M288953 八、新型說明： 【新型所屬之技術領域】 本新型是有關於一種電腦系統，特別是指一種無需透 過風扇排散中央處理器產生之高溫的電腦系統。 【先前技術】 隨著微技術快速開發的腳步，許多電子設備/儀器均已 邁向超高頻作業模式的階段，提供快速運算而因應各種執 _ 仃狀態。以電腦系統為例，其係由數量眾多的電子元件組 裝而成，在執行運算過程中無可避免會發生升溫現象，根 據實際測試結果可知，其中又以中央處理器產生的熱能所 佔比例最高。 為避免溫度過高而影響電子元件工作效率，製造業者 必須在電子70件週遭，甚至是直接在電子元件上加裝散熱 裔，搭配風扇導引冷空氣與熱空氣進行熱交換，以期能夠 快速排散熱空氣，維持電子元件正常運作。 Φ 夂限風扇屬於附加式的散熱結構，在組裝過程中必須 額外組設，且佔用的空間一定，裝配位置受到其體積大小 所限制，導致組裝後的電子設備/儀器體積無法微型化；而 且風扇價格也會直接造成整個電子設備/儀器的生產成本提 向，有鑑於此，若能以電子設備/儀器本身的結構為基準， 開發出不必依賴風扇即能達到相同散熱效果的產品，將可 取代風扇的使用性。 【新型内容】 因此，本新型之目的，即在提供一種無須依賴風扇， M288953 - 即可湘自身結構進行散熱的電腦系統。 於是，本新型之電腦系統包含一主機板、一設於該主 機板上的中央處理器、多數個設在該主機板上並與中央處 ❹形成電性連結之電子元件、—殼體、與該殼體配合界 疋出供前述主機板、中央處理器、電子元件容納其内之空 間的背板’以及一散熱裝置。該散熱裝置具有一自背板 往主機板=向突伸的圍壁，以及一設於該中央處理器頂部 % 且包括複數間隔排列之散熱鰭片的散熱模組。該圍壁將 工間區分出一供前述電子元件容納的第一區與一供該中央 處理器擺設的第二區，且該第一、二區彼此不相連通。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 以下配合參考圖式之兩個較佳實施例的詳細說明中，將可 清楚的呈現。 參閱圖1〜2,纟新型電腦系統之一較佳實施例是兼具收 _ 銀、銷貨、進貨、記帳等管理功能的端點銷售系統（p〇s ，POINT OF SALES)。 該電腦系統包含兩個主要的部份，一為勞幕（圖中未標 示元件編號）、一為供該螢幕撐立其上的底座丨，，該螢幕主 要包括一概呈矩形的中空前殼體1〇及一與前殼體1〇相互配 合的後殼體11，一組裝於前、後殼體10與u所界定出的 容置空間（圖未示）内的液晶顯示面板模組4，一由後殼體 11背面封罩後殼體U並與後殼體u配合地界定出一容置 空間2的背板3。 M288953 該容置空間2内安裝有一平板樣主機板5,液晶顯示面 板模組4係與主機板5電性連接，主機板5上設有—與爷背 板3相向的中央處理器6(cpu)、多數接附在該主機板^ 之電子元件7(僅以標E 7作為概稱），以及一散熱裝置％ 底座1，_設有與主機5 f性連接的硬碟機、電源供應 器及周邊電路，由於底座i，内之組成或結構並非本案的: 點，因此不予贅述。 該後殼體11與背板3間可利用螺鎖手段加以定位，當 然兩者間亦可以是-體成型。該後殼體u於對應散孰^ 8處形成-長矩形穿孔lu (顯示於圖3)。該主機板 6和電子元件7形成電性連接，且均容納在該容 置至間2内。 配合參見圖3,該散熱裝置8包 ^ ^ 栝自该者板3朝往主 =二:該容置空間2之圍壁81、-沿著該穿孔 111周緣彺返離主機板5方向（盘 伸的覃妒πυ壁81的延伸方向相反）延 申：罩體82,以及一組裝於該中央處理器 組83，該圍壁81及罩# s I月文…模 及罩體82間的位置大致上下相應。 3亥圍壁81進一步將該容置空 心 第-區與一第二區22，且第_/ 4為兩個部分：- 連诵。盆由# - 一區21及22彼此不相 二第；弟一區21是供為前述所有電子元件7容設之 "弟一區22則專一地供該令 3具有多數個對應於第一區21之證—& 6擺放。该月板 則形成多數相互間隔且對應於第二區^31，該罩體82 且其頂緣與背板3頂面形成高度差Η。弟-散熱孔84， M288953 该散熱棋組μ具有多數片彼此平行同向由中央處理号 6往背板3方向延展的散熱，㈣85，所有散熱鰭片85可^ 是鋁或銅製，並更延伸出該穿孔111後突出在背板3外。★亥 罩體82係沿著所有散熱·鰭片85的外周圍輪廓而完全包^ 住散熱鰭片85。 當該電腦系統進行作業時，該主機板5、中央處理器6 和所有電子元# 7因高頻運轉而產生熱度，並造成圍繞1 間的局部區域溫度提高，其中又財央處理器6和並週遭 的溫度升高速度最快最劇烈，本新型透壁Η將整個容 置空間2區分為第-區21與第二區22,使中央處理器“ 其他電子70件7構成區隔，受中央處理器6產生高溫傳導 影響的熱线無法任意流動至電子元# 7附近，防止整個 容置空間2内的溫度同步快速上升，控制溫度僅在該第二 區22處明顯提高。 同時，爲能快速並有效地排出第二區22的熱 型除了採用直接阻隔的方式區分出中央處理器6，還配人導 熱性極佳的散熱鰭片85自中央處理器6頂部帶離執度\ 著罩體82的第二散熱孔84，與外界的冷空氣進行熱交換： 快速地降低中央處理器6產生的熱度。 本新型以區隔出第一區21和第二區22， ^的^提取^扇排除高溫的f用手段，在無需額外、裝酉己 對電力的” θ即：達致相同的降溫效應，還能免除風扇 度= 散熱裝置8的特有結構進行熱 M288953 參閱圖4為本新型電腦系統之另一較佳實施例大致類 似於前一實施例，特別之處在於本實施例中，該散熱裝置9 不具有可包覆散熱鰭片95的罩體，而是利用背板3以略高 於散熱鰭片95頂端的高度齊平地遮覆主機板5、中央處理 器6和電子元件7,因此由外觀來看，該背板3呈現出較齊 平的流暢悲樣。但该谷置空間2内仍同樣受到圍壁9丨所分 隔，故第一區21内的溫度仍不受到第二區22溫度左右。 為了達到更理想的散熱效果，該背板3在對應散熱鰭 片95頂端處（相當於第二區22處）對應地預先成形出多數個 第一散熱孔32，令第二區22與外界環境的空氣快速進行熱 交換，至於對應其他電子元件7處也可以採取相同的散熱 孔31模式，迅速排出第一區21内的熱度。 歸納上述，本新型之電腦裝置透過特殊的圍壁81、82 、91、92結構，將產熱量較高的中央處理器6與其他電子 兀件7分隔開，並配合散熱鰭片85、95經由散熱孔84、32 進行熱交換，取代習知技術依賴風扇排散熱空氣的手段， 不但減少製造成本的支出，還能在不更動原有結構組設的 前提下達到排除熱能的效果，確實達到本新型訴求之目的 〇 惟以上所述者，僅為本新型之較佳實施例而已，當不 ^以此限定本新型實施之範圍，即大凡依本新型申請專利 範圍及新型說明内容所作之簡單的等效變化與修飾，皆仍 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 M288953M288953 VIII. New Description: [New Technology Field] This new type is related to a computer system, especially a computer system that does not need to dissipate the high temperature generated by the central processing unit through a fan. [Prior Art] With the rapid development of micro-technology, many electronic devices/instruments have moved to the UHF operating mode, providing fast calculations in response to various implementations. Taking a computer system as an example, it is assembled from a large number of electronic components, and it is inevitable that temperature rise will occur during the execution of the calculation process. According to the actual test results, the heat energy generated by the central processing unit is the highest. . In order to avoid the high temperature and affect the working efficiency of electronic components, manufacturers must install heat sinks around 70 electronic components, even directly on electronic components, and use a fan to guide the cold air and hot air for heat exchange, in order to quickly discharge Cooling air to maintain the normal operation of electronic components. The Φ limit fan is an additional heat dissipation structure, which must be additionally assembled during the assembly process, and the occupied space is limited. The assembly position is limited by its size, resulting in the miniaturization of the assembled electronic device/instrument volume; The price will directly lead to the production cost of the entire electronic equipment/instrument. In view of this, if the product can be developed based on the structure of the electronic device/instrument itself, it can replace the product that can achieve the same heat dissipation effect without relying on the fan. The usability of the fan. [New content] Therefore, the purpose of the present invention is to provide a computer system that does not need to rely on a fan, M288953 - to dissipate its own structure for heat dissipation. Therefore, the computer system of the present invention comprises a motherboard, a central processing unit disposed on the motherboard, and a plurality of electronic components disposed on the motherboard and electrically connected to the central portion, the housing, and The housing cooperates with the backplane of the motherboard, the central processing unit, the electronic component to accommodate the space therein, and a heat sink. The heat dissipating device has a surrounding wall extending from the back plate to the main board = a protruding portion, and a heat dissipating module disposed on the top of the central processing unit and including a plurality of spaced fins. The enclosure distinguishes a first zone for receiving the electronic component from a second zone for the central processor, and the first and second zones are not in communication with each other. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. Referring to Figures 1 and 2, a preferred embodiment of the novel computer system is an endpoint sales system (p〇s, POINT OF SALES) that combines management functions such as receiving, selling, purchasing, and billing. The computer system comprises two main parts, one is a curtain (the component number is not shown), and the other is a base 供 for the screen to support, the screen mainly comprises a hollow front shell having a rectangular shape. 1 and a rear housing 11 that cooperates with the front housing 1 , a liquid crystal display panel module 4 assembled in an accommodation space (not shown) defined by the front and rear housings 10 and u, A backing plate 3 is defined by a rear housing 11 and a rear housing 3 defining a receiving space 2 in cooperation with the rear housing u. M288953 A slab-like motherboard 5 is mounted in the accommodating space 2, and the liquid crystal display panel module 4 is electrically connected to the motherboard 5, and the motherboard 5 is provided with a central processing unit 6 (cpu) facing the front panel 3. ), a majority of the electronic components 7 attached to the motherboard ^ (only as the standard E 7 as a general name), and a heat sink % base 1, _ with a hard disk drive and power supply connected to the host 5 f And the peripheral circuit, due to the base i, the composition or structure of the inside is not the case: point, therefore will not be described. The rear housing 11 and the back plate 3 can be positioned by means of a screw lock, and the two can also be formed in a body. The rear housing u forms a long rectangular perforation lu at the corresponding diffuser 8 (shown in Figure 3). The motherboard 6 and the electronic component 7 are electrically connected and housed in the receptacle 2 to each other. Referring to FIG. 3, the heat dissipating device 8 is packaged from the board 3 toward the main=two: the surrounding wall 81 of the accommodating space 2, and the direction of the perforation 111 is returned to the direction of the main board 5 (disc) The extension of the 覃妒πυ wall 81 is opposite to the extension direction): the cover 82, and a position assembled between the wall 81 and the cover 81 and the cover 82 Approximate up and down. The 3's surrounding wall 81 further accommodates the hollow first-region and the second region 22, and the _/4 is two parts: - flail. The basin consists of # - Zones 21 and 22 are inconsistent with each other; Brother Zone 21 is for all of the aforementioned electronic components 7 "Di division 22 is exclusively for the order 3 has a majority corresponding to the first Zone 21's certificate - & 6 placed. The moon plates are formed to be spaced apart from each other and correspond to the second region 31, and the cover 82 has a height difference 顶 from the top surface of the back plate 3. Desperate hole 84, M288953 The heat-dissipating chess set μ has a plurality of heat-dissipating fins extending in parallel with each other from the central processing number 6 toward the back-plate 3, (4) 85, and all the heat-dissipating fins 85 can be made of aluminum or copper, and are further extended. After the perforation 111 is exited, it protrudes outside the backing plate 3. The cover body 82 completely encloses the heat dissipation fins 85 along the outer peripheral contour of all the heat dissipation fins 85. When the computer system is operating, the motherboard 5, the central processing unit 6, and all of the electronic components #7 generate heat due to high frequency operation, and cause a temperature increase around a local area, wherein the central processor 6 and And the temperature rises around the fastest and most severely. The new transom channel divides the entire accommodating space 2 into the first area 21 and the second area 22, so that the central processor "70 pieces of other electronic components are separated by The hot wire that the central processor 6 generates high-temperature conduction cannot flow arbitrarily to the vicinity of the electron element #7, preventing the temperature in the entire accommodating space 2 from rising rapidly, and the control temperature is only significantly increased at the second region 22. The heat type capable of quickly and efficiently discharging the second zone 22 distinguishes the central processing unit 6 by means of direct blocking, and also has a heat-dissipating fin 85 with excellent thermal conductivity from the top of the central processing unit 6 The second heat dissipation hole 84 of the cover body 82 exchanges heat with the outside cold air: rapidly reducing the heat generated by the central processing unit 6. The present invention separates the first area 21 and the second area 22, ^Fan excludes high temperature f "There is no need to add extra power to the power" θ: to achieve the same cooling effect, but also to eliminate the fan degree = the unique structure of the heat sink 8 for heat M288953 See Figure 4 for another preferred computer system of the present invention The embodiment is substantially similar to the previous embodiment. In particular, in the embodiment, the heat sink 9 does not have a cover body that can cover the heat dissipation fins 95, but uses the back plate 3 to be slightly higher than the heat dissipation fins 95. The height of the top end flushes the main board 5, the central processing unit 6, and the electronic component 7, so that the back panel 3 exhibits a smooth and sinuous appearance. However, the valley space 2 is still equally separated by the surrounding wall 9 so that the temperature in the first zone 21 is still not affected by the temperature of the second zone 22. In order to achieve a more ideal heat dissipation effect, the back plate 3 correspondingly pre-forms a plurality of first heat dissipation holes 32 at the top end of the corresponding heat dissipation fins 95 (corresponding to the second region 22), so that the second region 22 and the external environment The air is rapidly exchanged for heat, and the same heat dissipation hole 31 mode can be adopted corresponding to the other electronic components 7, and the heat in the first zone 21 is quickly discharged. In summary, the computer device of the present invention separates the central processing unit 6 with high heat generation from other electronic components 7 through the special surrounding walls 81, 82, 91, 92, and cooperates with the heat dissipation fins 85, 95. Heat exchange through the heat dissipation holes 84, 32, instead of relying on the conventional technology to rely on the fan to dissipate the air, not only reduces the cost of manufacturing costs, but also achieves the effect of eliminating thermal energy without changing the original structure. The purpose of the present invention is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simplicity of the patent application scope and the new description content of the present invention. The equivalent changes and modifications are still within the scope of this new patent. [Simple diagram] M288953
圖 1是本新型電腦系統之一 較佳實施例的一立體組合 圖2是該較佳實施例的一 一部分的背板係被移除； 局部剖面後視圖 一底座與1 is a perspective view of a preferred embodiment of a preferred computer system. FIG. 2 is a portion of the preferred embodiment of the backplane removed; a partial cross-sectional rear view of a base and
圖3是該較佳實施例不同於圖2的 明一中央顯示器與其他電子元件_的情形 圖4是又一局部剖面圖，說明本^ 較佳實施例中，背板呈現齊平樣。 局部剖視圖，說 •，及 電腦系統的另—3 is a view of the preferred embodiment different from that of the central display and other electronic components of FIG. 2. FIG. 4 is still another partial cross-sectional view showing the back panel in a preferred embodiment. Partial section view, say •, and another part of the computer system
10 M288953 【主要元件符號說明】 10 前殼體 4 液晶顯不面板核組 11 後殼體 5 主機板 1， 底座 6 中央處理器 111 穿孔 7 電子元件 2 容置空間 8 > 9 散熱裝置 21 第一區 81 、91圍壁 22 第二區 82 罩體 3 背板 83 散熱模組 31 第一散熱孔 84 第二散熱孔 32 第二散熱孔 85 、95散熱鰭片 1110 M288953 [Main component symbol description] 10 Front case 4 LCD display panel core group 11 Rear case 5 Mother board 1, base 6 Central processing unit 111 Perforation 7 Electronic component 2 accommodating space 8 > 9 Heat sink 21 One area 81, 91 wall 22 second area 82 cover 3 back plate 83 heat dissipation module 31 first heat dissipation hole 84 second heat dissipation hole 32 second heat dissipation hole 85, 95 heat dissipation fin 11