TWI390564B - Keyboard and notebook computer using the same - Google Patents

Description

Keyboard and notebook computer

The present invention relates to a keyboard and a notebook computer using the same, and more particularly to a keyboard assembled by a hot melt method and a notebook computer using the same.

The notebook computer has the advantages of "light, thin, short, and small", which makes the notebook computer gradually replace the desktop computer and become the mainstream in the market. In order to meet the requirements of thinness and lightness, many components of the notebook computer must be thinned.

Taking the keyboard as an example, the keyboard includes several layers of thin layer structure. These thin layers are stacked one on another in layers to keep the keyboard thin and light.

One traditional way of assembling is to use screws and nuts to lock these thin layers. However, this method must use a large number of screws and nuts, which is quite expensive. And the screws and nuts still have a certain thickness, which cannot reduce the thickness of the keyboard.

The invention relates to a keyboard and a notebook computer using the same, which utilizes the design of a heat-melting column and a hot-melt hole, so that the keyboard and the notebook computer can be kept thin and light without excessive material.

According to an aspect of the invention, a keyboard is proposed. The keyboard includes a plastic frame and a metal back plate. The plastic frame consists of several plastic hooks and several hot-melt columns. The metal backing plate has several hot melt holes. The metal back plate includes several metal hooks. The hot melt columns after the hot melt are engaged with the corresponding hot melt holes to engage the plastic frame and the metal back plate. The heat-melting columns and the hot-melt holes are adjacent to the plastic hooks and the metal hooks.

According to another aspect of the present invention, a notebook computer is proposed. The notebook computer includes a casing and a keyboard. The keyboard is placed on the case. The keyboard includes a plastic frame and a metal back plate. The plastic frame consists of several plastic hooks and several hot-melt columns. The metal backing plate has several hot melt holes. The metal back plate includes several metal hooks. The hot melt columns after the hot melt are engaged with the corresponding hot melt holes to engage the plastic frame and the metal back plate. The heat-melting columns and the hot-melt holes are adjacent to the plastic hooks and the metal hooks.

In order to make the above-mentioned contents of the present invention more comprehensible, a preferred embodiment will be described below, and in conjunction with the drawings, a detailed description is as follows:

The following is a detailed description of the embodiments, which are intended to be illustrative only and not to limit the scope of the invention. In addition, the drawings in the embodiments omit unnecessary elements to clearly show the technical features of the present invention.

Please refer to FIG. 1 , which is a schematic diagram of a notebook computer 100 according to a preferred embodiment of the present invention. The notebook computer 100 includes a casing 110 and a keyboard 120 . The casing 110 is used to house components such as a main circuit board, a memory, a central processing unit, and a battery. The keyboard 120 is disposed on the casing 110.

Please refer to FIG. 2 and FIG. 3 , FIG. 2 is an exploded view of the casing 110 and the keyboard 120 , and FIG. 3 is a rear view of the dotted area 3 of the metal frame 122 of FIG. 2 . The keyboard 120 includes a button circuit board 123, a plastic frame 121 and a metal back plate 122. The plastic frame 121 includes a plurality of plastic hooks 121A, and the metal back plate 122 includes a plurality of metal hooks 122A (shown in FIG. 3). The plastic hook 121A and the metal hook 122A are engaged with the casing 110 to fix the keyboard 120 to the casing 110.

Please refer to FIG. 4 , which shows a side view of the plastic frame 121 and the metal back plate 122 . The plastic frame 121 further includes a plurality of heat-melting columns 121B, and the metal back plate 122 has a plurality of hot-melt holes 122B. Each of the heat-melting columns 121B corresponds to each of the hot melt holes 122B. Each of the heat-melting columns 121B after the heat fusion is engaged with the corresponding hot-melt holes 122B, so that the plastic frame 121 and the metal back plate 122 are engaged with each other.

Please refer to FIG. 5, which shows a positional arrangement diagram of the heat-melting column 121B and the hot-melt hole 122B. As shown in FIG. 4, each of the heat-melting columns 121B corresponds to a heat-melting hole 122B, and thus the number of the heat-melting columns 121B is equal to the number of the heat-melting holes 122B. The position and number of the heat-melting column 121B and the hot-melt hole 122B will affect the bonding strength of the plastic frame 121 and the metal back plate 122 and the floating condition in use.

As shown in FIG. 5, according to the results of a plurality of experiments, it can be found that the closer the position of the hot-melt column 121B and the hot-melt hole 122B is to the plastic hook 121A, the better the bonding strength between the plastic frame 121 and the metal back plate 122 is. The less floating condition of the keyboard 120 when in use. Therefore, the position of the heat-melting post 121B and the hot-melt hole 122B of the present embodiment is close to the set position of the plastic hook 121A.

In addition, according to the results of other experiments, it can be found that the closer the position of the hot-melt column 121B and the hot-melt hole 122B is to the metal hook 122A, the better the bonding strength between the plastic frame 121 and the metal back plate 122 and the keyboard 120. There will be less floating conditions when in use. Therefore, the position of the hot-melt post 121B and the hot-melt hole 122B of the present embodiment is also close to the set position of the metal hook 122A.

Therefore, the hot-melt column 121B and the hot-melt hole 122B of the embodiment are disposed adjacent to the plastic hook 121A and the metal hook 122A. That is to say, the number of the heat-melting column 121B and the hot-melt hole 122B is related to the number of the plastic hooks 121A and the number of the metal hooks 122A.

In a preferred case, each of the plastic hooks 121A and each of the metal hooks 122B correspond to at least one set of heat-melting columns 121B and hot-melt holes 122B. Therefore, the number of the hot-melt column 121B and the hot-melt hole 122B must be greater than the number of the plastic hooks 121A and the number of the metal hooks 122A, that is, the following formula (1) is satisfied:

Where K is the number of metal hooks 122A, and J is the number of plastic hooks 121A, where Y is the number of hot-melt columns 121B and the number of hot-melt holes 122B.

In addition, according to other experimental results, it can be found that when the distance between the hot-melt column 121B and the hot-melt hole 122B is smaller than the minimum distance X of the plastic hook 121A, the bonding strength can be improved to a certain extent, and the floating condition is also achieved. A certain degree of reduction effect. Therefore, if the keyboard 120 is divided into a plurality of equilateral triangles formed by the minimum distance X, and the heat-melting post 121B and the hot-melt hole 122B are disposed at the vertices of the regular triangles, a certain degree of effect can be achieved. As shown in FIG. 5, the keyboard 120 has a length L and a width W. The area of the aforementioned equilateral triangle is The area of the keyboard is LW , and the keyboard 120 can be set up at most. An equilateral triangle.

An equilateral triangle has three vertices; two connected regular triangles have four vertices; three connected regular triangles have five vertices. So on and so forth, An equilateral triangle has Vertices.

Therefore, the number of the hot melt columns 121B and the hot melt holes 122B is smaller than When the vertices of the regular triangles are set, the bonding strength can be improved to a certain extent, and the floating condition can be reduced to a certain extent. That is, the following formula (2):

The above formulas (1) and (2) can be combined into the following formula (3):

That is to say, in the case where the number of the hot-melt column 121B and the hot-melt hole 122B satisfies the above formula (3), the bonding strength can be improved to a certain extent, and the floating state can be reduced to a certain extent, and The quantity will be reduced to a certain extent.

In one embodiment, after the heatsink column 121B and the hot melt hole 122B are simplified according to the above arrangement, the number is greatly reduced from 130 to 36. However, the hot-melt column 121B and the hot-melt hole 122B can still achieve a certain degree of improvement in the bonding strength, and can also achieve a certain degree of reduction effect on the floating condition.

In addition, after the number of the heat-melting column 121B and the heat-melting hole 122B is simplified, the defined heat-melting column 121B and the heat-melting hole 122B can be used in common for notebook computers of different models. Therefore, notebooks of different models can use the same hot-melt fixture to heat the hot-melt column 121B. The plastic frame 121 can also be injection molded using the same mold. Significantly reduce the development cost of fixtures and molds.

In view of the above, the present invention has been disclosed in a preferred embodiment, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100. . . Notebook computer

110. . . cabinet

120. . . keyboard

121. . . Plastic frame

121A. . . Plastic hook

121B. . . Hot melt column

122. . . Metal backplane

122A. . . Metal hook

122B. . . Hot melt hole

123. . . Button circuit board

3. . . Dotted area

L. . . Length of keyboard

W. . . Keyboard width

X. . . Minimum distance of plastic hook

1 is a schematic diagram of a notebook computer according to a preferred embodiment of the present invention;

Figure 2 is a schematic exploded view of the casing and the keyboard;

Figure 3 is a rear view of the dashed area 3 of the metal frame of Figure 2;

Figure 4 is a side view showing the plastic frame and the metal back plate;

Figure 5 is a diagram showing the position of the hot-melt column and the hot-melt hole.

121A. . . Plastic hook

121B. . . Hot melt column

122A. . . Metal hook

122B. . . Hot melt hole

L. . . Length of keyboard

W. . . Keyboard width

X. . . Minimum distance of plastic hook

Claims (10)

A keyboard comprising: a plastic frame, comprising: a plurality of plastic hooks; and a plurality of hot-melt columns; and a metal back plate having a plurality of hot-melt holes, the metal back plate comprising: a plurality of metal hooks; After the hot melt, the heat-melting columns are engaged with the corresponding hot-melt holes, so that the plastic frame and the metal back plate are engaged with each other, and the hot-melt columns and the hot-melt holes are adjacent to the plastics The hook and the metal hooks have a minimum distance X, the keyboard has a length L and a width W, and the number of the hot melt columns is less than . The keyboard of claim 1, wherein the number of the heat-melting columns is equal to the number of the hot-melt holes. The keyboard of claim 1, wherein the number of the hot-melt columns is related to the number of the plastic hooks and the number of the metal hooks. The keyboard of claim 1, wherein the number of the hot-melt columns is greater than or equal to the number of the plastic hooks and the number of the metal hooks. The keyboard of claim 1, wherein the plastic hooks have a minimum distance, the keyboard has a length and a width, and the number of the heat-melting columns is related to the minimum distance, the length and the width. . A notebook computer comprising: a casing; and a keyboard disposed on the casing, the keyboard comprising: a plastic frame comprising: a plurality of plastic hooks; and a plurality of hot-melt columns; and a metal back plate The metal back plate includes: a plurality of metal hooks; wherein each of the hot melt columns after the hot melt is engaged with the corresponding hot melt holes, so that the plastic frame and the metal back The hot-melt columns and the hot-melt holes are adjacent to the plastic hooks and the metal hooks. The plastic hooks have a minimum distance X, and the keyboard has a length L and a width W. The number of hot melt columns is less than . The notebook computer of claim 6, wherein the number of the hot melt columns is equal to the number of the hot melt holes. The notebook computer of claim 6, wherein the number of the hot melt columns is related to the number of the plastic hooks and the number of the metal hooks. The notebook computer of claim 6, wherein the number of the hot-melt columns is greater than or equal to the number of the plastic hooks and the number of the metal hooks. The notebook computer of claim 6, wherein the plastic hooks have a minimum distance, the keyboard has a length and a width, and the number of the heat-melting columns is related to the minimum distance, the length, and The width degree.