無法將機箱内部之高熱空氣快速排除，且當 /里度增加到-定時’财腦便會因溫度過高_係，使電腦 生電腦#機且無法運作的缺失’衫嚴重影響到電腦 此行業多 是故，創作人有鑑於上述習用之缺失，特以其從事 5 M298163 年之研發經驗’經由不斷試作與修改，方設計出電子裝置之機箱 散熱結構，用以改善習用結構之缺失。 【新型内容】 故’創作人有鑑於上述之問題以及缺失，乃搜集相關的資料， 經由多方的評估以及考量，並以從事於此行業所累積之多年經[Prior Art] According to the advancement of computer technology in recent years, computers or personal computers have become almost the same, and the necessary JLs of the mother's family have become more and more popular because of the convenience and popularity of computers or personal computers. The trend of the necessary electrical appliances in the home, and thus the work to be handled and the basic functions that should be possessed are also gradually complicated and more _ increasingly complex, so that the micro-processed crystal frequency needs to be relatively beautiful. Can perform work smoothly. Therefore, when the processing frequency of the micro-processed wafer is increased, the thermal energy of the processing chip is relatively increased, and the wafer is damaged due to high heat, and the lifetime of the wafer is examined, so that the micro-processed wafer is processed. Heat sinks are provided on the top to enable the heat generated by the micro-processed wafer to be conducted to the heat sink, but the heat generated by several micro-processed wafers is formed inside the chassis - the hot air is gathered up - but only after the chassis The side is equipped with a small cooling fan, and the electronic device is equipped with a fan to read the heat. It is impossible to quickly remove the hot air inside the chassis, and when the temperature is increased to - the timing, the temperature will be too high. The lack of 'computers that can't work on computers and computers that are inoperable seriously affects the computer industry. The creators have made their own research and development experience of 5 M298163 in view of the lack of the above-mentioned practices. The chassis heat dissipation structure of the electronic device is designed to improve the lack of the conventional structure. [New content] Therefore, the creators have collected relevant information in view of the above-mentioned problems and lacks, and have been evaluated and considered by many parties, and have accumulated many years of experience in this industry.
驗，經由不斷之試作以及修改，始設計出此種電子裝置之機箱散 熱結構的新型專利誕生者。 本創作之主要目的乃在於控制面板設置有鏤空之容置部，使 谷置U卩收谷有辅助主機板以及電氣設備快速排散熱空氣的散熱裝 置藉以避免因機箱内熱空氣之排放效率過低，使得電路板以及 電乳设備於運作時，造成機箱内部之溫度過熱，進而縮短電路板 以及電氣設備使用壽命的缺失。 【實施方式】 / 、為達成上述目的及功效，本創作所採用之目的、構造技術特 徵以及其功效，茲繪圖就本創作之較佳實施例詳加說明其 功能如下，俾利完全瞭解。 /、 月叫參閱第―、二、二A、三圖所示，係為本創作較佳 立ΐ外觀圖、立體分解圖、散_置立體分解圖以及側視 i =有2中可清楚看出’本創作電子裝置之機箱散熱結構 係=有越裝£1以及鋪2，兹將上述構件詳細說明 扣部1躲置祕座11，錄座11外緣設置有卡 12置丈^並於基座11 定錄112，使定趣1 置入於風扇i 2所設置之凹槽12 〇，並於風扇丄2 ^ 6 M298163 置有可供空氡流通之網罩13。 g機箱2為具有可收容電路板21以及電氣設備2 2的容置 空^20 ’並於機箱2前方設置有控制面板23，且控制面板2 3设置有可收容散熱裝置1之容置部2 3 0以及可使卡扣部11 1肷入之扣合部2 31，並於控制面板2 3設置有可收容電氣設 備2 2之開口2 3 2。After the trial and modification, the new patents for the heat dissipation structure of the chassis of such electronic devices were designed. The main purpose of this creation is that the control panel is provided with a hollowed-out housing, so that the valley has a auxiliary motherboard and an electric device to quickly dissipate the cooling air to avoid the low efficiency of the hot air in the chassis. When the circuit board and the electric milk device are in operation, the temperature inside the chassis is overheated, thereby shortening the loss of the service life of the circuit board and the electrical equipment. [Embodiment] / In order to achieve the above purpose and effect, the purpose, structural technical features and functions of the present invention are described in detail in the preferred embodiment of the present creation, and the functions are as follows. /, The month is called the first, second, second, and third pictures, which is the best view of the creation of the original, the three-dimensional exploded view, the scattered _ stereo exploded view and the side view i = 2 can be clearly seen The 'heat dissipation structure of the chassis of the creation electronic device=there is more than £1 and the shop 2, and the above-mentioned components are explained in detail. The buckle part 1 hides the secret seat 11, and the outer edge of the recording seat 11 is provided with the card 12 The pedestal 11 is recorded 112, so that the cradle 1 is placed in the recess 12 设置 provided by the fan i 2 , and the grill 丄 2 ^ 6 M298163 is provided with a mesh cover 13 for air circulation. The g chassis 2 has a receiving space 20 accommodating the circuit board 21 and the electrical device 22, and a control panel 23 is disposed in front of the chassis 2. The control panel 23 is provided with a receiving portion 2 for accommodating the heat dissipating device 1. 30 and the engaging portion 2 31 that can be inserted into the latching portion 11 1 , and the control panel 23 is provided with an opening 2 3 2 that can accommodate the electrical device 22 .
曰返之詳細說明中，該電路板21係為固設有各種電子零 ^曰曰#、中央處理器、連接器等電腦绿所需之配備等，而電 ^又^2 2則可為硬碟機、光碟機、磁碟機或是線路裝置，俾當 令置工間2 〇内之電路板2丄、電氣設備2 2因運作而產生熱 ^熱空氣散佈於容置空間2 Q時，即可藉由散熱裝置丄對電 為^ 1以及電氣設備2 2進行輔助散熱，使容置空間2 0内之 外部空氣產生職，並使容置空間2㈣速排散機箱2 哭^ί = ^降低容置空間2 〇内之溫度，使電路板21以及電 射運作，並延魏路板21以及電氣設備 率，並有猎以降低電路板21以及電氣設備2 2之故障 丰亚有效提昇電腦主機之使用效率。 於散為中i 之機箱散熱結構可進一步 2，且機箱2亦可設置I個上之散熱風扇1 機箱2内熱空氣之散熱效率之放熱袭置1，藉以增加 部2 3 〇為可收六右控制面板2 3所設置之容置 1亦可利用直流電進行啟動，而基 ，且散熱衣置 熱裝置1定位之卡扣部m，並帅制面步設置有使散 可供卡扣部！ U换入之扣合部制面板2 3進-步設置有 板2 3上，然，非因此即侷限 I真=熱農置1固定於面 J乍之專利乾圍，如利用其它修 1 M298163 姊及等效結構變化’均應同理包含於本創作之專利範圍内， 陳明。 口 综合上述之詳細說明，本創作電子裝置之機箱散熱結構於 際使用時，可將電路板2丄以及電氣設備22因運作而產埶 空氣，利用散熱裝置1將機箱2内部的熱空氣排出至機箱2外、 邛，以達到使機If 2内部與外部之空氣相互流通，並達到快 ，機箱2内部熱空氣之功效，畴決㈣機箱散熱結構之電路板 !=氣設備2 2於運作時，因機箱2内部的溫度過= 件电路板21以及f氣設備2 2使用壽命縮短之缺失。 本創:之=僅=創作之較佳實施例而已，非因此即侷限 内，合予陳明。支匕均應同理包含於本創作之專利範圍 2所述’本創作上述之機箱風扇於使料 故=;實_鄉 保障創作人之辛苦創作，倘“局==准3吝: 函指示，創作人定當竭力配合，實感ir疑，睛不吝來 M298163 【圖式簡單說明】 第一圖係為本創作較佳實施例之立體外觀圖。 第二圖係為本創作較佳實施例之立體分解圖。 第二A圖係為本創作較佳實施例之散熱裝置立體分解圖。 第三圖係為本創作較佳實施例之側視剖面圖。 主要元件符號說明 1、 散熱裝置 1 1、基座 111、 卡扣部 112、 定位柱 2、 機箱 2 0、容置空間 21、電路板 2 2、電氣設備 2 3、控制面板 1 2、風扇 12 0、凹槽 1 3、網罩 2 3 0、容置部 2 31、扣合部 2 3 2、開口 9In the detailed description of the return, the circuit board 21 is equipped with various electronic components such as various electronic components, a central processing unit, a connector, etc., and the electric device ^2 2 can be hard. A disc player, a CD player, a disk drive or a line device, when the circuit board 2 in the work area is 2 丄, and the electrical equipment 22 is generated by the operation, the hot air is dispersed in the accommodating space 2 Q, that is, The heat dissipation device can be used to assist the heat dissipation of the electrical device and the electrical device 2, so that the external air in the accommodating space 20 is generated, and the accommodating space 2 (four) speed disperses the chassis 2 crying ^ί = ^ lowering The temperature inside the accommodating space 2 makes the circuit board 21 and the electric radiation operate, and the Wei road board 21 and the electrical equipment rate, and there are hunting to reduce the fault of the circuit board 21 and the electrical equipment 2 The efficiency of use. The heat dissipation structure of the chassis in the middle of the i can be further 2, and the chassis 2 can also be provided with a cooling fan 1 on the chassis 2, and the heat dissipation efficiency of the hot air in the chassis 2 is set to 1, thereby increasing the number of 2 3 可 to be receivable The accommodating 1 provided by the right control panel 23 can also be activated by direct current, and the base portion, and the heat-dissipating device is positioned with the buckle portion m of the heat device 1, and the surface portion of the heat-dissipating device is provided with a loose-fitting portion! U is replaced by the button panel 2 3 step-by-step setting is provided on the board 2 3, however, it is not limited to the limit I true = hot farm set 1 is fixed in the face of the patent, such as the use of other repair 1 M298163 Both 姊 and equivalent structural changes shall be included in the scope of this patent, Chen Ming. According to the above detailed description, when the heat dissipation structure of the chassis of the electronic device is used, the circuit board 2 and the electrical equipment 22 can generate air due to the operation, and the heat dissipation device 1 discharges the hot air inside the chassis 2 to the air. Outside the chassis 2, 邛, in order to achieve the internal and external air of the machine If 2, and achieve fast, the internal hot air of the chassis 2, the domain (4) chassis cooling structure of the circuit board! = gas equipment 2 2 during operation Because of the temperature inside the chassis 2, the missing circuit board 21 and the f-gas device 2 2 have a shortened service life. This creation: = only = the preferred embodiment of the creation, not limited to it, and is given to Chen Ming. The support should be included in the scope of patent 2 of this creation. 'The above-mentioned chassis fan is used as the material; _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The creator will try his best to cooperate, the real feeling is irritating, the eye will not come to M298163 [Simplified illustration] The first picture is the three-dimensional appearance of the preferred embodiment of the creation. The second picture is the three-dimensional design of the preferred embodiment. 2 is an exploded perspective view of a heat dissipating device according to a preferred embodiment of the present invention. The third drawing is a side cross-sectional view of a preferred embodiment of the present invention. Base 111, snap portion 112, positioning post 2, chassis 20, housing space 21, circuit board 2, electrical device 23, control panel 1, fan 12 0, recess 13 0, the receiving portion 2 31, the fastening portion 2 3 2, the opening 9