TWM296570U - Heat dissipation auxiliary plate for high speed drilling - Google Patents

Heat dissipation auxiliary plate for high speed drilling Download PDF

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Publication number
TWM296570U
TWM296570U TW95205598U TW95205598U TWM296570U TW M296570 U TWM296570 U TW M296570U TW 95205598 U TW95205598 U TW 95205598U TW 95205598 U TW95205598 U TW 95205598U TW M296570 U TWM296570 U TW M296570U
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TW
Taiwan
Prior art keywords
heat
drilling
speed drilling
dissipating
circuit board
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Application number
TW95205598U
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Chinese (zh)
Inventor
Ming-Jeng Shiau
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Uniplus Electronics Co Ltd
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Application filed by Uniplus Electronics Co Ltd filed Critical Uniplus Electronics Co Ltd
Priority to TW95205598U priority Critical patent/TWM296570U/en
Publication of TWM296570U publication Critical patent/TWM296570U/en

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Description

M296570 八、新型說明: 【新型所屬之技術領域】 一種使用在印刷電路板之鑽孔蓋板板材,尤指一種設 :有一固態耐磨潤滑塗層以及熱熔潤滑層之高速鑽孔用散熱 •輔助板材,其可在鑽孔加工中避免產生碎屑並具有導熱散 熱之作用。 【先前技術】 近年來,隨著電子技術的日新月異,許多高科技產業 的相繼問世,使得更人性化,功能更佳的電子產品不斷地 推陳出新,且這些電子產品更不斷地朝向輕、薄、短 的趨勢設計發展。各種電子產品均具有至少_主機板,盆 二子元件及電路板所構成’而電路板之功能係在 於搭載及電性連接各個電子元件,使得這 彼此電性連接,而目前笋赍目夕币& 丁兀什犯夠 (Prints 路板係為印刷電路板 (printed Circuit Board: PCB)。 印刷電路板能將電子零組件聯接 功能’因此S所有電子資W σ T 揮正體 彼山“ I Η或缺的基本構成要 牛。由於印刷電路板設計品質 早甚口沾Τ止ώ 貝良秀不背,不但直接影響電 產口口的可罪度,亦可左右系統產 & ☆M296570 VIII. New description: [New technical field] A drilled cover plate used in printed circuit boards, especially a heat sink for high-speed drilling with a solid wear-resistant lubricating coating and a hot-melt lubricating layer. Auxiliary sheet, which can avoid chipping during drilling and has the function of heat conduction and heat dissipation. [Prior Art] In recent years, with the rapid development of electronic technology, many high-tech industries have emerged, making more humanized and better-functioning electronic products continue to evolve, and these electronic products are constantly moving toward light, thin and short. The trend of design development. All kinds of electronic products have at least _ motherboard, two sub-components and circuit boards. The function of the circuit board is to mount and electrically connect the electronic components, so that the two are electrically connected to each other. Ding Wei is guilty (Prints board is printed circuit board (PCB). Printed circuit board can connect electronic components to function 'so all the electronic resources W σ T 正 彼 “ “ “ “ “ “ The basic composition of the cattle. Because the quality of the printed circuit board design is very sloppy, the Beiliang show is not back, not only directly affects the guilt of the mouth of the electric product, but also the system production & ☆

經當祜避盔β「平7 / 口的观子力,因此PCB 、、…皮稱為疋「電子系統產品之母 刷電路板是以不導電材料所製 業之基」。印 都設計有欲鑽孔以安褒晶片2 =板’在此平板上通常 助於讓預先定羞/Γ 電子元件。元件的孔有 助於讓預心録板面上印製之Μ 5 M296570 赵來將電子元件的接腳穿過ρα後,再以導電性的金屬 焊條黏附在PCB而形成電路。 然’進行電路板鑽孔時,對於孔徑小的孔洞,相對地 而抓用較小的鑽針,也因如此,斷針的發生是時而易見的。 現7般技術之印刷電路板之鑽孔方法,係在印刷電路板 上&有一銘材蓋板(參見第3圖),使鑽孔時,供鑽針緩衝 及政熱’ e玄紹材盖板一般係由鋁箔層、多孔纖維層以及潤 滑層所組成。 此銘材盖板在進行鑽孔時,由於該多孔纖維層為固態 不易溶解,在鑽孔過程中會產生碎屑於鑽孔中,造成斷 針或造成印刷電路板鑽孔部份之内壁粗糙化。 ±由於該多孔纖維層在鑽頭轉速提高而加快鑽孔速度 日守,無法有效的將鑽針於高速摩擦下所產生的熱能帶離, 因此造成鑽針之使用壽命減短。 再者’該紹材蓋板之紹箱層在鑽孔過程中由於鑽針潤 滑不夠,鑽孔時容易使金屬碎屑在高速下大量散落在印刷 =路板上’若未處理乾淨,可能會造成印刷電路板在使用 日守電路短路’進而影響到產品信賴度。 【新型内容】 本創作之目的係提供一種適用於印刷電路 工之高速鑽孔用散埶辅肋柘紝甘4 Λ、# 錢孔加 月又…、輔助板材,其組成簡單,成本 本創作之再-目的係提供一種高速鑽孔辅 材,可避免鑽孔過程造成镨$丨# % 欢…辅助板 L成鑽孔部份之内壁粗糙或斷針情形。 6 M296570 本創作之再—目的係提供—種高速鑽孔用散熱辅助板 材,其可有效傳導鑽針之熱能,達到散熱效果。 為達j述之目的,本創作高速鑽孔用散熱輔助板材, 包括一支撐材、一固態耐磨潤滑塗層與一熱熔潤滑層,其 中該固態耐磨潤滑塗層係貼附於該支撐材Jl,而該熱熔潤 滑層塗佈於該固態耐磨潤滑塗層上,透過固態耐磨潤滑塗 層之結構,改善習用多孔纖維層在鑽孔加工中所產生之碎 屑,避免鑽孔部份之内壁粗糙或斷針情形並達到導熱散熱 之作用。 ....... 為便於對本創作能有更深入的暸解,茲藉一實施例詳 述於後·· 【實施方式】 請參閱第1圖,圖示内容為本創作高速鑽孔用散熱辅 助板材(1)之一較佳實施例,其包含一支撐材(13)、一固態 鲁耐磨潤滑塗層(11)與一熱熔潤滑層(丨2)。 戎固態耐磨潤滑塗層(11 ),係貼附於該支樓材(13 ) 上。而該熱熔潤滑層(12)係塗佈於前述之固態耐磨潤滑塗 層(11)上,在本創作之較佳實施例中,該熱熔潤滑層 係 k 自壬乙一醇驗(nony 1 pheno 1 p〇 1 yethy 1 ene glycol ether)、聚乙烯乙二醇(peg)、聚乙烯醇(PVA)、 聚丙烯酸(acrylic acid)及其鹽類、聚曱基丙烯酸甲酯 (Perspex)、蟲臘酸(cerotic acid)、肉豆蔻酸更丙酯、單 硬脂酸甘油酯、蜜墙以及其混合物之一種。 7 M296570 4支撐材(13)可為一塑料板材或一金屬箔板,本實施 例以塑料板材作為一最佳實施方式,該支撐材(13)係用以 支撐上述之固態耐磨潤滑塗層(11)與熱熔潤滑層(12),其 ;於鑽孔加工時所產生之碎屑並非可導電之金屬,因此可避 、免印刷電路板(2 )於使用時電路短路或燒毀。 • 實施時,如第2圖所示,將前述完成之高速鑽孔用散 熱辅助板材(1)置於印刷電路板(2)上,以進行鑽孔作業, 當鑽孔裝置達到預定鑽孔位置日夺,即令鑽針⑷下降鑽孔, 1鑽針(4)下降後,經由本創作所設之熱熔潤滑層2),故可 先使該鑽針潤滑並緩衝貫穿之力道,以避免孔偏或斷針, 而鑽針(4)持續下降時,便會經過本創作所設之固態耐磨潤 滑塗層(11),其可將鑽孔加工所產生之熱能帶離,以減少 鑽孔摩擦發熱而對印刷電路板⑵材質產生影響並延長鑽 針(4)之使用哥命。當鑽針再持續下降時,即會經過本 創作之支稽材(13)。在本創作之較佳實施例中,該支撐材 %〇3)係為一塑料板材,當鑽針(4)貫穿該支撐材(13)時,其 產生之塑料碎屬並非可導電之金屬,可避免印刷電路板⑵ 於使用時電路短路或燒毁。 因此,本創作具有以下之優點: 1·本創作提供一種適用於印刷電路板鑽孔加工之高速 鑽孔用散熱辅助板材,其組成簡單,成本低廉。 2·本=作提供—種高速鑽孔用散熱輔助板材,其所設之 固悲耐磨潤滑塗層,可將鑽孔過程中所產生之熱能帶 離,達到散熱效果。 M296570 3 ·本創作&供一種南速鑽孔用散熱輔助板材’其透過固 態耐磨潤滑塗層之結構,相較於習用多孔纖維層之設 計,本創作可避免鑽孔過程產生碎屑而造成鑽孔部份When you avoid the helmet, the "battery of the 7th / mouth", the PCB, and the skin are called "the mother circuit of the electronic system is based on the non-conductive material." The Indians are designed to drill holes to mount the wafer 2 = board 'on which is usually used to help pre-shake/Γ electronic components. The hole of the component helps to print on the surface of the pre-cardboard. 5 M296570 Zhao Lai passes the pin of the electronic component through ρα, and then adheres to the PCB with a conductive metal electrode to form a circuit. However, when drilling a circuit board, a small drill hole is relatively used for a hole having a small aperture, and as a result, the occurrence of a broken needle is sometimes easy to see. Nowadays, the method of drilling the printed circuit board of the 7-technical technology is on the printed circuit board & there is a cover plate of the material (see Figure 3), so that when drilling, the needle is buffered and the political heat is used. The cover plate is generally composed of an aluminum foil layer, a porous fiber layer, and a lubricating layer. When the cover plate of the material is drilled, since the porous fiber layer is solid and difficult to dissolve, debris may be generated in the borehole during the drilling process, causing broken needles or causing rough inner wall of the drilled portion of the printed circuit board. Chemical. ± Because the porous fiber layer accelerates the drilling speed when the drill speed is increased, it is impossible to effectively remove the heat energy generated by the drill under high-speed friction, thereby shortening the service life of the drill. Furthermore, the 'layer of the cover plate of the finished material is insufficiently lubricated during the drilling process. When the hole is drilled, the metal debris is easily scattered at a high speed on the printing plate. If it is not cleaned, it may be This causes the printed circuit board to be short-circuited using the daily circuit, which in turn affects product reliability. [New Content] The purpose of this creation is to provide a high-speed drilling method for high-speed drilling of printed circuit workers, such as 埶 柘纴 4 4 # # # # # # 钱 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Re-purpose is to provide a high-speed drilling auxiliary material, which can avoid the drilling process causing 镨$丨#% 欢... The auxiliary plate L is roughened or broken in the inner wall of the drilled portion. 6 M296570 The re-creation of this creation—the purpose is to provide a kind of heat-dissipating auxiliary board for high-speed drilling, which can effectively transmit the heat energy of the drill to achieve the heat dissipation effect. For the purpose of the description, the heat dissipation auxiliary plate for high-speed drilling includes a support material, a solid wear-resistant lubricating coating and a hot-melt lubricating layer, wherein the solid wear-resistant lubricating coating is attached to the support. Material J1, and the hot-melt lubricating layer is coated on the solid wear-resistant lubricating coating, and through the structure of the solid wear-resistant lubricating coating, the debris generated by the conventional porous fiber layer in the drilling process is improved, and the drilling is avoided. Part of the inner wall is rough or broken and the heat conduction is achieved. . . . In order to facilitate a deeper understanding of this creation, the following is a detailed description of the embodiment. [Embodiment] Please refer to Figure 1, which shows the heat dissipation for high-speed drilling. A preferred embodiment of the auxiliary sheet (1) comprises a support material (13), a solid Lu-resistant lubricating coating (11) and a hot-melt lubricating layer (丨2).戎 Solid wear-resistant lubricating coating (11) attached to the support (13). The hot-melt lubricating layer (12) is applied to the solid wear-resistant lubricating coating (11) described above. In the preferred embodiment of the present invention, the hot-melt lubricating layer is k-none alcohol test (nony 1 pheno 1 p〇1 yethy 1 ene glycol ether), polyethylene glycol (peg), polyvinyl alcohol (PVA), acrylic acid and its salts, polymethyl methacrylate (Perspex), A cerotic acid, a more propyl myristate, a glyceryl monostearate, a honey wall, and a mixture thereof. 7 M296570 4 support material (13) can be a plastic plate or a metal foil plate. In this embodiment, a plastic plate is used as a preferred embodiment, and the support material (13) is used to support the above solid wear-resistant lubricating coating. (11) and the hot-melt lubricating layer (12), the debris generated during the drilling process is not a conductive metal, so that the printed circuit board (2) can be avoided or prevented from being short-circuited or burned during use. • In implementation, as shown in Figure 2, the above-mentioned completed high-speed drilling heat-dissipating auxiliary plate (1) is placed on the printed circuit board (2) for drilling operation, when the drilling device reaches the predetermined drilling position. In the day, the drill (4) is lowered and drilled. After the drill (4) is lowered, the hot-melt lubrication layer 2) is set by the creation. Therefore, the drill can be lubricated and buffered through the force path to avoid the hole. When the needle (4) is continuously lowered, it will pass through the solid wear-resistant lubricating coating (11) provided by the creation, which can remove the heat generated by the drilling process to reduce the drilling. Friction heat affects the material of the printed circuit board (2) and prolongs the use of the drill (4). When the burs continue to fall, they will pass through the creation of the material (13). In a preferred embodiment of the present invention, the support material % 〇 3) is a plastic sheet material, and when the bur (4) penetrates the support material (13), the plastic granules produced by the burr are not electrically conductive metals. It can avoid short circuit or burnout of the printed circuit board (2) during use. Therefore, this creation has the following advantages: 1. This creation provides a high-speed drilling auxiliary plate suitable for drilling circuit board drilling, which is simple in composition and low in cost. 2. This book provides a kind of heat-dissipating auxiliary plate for high-speed drilling. It is equipped with a solid and wear-resistant lubricating coating to remove the heat generated during the drilling process and achieve the heat dissipation effect. M296570 3 · This creation & for a south-speed drilling heat-dissipating auxiliary sheet's structure through a solid wear-resistant lubricating coating, compared to the design of the conventional porous fiber layer, this creation can avoid the debris generated during the drilling process. Causing the drilled part

之内壁粗糙或斷針情形。 4 ·本創作k供一種而速鑽孔用散熱輔助板材,該支撐材 可為一塑料板材,除可以有效降低製作成本外,其不The inner wall is rough or broken. 4 · This creation k is used for a heat-dissipating auxiliary plate for drilling at a speed. The support material can be a plastic plate, which can effectively reduce the production cost.

導電之特性,可避免習用鋁材蓋板於鑽孔加工時,掉 〜孟屬卒屑所產生之短路問題,即使本發明之支撐材 選擇金屬箔板,鑽孔仍可藉由本發明之熱熔潤滑層及 固態耐磨㈤滑塗層之雙層、潤滑設計,達爿良好之潤 二,使侍鑽孔時,有效減少金屬碎屑喷濺至四周。 依以上所揭示之說明與圖示,本創作確可達到 =預期目的’提供—種高速鑽孔用散熱輔助板材,其 上俜:尤:::中避免產生碎屑並具有導熱散熱之作用。以 體實施例及所運用之技術手段之說明, 根據本文的揭露或教導 若依本創作之技彳^⑪ 導出若干的變化與修飾, 手4又所作之等效— 仍未超出說明蚩及& 手效义化,其所產生之作用 «兄Θ曰及圖式所涵蓋之實質 本創作之技術範疇内。 、_ t句應視為在 9 M296570 【圖式簡單說明】 第1圖係為本創作高速鑽孔用散熱輔助板材之剖示圖。 第2圖係為本創作高速鑽孔用散熱輔助板材置於印刷 . 電路板上鑽孔時之使用狀態示意圖。 : 第3圖係為習用鑽孔蓋板之剖示圖。 【主要元件符號說明】 固態耐磨潤滑塗層11 支撐材13 習用鑽孔蓋板3 潤滑層32 鑽針4 高速鑽孔用散熱辅助板材 熱熔潤滑層12 印刷電路板2 多孔纖維層31 鋁箔層33The conductive property can avoid the short circuit problem caused by the conventional aluminum cover plate during the drilling process. Even if the support material of the present invention selects the metal foil plate, the drilling can still be performed by the hot melt of the present invention. Lubricating layer and solid wear-resistant (5) Double-layered, lubricated design of the slip coating, which achieves a good moisturizing effect, which effectively reduces metal debris splashing around when drilling. According to the above description and illustration, this creation can achieve the purpose of 'desirable purpose'. A kind of heat-dissipating auxiliary plate for high-speed drilling, in which the upper:::: avoids the generation of debris and has the function of heat conduction and heat dissipation. With reference to the embodiments and the technical means employed, according to the disclosure or teachings herein, a number of variations and modifications are derived from the technique of the present invention, and the equivalent of the hand 4 is still beyond the description and & The effect of the meaning of the hand, the role of the brothers and the schema covered by the essence of the creation of the technical scope. _ t sentence should be regarded as 9 M296570 [Simple description of the drawing] The first picture is a sectional view of the heat-dissipating auxiliary plate for high-speed drilling. The second figure is a schematic diagram of the state of use when the heat-dissipating auxiliary sheet for high-speed drilling is placed in the printing. : Figure 3 is a cross-sectional view of a conventional drilled cover. [Main component symbol description] Solid wear-resistant lubricating coating 11 Support material 13 Conventional drilled cover 3 Lubricating layer 32 Drilling needle 4 High-speed drilling heat-dissipating auxiliary sheet Hot-melt lubricating layer 12 Printed circuit board 2 Porous fiber layer 31 Aluminum foil layer 33

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Claims (1)

M296570 九、申請專利範圍: L 一種高速鑽孔用散熱輔助板材,係用以置於印刷電路板 上方以供鑽孔使用,其包括: 一固態对磨潤滑塗層; 一支撐材,供上述之固態耐磨潤滑塗層貼附與支撐;以M296570 IX. Scope of application: L A heat-dissipating auxiliary plate for high-speed drilling, which is placed on top of a printed circuit board for drilling. It includes: a solid-phase grinding lubricant coating; a support material for the above Solid wear-resistant lubricating coating attached and supported; 一熱熔潤滑層,塗佈於上述固態耐磨潤滑塗層表面上; 藉此在印刷電路板之鑽孔加工中避免產生碎屑,並有導 熱散熱作用。 2. 如申請範圍第1項所述之高速鑽孔用散熱輔助板材,其中該 支撐材為一塑料。 3. 如申請範圍第1項所述之高速鑽孔用散熱辅助板材,其中該 支撐材為一金屬箔板。 4. 如申請範圍第1項所述之高速鑽孔用散熱輔助板材,其中該 熱溶潤滑層係選自壬盼聚乙二醇醚(nonyl phenol polyethylene glycol ether)、聚乙烯乙二醇(PEG)、聚 乙烯醇(PVA)、聚丙烯酸(acrylic acid)及其鹽類、聚 曱基丙稀酸甲酯(Perspex)、蟲臘酸(cerot ic acid)、肉 豆蔻酸更丙酯、單硬脂酸甘油酯、蜜蠟以及其混合物之A hot-melt lubricating layer is coated on the surface of the solid wear-resistant lubricating coating; thereby avoiding the generation of debris in the drilling process of the printed circuit board and having a heat-dissipating heat dissipation effect. 2. The heat-dissipating auxiliary sheet for high-speed drilling according to item 1 of the application, wherein the support material is a plastic. 3. The heat-dissipating auxiliary sheet for high-speed drilling according to item 1 of the application, wherein the support material is a metal foil board. 4. The heat-dissipating auxiliary sheet for high-speed drilling according to item 1 of the application, wherein the hot-melt lubricating layer is selected from the group consisting of nonyl phenol polyethylene glycol ether and polyethylene glycol (PEG) ), polyvinyl alcohol (PVA), acrylic acid and its salts, methyl polymethyl acrylate (Perspex), cerot ic acid, propyl propyl myristate, single hard Glycerol, beeswax and mixtures thereof 1111
TW95205598U 2006-04-03 2006-04-03 Heat dissipation auxiliary plate for high speed drilling TWM296570U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105583889A (en) * 2014-10-22 2016-05-18 合正科技股份有限公司 Cover plate for hole drilling

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105583889A (en) * 2014-10-22 2016-05-18 合正科技股份有限公司 Cover plate for hole drilling

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