M296409 八、新型說明： 【新型所屬之技術領域】 本新型是有關於一種增壓型電腦，且特別是有關於一 種增壓型個人電腦電腦。 【先前技術】 隨著貧訊科技的高度發展，例如積體電路之製程的改 進以及對積體電路功此規格的要求日益升高，現今積體 電路的設計已是十分的精緻與複雜。肇因於複雜的電路設 汁所引發之龐大電能的消耗，而這些消耗的電能無可避免 地將造成晶片溫度的上升。 而，以積體電路為基礎的相關元件在電腦的應用上 相當重要，尤其是中央處理器不僅消耗功率日益提高，且 相對地其所產生之熱量也日益增加。其將造成電腦系統之 1部溫度的提高。當過多地熱量聚集在機殼内部而無法即 才政掉時’其將造成電子元件無法正常工作，甚至使整個 電腦系統當機或損毀。 一由於中央處理裔與其他的電+元件的消耗功率日益提 η且由於過问的溫度不僅僅會造成中央處理器的損壞， 更可能造成整個電腦系統之毀損H無可避免的由於 部分的電腦應用程式，尤其是許多的電腦遊戲程式，其需 用中央處理裔十分魔大的資源。當中央處理器之常常處 〈接近於滿載的十月況下運轉，其溫度的提高是可以被預期 的。 部分的中央處理器或者電腦系統製造者，為了避免過 5 M296409 门的’皿度仏成自身的損毁，當溫度超過-預定的溫度時， 會將中央處理n自動降頻，以降低中央處理器之工作溫 度。=而’降頻後的電腦的速度明顯低於原來中央處理器 的正常速度，其將造成電腦的運算速度降低。尤i是對於 專業的電腦遊戲玩家，當其正在與其他的電腦玩家交手 時’電腦速度的降低將可造成完全不一樣的遊戲結果。M296409 VIII. New description: [New technical field] The present invention relates to a supercharged computer, and in particular to a supercharged personal computer. [Prior Art] With the rapid development of the technology, such as the improvement of the process of the integrated circuit and the increasing requirements for the integrated circuit, the design of the integrated circuit is very delicate and complicated.肇Because of the huge electrical energy consumption caused by complex circuit design, these consumed electric energy will inevitably cause the temperature of the wafer to rise. However, related components based on integrated circuits are of great importance in the application of computers. In particular, the central processing unit not only consumes more and more power, but also generates relatively more heat. It will cause an increase in the temperature of one part of the computer system. When too much heat accumulates inside the casing and cannot be ruined, it will cause the electronic components to malfunction and even cause the entire computer system to crash or be destroyed. As the power consumption of the central processing unit and other electric + components is increasing η and the temperature of the interrogation will not only cause damage to the central processing unit, it is more likely to cause damage to the entire computer system. H is inevitable due to part of the computer. Applications, especially many computer game programs, require a centrally processed resource. When the central processor is often operated close to full load in October, an increase in temperature can be expected. Some central processing units or computer system manufacturers, in order to avoid the damage of the 5 M296409 door's 'degree of dish', when the temperature exceeds the predetermined temperature, the central processing n will be automatically down-converted to reduce the central processing unit. Working temperature. = And the speed of the computer after the down-conversion is significantly lower than the normal speed of the original CPU, which will cause the computer to slow down. Especially for professional computer gamers, when they are playing against other computer players, the reduction in computer speed will result in completely different game outcomes.
【新型内容】 鑒於上述之先前技術說明中所述，由於中央處理器的 工作溫度過高將會影響電腦系統的正常運作。然而，藉由 降頻，以降低中央處理器之工作溫度，不僅僅；‘ 的運算速度降低，尤其是對於專㈣制者，其可能造成 無法預知的後果。 本新型之目的之一係提供一種增壓型電腦，利用一增 壓開關啟動-增壓冷卻裝置，使電腦之卫作溫度，尤其^ 中央處理器的工作溫度可被有效的控制在_適當的工作溫 度，以避免降頻而使電腦的運算速度降低。 本新型之另-目的係提供一種增壓型電腦，利用一辦 壓開關啟動-增壓冷卻裝置，使中央處理器可以維持在^ 用軟體所需的最大的卫作效率下工作，使專業的電腦使用 者可無須顧慮中央處理器燒毀或降頻等問題，更可以延長 電腦的使用壽命。 、 根據以上所述之目的，本新型係—種增壓型電腦包含 有-電腦機殼、-風扇、-料冷卻裝置、—電源開關以 及一增壓開關。電源開關安裝於電腦機殼之上，以用來啟 M296409 動增壓型電腦與風扇。而此風扇係用來降低增壓型電腦之 一中央處理器之一工作溫度。增壓開關亦安裝於電腦機殼 之上，以用來啟動增壓冷卻裝置，進一步降低中央處理器 之工作溫度。當啟動此增壓冷卻裝置可有效地避免中央處 理器發生一降頻的情況。其中上述之增壓開關與該電源開 關均係為手動開關。而增壓冷卻裝置可以為一渦輪增壓風 扇、一致冷晶片模組冷卻裝置及/或一增壓電動泵。 本新型之一態樣係為一種氣冷式增壓型電腦，包含一 電腦機殼、一風扇、一渦輪增壓風扇、一電源開關以及一 增壓開關。電源開關安裝於電腦機殼之上，以用來啟動增 壓型電腦與風扇，而風扇係用來降低增壓型電腦之一中央 處理器之一工作溫度。增壓開關亦安裝於電腦機殼之上， 以用來啟動渦輪增壓風扇，進一步降低中央處理器之工作 度。當啟動此渦輪增壓風扇後，可有效地避免中央處理 器發生一降頻的情況。其中上述之增壓開關與電源開關均 係為手動開關。 本新型之另一態樣係為一種水冷式增壓型電腦包含有 電腦機殼、一水冷式冷卻器一電源開關與一增壓開關。 水冷式冷卻器更包含有一散熱器、—水箱、一電動泵、以 及一冷卻反應室。電源開關安裝於電腦機殼之上，以用來 啟動增壓型電腦與水冷式冷卻器，而水冷式冷卻器係用來 降低水冷式增壓型電腦之一中央處理器之一工作溫度。增 壓開關亦安裝於電腦機殼之上，當開啟增壓開關後，有^ 地増加冷卻反應室之一冷凍能力，以進一步降低中央處理 器之工作溫度。 M296409 此增壓開關係用來調升冷卻反應室之冷凍能力，以避 免中央處理器發生一降頻的情況。其中增壓開關與電源開 關均係為手動開關。_般而t，此增麼開關係、以提高電動 泵之一轉速，以增加冷卻反應室之冷凍能力。或者，此增 壓開關係啟動-增壓電動泵，以增加冷卻反應室之冷束能 力0[New content] In view of the above description of the prior art, the operating temperature of the central processing unit is too high, which will affect the normal operation of the computer system. However, by down-converting, the operating temperature of the central processing unit is lowered, not only because of the reduced speed of the operation, especially for the special (four) system, which may have unpredictable consequences. One of the purposes of the present invention is to provide a supercharged computer that uses a booster switch to activate a supercharged cooling device to make the temperature of the computer's bathroom, in particular, the operating temperature of the central processor can be effectively controlled. Operating temperature to avoid frequency reduction and reduce the computer's computing speed. Another object of the present invention is to provide a supercharged computer that utilizes a pressure-activated switch-priming-cooling cooling device so that the central processing unit can maintain the maximum working efficiency required for the software, making the professional Computer users can extend the life of the computer without worrying about the CPU burning or downsizing. According to the above, the novel type of supercharged computer includes a computer case, a fan, a material cooling device, a power switch, and a boost switch. The power switch is mounted on the computer case to activate the M296409 supercharger computer and fan. This fan is used to reduce the operating temperature of one of the central processing units of the supercharged computer. A booster switch is also mounted on the computer housing to activate the booster cooling unit, further reducing the operating temperature of the central processor. When the booster cooling device is activated, the central processor can be effectively prevented from being down-converted. The above-mentioned boost switch and the power switch are both manual switches. The boost cooling device can be a turbocharged fan, a uniform cold die module cooling device, and/or a booster electric pump. One aspect of the present invention is an air-cooled supercharged computer comprising a computer housing, a fan, a turbofan, a power switch, and a boost switch. The power switch is mounted on the computer case to activate the booster computer and the fan, and the fan is used to reduce the operating temperature of one of the central processors of the booster computer. The booster switch is also mounted on the computer case to activate the turbocharged fan, further reducing the CPU's operation. When this turbofan is activated, it can effectively avoid a frequency reduction in the central processor. The above-mentioned boost switch and power switch are both manual switches. Another aspect of the present invention is a water-cooled supercharged computer comprising a computer casing, a water-cooled cooler, a power switch and a booster switch. The water-cooled chiller further includes a radiator, a water tank, an electric pump, and a cooling reaction chamber. The power switch is mounted on the computer case to activate the booster computer and the water-cooled chiller, while the water-cooled chiller is used to reduce the operating temperature of one of the central processors of the water-cooled supercharged computer. The booster switch is also mounted on the computer case. When the boost switch is turned on, the cooling capacity of one of the cooling chambers is increased to further reduce the operating temperature of the central processor. M296409 This boost-on relationship is used to increase the cooling capacity of the cooling chamber to avoid a down-conversion of the central processor. The boost switch and the power switch are both manual switches. _ Like t, this increases the relationship to increase the speed of one of the electric pumps to increase the cooling capacity of the cooling reaction chamber. Alternatively, the boost-open relationship initiates a boost-charge electric pump to increase the cold beam capacity of the cooled reaction chamber.
本新5L之又悲樣，係為一種致冷晶片式增壓型電 月6)，其包含有一電腦機殼、一致冷晶片冷卻裝置、一電源 :關以及一增壓開關。其中，致冷晶片冷卻裝置更包含二 放熱片、-致冷晶片模組以及—冷卻板。電源開關安裝於 ，腦機殼之上，以絲啟動致冷晶片式增壓型電腦與致冷 晶片冷卻裝置。致冷晶片冷卻裝置係用來降低致冷晶片工; 增壓型電腦之-中央處理器之―4溫度。增壓開關亦安 裝於電腦機殼之上’當開啟增壓開關後，可有效地增加冷 卻板之-冷凍能力，以進一步降低中央處理器之工作溫度: 其中增壓開關係以調升冷卻板之冷東能力，使避免中 央處理盗發生-降頻的情況。而上述之増壓開關與電源開 關均係為手動開關。—般而言，增壓開關係提高致冷晶片 拉、、且之I作電壓差，以增加冷卻板之冷康能力。或者， 增壓開關係啟動-增壓致冷Μ模組，㈣加冷卻板之冷 康能力。其中上述之中央處理器風扇係位於中央處理器: 上’以驅動冷卻板所產生之—低溫空氣，以降低中央處理 器之工作溫唐。 本新型之增壓型電腦，利用—增壓開關，啟動-增壓 冷部裝置’使電腦之卫作溫度，尤其是中央處㈣的工作 M296409 溫f可被有效的控制在—適當的卫作溫度，有效地避免中 發生降頻的現象。更由於中央處理器可穩定的維 s的卫作溫度，冑中央處理器可以提供應用軟體所 需的最大的工作效率，使專業的電腦使用者可無須顧慮中 央處理器燒毀的問題，更可以延長電腦的使用壽命 【實施方式】 本新型之增壓型電腦，可使得中央處理器維持在一適 當的工作温度下運轉，以避免降頻而使電腦的運算速度降 低’更可以避免由於長時間高溫的操作使得中央處理器燒 毀的問題。以下將以圖示及詳細說明清楚說明本新型之精 神’如熟悉此技術之人員在瞭解本新型之較佳實施例後， 當可由本新型所教示之技術，加以改變及修飾，其並不脫 離本新型之精神與範圍。 參閱第1 ®，其係繪示本新型之一種增壓型電腦之示 意圖。此增壓型電腦之電腦機殼100至少包含有一電源開 關110以及一增壓開關120。同時參閱第2圖， 示: 新型之增壓型電腦之第一較佳實施例之示意圖。此較佳實 施利用安裝於電腦機殼200上之一增壓冷卻裝置24〇，例如 是一渦輪增壓風扇，以進一步提供中央處理器所需的冷卻 空氣。 一般而言，電腦均可利用安裝於電源供應器23〇上之 風扇232進行冷卻。但由於中央處理器所消耗的能量越來 越大，使得中央處理器的溫度越來越高，目前絕大部分的 中央處理器均安裝有一專用的風扇（參閱第4圖）直接進行 9 M296409 >卻然而’儘官如此電腦在連續高效率的運轉下，仍會 因為溫度太高而產生降頻或者是工作異常的情況。9 、—因此’昌電腦使用者在執行會明顯受㈣巾央處理器之 、斤速度# k #響的-應用程式時，使用者僅需將電源開 關210旁邊的·_ 22〇開啟，以啟動增墨冷卻裝置 240’其可進—步的強制冷卻電腦的卫作溫度，尤其是中央 處理器的工作溫度。 、 當中央處理器的工作溫度不會因為溫度的上升， 成電腦運算效率降低的時候，使用者可不用擔心因為運= 效率的降低，而影響到電腦操作的品質。尤其是一個專業 的電玩高手可不用擔心其中央處理器因為溫度太高而產生 降，的現象，更可以不用擔心因此而造成中央處理器燒毀 的ί月况發生。使用者僅需在必須完全應用到中央處理器的 運算效率時，按下增壓開關22〇即可放心的進行電腦=操 作也就疋說，當增壓開關220被按下以後，増壓冷卻裝 置^40將全功能將冷卻空氣吹入或由電腦機殼200内部將 熱空氣吸出，以有效的降低電腦與中央處理器的工作溫度。 由於增壓冷卻裝置240並非為了常態進行電腦與中央 處理器的冷卻，所以其可以利用渦輪增壓風扇，或者較傳 統散熱風^ 232之風量及/或風壓更大的風扇，以進行散 熱。雖然’其耗電量或’音可能因此而增大許多，然而對 ;必須利用電腦運算效率來贏得比赛的電腦專業玩家而 言，此時中央處理器與電腦均能在穩定且全負載的情況 運轉卻是更為重要。 因此，本新型之増壓冷卻裝置240可無須考慮電源的 M296409 /肖耗及/或"呆音的大小，其重點在於可有效的降低中央處理 器與電腦的工作溫度。 參閱第3圖，其係繪示本新型之增壓型電腦之第二較 佳實施例之示意圖。如圖中所示，此電腦係為一水冷式電 腦，其電腦機殼300上亦安裝有增壓開關32〇。增壓開關 320連接於增壓冷卻裝置。此增壓冷卻裝置包含有冷卻反應 室330、電動泵340、散熱器350、水箱36〇以及水管37〇 所構成之一水冷式冷卻器。當使用者欲進行全負載操作 時，僅需將增壓開關320按下，則可加快電動泵34〇的運 轉速度’使得冷卻反應室330可提供更大的散熱能力，以 降低中央處理器與電腦的溫度。 其可以是利用加強水冷式電腦之電動泵的轉速，使冷 卻反應室330的冷凍能力提升，亦可以是利用二電動泵 340, 一為標準電動泵以及另一為增壓電動泵，在需要提高 冷柬能力時，開啟增壓電動泵，以增加冷卻反應室33〇的 冷凍能力。由於，本新型之增壓冷卻裝置並不需要常態開 啟，故可無須考慮電源的消耗及/或噪音的大小，其重點在 於可有效的降低中央處理器與電腦的工作溫度。 參閱第4圖，其係繪示本新型之增壓型電腦之第三較 佳實加例之示思圖。此增壓型電腦係使用一致冷晶片冷卻 裝置。如圖中所示，電腦機殼400上亦安裝有電源開關41〇 與增壓開關420。電源開關410可啟動電腦與正常之散熱系 統。而增壓開關420則用來啟動增壓冷卻裝置的冷凍能力， 以降低中央處理器與電腦的工作溫度。此增壓冷卻裝置包 含有散熱片430、致冷晶片模組440以及冷卻板450。當使 11 M296409 用者欲進行全負載操作時，僅需將增壓開關42〇按下，則 可提回致4日日片模組440之電壓差，或者是啟動一增壓致 冷晶片模組，以提高冷卻板450的冷凍能力，使得冷卻板 450可提供更大的散熱能力，以降低中央處理器46〇與電腦 的派度。中央處理裔460上則更安裝有一中央處理器風扇 47〇，以驅動低溫的空氣進行中央處理器46〇的冷卻。 由於，本新型之增壓冷卻裝置並不需要常態開啟，故 可無須考慮電源的消耗及/或噪音的大小，其重點在於可有 效的降低中央處理器與電腦的工作溫度。藉由增壓冷卻裝 置可使彳于中央處理器維持在一適當的工作溫度下運轉，以 避免降頻而使電腦的運算速度降低，更可以避免由於長時 間高溫的操作使得中央處理器的壽命減少或者燒毀的問 題。 雖然本新型已以較佳實施例揭露如上，然其並非用以 限定本新型，任何熟習此技藝者，在不脫離本新型之精神 和範圍内，當可作各種之更動與潤飾，因此本新型之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本新型之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 第1圖係為本新型之增壓型電腦之示意圖； 弟2圖係為本新型之增壓型電腦之第一較佳實施例之 示意圖； 第3圖係為本新型之增壓型電腦之第二較佳實施例之 12 M296409 示意圖；以及 第4圖係為本新型之增壓型電腦之第三較佳實施例之 示意圖。 【主要元件符號說明】 100 :電腦機殼 340 :電動泵 110 :電源開關 350 :散熱器 120 :增壓開關 360 :水箱 200 :電腦機殼 370 :水管 210 :電源開關 400 :電腦機殼 220 :增壓開關 410 :電源開關 230 :電源供應器 420 :增壓開關 232 :風扇 430 :散熱片 240 :增壓冷卻裝置 440 :致冷晶片模組 300 :電腦機殼 450 :冷卻板 320 :增壓開關 460 :中央處理器 330 :冷卻反應室 470 :中央處理器風扇 13The new 5L is also a kind of cold-type wafer type supercharged electric power type 6), which includes a computer case, a uniform cold chip cooling device, a power supply: a shut-off and a boost switch. The cooling chip cooling device further comprises two heat releasing sheets, a cooling chip module and a cooling plate. The power switch is mounted on the brain casing to start the cooling chip type supercharged computer and the cooling chip cooling device. The refrigerated wafer cooling device is used to reduce the temperature of the cryo wafers; the temperature of the supercharged computer - the central processor. The booster switch is also mounted on the computer case. When the boost switch is turned on, the cooling plate's -freezing capacity can be effectively increased to further reduce the operating temperature of the central processor: wherein the boosting switch is used to raise the cooling plate. The ability of the cold east to avoid the central handling of theft-down frequency. The above-mentioned rolling switch and power switch are both manual switches. In general, the boost-on relationship increases the cooling chip pull and the voltage difference is increased to increase the cooling capacity of the cooling plate. Alternatively, the boost-on relationship activates the boost-cooling module, and (4) the cooling capability of the cooling plate. The central processor fan described above is located in the central processor: upper to drive the cooling plate to generate low temperature air to reduce the operating temperature of the central processor. The new supercharged computer uses the booster switch and the start-pressurization cold-station device to make the temperature of the computer's bathroom, especially the work of the central (4) M296409 temperature f can be effectively controlled - appropriate maintenance Temperature, effectively avoiding the phenomenon of frequency reduction. Moreover, due to the stable temperature of the central processing unit, the central processing unit can provide the maximum working efficiency required by the application software, so that professional computer users can avoid the problem of burning the central processing unit without delay. The service life of the computer [Embodiment] The new supercharged computer can keep the central processor running at an appropriate working temperature to avoid the frequency reduction of the computer and reduce the computing speed of the computer. The operation caused the central processor to burn down. The spirit and scope of the present invention will be apparent from the following description of the preferred embodiments of the present invention. The spirit and scope of the new model. Refer to Section 1 for a schematic representation of a supercharged computer of the present invention. The computer casing 100 of the supercharged computer includes at least a power switch 110 and a boost switch 120. Referring also to Fig. 2, there is shown a schematic view of a first preferred embodiment of a novel supercharged computer. This preferred implementation utilizes a booster cooling unit 24, such as a turbocharged fan, mounted to the computer housing 200 to further provide the cooling air required by the central processing unit. In general, the computer can be cooled by a fan 232 mounted on the power supply unit 23A. However, due to the increasing energy consumption of the central processing unit, the temperature of the central processing unit is getting higher and higher. At present, most of the central processing units are equipped with a dedicated fan (see Figure 4). The 9 M296409 > However, it is said that the computer will continue to operate under continuous high efficiency, and it will still cause frequency reduction or abnormal operation due to too high temperature. 9, - Therefore, when the user of Chang computer is obviously affected by the application of the (4) towel processor, the user only needs to turn on the _ 22 旁边 next to the power switch 210 to The ink refilling device 240' is activated to forcibly cool the computer's operating temperature, especially the operating temperature of the central processing unit. When the operating temperature of the central processing unit does not increase due to temperature rise, the user can avoid the loss of efficiency and affect the quality of computer operation. In particular, a professional video game master can not worry about the phenomenon that the central processing unit is lowered due to too high temperature, and it is not necessary to worry about the occurrence of the central processor burning. The user only needs to press the boost switch 22 在 to perform the computer=operation when the operation efficiency has to be fully applied to the central processing unit. That is to say, when the boost switch 220 is pressed, the pressure is cooled. The device 40 will fully blow the cooling air into or out of the computer casing 200 to effectively reduce the operating temperature of the computer and the central processing unit. Since the supercharged cooling device 240 does not cool the computer and the central processor for the normal state, it can utilize a turbocharged fan or a fan having a larger air volume and/or a higher wind pressure than the conventional heat radiating air to dissipate heat. Although 'its power consumption or 'sound may increase a lot, but for; computer professional players who must use computer computing efficiency to win the game, the central processor and the computer can be stable and fully loaded. Running is more important. Therefore, the novel chilling device 240 does not need to consider the power supply M296409 / xiao and / or "sound", the focus is on effectively reducing the operating temperature of the central processor and the computer. Referring to Figure 3, there is shown a schematic view of a second preferred embodiment of the supercharged computer of the present invention. As shown in the figure, the computer is a water-cooled computer, and a computerized booster switch 32 is mounted on the computer casing 300. The boost switch 320 is connected to a boost cooling device. The supercharged cooling device comprises a water-cooled cooler formed by a cooling reaction chamber 330, an electric pump 340, a radiator 350, a water tank 36, and a water pipe 37. When the user wants to perform a full load operation, only pressing the boost switch 320 down can speed up the operation speed of the electric pump 34〇 so that the cooling reaction chamber 330 can provide greater heat dissipation capability to lower the central processing unit and The temperature of the computer. It may be that the speed of the electric pump of the water-cooled computer is increased, and the refrigeration capacity of the cooling reaction chamber 330 is improved. Alternatively, the two electric pumps 340, one for the standard electric pump and the other for the supercharged electric pump, may be used. When the cold trapping capacity is enabled, the booster electric pump is turned on to increase the freezing capacity of the cooling reaction chamber 33 。. Since the new type of supercharged cooling device does not require normal opening, it is not necessary to consider the power consumption and/or noise level, and the focus is on effectively reducing the operating temperature of the central processing unit and the computer. Referring to Figure 4, there is shown a diagram of a third preferred embodiment of the supercharged computer of the present invention. This supercharged computer uses a consistent cold wafer cooling unit. As shown in the figure, a power switch 41A and a boost switch 420 are also mounted on the computer casing 400. The power switch 410 activates the computer and the normal cooling system. The boost switch 420 is used to activate the refrigeration capacity of the booster cooling device to reduce the operating temperature of the central processing unit and the computer. The booster cooling device includes a heat sink 430, a refrigerant chip module 440, and a cooling plate 450. When the user of 11 M296409 wants to perform full load operation, only the pressurization switch 42 is pressed, the voltage difference of the 4 day solar module 440 can be recovered, or a boosted cooling die can be activated. In order to improve the freezing capacity of the cooling plate 450, the cooling plate 450 can provide greater heat dissipation capability to reduce the dispatch of the central processing unit 46 to the computer. The central processing unit 460 is further equipped with a central processing unit fan 47 〇 to drive the low temperature air for cooling of the central processing unit 46. Since the new type of supercharged cooling device does not need to be normally turned on, it is not necessary to consider the power consumption and/or noise level, and the focus is on effectively reducing the operating temperature of the central processing unit and the computer. The supercharged cooling device can keep the central processing unit operating at an appropriate operating temperature to avoid the frequency reduction and reduce the computing speed of the computer, and can avoid the life of the central processing unit due to long time high temperature operation. Reduce or burn down problems. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and the present invention can be modified and retouched without departing from the spirit and scope of the present invention. The scope of protection is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious, the detailed description of the drawings is as follows: Figure 1 is a new type of supercharged computer 2 is a schematic view of a first preferred embodiment of a new type of supercharged computer; FIG. 3 is a schematic view of a 12 M296409 of a second preferred embodiment of the supercharged computer of the present invention; 4 is a schematic view of a third preferred embodiment of the novel supercharged computer. [Main component symbol description] 100: Computer case 340: Electric pump 110: Power switch 350: Heat sink 120: Pressurization switch 360: Water tank 200: Computer case 370: Water pipe 210: Power switch 400: Computer case 220: Boost switch 410: power switch 230: power supply 420: boost switch 232: fan 430: heat sink 240: boost cooling device 440: cold chip module 300: computer case 450: cooling plate 320: supercharging Switch 460: central processor 330: cooling reaction chamber 470: central processor fan 13