M286551 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種電子產品 計，尤指-種用應用於筆記型電腦主主構設 構。 王铖之溢膠空間預留結 【先前技術】 諸如電腦之電子產品可執行繁雜程式的渾笞 並:資Γ理歸納成為資訊:提“用 者Τ以有麟的知各項事務之判斷及處理之使用 遍及各個年齡層之使用者，其中 V, ^ ^ . 丨思考逼子產品日益小型 主匕與可攜化之發展趨勢，尤以筆記型電腦之發展最受關 注。而面對目前專業分工的高度競爭時代1論在=關 製造、或是組裝上，都必須朝向輕 3, 别m潯紐小以及降低成本之 目“不斷地創新研究，以期提昇市場競爭力。因此， 有助於節省空間綺低製造成本等實質之功效增進，ς何 的改良對於業者而言均為具有產業利用價值之創作。 ”以例如筆記型電腦之電子產品來說，如第1圖所示， 白用筆g型電腦之主機結構係包括相互對應組接之框架2 及殼體4 ’且該框架2與殼體4間並安裝一模組化之主機 板(未圖示）。該主機板通常額外整合設置例如硬碟機、光 碟機、電池、數據機、網路卡等電子零組件，而該殼體4 則通常包括預設有鍵盤開π與游標觸控板開口以分別供裝 叹鍵盤與游標觸控板之上殼41以及於與該上殼41組裝後 形成一容置空間以容納所需之元件及裝置之下殼43 ^ 18445 M286551 智用筆記型電腦主機結構之設計中，為了運用複數個 "例如螺絲、鋼釘之螺接元件6鎖固該框架2及該殼體4， 必須於該框架2及該殼體4佈設複數個對應位置之穿孔21 與鎖孔431，通常係於該殼體4之下殼43佈設鎖孔431， 於該框架2則佈設對應之穿孔21。該螺接元件6之佈設位 置，通常係涵蓋該殼體4之部分區域以及大致位於鍵盤開 .口與游標觸控板開口附近之中央區域。組裝成主機結構之 •方式’通常係藉由該螺接元件6由該下殼43向上穿過該鎖 孔431、主機板並鎖固至該框架2以及該框架2向上鎖固 至該上殼41，進而使該殼體4與該框架2緊密地結合，並 ^確保該殼體4之表面平整度，以避免因該殼體4之局部 突起而導致磨損例如液晶顯示器之面板8。 如第2A圖所示，該鎖孔431 一般係於成型時先預留 之冰度較淺之圓孔狀開口，通常爲防止溢膠，需在該鎖孔 43:下預留至少〇.2毫米之溢膠空間。接著如第2b圖所示 _以該螺接元件6熱熔該下殼43形成螺孔（即，鎖孔 供鎖固該螺接元件6。 、 ） 、而由於機構δ又计上之考量，並無法確實預留〇 2 毫米以上之溢膠空間。因此，熱熔該下殼43時會產生埶熔 膠堆積於該鎖孔431底部，造成該螺接元件6進入時與該 下奴43產生干涉現象。爲了避免此種干涉現象，如將該鎖 孔431朝該框架2之方向延伸高度來預留溢膠空間，則勢 必增加主機結構之整體厚度，否則該等佈設於中央區域之 螺接7L件6必然造成主機板上之電路佈局必須因應位於該 6 18445 M286551 ，螺接元件6之佈設位置而進行閃躲設計，以致於增加主機 '板電路佈局設計之困難與複雜度。如此一來，不僅降低主 機板電路佈局設計之自由度，也通常造成主機板的尺寸相 對增大，同樣亦致使主機結構之體積也難以縮小。 再者，將該鎖孔431朝遠離該框架2之方向延伸高产 來預留溢膠空間固不致增加主機結構内部所需之厚度同= 可降低對降低主機板電路佈局設計之干擾。然而=於气 螺接元件6之佈設位置並非平均分配於各個區域，當該= 孔431突出於該下殼43外表面之高度越高，整個主機 =平穩支撐性便舰。如此—來，為了保持主機結構之於 :面上的平穩支撐性’便須於成形該下殼43外表面時增設 :個支撐部以維持平衡，而造成成形結構複雜且所費不曰 ^，且所需之支撐部的數量越多，也造成成型模具單 同與所需塑料增加之問題，相對增加製造成本。 、乂 因此，如何開發一種得以解決上述習知技術各種 的電子產品之溢膠空間預留結構，藉以節省電子產。之二 部空間、節省材料、以及降低 ： 決的課題。 ^ μ為目則亟欲解 【新型内容】 雲於以上所述習知技術之缺點，本創 供一種可節省空間之泰工 目的係提 Μ門之电子產品之溢膠空間預留結構。 本創作之另-目的係提供一種可節省材料成本之恭 子產品之溢膠空間預留結構。。 包 本創作之又-目的係提供—種可降低製造成本之電 18445 7 M286551M286551 VIII. New Description: [New Technology Field] This creation is about an electronic product, especially the application of the main structure of a notebook computer. Wang Yuzhi's overflow space reservation [previous technology] Electronic products such as computers can be used to execute complicated programs: Γ Γ 成为 成为 成为 成为 成为 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : 用Using users of all ages, among them, V, ^ ^ . 丨 Thinking about the growing trend of small-scale products and portability of the product, especially the development of notebook computers. In the face of the current professional division of labor In the era of high competition, in the production, or assembly, it must be toward the light 3, do not want to small and small and reduce the cost of the goal of "continuous innovation research, in order to enhance market competitiveness. Therefore, it contributes to the saving of space and the improvement of the actual cost of manufacturing, and the improvement of any improvement is an creation of industrial use value for the industry. For example, in the electronic product of the notebook computer, as shown in FIG. 1 , the main structure of the white pen g type computer includes the frame 2 and the housing 4 ′ which are respectively associated with each other and the frame 2 and the housing 4 And install a modular motherboard (not shown). The motherboard usually integrates electronic components such as a hard disk drive, a CD player, a battery, a data machine, and a network card, and the housing 4 Generally, a keyboard opening π and a cursor touch panel opening are provided for respectively mounting the sing keyboard and the cursor touch panel upper shell 41 and assembling the upper shell 41 to form an accommodating space for accommodating the required components and Under the device 43 ^ 18445 M286551 in the design of the intelligent notebook mainframe structure, in order to use a plurality of "such as screws, steel screwing elements 6 to lock the frame 2 and the housing 4, must be in the frame 2, the housing 4 is provided with a plurality of corresponding positions of the through hole 21 and the locking hole 431, usually the lower cover 43 of the housing 4 is provided with a locking hole 431, and the frame 2 is provided with a corresponding through hole 21. The screwing element The location of the 6 is usually covered in part of the housing 4 and It is located substantially in the central area near the opening of the keyboard opening and the touchpad of the cursor. The manner of assembling into the main structure is generally passed through the locking hole 431 and the motherboard through the lower casing 43 by the screwing member 6. Locked to the frame 2 and the frame 2 is locked upward to the upper casing 41, thereby tightly coupling the casing 4 with the frame 2, and ensuring the surface flatness of the casing 4 to avoid the shell The partial protrusion of the body 4 causes wear such as the panel 8 of the liquid crystal display. As shown in FIG. 2A, the keyhole 431 is generally a shallow hole-shaped opening which is reserved for shallowness during molding, and is generally used to prevent overflow. It is necessary to reserve at least 〇2 mm of the overflow space under the keyhole 43. Then, as shown in FIG. 2b, the lower case 43 is thermally fused by the screwing member 6 to form a screw hole (ie, the keyhole is provided for The screwing element 6 is locked, and the mechanism δ is taken into consideration, and the overflow space of 〇2 mm or more cannot be reserved. Therefore, when the lower case 43 is thermally fused, 埶 melted rubber is accumulated. At the bottom of the keyhole 431, the screw element 6 is caused to interfere with the lower slave 43 when entering. In order to avoid such interference phenomenon, if the locking hole 431 is extended in the direction of the frame 2 to reserve the overflow space, the overall thickness of the main structure is necessarily increased, otherwise the screwed 7L piece 6 disposed in the central area is required. It is inevitable that the circuit layout on the motherboard must be designed to be dodged in response to the layout position of the screw connector 6 of the 6 18445 M286551, so as to increase the difficulty and complexity of the host circuit layout design. The degree of freedom in the design of the board circuit layout also generally causes the size of the motherboard to be relatively increased, which also makes it difficult to reduce the size of the mainframe structure. Furthermore, the lock hole 431 is extended in a direction away from the frame 2 to be reserved. The overflow space does not increase the thickness required inside the host structure. It can reduce the interference on the circuit layout design of the motherboard. However, the arrangement position of the gas screwing member 6 is not evenly distributed to the respective regions, and the height of the hole 431 protruding from the outer surface of the lower casing 43 is higher, and the entire main body = smooth supportive liner. In this way, in order to maintain the smooth support of the main structure on the surface, it is necessary to add a support portion to maintain the balance when forming the outer surface of the lower casing 43, which causes the forming structure to be complicated and costly. Moreover, the more the number of support portions required, the problem that the molding die alone and the required plastic increase, and the manufacturing cost is relatively increased.乂 Therefore, how to develop an overflow space reservation structure for solving various electronic products of the above-mentioned conventional technologies, thereby saving electronic products. The second space, material saving, and reduction: the problem. ^ μ 为 为 为 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 The other purpose of this creation is to provide a spill space reservation structure for Kyoko products that can save material costs. . The purpose of this creation is to provide electricity that reduces manufacturing costs. 18445 7 M286551
子產品之溢膠空間預留結構，俾提昇主機板電路 之自由度。 °T 為達上揭目的以及其他目的，本創作提供—種 品之溢膠空間預留結構，該溢谬空間預留結構係設= 產品之殼體以預留空間供溢膠之用，且 ” 玄巴括一結合部 以及-溢膠凹部。該結合部係供螺接元件以結合該 子產品之殼體。該溢膠凹部則係設於該結合部内緣，二二 結合該螺接元件時所產生之熱轉對堆積於此， ς 螺接元件與該殼體產生干涉現象。 〜 較佳地，該結合部係為-鎖孔，並且例如為一圓 開口。於-個實施態樣中’該結合部係延伸自該殼體 面之結構’且該結合部可為—例如突出於該殼體外表面: 結構。於另-個實施態樣中，該結合部亦可選擇為 於該殼體外表面之結構。該溢膠凹部則可為選自包括2 階狀半圓凹部、錐狀凹部、矩形、一字形、十字妒 則幾何形、或其他適當形狀之凹陷結構之其中一者复不規 該溢膠凹部之凹陷深度較佳係大於〇 八中’ 於此。 ζ毛未’但並非侷限 前述本創作所提出之電子產品之溢膠空間預留結 構，係利用凹設溢膠凹部於殼體中供結合螺接元件^士入 部，爲日趨薄化甚至超薄化之電子產品的内部 ϋ 防止溢膠所需預留之溢膠空間，且該結合部復可較習知二 術為短，而該預留之溢膠空間又不會佔 白σ Α甩丁座口口之肉邱 工間。如此’便可避免干涉之同時達到節省空間之效果。。 18445 8 M286551 同蚪’相較於習知技術而言，應 ， 殼體之材料、妒左- λ丄人 J J即名成形 鈿紐、、O a部與螺接元件之長， SLt:::主機板電路佈局設計之困難與複雜度、： 度：可縮小主機板的尺 習知技術^ + 應用本創作可克服 【實施二諸多缺點，相對可提昇產業利用價值。 ►以下係藉由特定的具體實施例說明本創作之電子產 品之溢膠空間預留結構實施方式，熟習此技藝之人士可由 Γ1 書：揭示之内容輕易地瞭解本創作之其他優點與功 藉由其他不同的具體實施例加以施行或應 用本說明書中的各項細節亦可基於不同觀點與應用，在 不悖離本創作之精神下進行各種修飾與變更。 、以下之實施例係進一步詳細說明本創作之觀點，但並 非以任何觀點限制本創作之範疇。 應注思的’本創作之雷早吝σ夕# _ ‘ 少 钔卞I电于屋〇口之祕膠空間預留結構 係設於電子產品之殼體以預留空間供溢膠之用，以下之實 施例係採可應用在電子產品（例如筆記型電腦）中的殼體只 (例如下殼）為例而說明，但並非以此為限者，由^習知 之筆記型電腦以及其殼體等俱可為適用對象，其結構並未 改變，故為簡化起見，並使本創作之特徵及結構^為清晰 易懂，乃於圖式中僅顯示出與本創作直接關聯之結構Υ其 餘部份則予以略除。 差一實施例 18445 9 M286551 第3及第4圖為依照本創作之電子產品之溢膠空間預 留結構的第一實施例所繪製之圖式。如第3圖所示，本創 作提供一種電子產品之溢膠空間預留結構1，該溢膠空間 預留結構1係設於該電子產品之殼體（例如下殼並 且係包括一結合部11(例如鎖孔）以及一設於該結合部^ 内緣之溢膠凹部13。 該結合部11係供結合螺接元件6,以組裝該電子產口 •之殼體，於本實施例中，該結合部丨1係為一圓孔%狀開Γ， 且該結合部11突出於該下殼43,外表面以及内表面之高度 係與習知技術之高度相同，而不致影響電子產品之於 的平穩支撐性。雖本實施例中之結合部丨丨係以延伸自該下 殼43,外表面之圓孔狀開口為例說明，惟應了解的是，°舉 =形成於該下殼43,外表面且可供該螺接元件6，鎖入之構 ^ ’均可提供同樣之固定結合效果，亦可使該結合部^ =於該下殼43,内表面之高度係較習知技術之高度為低， :令該結合部11為一平行於該下殼43,外表面而形成之直 =形狀的開口’而不以突出於該下殼43，外表面之圓孔狀 二形式為限，且此皆屬於所屬技術領域中具有通常知識 考易於思及之變化。 々皿膠凹。卩13則可為—對該結合部丨1進行鑽孔所形 階狀半圓凹部。應注意的是，該輯凹部13之設置 13=鑽孔為限，亦可於成型殼體之同時形成該溢膠凹部 之即=鑽孔所需之時間，或者也可採其他等效方式設置 1偈限於本實施例中所述者。同時，為使該溢膠凹 18445 10 M286551 4 13提供較佳之溢膠空間，該溢膠凹部13之凹陷深度較 么可為大於〇· 2毫米者，但亦非以此限。 如第4圖所示，當將該螺接元件6(例如螺絲、銅釘） 以習知之方式鎖入該結合部丨丨後，所產生之熱熔膠係堆積 於该結合部11内緣之溢膠凹部13。如此一來，便可避免 4知技術中造成該螺接元件6,進入時與該該下殼產生 干涉現象之問題。 φ 同時’由於該結合部11突出於該下殼43,表面之高度 係與習知技術之高度相同、甚至可稍低於習知技術之高度 而平行於該下殼43,外表面或使該結合部n之於該下殼 43内表面之尚度係較習知技術之高度為低，俾縮短該結合 部11之高度，且進而節省主機結構之内部空間。藉此，便 可解决主機結構之整體厚度增加以及主機板電路佈局設計 之困難與複雜度增加所造成之主機結構之體積難以縮小、 主機板尺寸增大以及主機板電路佈局設計之自由度降低等 φ 缺失。 此外’應用本創作無須如習知技術為了保持主機結構 之於平面上的平穩支撐性而增設多個支撐部以維持平衡， 相對可克服習知技術於平穩支撐性差、成形結構複雜以及 所費不貲等缺點’且可於成形殼料同步形成本創作之溢 膠空間預留結構以減少塑料，更可因縮短該結合部U之高 度而縮短該螺接元件6,之長度。因此，本創作之電子產品 之謂空間預留結構相較於習知技術可節省材料，並進而 降低製造成本。 18445 11 M286551 由此可知，應用本創作之電子產品之溢膠空間預留紝 構，已可利於解決習知技術之種種缺失，並兼具前述之多。 種實質功效增進與高度產業利用價值無虞。 夕 第二實施例 第5圖為依照本創作之電子產品之溢膠空間預留結 的第二實施例料製之圖^。其中，與第—實施例相 近似之70件係以相同或近似之元件符號表示，並省略詳細 之敘述，以使本案之說明更清楚易懂。 、田 第二實施例與第一實施例最大不同之處在於第一實 施例之溢膠凹部1 3係呈一階壯主 、 ,丄〇诉王1白狀丰固凹部，第二實施例則你 設置呈錐狀凹部之溢职ω邮彳q， ’、 ^ 胗凹邛13，而使殼體之成形結構更 如第5圖所示，本實施例之溢朦凹部13，係自該結合 内緣凹陷之錐狀結構，且其凹陷深度可大於等於第— 實施例之溢膠凹部13。當將該螺接元件鎖人該結合部u 後仍可7所產生之熱炫夥堆積於該溢膠凹部U，，以 ==進:時與該殼體產生干涉現象，且藉由簡化殼 肢成开"。構，更可解決習知技術之支成型模具單價較高食 所需;料增:之問題，相對降低製造成本。 ，、 田然，刖述貫施例中之溢膠凹部13、13,係設置呈一The sub-product's overflow space reserved structure, which increases the degree of freedom of the motherboard circuit. °T In order to achieve the purpose of the purpose and other purposes, the creation provides a spill-proof space reserved structure of the product, the reserved space of the overflow space is set = the shell of the product is reserved for the overflow of glue, and The sinus includes a joint and an overflow rubber recess. The joint is for a screwing member to join the shell of the sub-product. The overflow recess is attached to the inner edge of the joint, and the screw joint is combined with the screw member. When the heat transfer pair generated is accumulated, the 螺 screwing element interferes with the housing. 〜 Preferably, the joint is a keyhole, and is, for example, a circular opening. In one embodiment The joint portion extends from the structure of the casing surface and the joint portion may be, for example, protruded from the outer surface of the casing: a structure. In another embodiment, the joint portion may also be selected outside the casing. The structure of the surface may be a recessed structure selected from the group consisting of a 2 stepped semicircular recess, a tapered recess, a rectangle, an inline, a crossbow geometry, or other suitable shape. The depth of the depression of the overflow rubber recess is preferably greater than that of the concrete In the 'this. The hair is not' but is not limited to the above-mentioned creation of the electronic product, the overflow space reserved structure of the electronic product, the use of recessed overflow plastic recess in the housing for the combination of screw components into the department, for the increasingly The internal ϋ of the thinned or even ultra-thinned electronic product prevents the overflow space required for the overflow of the glue, and the joint can be shorter than the conventional two, and the reserved overflow space does not occupy White σ Α甩 之 口 邱 邱 邱 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18妒 left- λ丄人JJ is the name of the forming 钿 button, O a part and the length of the screwing element, SLt::: The difficulty and complexity of the circuit board layout design: Degree: can reduce the size of the motherboard Knowing the technology ^ + Applying this creation can overcome [the implementation of two many shortcomings, which can enhance the industrial utilization value. ► The following is a specific embodiment to illustrate the implementation of the electronic product spillover space reservation structure of this creation, familiar with this Skilled person can be Γ1 book: reveal The contents of the present disclosure are easily understood by the other specific embodiments. The details of the present specification can also be applied based on different viewpoints and applications, without departing from the spirit of the present invention. Various modifications and changes. The following examples further illustrate the concept of this creation, but do not limit the scope of this creation by any point of view. The thought of this creation's thunder 吝 吝 夕 # _ _ ' 钔卞 钔卞 I The secret space structure of the electric appliance in the eaves is set in the housing of the electronic product to reserve space for overflowing. The following embodiments adopt a shell that can be applied in an electronic product such as a notebook computer. The body only (for example, the lower case) is described as an example, but it is not limited thereto. The notebook computer and the casing thereof can be applied to the object, and the structure thereof is not changed, so for the sake of simplicity, And make the features and structure of this creation clear and easy to understand, but only the structure directly related to the creation is shown in the drawing, and the rest is omitted. Poor Embodiment 18445 9 M286551 Figures 3 and 4 are diagrams drawn in accordance with a first embodiment of the overflow space pre-reservation structure of the electronic product of the present invention. As shown in FIG. 3, the present invention provides an overflow space reservation structure 1 for an electronic product, which is disposed in a casing of the electronic product (for example, a lower casing and includes a joint portion 11). (e.g., a keyhole) and an overflow recess 13 provided on the inner edge of the joint portion. The joint portion 11 is for engaging the screw member 6 to assemble the housing of the electronic product port. In this embodiment, The joint portion 系1 is a circular hole-shaped opening, and the joint portion 11 protrudes from the lower shell 43, and the heights of the outer surface and the inner surface are the same as those of the prior art, without affecting the electronic product. Although the joint portion of the present embodiment is exemplified by a circular hole-shaped opening extending from the outer surface of the lower shell 43, it should be understood that the lift is formed on the lower shell 43, The outer surface can be provided with the screwing member 6, and the locking structure can provide the same fixed bonding effect, and the bonding portion can also be used for the lower surface of the lower casing 43, and the height of the inner surface is higher than that of the prior art. The height is low, so that the joint portion 11 is a straight shape formed parallel to the outer surface of the lower shell 43 The mouth 'is not limited to the circular hole-shaped form of the outer shell 43 and the outer surface, and all of them belong to the prior art which has a common knowledge and can be easily changed. For the joint portion 丨1, the stepped semicircular recess is drilled. It should be noted that the setting of the recess 13 is limited to the drilling, and the recess of the overflow can be formed simultaneously with the molding of the housing. That is, the time required for the drilling, or other equivalent manners, may be limited to those described in the embodiment. Meanwhile, in order to provide the overflowing recess 18445 10 M286551 4 13 with a better overflow space, The recessed depth of the overflow rubber recess 13 may be greater than 〇·2 mm, but it is not limited thereto. As shown in Fig. 4, when the screwing element 6 (for example, a screw or a copper nail) is in a conventional manner After the binding portion is locked, the generated hot melt adhesive is deposited on the adhesive recess 13 of the inner edge of the joint portion 11. Thus, the screwing member 6 can be prevented from being entered in the prior art. a problem of interference with the lower shell. φ simultaneous 'because the joint 11 protrudes below 43, the height of the surface is the same as the height of the prior art, even slightly lower than the height of the prior art, parallel to the lower shell 43, the outer surface or the joint n to the inner surface of the lower shell 43 The degree of the system is lower than that of the prior art, and the height of the joint portion 11 is shortened, and the internal space of the host structure is saved, thereby thereby solving the difficulty of increasing the overall thickness of the host structure and the circuit layout design of the motherboard. The complexity of the host structure is difficult to shrink, the size of the motherboard is increased, and the freedom of the motherboard circuit layout design is reduced. φ is missing. In addition, the application of this creation does not need to be as in the prior art in order to keep the host structure on the plane. The smooth support and the addition of a plurality of support portions to maintain the balance can overcome the shortcomings of the conventional technology, such as poor smooth support, complicated forming structure and costly, and can simultaneously form the overflow space of the creation of the molded shell material. The structure is left to reduce the plastic, and the length of the screwing member 6 can be shortened by shortening the height of the joint U. Therefore, the space reserved structure of the electronic product of the present invention can save material and further reduce the manufacturing cost compared with the prior art. 18445 11 M286551 It can be seen from this that the application of the electronic product spillover space reserved structure of the present invention has been able to solve the various shortcomings of the prior art, and has many of the foregoing. The increase in substantive efficacy and the high value of industrial use are innocent. EVE EMBODIMENT EMBODIMENT Fig. 5 is a view showing a second embodiment of the overflowing space of the electronic product according to the present invention. In the above, the same reference numerals are given to the same or similar components, and the detailed description is omitted to make the description of the present invention clearer and easier to understand. The second embodiment differs greatly from the first embodiment in that the overflow rubber recessed portion 13 of the first embodiment is a first-order strong main body, and the vaulting king 1 white-shaped rich concave portion, and the second embodiment is You set the overflow ω post q, ', ^ 胗 邛 13 in the shape of a conical recess, and the forming structure of the housing is more as shown in Fig. 5. The overflow recess 13 of this embodiment is from the combination. The inner edge is recessed in a tapered structure, and the depth of the recess may be greater than or equal to the overflow recess 13 of the first embodiment. When the screwing member is locked by the joint portion u, the heat ray that can be generated by the stacking portion 7 is accumulated in the overflow recess U, and the interference occurs with the housing when ==: and the shell is simplified. Open the limbs ". The structure can solve the problem that the conventional molding die has a higher unit price and higher food consumption; the problem of material increase: relatively lower the manufacturing cost. , Tian Ran, 刖 贯 贯 施 施 施 施 施 施 施 施 施 13 13 13 13 13 13 13 13 13
St部或錐狀凹部，，應注意的是，只要可供堆 積熱料之溢膠預留空間者皆適用於本創作；換言之，该 4凹:13、13，之凹陷結構可為矩形、—字形、十字形、 不見則幾何$或其他適當形狀者，而且屬於所屬技術領域 18445 12 M286551 常知識者可加以彈性m，業者可依實際需 求應料創作之設計。同時，雖前述實施例中係將本創作 之轉空間預留結構以形成於下殼為例作㈣者，但應了 :二作並非侷限於此，而係適用於電子產品中之殼體的 八他需要預留熱熔膠堆積以避免干涉現象之部分。 ，上所述，本創作提供如筆記型電腦之電子蓋品中的 双體適當之溢膠空間預留結構，可於電子產品日趨薄型化 之際’達到節賓結構空間以及節省材料之效果，符合追求 =專短小以及降低成本之目標。&，本創作可解決習知技 失’且本創作實具設計彈性，並可有效提昇產 以上所述之具體實施例，僅係用以例釋本創作之特點 及功效’而非用以限定本創作之可實施㈣，在未脫 ^作上揭之精神與技術範噚下，任何運用本創作所揭示内 等效改變及修飾’均仍應為下述之申請專利範 【圖式簡單說明】 第1圖係顯示習知筆記型電腦主機結構之分解圖； f 2Α圖係顯示習知筆記型電腦之鎖孔的放大示意圖 第2Β圖係顯示習知筆記型電腦之鎖孔鎖入螺接^ 之示意圖； 預留結構 入螺接元 第3圖係顯示本創作之電子產品之溢膠空間 的第一實施例之構造示意圖； 第4圖係顯示本創作之溢膠空間預留結構鎖 18445 13 M286551 件之示意圖；以及 第5圖係顯示本創作之電子產品之溢膠空間預留結構 的第二實施例之構造示意圖。 【主要元件符號說明】 1 溢膠空間預留結構 11 結合部 13、13’溢膠凹部 2 框架 21 穿孔 4 殼體 41 上殼 43、43’下殼 431 鎖孔 6、6’ 螺接元件 8 面板 14 18445St part or tapered recess, it should be noted that as long as the space for the overflow of the hot material can be applied to the creation; in other words, the 4 concave: 13, 13, the concave structure can be rectangular, - Glyphs, crosses, invisible geometry or other suitable shapes, and belong to the technical field of 18445 12 M286551 can be flexibly m, the industry can create the design according to actual needs. Meanwhile, in the foregoing embodiment, the space for reserving the space of the creation is formed in the lower case as an example (4), but it should be noted that the second method is not limited thereto, but is applicable to the casing of the electronic product. Eight he needs to reserve hot melt adhesive to avoid interference. As described above, the present invention provides a double-body suitable overflow space reserved structure in the electronic cover of a notebook computer, which can achieve the effect of the guest structure space and material saving when the electronic product becomes thinner and thinner. In line with the pursuit = short-term and cost reduction goals. & This creation can solve the problem of knowing the skill and the design is flexible, and can effectively enhance the specific examples described above. It is only used to explain the characteristics and functions of the creation' instead of Limitation of the implementation of this creation (4), under the spirit and technical norms of the uncovering, any equivalent change and modification revealed by the use of this creation should still be the following patent application form [Simple diagram Explanation: Figure 1 shows an exploded view of the structure of a conventional notebook computer; f 2Α shows an enlarged view of the lock hole of a conventional notebook computer. Figure 2 shows a lock hole of a conventional notebook computer. FIG. 3 is a schematic view showing a first embodiment of the overflow space of the electronic product of the present invention; FIG. 4 is a schematic view showing the structure of the overflow space reserved for the creation of the present invention; 18445 13 is a schematic diagram of a second embodiment of the M286551 device; and FIG. 5 is a schematic view showing a second embodiment of the overflow space reserved structure of the electronic product of the present invention. [Main component symbol description] 1 Overflow space reserved structure 11 Bonding portion 13, 13' overflow rubber recess 2 Frame 21 Perforation 4 Housing 41 Upper shell 43, 43' Lower shell 431 Locking holes 6, 6' Screwing element 8 Panel 14 18445