TWM287321U - Composition structure of environmentally friendly tape (slab) - Google Patents

Composition structure of environmentally friendly tape (slab) Download PDF

Info

Publication number
TWM287321U
TWM287321U TW94217802U TW94217802U TWM287321U TW M287321 U TWM287321 U TW M287321U TW 94217802 U TW94217802 U TW 94217802U TW 94217802 U TW94217802 U TW 94217802U TW M287321 U TWM287321 U TW M287321U
Authority
TW
Taiwan
Prior art keywords
environmentally
face
friendly
substrate
adhesive tape
Prior art date
Application number
TW94217802U
Other languages
Chinese (zh)
Inventor
Shing-Tzung Lin
Original Assignee
Shing-Tzung Lin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shing-Tzung Lin filed Critical Shing-Tzung Lin
Priority to TW94217802U priority Critical patent/TWM287321U/en
Publication of TWM287321U publication Critical patent/TWM287321U/en

Links

Description

M287321 八、新型說明: 【新型所屬之技術領域】 本創作係涉及-種環保黏㈣(板)_結構,_是指-種結合環保基 材、離形紙、熱熔膠層之創新結構組成設計者。 【先前技術】 按’傳統黏膠帶之基材通常係採用塑膠材質而頗不環保,且其膠劑部份 ♦通常含有甲苯之類的具毒性揮發成份,因此使用上易對人體健康產生 不良影響;另’雖有-些黏膠帶係改採用紙材作為黏膠帶之基材,但基於 其膠劑部份具有腐純之考量,紙材表面必須得再進行淋膜形成保護層之 -後,方能進行膠劑之塗覆,然'如此顯然造成構造上的複雜化徒增作 .業之流程而存在成本增加之缺弊,並且,前述淋朗施作也容易導致紙材 構造產生無法職縮舒張現象’進㈣成师帶表柯平整之瑕疵現象, 實難符合產業之品質要求者。 • 是以’針對上述習知黏膠帶所存在之問題點,如何開發-種更具理 想實用性之創新結構’實有待相關業者再加叫力研發突破之目標及 方向。 有鑑於此,創作人本於多年從事相關產品之製造開發與設計經 驗’針對上述之目標,詳加設計與審慎評估後,終得一確具實用性之 本創作。 【新型内容】 M287321 即,本創作之主要 欲欲解種環保黏膠帶(板)組成結構,其所 欲奴解決之技術問題點,係針對習 者;其解關狀技轉私括:触加歧良突破 材料而界定出-第一面部及第:材’為具有-預定厚度之面狀 夂弟—面部;至少一離形紙,具滑 剝離面;至少一熱熔膠居 / 3係於熱溫時先塗佈於離形紙之剝離面上, 俟溫降後再轉貼合於環保基 旧主少一面部上者,精此創新獨特設 計,俾可構組成一種兼呈援彳 粟%保、構造簡單、平整度佳之環保 板)結構者。 4 本創作之另-較佳實施型態,係在於麟述熱轉層係直接塗佈 於ί衣保基材的至面部上;以使離形紙之剝離面貼合於該孰溶膠層 上而構成該環保黏膠帶(板)整體結構;惟此實施例中,該環保基材= 度係設成大於Q . i 5mm之狀態為較佳,藉此以確保能承受熱溶膠 層之熱度而不致變形者。 ' / 【實施方式】 為使貝審查委員對本創作之目的、特徵及功效能夠有更進_步之瞭解與 認識,茲請配合【圖式簡單說明】詳述如后: 首先,請配合參閱第1、2、3圖所示,係本創作環保黏膠帶(板) 組成結構之較佳實施例,該環保黏膠帶(A)(或板)係包括: 一環保基材(1 〇),為具有一預定厚度之面狀材料而界定出一第 一面部(1 1 )及第二面部(1 2 ); 6 M287321 至少-離形紙(20),具有一光滑之剝離面(2 1); 至夕熱溶膠層(3 0 ),係於熱溫時先塗佈於離形紙(2 〇 )之 剝離面(2 1 )上’俟溫度下降(但尚未完全冷卻)後再轉貼合於環 保基材(1〇)的至少一面部(1;ί)、(丄2)上者。 其中,該所述環保基材(! Q)可為:ρ ρ、ρ Ε、紙材等環保 材質者。 • 復如第4圖所示,係本創作環保黏膠帶(板)組成結構之另-較佳實施 例,其組成結構同樣係包括環保基材(丄0 Β)、祕膠層(3 0 Β)以 及離形紙(2 0 Β ),而其有別於前述實施例之處係在於該所述熱溶膠 •層(3 0 Β )係直接塗佈(包括喷覆方式)於環保基材(1 〇 Β )的至少-面部(1 1 )、( 1 2 )上;以使離形紙(2 〇 Β )之剝離面(2丄)貼合 於該熱熔膠層(3 0 B)上而構成該環保黏膠帶(板)整體結構;惟此實施 例中’該環保基材(1 0B)之厚度係設成大於〇 · 1 5mm之狀態為 春較佳,藉此以確保能承受熱熔膠層(3 Q b)之熱度而不致變形者。 【功效說明】 本創作環保黏膠帶(板)組成結構整體藉由其環保基材(1 〇 )、離形紙(2 0 )、熱熔膠層(3 0 )之創新結構組成設計;俾可利用該環保基材(1 〇 )達 到更佳環保之優點;而採用熱熔膠層(3 0 )可省略習知甲笨類揮發成份之 使用,俾可降低對於使用者健康之威脅;又藉由該熱熔膠層(3 〇 )係於熱 溫時先塗佈於離形紙(2 0)之剝離面(2 1 )上,俟溫度下降再轉 7 M287321 貼合於環祕材(i 〇 )面部上之結構組成特色,俾可省略f知琳膜 層之錢,達到構造轉、利於大量生產且平整度更佳之實用進步性,提供 消費者更加實用好用之黏膠帶產品型態者。 Ά文雜更與修改’皆應涵蓋於如下巾請專繼圍所界定之範嘴中。 综上所述,本創作係提供一種環保黏膠帶(板)組成結構,其確已達到本創 作之所有目的’另其組合結構之空間鶴未見於随產品,亦 前,已符合專利法之規定,爰依法提出申請。 m M287321 【圖式簡單說明】 第1圖:係本創作環保黏膠帶組成結構之立體圖。 第2圖:係本創作環保黏膠帶組成結構之分解剖視圖。 第3圖:係本創作環保黏膠帶組成結構之組合剖視圖。 第4圖:係本創作環保黏膠帶組成結構另一較佳實施例之剖視圖。 【主要元件符號說明】 環保黏膠帶 ( A ) 一壞保基材 ( 10) 第一面部 ( 11) 第二面部 (1 2 ) 離形紙 ( 2 0) 剝離面 (2 1 ) 熱溶膠層 ( 3 0)M287321 VIII. New description: [New technical field] This creation relates to environmentally friendly adhesive (four) (board) _ structure, _ refers to the combination of environmentally friendly substrates, release paper, hot melt adhesive layer Designer. [Prior Art] According to the 'traditional adhesive tape, the substrate is usually made of plastic material and is not environmentally friendly. The glue part ♦ usually contains toxic volatile components such as toluene, so the use of it easily has adverse effects on human health. Another 'Although some adhesive tapes are made of paper as the substrate of adhesive tape, but based on the fact that the adhesive portion has rot purity, the surface of the paper must be coated with a protective layer. It is possible to apply the glue, but it is obviously caused by the complexity of the structure. The process of the industry has the disadvantage of increasing the cost, and the above-mentioned application of the galaxies can easily lead to the inability of the paper structure. The phenomenon of shrinking and relaxing is 'into (four), the teacher is taking the form of Ke Ping, and it is difficult to meet the quality requirements of the industry. • It is based on the problem of the above-mentioned conventional adhesive tape, how to develop - an innovative structure with more practicability and practicality, and it is waiting for the relevant industry to increase the goal and direction of the breakthrough. In view of this, the creators have been engaged in the manufacturing development and design experience of related products for many years. In view of the above objectives, after detailed design and careful evaluation, they have finally achieved a practical and practical creation. [New content] M287321 That is, the main desire of this creation is to solve the composition of the environmentally-friendly adhesive tape (board), and the technical problems of the slaves to solve it are aimed at the learners; The distinguishing breakthrough material defines that the first face and the first material are a face-shaped face having a predetermined thickness; at least one release paper having a sliding peeling surface; at least one hot melt adhesive home / 3 series When it is heated at the temperature, it is first applied to the peeling surface of the release paper. After the temperature rises, it is transferred to the old one of the environmental protection base. The original design is unique and innovative, and the composition can be combined into a kind of aid. % structure, environmental protection board with simple structure and good flatness. 4 Another preferred embodiment of the present invention is that the Lintu thermal transfer layer is directly applied to the face of the ί clothing substrate; so that the release surface of the release paper is attached to the ruthenium layer. The overall structure of the environmentally-friendly adhesive tape (board) is formed; however, in this embodiment, the environmentally-friendly substrate = degree is set to be greater than Q. i 5 mm is preferable, thereby ensuring the heat resistance of the hot melt layer. Not deformed. ' / [Implementation] In order to enable the Beck Review Committee to have a better understanding and understanding of the purpose, characteristics and efficacy of this creation, please cooperate with the [Simplified Description of the Drawings] as detailed below: First, please refer to the 1, 2, and 3, which are preferred embodiments of the composition of the environmentally-friendly adhesive tape (board), the environmentally-friendly adhesive tape (A) (or board) includes: an environmentally friendly substrate (1 〇), a planar material having a predetermined thickness to define a first face (1 1 ) and a second face (1 2 ); 6 M287321 at least a release paper (20) having a smooth peeling surface (2 1) The hot sol layer (30) is applied to the release surface (2 1 ) of the release paper (2 〇) at the hot temperature, and the temperature is lowered (but not completely cooled) and then transferred to the surface. At least one face (1; ί), (丄2) of the environmentally friendly substrate (1〇). The environmentally friendly substrate (! Q) may be an environmentally friendly material such as ρ ρ, ρ Ε or paper. • As shown in Figure 4, this is another preferred embodiment of the composition of the environmentally-friendly adhesive tape (board). The composition also includes the environmentally friendly substrate (丄0 Β) and the secret layer (30 Β). And the release paper (20 Β ), which differs from the previous embodiment in that the hot sol layer (30 Β ) is directly coated (including sprayed) on an environmentally friendly substrate ( 1 〇Β ) at least on the face (1 1 ), ( 1 2 ); so that the release surface (2 丄) of the release paper (2 〇Β ) is attached to the hot melt adhesive layer (30 B) The overall structure of the environmentally-friendly adhesive tape (board) is formed; however, in this embodiment, the thickness of the environmentally-friendly substrate (10B) is set to be greater than 〇·15 mm, which is better for spring, thereby ensuring heat resistance. The heat of the melt layer (3 Q b) is not deformed. [Efficacy Description] The composition of the environmentally-friendly adhesive tape (board) is designed by the innovative structure of its environmentally friendly substrate (1 〇), release paper (20) and hot melt adhesive layer (30). The use of the environmentally-friendly substrate (1 〇) achieves the advantages of better environmental protection; and the use of the hot-melt adhesive layer (30) can omit the use of the conventional volatile components, which can reduce the threat to the user's health; When the hot melt adhesive layer (3 〇) is applied to the peeling surface (2 1 ) of the release paper (20) at the hot temperature, the temperature of the crucible is lowered and then transferred to 7 M287321 to be attached to the ring material (i 〇) The structure of the face is characterized by the fact that it can omit the money of the f-lin film layer, achieve the practical progress of structural transformation, mass production and better flatness, and provide consumers with more practical and useful adhesive tape products. . The essays and modifications should be covered in the following paragraphs. In summary, the creation department provides an environmentally-friendly adhesive tape (board) structure, which has indeed achieved all the purposes of this creation. 'The space of the other combination structure is not seen in the product, and it has already met the requirements of the Patent Law. , 提出 apply in accordance with the law. m M287321 [Simple description of the diagram] Fig. 1 is a perspective view of the composition of the environmentally friendly adhesive tape. Figure 2: An anatomical view of the composition of the environmentally friendly adhesive tape. Figure 3: A sectional view of the composition of the environmentally friendly adhesive tape. Fig. 4 is a cross-sectional view showing another preferred embodiment of the composition of the environmentally-friendly adhesive tape of the present invention. [Main component symbol description] Environmentally friendly adhesive tape (A) A bad protective substrate (10) First face (11) Second face (1 2) Release paper (20) Release surface (2 1) Hot melt layer ( 3 0)

99

Claims (1)

M287321 九、申請專利範圍: • 1、一種環保黏膠帶(板)組成結構,包括: -核保基材,為具有—财厚度之面狀材料而界 及第二面部; 33第-面部 至少一離形紙,具有一光滑之剝離面; 至少-熱轉層’係於熱溫時先塗佈於離形紙之剝離面上 • %後再轉貼合於環保基材的至少—㈣上者。 、溫 2依❹料鄕圍第μ所述之環縣料(板)城結構,其 環保基材可為:Ρ ρ、ρ Ε、紙材者。 • 3、一種環保黏膠帶(板)組成結構,包括: 王衣保基材,為具有一預定厚度之面狀材料而界定出一第—面咅 及第二面部; Ρ 至少一熱熔膠層,係塗佈於環保基材的至少一面部上; 至少一離形紙,具有一光滑之剝離面,藉其剝離面以貼合於熱熔 膠層上者。 4、依據申請專利範圍第3項所述之環保黏膠帶(板)組成結構,其中該 環保基材可為:Ρ Ρ、Ρ Ε、紙材者。 、5、依據申請專利範圍第3項所述之環保黏膠帶(板)組成結構,其中該 環保基材之厚度係大於〇 · 1 5 mm為較佳者。M287321 Nine, the scope of application for patents: • 1, an environmentally friendly adhesive tape (board) composition, including: - nuclear protection substrate, for the face material with a thick thickness and the second face; 33 first - face at least one The release paper has a smooth peeling surface; at least the heat transfer layer is applied to the release surface of the release paper at the temperature of the heat, and then is applied to at least the above-mentioned (4) of the environmentally friendly substrate. , Wen 2 depends on the material of the ring material (plate) city structure described in the second, the environmental protection substrate can be: ρ ρ, ρ Ε, paper. • 3. An environmentally-friendly adhesive tape (board) composition comprising: a Wang Yibao substrate defining a first face and a second face for a planar material having a predetermined thickness; Ρ at least one hot melt adhesive layer Applying to at least one face of the environmentally-friendly substrate; at least one release paper having a smooth release surface, by which the release surface is attached to the hot melt adhesive layer. 4. The environmentally-friendly adhesive tape (board) structure according to item 3 of the patent application scope, wherein the environmental protection substrate can be: Ρ Ρ, Ρ Ε, paper material. 5. The composition of the environmentally-friendly adhesive tape (board) according to item 3 of the patent application scope, wherein the thickness of the environmentally-friendly substrate is greater than 〇 · 15 mm.
TW94217802U 2005-10-14 2005-10-14 Composition structure of environmentally friendly tape (slab) TWM287321U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94217802U TWM287321U (en) 2005-10-14 2005-10-14 Composition structure of environmentally friendly tape (slab)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94217802U TWM287321U (en) 2005-10-14 2005-10-14 Composition structure of environmentally friendly tape (slab)

Publications (1)

Publication Number Publication Date
TWM287321U true TWM287321U (en) 2006-02-11

Family

ID=37429832

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94217802U TWM287321U (en) 2005-10-14 2005-10-14 Composition structure of environmentally friendly tape (slab)

Country Status (1)

Country Link
TW (1) TWM287321U (en)

Similar Documents

Publication Publication Date Title
TW201016482A (en) Transfer film, method of manufacturing the same, transfer method and object surface structure
JP2010505466A5 (en)
JP2006518883A5 (en)
JP2009542473A5 (en)
WO2005063464A3 (en) Process of microstructuring of a surface of a multi-layered flexible substrate, and microstructured substrate
TWI322767B (en) Thermal transfer film, method of manufacturing the same and thermal transfer method
TWM334978U (en) Film tag
TWM287321U (en) Composition structure of environmentally friendly tape (slab)
TW495440B (en) Secure ID badge construction utilizing inkjet printing
JP2000206809A5 (en)
KR200430413Y1 (en) Transcription sheet for printing
JP3184642U (en) Pressed flower seal and chopsticks wrapped with a pressed flower seal
TWI313645B (en)
KR20120116112A (en) Card using precious metal and method of manufacturing the same
CN207310891U (en) A kind of gold stamping transfer membranes of PET
JP3826644B2 (en) Method for producing paper laminate having metallic luster
TWM279513U (en) Improved structure for pressure sensitive trans-printing sticker
TW407450B (en) Method for manufacturing three dimensional circuit board
KR200272791Y1 (en) Transcription which has a portion hologram
TWI341797B (en)
RU2468924C2 (en) Method to apply image onto surface
TWI294798B (en) Method of manufacturing precious metal card for plaques and article made using the method
TWM411346U (en) Transfer printing film
TWM362766U (en) Structure of three-dimensional gilding sticker
TWM272671U (en) Trans-printing roller structure for thin film trans-printing tool

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees