TWM290366U - Liquid-cooling heat radiator - Google Patents

Liquid-cooling heat radiator Download PDF

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Publication number
TWM290366U
TWM290366U TW94220390U TW94220390U TWM290366U TW M290366 U TWM290366 U TW M290366U TW 94220390 U TW94220390 U TW 94220390U TW 94220390 U TW94220390 U TW 94220390U TW M290366 U TWM290366 U TW M290366U
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Taiwan
Prior art keywords
liquid
fitting
wall
surrounding wall
space
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TW94220390U
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Chinese (zh)
Inventor
Jian-Rung Chen
Jr-Guang Liou
Shing-Hua Shu
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Yen Sun Technology Corp
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Priority to TW94220390U priority Critical patent/TWM290366U/en
Publication of TWM290366U publication Critical patent/TWM290366U/en

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Description

M290366 八、新型說明: 【新型所屬之技術領域】 本新型是有關於一種散熱裝置,特別是指一種液冷式 散熱裝置。 ” 【先前技術】 般電子儀裔藉由内部裝設的複數積體電路晶片的操 作來達到預定的功能。該等積體電路晶片若於長時間或是 操作時脈(clock rate)很高的使用情形下,往往會產生熱量而 使積體電路晶片本身的溫度升高,但是高溫會影響積體電 路晶片的工作效率,使得電子儀器速度變得非常慢,甚至 幾近故障的情況發生,且由於該等積體電路晶片均是極精 雄、的零件,處於高溫環境之下有時會造成該電子儀器燒毀 因此目刖精岔昂貴的電子儀器中會在積體電路晶片上裝 設有散熱裝置以避免積體電路晶片溫度過高的現象。 一般常見的散熱裝置有氣冷式散熱裝置及液冷式散熱 衣置氣冷式散熱裝置利用風扇轉動來帶動氣流吹過該等 積體電路晶片,氣流對流的效果可帶走該等晶片輕射出來 的熱量。 而液冷式散熱裝置一般須配合一裝設在該等積體電路 曰曰片上的散熱鰭片,該散熱鰭片一般是由金屬材質製成, 口此可先傳導出該等晶片的熱量,再藉由冷卻液接觸該散 熱,片來吸收该散熱韓片的熱量,而液冷式散熱裝置即用 來帶動該冷卻液的流動以增進散熱效果。 麥閱圖1,中華民國專利公告號第587784號揭露一種 M290366 習知的液冷式散熱裝置8,該散熱裝置8包括一底座8 j、 一風扇82、一驅動件83 ’及一封蓋84,該底座81及該封 蓋84兩者相配合可界定出一液流空間。該風扇82設置於 該液流空間中。 該底座81具有一底壁813、一由該底壁813之周緣往 上延伸的圍繞壁814、一設於該底壁813上之固定軸管815 、四为別對稱形成於该底壁813外部底面上的容置部$ 16、 秦一形成於該圍繞壁814上的輸入管817,及另一形成於該圍 繞壁814上的輸出管818。而每一容置部816則可界定出一 容室空間並且與該液流空間隔離不相連通以達到防水效果 〇 該風扇82設置於該固定軸管815上,並具有一可轉動 ,地樞設在該固定軸管815上的扇葉本體822,及一環繞該扇 葉本體822周緣的磁鐵環821。該扇葉本體822具有複數扇 葉8221,而該磁鐵環821套設於該等扇葉8221外緣上。 • 該驅動件83可通電激磁感應該磁鐵環821帶動該風扇 82旋轉,以帶動該冷卻液由該輸入管817流入該液流空間 中並由該輸出管818排出至外界。該驅動件83包括四定子 ' 為專疋子線圈8 3 1分別設置於對應之容置部816 内。 田液體經由該底座8丨上之輸入管8丨7而進入該液流空 門^ ’並不會滲出到該容室空間,該四定子線圈831自然 不又衫響。而該四定子線圈831於通電時會產生磁場,磁 線可牙透過該底座81與該風扇82的磁鐵環821產生磁 M290366 性互斥,進而推動該風扇82旋轉,帶動冷卻液由該底座8i 上之輪出管818排出。 但是習知的散熱裝置8需要於該底座81上開設複數個 不與該液流空間相連通的容置部816,並將該四定子線圈 ^分別設置於該容置部816内部,以形成一良好的防水結 才。但是此種設計在組裝時需要安裝四個定子線圈831,組 :相較為繁項,組裝效率低,四個定子線圈831也會提 南產品成本,造成產品的利潤不易提昇。 *再者,該四定子線圈831因為必須分別裝設於對應的 P 816 Θ所以會為§亥四定子線圈831的連接帶來困 雞,、不便。此外,該等客晉邱s ^寻今置邛816彼此互不連通且分散遠 離’使該等定子線圈831通電產 ,.^ 电座玍的磁力比較無法靠近形 成磁力迴路,因此會形成電磁功率損耗的缺點。 【新型内容】 因此,本新型之目的,卽力妲 P在獒L 一種可以方便組裝且 可減少電磁功率損耗的液冷式散熱裝置。 =是,本新型液冷式散熱裝置適用於帶動—冷卻液快 速&動,且包含一殼座、一 -驅叙杜 《封盍、一風扇及 〇 忒喊座包括一頂壁、—由該頂壁的内緣向内且向下延 圍繞壁,及-由該頂壁的外緣向下延伸的外圍繞壁 ΟM290366 VIII. New description: [New technical field] The present invention relates to a heat dissipating device, in particular to a liquid cooling heat dissipating device. [Prior Art] The electronic device achieves a predetermined function by the operation of a plurality of integrated circuit chips that are internally mounted. If the integrated circuit chip is used for a long time or the clock rate is high. In the use case, heat is generated to increase the temperature of the integrated circuit chip itself, but the high temperature affects the working efficiency of the integrated circuit chip, so that the speed of the electronic instrument becomes very slow, even a near fault condition occurs, and Since these integrated circuit chips are extremely delicate parts, in the high temperature environment, the electronic equipment may be burned, so that the electronic equipment that is used in the fine and expensive electronic equipment is provided with heat dissipation on the integrated circuit chip. The device avoids the phenomenon that the temperature of the integrated circuit chip is too high. The common heat dissipating device includes an air-cooled heat dissipating device and a liquid-cooled heat dissipating device. The air-cooling heat dissipating device uses a fan to rotate to drive the airflow through the integrated circuit chip. The effect of airflow convection can take away the heat that the wafers emit lightly. The liquid-cooled heat sink generally has to be installed in the integrated circuit. The fins on the chip are generally made of a metal material, and the heat of the wafers is first conducted, and the heat is contacted by the coolant to absorb the heat of the heat sink. The liquid-cooled heat dissipating device is used to drive the flow of the cooling liquid to enhance the heat dissipating effect. A liquid-cooling heat dissipating device 8 of the prior art is disclosed in the Chinese Patent Publication No. 587784. A base 8 j, a fan 82, a driving member 83' and a cover 84, the base 81 and the cover 84 cooperate to define a flow space. The fan 82 is disposed in the flow space The base 81 has a bottom wall 813, a surrounding wall 814 extending upward from the periphery of the bottom wall 813, a fixed shaft tube 815 disposed on the bottom wall 813, and four are symmetrically formed on the bottom wall 813. a receiving portion $16 on the outer bottom surface, an input tube 817 formed on the surrounding wall 814, and another output tube 818 formed on the surrounding wall 814. Each receiving portion 816 can be defined a chamber space and not isolated from the flow space isolation The fan 82 is disposed on the fixed shaft tube 815, and has a blade body 822 pivotally disposed on the fixed shaft tube 815, and a magnet ring surrounding the periphery of the blade body 822. 821. The blade body 822 has a plurality of blades 8221, and the magnet ring 821 is sleeved on the outer edge of the blades 8221. The driving member 83 can be energized to induce the magnet ring 821 to drive the fan 82 to rotate. The cooling liquid flows into the liquid flow space from the input pipe 817 and is discharged to the outside by the output pipe 818. The driving member 83 includes four stators ′ for the dedicated sub-coils 8 3 1 respectively disposed in the corresponding accommodating portions 816 The liquid of the field enters the liquid flow door through the input pipe 8丨7 on the base 8 and does not seep into the space of the chamber, and the four-stator coil 831 naturally does not ring. When the four stator coils 831 are energized, a magnetic field is generated, and the magnetic wires are magnetically permeable to the magnetic ring 821 of the fan 82 through the base 81, thereby pushing the fan 82 to rotate, and driving the coolant from the base 8i. The upper wheel outlet pipe 818 is discharged. However, the conventional heat dissipating device 8 needs to have a plurality of accommodating portions 816 that are not in communication with the liquid flow space, and the four stator coils are respectively disposed inside the accommodating portion 816 to form a heat dissipating device 8 . Good waterproof knot. However, this type of design requires four stator coils 831 to be assembled during assembly. The assembly is relatively complicated and the assembly efficiency is low. The four stator coils 831 also increase the product cost, which makes the profit of the product difficult to improve. * Furthermore, since the four stator coils 831 must be respectively mounted on the corresponding P 816 Θ, it is inconvenient for the connection of the θ海四 stator coil 831. In addition, the guest Jinqiu s ^ 今 邛 邛 816 are not connected to each other and dispersed away from 'the stator coil 831 is energized, the power of the 玍 比较 can not be close to form a magnetic circuit, thus forming electromagnetic power The disadvantage of loss. [New content] Therefore, the purpose of the present invention is to provide a liquid-cooled heat sink that can be easily assembled and can reduce electromagnetic power loss. = Yes, the new liquid-cooled heat sink is suitable for driving - cooling liquid fast & moving, and includes a shell, a - drive Syria "sealing, a fan and a shouting seat including a top wall, - by The inner edge of the top wall extends inwardly and downwardly around the wall, and - an outer surrounding niche extending downward from the outer edge of the top wall

該頂封蓋與該頂壁緊密 A , 系山配口並彼此界定出一液流空間 匕括至少二形成於該頂蓋 只支丁盖且運通外界與該液流空間 M290366 的液流孔。 該底封蓋與該外圍繞壁下半部緊密配合,並彼此界定 出一與该液流空間不相連通的容置空間。 該驅動件容設於該容置空間中,可被控制地輸出動力 。该風扇谷設於該液流空間中,可被該驅動件輸出的動力 驅動作動’帶動該冷卻液由一液流孔流入該液流空間後由 另一液流孔流出至外界。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效,在 以下配合參考圖式之一個較佳實施例的詳細說明中,將可 清楚的呈現。 參閱圖2、圖3與圖4,本新型液冷式散熱裝置適用於 帶動一冷卻液快速流動,且包含一殼座丨、一風扇2、一驅 動件3、一頂封蓋4、一底封蓋5、一第一氣密環6及一第 二氣密環7。 該殼座1包括一環形頂壁u、一由該頂壁u的内緣向 内且向下延伸的内圍繞壁12、一由該頂壁u的外緣向下延 伸的外圍繞壁13、一形成於該外圍繞壁丨3下緣的第一嵌合 槽14、一形成於該頂壁U周緣的第二嵌合件15,及一設置 於該内圍繞壁12底面的定位軸16。 該頂封蓋4可與該頂壁u結合,並與該頂壁u及該内 圍繞壁12相配合界定出一液流空間4丨。該頂封蓋4包括至 少二連通外界與該液流空間41的液流孔42,及一形成於該 頂封蓋4下周緣的第二嵌合槽43。 M290366 該底封蓋5可與該殼座1的外圍繞壁13下半部結合, 並與該外圍繞壁13、該頂壁11及該内圍繞壁12相配合界 定出一容置空間51,且該容置空間51與該液流空間41不 相連通。 該風扇2容設於該液流空間41,並可帶動該冷卻液由 一液流孔42流入且由另一液流孔42流出。該驅動件3容 設於該容置空間51,並可驅動該風扇2旋轉帶動該冷卻液 由一液流孔42流入該液流空間41後由另一液流孔42流出 至外界。 遠頂封蓋4的第二嵌合槽43可與該頂壁11的第二嵌合 件15對應嵌合,且彼此配合界定出一第二嵌合空間431, 該第二氣密環7由具彈性的材質製成,該第二氣密環7夾 設於該第二嵌合空間431中可防止該冷卻液滲出該液流空 間41。 該底封蓋5包括一可與該外圍繞壁13下緣密合的基壁 52,及一形成於該基壁52周緣的第一嵌合件53,該第一嵌 合槽14 T與該第-嵌合彳53 _應欲纟,且彼此配合界定 出-第-嵌合空間141,而該第一氣密環6是由具彈性的材 質製成,且夹設於該第-嵌合空^ 141可防止空氣中的濕 氣進入該容置空間51中影響該驅動件3的性能。 該風扇2包括—可旋轉地套設於該定絲16上的樞接 件20、-設於該樞接件2〇上而位於該頂壁u上方之液流 空間41㈣扇葉件2卜及_固設於該樞接件2q周緣而位 於該内圍繞壁12内緣之導磁件22,該扇葉件21可以該定 M290366 而該導磁件22係 位軸16為甲心旋轉而帶動冷卻液流動 可為一環形磁鐵。 該驅動件3包括一圍設於該内圍繞壁U外周面的定子 線圈31,以及—與該定子線圈η電連接的電路板32。今 =板32被通電時可使該定子線圈η激磁,驅動該輕 件21轉動。較子線圈31於通料會產生磁場,磁力線 可牙透過該_繞壁12與該風扇2的導磁件22產生磁性 互斥,以感應該導磁件22轉動而連動該樞接件20以定位 ^ 16為中"帶動扇葉件21旋轉,藉以帶動冷卻液由-液 =孔42流入該殼座!之液流空間41並由另一液流孔U排 出。 』本新型藉由隔絕該液流空f“ i與該容置空間Η,可防 ^ ^液/瓜卫間41中的冷卻液滲漏至該容置空間中影響 /驅動件3的性&。該驅動件3的定子線圈η圍設於該内 圍:“ 12的外周面可使該定子線圈31的磁力易於形成磁 力迴路,減少能量的損耗。 τ σ上述’本新型液冷式散熱裝置由於只需將該驅動 件3容設於一容詈办pq 二間51中即完成組裝,因此可使該驅動 方便安政。且由於該定子線圈31環設於該内圍繞壁12 卜周面並貼近4風扇2的導磁件U,可使該^子線圈Η通 電敖兹產生的磁力線易於形成磁力迴路,減少磁力發散所 :成的電磁功率損耗。再者,由於該容置空間Μ與該液流 空間二彼此不相連通,且該第一散合件53、第一欲合槽 第氣在% 6緊密結合,可防止該液流空間41中的冷 10 M290366 卻液渗漏出該液流空門 槽43及第二氣密二41。而該第二嵌…、第二嵌合 該容置Μ 51中而2緊密結合可防止空氣中的濕氣進入 達到本新型的目的广该驅動件3的性能。因此,讀實能 处、隹i所述者,僅為本新型之較佳實施例而已,當不 一、^限疋本新型實施之範圍,即大凡依本新型中請專利 =圍及新型說明内容所作之簡單的等效變化與修_,皆仍 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖 1是一立體分解圖,說明一習知的液冷式散熱裝 置 圖2是一立體圖,說明本新型液冷式散熱裝 佳實施例; 較 圖3是一立體分解圖,輔助說明圖2所示之本新型、 冷式散熱裝置;及 灰 圖4是一側視剖面圖,輔助說明圖2所示之本新型、 冷式散熱裝置。 ( 11 M290366 【主要元件符號說明】 1 * · •殼座 3L· * 定子線圈 11… •頂壁 32·« . > 電路板 12*· • 内圍繞壁 4 . » *頂封蓋 13… •外圍繞壁 41.* •液流空間 14… •第一嵌合槽 42·. •液流孔 141* •第一嵌合空間 43 · · •第二欲合槽 15· · •第二嵌合件 431 · •第二嵌合空間 16·. # 定位軸 5 · · •底封蓋 3 風扇 51 · · • 容置空間 20 枢接件 52* · •基壁 21 · · ♦扇葉件 53… • 第一嵌合件 22.. • 導磁件 6 · · •第一氣密環 3 * * • 驅動件 7… •第二氣密環 12The top cover is tightly aligned with the top wall A, and defines a flow space for each other, including at least two fluid flow holes formed in the top cover only for the cover and for transporting the outside and the liquid flow space M290366. The bottom closure fits snugly against the lower half of the outer surrounding wall and defines an accommodation space that is out of communication with the flow space. The driving member is accommodated in the accommodating space and can be controlled to output power. The fan valley is disposed in the liquid flow space, and can be driven by the power outputted by the driving member to drive the coolant to flow into the liquid flow space from one liquid flow hole and then flow out to the outside through another liquid flow hole. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. Referring to FIG. 2, FIG. 3 and FIG. 4, the liquid cooling heat dissipating device is suitable for driving a rapid flow of cooling liquid, and comprises a shell seat, a fan 2, a driving member 3, a top cover 4 and a bottom. The cover 5, a first airtight ring 6 and a second airtight ring 7. The housing 1 includes an annular top wall u, an inner surrounding wall 12 extending inwardly and downwardly from an inner edge of the top wall u, and an outer surrounding wall 13 extending downward from an outer edge of the top wall u, A first fitting groove 14 formed on the lower edge of the outer surrounding wall 3, a second fitting member 15 formed on the periphery of the top wall U, and a positioning shaft 16 disposed on the bottom surface of the inner surrounding wall 12. The top cover 4 is engageable with the top wall u and cooperates with the top wall u and the inner surrounding wall 12 to define a flow space 4丨. The top cover 4 includes at least two liquid flow holes 42 communicating with the outside and the liquid flow space 41, and a second fitting groove 43 formed on the lower periphery of the top cover 4. M290366 The bottom cover 5 can be combined with the lower half of the outer surrounding wall 13 of the housing 1 and cooperate with the outer surrounding wall 13, the top wall 11 and the inner surrounding wall 12 to define an accommodating space 51. The accommodating space 51 is not in communication with the liquid flow space 41. The fan 2 is accommodated in the liquid flow space 41, and the coolant can be caused to flow from one liquid flow hole 42 and flow out from the other liquid flow hole 42. The driving member 3 is disposed in the accommodating space 51, and can drive the fan 2 to rotate to drive the cooling liquid to flow into the liquid flow space 41 from the liquid flow hole 42 and then flow out to the outside through the other liquid flow hole 42. The second fitting groove 43 of the top cover 4 can be correspondingly engaged with the second fitting 15 of the top wall 11 and cooperate with each other to define a second fitting space 431. The second airtight ring 7 is The second airtight ring 7 is sandwiched in the second fitting space 431 to prevent the coolant from seeping out of the liquid flow space 41. The bottom cover 5 includes a base wall 52 that can be in close contact with the lower edge of the outer surrounding wall 13 , and a first fitting member 53 formed on the periphery of the base wall 52 . The first fitting groove 14 T and the The first-fitting 彳 53 _ is intended to be 纟, and cooperates to define a first-fitting space 141, and the first airtight ring 6 is made of an elastic material and is sandwiched by the first-fitting The air 141 prevents moisture in the air from entering the accommodating space 51 to affect the performance of the driving member 3. The fan 2 includes a pivoting member 20 rotatably sleeved on the fixing wire 16, a liquid flow space 41 (four) of the blade member 2 disposed on the pivoting member 2b and located above the top wall u a magnetically permeable member 22 fixed to the inner periphery of the inner peripheral wall 12 at the periphery of the pivoting member 2q. The blade member 21 can be fixed by M290366 and the magnetically accommodating member 22 of the magnetically permeable member 22 is rotated by the centroid. The coolant flow can be a ring magnet. The driving member 3 includes a stator coil 31 surrounding the outer peripheral surface of the inner surrounding wall U, and a circuit board 32 electrically connected to the stator coil n. Now, when the plate 32 is energized, the stator coil η can be excited to drive the light member 21 to rotate. The magnetic field of the sub-coil 31 generates magnetic field, and the magnetic flux can be magnetically repelled through the wall 12 and the magnetic conductive member 22 of the fan 2 to sense the rotation of the magnetic member 22 to interlock the pivoting member 20. Positioning ^ 16 is medium " driving the blade member 21 to rotate, thereby driving the coolant to flow into the housing from the liquid-hole 42! The liquid flow space 41 is discharged from the other liquid flow hole U. The present invention can prevent the coolant in the liquid/guar 41 from leaking into the accommodating space by affecting the influence/drive member 3 by isolating the liquid flow space f"i and the accommodating space Η. The stator coil n of the driving member 3 is disposed around the inner circumference: "the outer peripheral surface of the 12" allows the magnetic force of the stator coil 31 to easily form a magnetic circuit, thereby reducing energy loss. τ σ The above-mentioned liquid cooling type heat dissipating device can be assembled by simply accommodating the driving member 3 in the two compartments 51 of the accommodating office pq, so that the driving can be facilitated by the government. Moreover, since the stator coil 31 is disposed around the circumferential surface of the inner surrounding wall 12 and close to the magnetic conductive member U of the fan 2, the magnetic lines generated by the coil of the coil can be easily formed into a magnetic circuit, and the magnetic flux is reduced. : The electromagnetic power loss. Furthermore, since the accommodating space Μ and the liquid flow space 2 are not in communication with each other, and the first accommodating member 53 and the first desired plenum are tightly coupled at % 6 , the liquid flow space 41 can be prevented. The cold 10 M290366 leaks out of the liquid flow empty door slot 43 and the second airtight two 41. The second engagement, the second engagement of the accommodating jaws 51 and the intimate combination of 2 prevent the moisture in the air from entering the performance of the driving member 3 for the purpose of the present invention. Therefore, it is only the preferred embodiment of the present invention, which is only the scope of the present invention, that is, the scope of the new implementation of the present invention. The simple equivalent changes and repairs made by the content are still within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view showing a conventional liquid-cooled heat sink device. FIG. 2 is a perspective view showing a preferred embodiment of the liquid-cooled heat sink assembly of the present invention; FIG. 3 is an exploded perspective view of FIG. The present invention relates to the novel, cold heat sink shown in FIG. 2; and the gray figure 4 is a side cross-sectional view, which assists in explaining the novel, cold heat sink shown in FIG. 2. ( 11 M290366 [Description of main component symbols] 1 * · • Housing 3L· * Stator coil 11... • Top wall 32·« . > Circuit board 12*· • Inner surrounding wall 4. » *Top cover 13... Outer surrounding wall 41.* • Flow space 14... • First fitting groove 42·. • Flow hole 141* • First fitting space 43 • • Second intended groove 15 • • • Second fitting 431 · • 2nd fitting space 16·. # positioning shaft 5 · · • bottom cover 3 fan 51 · · • accommodating space 20 pivoting member 52* · • base wall 21 · · ♦ fan blade 53... • First fitting 22:. Magnetic member 6 · · • First airtight ring 3 * * • Drive member 7... • Second airtight ring 12

Claims (1)

M290366 九、申請專利範圍: 適用於帶動-冷卻液快速流動 1 · 一種液冷式散熱裝置 包含: 下延伸的外 由該頂壁的内緣向内且向 由”亥頂壁的外緣向下伸外M290366 IX. Patent application scope: Applicable to driving-cooling fast flow 1 · A liquid-cooled heat sink consisting of: the lower extension is made inward by the inner edge of the top wall and downwards from the outer edge of the top wall Stretch outside 一殼座,包括一頂壁、 下延伸的内圍繞壁,及一由 圍繞壁; 一頂封蓋, 壁相配合界定出 別連通外界與該液流空間的液流孔; 一容設於該液流空間中的風扇; 底封蓋,可與該殼座的外圍繞壁下半部結合而與 該外圍繞壁、該頂壁及該内圍繞壁相配合界定出一與該 液流空間不相連通的容置空間·,及 谷没於該容置空間的驅動件,包括一圍設於該内 圍繞壁外緣的定子線圈,以及一與該定子線圈電連接的 電路板’该電路板被通電可使該定子線圈激磁而驅動該 風扇轉動’使該風扇作動帶動該冷卻液由一液流孔流入 该液流空間後由另一液流孔流出至外界。 2_依據申請專利範圍第丨項所述之液冷式散熱裝置,其中 ’该風扇係包括一可樞設於該内圍繞壁底面之樞接件、 一設於該樞接件上而位於該頂壁上方之液流空間内的扇 葉件’及一固設於該樞接件周緣而位於該内圍繞壁内緣 之導磁件,該定子線圈被通電激磁時可感應該導磁件轉 動而連動該樞接件帶動扇葉件轉動。 13 M290366 3·依據申請專利範圍第2項所述之液冷式散熱裝置,其中 ’该殼座包括一設置於該内圍繞壁底面的定位軸,而該 風扇之樞接件係可旋轉地套設於該定位軸上。 4.依據申請專利範圍第2或3項所述之液冷式散熱裝置, 其中’該導磁件是為一環形磁鐵。 5·依據申請專利範圍第丨項所述之液冷式散熱裝置,其中 ’該底封蓋包括一基壁及一形成於該基壁周緣的第一嵌 合件,而該殼座還包括一形成於該外圍繞壁下緣且可與 該第一嵌合件彼此對應相嵌合的第一嵌合槽。 6.依據申請專利範圍第5項所述之液冷式散熱裝置,還包 含一第一氣密環,該第一氣密環夾設於該第一嵌合件與 该第一嵌合槽相嵌合後所界定的第一嵌合空間中。 7·依據申請專利範圍第丨項所述之液冷式散熱裝置,其中 ’該殼座還包括一形成於該頂壁周緣的第二嵌合件,而 該頂封蓋還包括一形成於其下周緣且可與該第二嵌合件 彼此對應相嵌合的第二嵌合槽。 8·依據申請專利範圍第7項所述之液冷式散熱裝置,還包 含一可夾設於該第二嵌合件與該第二嵌合槽相嵌合後所 界定的第二嵌合空間中的第二氣密環。 14a housing, comprising a top wall, a downwardly extending inner surrounding wall, and a surrounding wall; a top cover, the wall matching to define a flow hole connecting the outside and the liquid flow space; a fan in the flow space; a bottom cover engageable with the lower half of the outer surrounding wall of the housing to cooperate with the outer surrounding wall, the top wall and the inner surrounding wall to define a flow space a communicating space that communicates with the valley, and a driving member that is not in the accommodating space, includes a stator coil surrounding the outer periphery of the inner surrounding wall, and a circuit board electrically connected to the stator coil When the electric current is energized, the stator coil is excited to drive the fan to rotate. The fan is driven to move the coolant into the liquid flow space from one liquid flow hole and then flow out to the outside through another liquid flow hole. The liquid-cooled heat dissipating device according to the invention of claim 2, wherein the fan system comprises a pivoting member pivotable on a bottom surface of the inner surrounding wall, and a fan member is disposed on the pivoting member. a blade member in the flow space above the top wall and a magnetic conductive member fixed on the periphery of the pivoting member and located at the inner edge of the inner surrounding wall, the stator coil being inductively energized to induce the rotation of the magnetic conductive member The interlocking member drives the blade member to rotate. The liquid-cooled heat sink of claim 2, wherein the housing includes a positioning shaft disposed on a bottom surface of the inner surrounding wall, and the pivoting member of the fan is rotatably sleeved Set on the positioning axis. 4. The liquid-cooled heat sink according to claim 2, wherein the magnetic conductive member is a ring magnet. 5. The liquid-cooled heat sink according to the invention of claim 2, wherein the bottom cover comprises a base wall and a first fitting formed on a periphery of the base wall, and the housing further comprises a a first fitting groove formed at a lower edge of the outer surrounding wall and engageable with the first fitting member. 6. The liquid-cooled heat sink according to claim 5, further comprising a first airtight ring, the first airtight ring being sandwiched between the first fitting and the first engaging groove The first fitting space defined after the fitting. 7. The liquid-cooled heat sink according to the above application, wherein the housing further comprises a second fitting formed on a periphery of the top wall, and the top cover further comprises a a second fitting groove which is fitted to the lower circumference and which is engageable with the second fitting. The liquid-cooling heat sink according to claim 7, further comprising a second fitting space defined by the second fitting member and the second fitting groove The second airtight ring in the middle. 14
TW94220390U 2005-11-24 2005-11-24 Liquid-cooling heat radiator TWM290366U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113137374A (en) * 2020-01-17 2021-07-20 建准电机工业股份有限公司 Liquid cooling type heat dissipation system and pump thereof
CN113404698A (en) * 2020-03-16 2021-09-17 建准电机工业股份有限公司 Liquid cooling type heat dissipation system and pump thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113137374A (en) * 2020-01-17 2021-07-20 建准电机工业股份有限公司 Liquid cooling type heat dissipation system and pump thereof
CN113404698A (en) * 2020-03-16 2021-09-17 建准电机工业股份有限公司 Liquid cooling type heat dissipation system and pump thereof

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