M286464 八、新型說明： 【新型所屬之技術領域】 本創作係屬於一種發光二極體裝置，尤指一種利用壓 縮循環中的低溫冷媒對發光二極體進行吸熱與降溫。 【先前技術】 發光二極體（Light Emitting Diode，LED)具有省 電節能的功效，近來迅速普及，常應用於交通信號燈、電 子看板、手電筒、檯燈及投射燈等電子設備上。然而，發 ® 光二極體運作時產生高熱，若發光二極體無搭配適當的散 熱設計，則運作時，發光二極體將因高溫而壽命大幅縮短 甚至燒毀。 一般而言，發光二極體的晶芯溫度所能容忍於攝氏120 度，遠低於傳統燈泡運作時的溫度，高亮度發光二極體設 備所搭配的散熱設計將深深影響其使用壽命。 此外，發光二極體的發光亮度與其晶芯溫度有關，如 以下表一所示，有效降低晶芯溫度可明顯提高發光二極體 ® 亮度，例如，當晶芯溫度由一般的設計值攝氏90度降低 到攝氏25度時，其亮度可提高33%。 表1、發光二極體晶蕊溫度（Tj)與發光亮度之關係 發光二極體 Tj oc Relative intensity Intensity increase from Tj=90oC 90 75 Baseline 60 87 +16% 50 91 +21% 45 93 +24% 40 95 +27% 25 100 +33% 此外，降低晶芯溫度亦可延長壽命，例如，在固定電 M286464 流下，發光二極體所在的一基座溫度（晶芯溫度約攝氏10 1 度）由攝氏85度下降到達攝氏55度（晶芯溫度約攝氏81 度）時，發光二極體壽命（定義為光衰〇·7)可以由15, 〇〇〇 小時增加到60, 000小時，即為原壽命的四倍長。 顯然，降低發光二極體晶芯溫度有助於發光二極體提 高亮度及壽命，而欲降低發光二極體溫度，則必須在其散 熱方面著手。 以50-1 00瓦高功率發光二極體照明燈具來說，要在 ® 狹小的照明燈具内部空間中作出有效的散熱設計極為困 難。 以傳統鋁或銅製散熱器搭配風扇的散熱設計來說，不 但體積大，且風扇運作時產生噪音，因此不適用於發光二 極體裝置。 請參照第四圖，另有以迴路熱管來對發光二極體散熱 的設計，係主要在一散熱外罩（9 3)内設置一導熱基座 I ( 9 0 )，且外部設置有複數個發光二極體（9 1 )，在 導熱基座（9 0 )上設置有一迴路熱管（L〇〇p Heat Pipe， LHP ) (92)，該迴路熱管（9 2 )係繞設在散熱外罩 (9 3)上’且内部設置有易揮發的液體，藉此，迴路熱 管（9 2 )可以内部液體吸收發光二極體（9 1 )的高熱， 並與外界熱交換而散熱，此種設計雖然可有效對發光二極 體（9 1 )散熱，然而當發光二極體（9 1 )發熱功率超 過150瓦，或者發光二極體燈具的尺寸增大時，迴路熱管 (9 2 )即效能不足，或是效能上大幅衰減。 5 M286464 此外，上述提到的散熱結構皆為被動式的散熱設計， 即僅依賴發光二極體因運作時自身高溫與常溫之間的溫度 差來散熱，此種散熱方式容易受到環境溫度及環境内通風 程度的影響。 【新型内容】 故本創作人根據現有發光二極體（Ught D1〇de’ LED)裝置僅利用效率不彰之被動式散熱設計來散 熱的缺點，改良其不足與缺失，進而創作出一種發光二極 體燈具的主動式移熱與降溫裝置。 本創作主要目的係提供一種具主動式移熱與降溫功能 的發光二極體燈具，利用愿給搡彡法山 七用壓細機循裱中的低溫冷媒來對發 光二極體進行吸熱與降溫。 為達上述目#係令則述具主動式移熱與降溫功能的 發光二極體燈具包含有： 一散熱外罩； 一主動式移熱與降溫裝置，係設置在散熱外罩内，且 包含有-蒸發器、一冷凝器、一壓縮機、一膨脹閥及一低 溫板’其中該低溫板設置在該蒸發器上，該冷凝器係設置 在散熱外罩上，壓縮機、冷凝器、膨脹閥及蒸發器相互連 接，連接順序為Μ縮機接合冷凝器、冷凝器接合膨服閥、 膨脹閥接合蒸發H、蒸發H接合Μ縮機，構成—封閉迴路， 迴路内設置有一冷媒，壓縮機可壓縮氣態冷媒，膨脹閥可 膨脹冷媒；及 一發光二極體模組’係設置在該主動式移熱與降溫裝 6 M286464 置上而與低溫板接觸，且包含有至少—個發光二極體。 、-板==術手段，發光二極體所產生的熱量經由低 的液態冷媒，冷媒吸熱後蒸發為氣態 並進f細機，經由μ縮機 體，該氣態冷媒經過冷凝器進行散熱而凝結為 的液態冷媒，經過膨脹閥成為一錢且溫度低於環境溫度 態混合冷媒，最後冷媒進人蒸發器完成—個屢職 壤，利用壓縮循環中的低溫冷媒來對發光二極體進行吸軌 ’與降溫，可減低環境溫度變化及通風效果不良對發光二極 體的影響，甚至將發光二極體溫度維持在低於環境溫度以 下^能藉由降低發光二極體溫度，延長發光二極體壽命 並提高發光二極體亮度。 前述冷凝器係設置在散熱外罩上。 、前述低溫板係由二板體相固設組成，其中一板體為一 導熱板體，另-板體為一保溫板體，該蒸發器係夹設於 板體之間。 ' 1 _述發光二極體模組係包含有一基|，在基座與低溫 板接觸的-面上形成有一内容室，在基座上形成有數個與 内合至相連通且貫穿基座的穿孔，在穿孔内壁上設有一高 反射物質，在内容室内設置有一電路板，該等發光二極體 係e又置在该電路板上而伸入相對應的穿孔。 則述各穿孔剖面係成一梯形，梯形較闊的一端係背對 低溫板。 ^ 刚述基座背對低溫板的一面上形成有一與穿孔相連通 7 M286464 、：體各至’於氣體谷室内填充有一低露點氣體，於基座 上》又置有-密封覆蓋氣體容室的外透明板，低露點氣體可 避免低溫時結霜或凝露於透明板的表面上，以致於阻播光 線射出。 則述基座上形成有至少一熱氣旁通管，用以加熱透明 板，避免低溫時結霜或凝露於透明板的表面上，以致於阻 擋光線射出。 月’J述基座係由一設置在低溫板上的隔熱板、一設置在 瞻^熱板上的内基座及-設置在内基座上的外基座相固設組 成0 前述基座的氣體容室底部設置有一介於内基座及外基 座之間的内透明板，該内透明板係覆蓋基座穿孔及發光二 極體。 月1J述低露點氣體係介於内透明板與外透明板之間。 前述熱氣旁通管係形成於靠近透明板的外基座上。 前述低露點氣體係為氮氣。 前述透明板係以玻璃製造。 前述透明板係以塑膠製造。 前述散熱外罩係以金屬製造。 【實施方式】 請參照第一及第二圖，本創作具主動式移熱與降溫功 能的發光二極體燈具係包含有：一散熱外罩（1 〇 )、一 主動式移熱與降溫裝置及一發光二極體（Light EmittingM286464 VIII. New Description: [New Technology Field] This creation belongs to a kind of light-emitting diode device, especially a kind of low-temperature refrigerant in the compression cycle to absorb and cool the light-emitting diode. [Prior Art] Light Emitting Diode (LED) has the effect of saving energy and energy, and has recently become popular, and is often used in electronic devices such as traffic lights, electronic billboards, flashlights, desk lamps, and projection lamps. However, when the LED is operated, it generates high heat. If the LED is not equipped with a proper heat dissipation design, the LED will be greatly shortened or even burned due to high temperature during operation. In general, the core temperature of a light-emitting diode can be tolerated to 120 degrees Celsius, which is much lower than that of a conventional light bulb. The heat dissipation design of a high-brightness LED device will greatly affect its service life. In addition, the luminance of the light-emitting diode is related to the temperature of the crystal core. As shown in Table 1 below, effectively lowering the temperature of the crystal core can significantly improve the brightness of the LED, for example, when the temperature of the core is 90 degrees Celsius. When the degree is reduced to 25 degrees Celsius, the brightness can be increased by 33%. Table 1. Relationship between crystal core temperature (Tj) and luminescence brightness of light-emitting diodes Tj oc Relative intensity Intensity increase from Tj=90oC 90 75 Baseline 60 87 +16% 50 91 +21% 45 93 +24% 40 95 +27% 25 100 +33% In addition, lowering the temperature of the crystal core can also extend the life. For example, under the fixed electric current M286464, the temperature of a pedestal where the light-emitting diode is located (the temperature of the crystal core is about 10 degrees Celsius) When the temperature drops from 85 degrees Celsius to 55 degrees Celsius (the temperature of the crystal core is about 81 degrees Celsius), the lifetime of the light-emitting diode (defined as light decay 77) can be increased from 15, 〇〇〇 hours to 60,000 hours. The original life is four times longer. Obviously, lowering the temperature of the LED core helps the LED to improve brightness and lifetime, and to reduce the temperature of the LED, it must start with its heat dissipation. For a 50-1 00 watt high power LED lighting fixture, it is extremely difficult to make an effective thermal design in the interior of a small lighting fixture. The traditional aluminum or copper heat sink with the fan's heat dissipation design is not only bulky, but also produces noise when the fan is operating, so it is not suitable for the LED device. Please refer to the fourth figure, and the design of the heat dissipation of the light-emitting diode by the loop heat pipe is mainly provided with a heat-conductive base I (90) in a heat-dissipating cover (9 3), and a plurality of light-emitting portions are disposed outside. The diode (9 1 ) is provided with a loop heat pipe (LHP) (92) on the heat conducting base (90), and the loop heat pipe (92) is wound around the heat dissipation cover (9). 3) Upper and internally provided with a volatile liquid, whereby the loop heat pipe (9 2 ) can absorb the high heat of the light-emitting diode (9 1 ) and exchange heat with the outside to dissipate heat. This design can be used. Effectively dissipating heat from the light-emitting diode (9 1 ). However, when the heating power of the light-emitting diode (9 1 ) exceeds 150 watts, or the size of the light-emitting diode lamp is increased, the loop heat pipe (92) is insufficient in performance. Or the performance is greatly reduced. 5 M286464 In addition, the above-mentioned heat dissipation structure is a passive heat dissipation design, that is, it only relies on the temperature difference between the high temperature and the normal temperature of the light-emitting diode during operation, and the heat dissipation method is easily affected by the ambient temperature and the environment. The effect of the degree of ventilation. [New content] Therefore, the author created a kind of light-emitting diode based on the shortcomings of the existing UHT D1〇de' LED device using only the passive heat dissipation design to improve heat dissipation. Active heat transfer and cooling device for body lamps. The main purpose of this creation is to provide a light-emitting diode lamp with active heat transfer and temperature reduction function, which is intended to absorb and cool the light-emitting diode by using the low-temperature refrigerant in the 搡彡Fashan seven-use compactor. . In order to achieve the above-mentioned items, the light-emitting diode lamp with active heat-removing and cooling functions includes: a heat-dissipating cover; an active heat-removing and cooling device, which is disposed in the heat-dissipating cover and includes - An evaporator, a condenser, a compressor, an expansion valve, and a cryopanel, wherein the cryopanel is disposed on the evaporator, the condenser is disposed on the heat dissipation cover, the compressor, the condenser, the expansion valve, and the evaporation The devices are connected to each other, and the connection sequence is a collapsing machine to join the condenser, a condenser to engage the expansion valve, an expansion valve to engage the evaporation H, and an evaporation H to engage the retractor to form a closed loop, a refrigerant is arranged in the circuit, and the compressor can compress the gaseous state. The refrigerant, the expansion valve expandable refrigerant; and a light-emitting diode module are disposed on the active heat-removing and cooling device 6 M286464 and are in contact with the cryopanel, and include at least one light-emitting diode. , - plate = = means, the heat generated by the light-emitting diode is passed through a low liquid refrigerant, the refrigerant absorbs heat and evaporates into a gaseous state and enters the fine machine, and the gaseous refrigerant passes through the condenser to dissipate heat and condense into The liquid refrigerant passes through the expansion valve and becomes a mixed refrigerant with a temperature lower than the ambient temperature state. Finally, the refrigerant enters the evaporator to complete the work--a repeated occupation, using the low-temperature refrigerant in the compression cycle to suck the light-emitting diodes' with Cooling can reduce the influence of ambient temperature change and poor ventilation effect on the light-emitting diode, and even keep the temperature of the light-emitting diode below the ambient temperature. 2. By reducing the temperature of the light-emitting diode and prolonging the life of the light-emitting diode. And improve the brightness of the light-emitting diode. The condenser is disposed on the heat dissipation cover. The low temperature plate is composed of two plate body phases, wherein one plate body is a heat conducting plate body, and the other plate body is a heat insulating plate body, and the evaporator is sandwiched between the plate bodies. The light-emitting diode module comprises a base | a content chamber is formed on the surface of the base in contact with the cryopanel, and a plurality of inner chambers are connected to the base and are connected to the base. The perforation is provided with a highly reflective material on the inner wall of the perforation, and a circuit board is disposed in the content chamber. The light-emitting diode system e is placed on the circuit board to extend into the corresponding perforation. The perforated sections are formed in a trapezoidal shape, and the wider end of the trapezoid is opposite to the cryopanel. ^ Just on the side of the pedestal back to the cryopanel, there is a connection with the perforation. 7 M286464, the body is filled with a low dew point gas in the gas valley, and the gas is placed on the pedestal. The outer transparent plate, low dew point gas can avoid frosting or condensation on the surface of the transparent plate at low temperature, so as to block the light from being emitted. At least one hot gas bypass pipe is formed on the base for heating the transparent plate to prevent frosting or condensation on the surface of the transparent plate at a low temperature, so as to block light from being emitted. The base of the moon is composed of a heat shield disposed on the cryopanel, an inner base disposed on the hot plate, and an outer base disposed on the inner base. The bottom of the gas chamber of the seat is provided with an inner transparent plate between the inner base and the outer base, and the inner transparent plate covers the base through hole and the light emitting diode. The low dew point system of the month 1J is between the inner transparent plate and the outer transparent plate. The aforementioned hot gas bypass pipe is formed on the outer base adjacent to the transparent plate. The aforementioned low dew point system is nitrogen. The aforementioned transparent plate is made of glass. The aforementioned transparent plate is made of plastic. The aforementioned heat dissipation cover is made of metal. [Embodiment] Please refer to the first and second figures. The LED lamp with active heat transfer and temperature reduction functions includes: a heat dissipation cover (1 〇), an active heat transfer and temperature reduction device, and Light Emitting
Diode，LED)模組（2 〇 )。 8 M286464 請進一步參照第三圖，該主動式移熱與降溫裝置係設 置在散熱外罩（10)内，且包含有一低溫板（70)、 二發器（3〇)、一冷凝器（40)、一壓縮機（5〇) 及一膨脹閥（6〇)。 該低溫板（7 〇 )係設置在該散熱外罩（i 〇 )内， 且由二板體所組成，其中一板體係為以金屬等高導熱性材 料製造的導熱板體（7丄），而另一板體係為以保麗龍等 低導熱性材料製造的保溫板體（7 2 )。 籲 該蒸發器（3 0 )係夾設於導熱板體（7 i )及保溫 板體（7 2 )之間。 該冷凝器（4 0 )係設置在散熱外罩（i 〇 )上，藉 由與散熱外罩（1 〇)相接觸，冷凝器上的熱量 可利用散熱外罩（1 〇)的大表面積來逸散。 上述壓縮機（5 0 )、冷凝器（4 0)、膨m闊（6 0 )及蒸發器（3 0 )相互連接，連接順序為壓縮機（5 0 )接合冷凝器（4 0 )、冷凝器（4 〇 )接合膨脹閥（6 馨0 )、膨脹閥（6 0 )接合蒸發器（3 〇 )、蒸發器（3 0)接合壓細機（5 0)，構成一封閉迴路，迴路内設置 有一冷媒（80)。其中該壓縮機（4〇)可壓縮氣態冷 媒（8 0 )，膨脹閥（6 〇 )可膨脹冷媒（8 〇 )。 該發光二極體模組（2 0 )係設置在該主動式移熱與 降溫裝置上而與低溫板（7 0 )接觸，且包含有一基座（2 1 )、一外透明板（2 2 )、一内透明板（2 3 )、一低 露點氣體、一電路板（2 4 )、至少一個發光二極體（2 9 M286464 5)及二密封墊（26) (27)。 該基座（2 1 )係設置在低溫板（7 〇 )上，包含一 隔熱板（211)、一内基座（212)、一外基座（2 13)、一内容室（214)、至少一穿孔（215)、 一氣體容室（216)、至少一熱氣旁通管（217)、 -密封墊（218)及至少一高反射物質（219);該 隔熱板（2 1 1 )係呈環狀而設置在低溫才反（7 〇 )的導 熱板體（7 1)上；該内基座（2 i 2)係設置在隔熱板 (2 1 1 )之上；該外基座（2 i 3 )係設置在内基座（2 12)之上；該内容室（214)係形成在基座（21) 面對低溫板（7〇)的一面上，且位於内基座（2丄2) 與隔熱板（2 1 1 )之間；該穿孔（2丄5 )係形成在内 基座（2 1 2 )且與内容室（2 i 4 )連通，穿孔（2工 5 ) 面係成梯形，梯形較為闊的一端係背對低溫板（7 0 );該高反射物質（2 1 9 )係、言史置在穿孔（2 1 5 ) 内壁；該氣體容室（2 1 6 )係形成在外基座（2 1 3 ) 上且與穿孑L (2 1 5)連通；該熱氣旁通管（2 1 7)係 呈環狀貫穿形成在外基座（2 1 3)上，用以加熱透明板， 避免低溫時結霜或凝露於氣體容室（2 i 6)内，阻擋光 線射出；該密㈣（2 1 8 )係設置在内基座（2 1 2 ) 與外基座（2 1 3 )之間。 該外透明板（2 2 )可以玻璃或塑膠製造，設置在基 座（21)上而密封覆蓋該氣體容室（216)。 該内透明板（2 3)可以玻璃或塑膠製造，設置在基 M286464 座（2 1)氣體谷至（2 1 6)底部，介於内基座（2 i 2)與外基座（213)之間，且覆蓋穿孔（215)。 藉由通入熱氣到熱氣旁通官（2 1 7)内部，可除去内/ 外透明板（2 2 ) ( 2 3 )表面上的結霜或凝露。 該低露點氣體可為氮氣’係設置在基座（2 1 )氣體 容室（2 1 6 )内而介於外透明板（2 2 )及内透明板（2 3 )之間’低露點氣體可避免低溫時結霜或凝露於透明板 ( 2 2 ) ( 2 3 )的表面上，以致於阻擋光線射出。 • 該電路板（24)係設置在基座（21)内容室（2 1 4 )中。 該發光二極體（2 5 )係設置在電路板（2 4 )上且 伸入相對應的基座（2 1 )穿孔（2 1 5 )，藉由穿孔（2 1 5 )的梯形剖面及高反射物質（2 1 9 )，發光二極體 (2 5 )的所發出的光線可被集中射出。 其中一密封墊（26)係設置在電路板（24)與基 座（21)隔熱板（21 1)之間，另一密封墊（27) > 係設置在電路板（2 4 )與低溫板（3 0 )之間。 藉由上述技術手段，發光二極體（2 5 )所產生熱量 經低溫板（7 0 )傳遞到蒸發器（3 〇 )中的液態冷媒（8 〇 液態冷媒（8 0 )吸熱後蒸發為氣態並進入壓縮機 (50)，經由壓縮機（50)的壓縮而成為一高溫高壓 氣體，該氣態冷媒（8 0 )經過冷凝器（4 〇 )進行散熱 而凝結為一高壓高溫的液態冷媒（8 〇 )，經過膨脹閥（6 〇 )成為一低壓且溫度低於環境溫度的氣液態混合冷媒（8 11Diode, LED) module (2 〇). 8 M286464 Please refer to the third figure. The active heat transfer and cooling device is disposed in the heat dissipation cover (10) and includes a cryopanel (70), a second generator (3〇), and a condenser (40). , a compressor (5 〇) and an expansion valve (6 〇). The cryopanel (7 〇) is disposed in the heat dissipation cover (i 〇) and is composed of two plates, wherein one plate system is a heat conduction plate body (7 丄) made of a highly thermally conductive material such as metal, and The other plate system is a heat insulating plate body (72) made of a low thermal conductive material such as styrofoam. The evaporator (30) is interposed between the heat conducting plate body (7 i ) and the heat insulating plate body (72). The condenser (40) is disposed on the heat dissipation cover (i 〇 ), and by the contact with the heat dissipation cover (1 〇), the heat on the condenser can be dissipated by the large surface area of the heat dissipation cover (1 〇). The compressor (50), the condenser (40), the expanded (6 0) and the evaporator (30) are connected to each other, and the connection sequence is that the compressor (50) engages the condenser (40) and condenses. (4 〇) engages the expansion valve (6 Xin 0), the expansion valve (60) engages the evaporator (3 〇), and the evaporator (30) engages the press (50) to form a closed loop in the circuit. A refrigerant (80) is provided. The compressor (4〇) compresses the gaseous refrigerant (80) and the expansion valve (6〇) expands the refrigerant (8 〇). The light emitting diode module (20) is disposed on the active heat transfer and temperature reducing device and is in contact with the cryopanel (70), and includes a base (2 1 ) and an outer transparent plate (2 2 ) ), an inner transparent plate (23), a low dew point gas, a circuit board (24), at least one light emitting diode (2 9 M286464 5), and two sealing pads (26) (27). The base (2 1 ) is disposed on the cryopanel (7 〇), and includes a heat shield (211), an inner base (212), an outer base (2 13), and a content chamber (214). At least one perforation (215), a gas chamber (216), at least one hot gas bypass tube (217), a gasket (218), and at least one highly reflective material (219); the heat shield (2 1 1 a heat-conducting plate body (7 1) which is disposed at a low temperature and is reversed (7 〇); the inner base (2 i 2) is disposed above the heat insulating plate (2 1 1 ); The base (2 i 3 ) is disposed on the inner base (2 12); the content chamber (214) is formed on a side of the base (21) facing the cryopanel (7〇), and is located at the inner base Between the seat (2丄2) and the heat shield (2 1 1 ); the perforation (2丄5) is formed in the inner base (2 1 2 ) and communicates with the content chamber (2 i 4 ), the perforation (2 5) The face is trapezoidal, the wider end of the trapezoid is backed to the cryopanel (70); the highly reflective material (2 1 9) is placed on the inner wall of the perforation (2 15); the gas chamber (2 1 6 ) is formed on the outer base (2 1 3 ) and communicates with the piercing L (2 15); the hot gas bypass pipe 2 1 7) is formed in an annular shape on the outer base (2 1 3) for heating the transparent plate to prevent frosting or condensation in the gas chamber (2 i 6) at low temperature, and blocking the light from being emitted; The dense (4) (2 1 8 ) is disposed between the inner base (2 1 2 ) and the outer base (2 1 3 ). The outer transparent plate (22) may be made of glass or plastic and is disposed on the base (21) to seal the gas chamber (216). The inner transparent plate (23) can be made of glass or plastic, and is disposed at the bottom of the base M286464 (2 1) gas valley to (2 16), between the inner base (2 i 2) and the outer base (213) Between and covering the perforations (215). The frosting or condensation on the surface of the inner/outer transparent plate (2 2 ) ( 2 3 ) can be removed by introducing hot air into the interior of the hot gas bypass (2 1 7). The low dew point gas may be a nitrogen gas system disposed in the gas chamber (2 1 6 ) of the susceptor (2 1 ) and between the outer transparent plate (2 2 ) and the inner transparent plate (23). It can avoid frosting or condensation on the surface of the transparent plate (2 2 ) ( 2 3 ) at low temperatures, so as to block the light from being emitted. • The board (24) is placed in the base (21) room (2 1 4). The light emitting diode (25) is disposed on the circuit board (2 4 ) and extends into the corresponding base (2 1 ) through hole (2 1 5 ) by a trapezoidal cross section of the through hole (2 1 5 ) and The highly reflective material (2 1 9 ), the light emitted by the light-emitting diode (25) can be concentratedly emitted. One of the gaskets (26) is disposed between the circuit board (24) and the base (21) heat shield (21 1), and the other seal (27) > is disposed on the circuit board (2 4) and Between the low temperature plates (30). By the above technical means, the heat generated by the light-emitting diode (25) is transferred to the liquid refrigerant in the evaporator (3 〇) via the cryopanel (7 0 ) (8 〇 liquid refrigerant (80) absorbs heat and evaporates into a gaseous state. And entering the compressor (50), through the compression of the compressor (50) to become a high-temperature high-pressure gas, the gaseous refrigerant (80) through the condenser (4 〇) to dissipate heat and condense into a high-pressure high-temperature liquid refrigerant (8 〇), through the expansion valve (6 〇) becomes a low pressure and the temperature is lower than the ambient temperature of the gas-liquid mixed refrigerant (8 11
【主要元件符號說明】 (1 0)散熱外罩 (2 1 )基座 (212)内基座 (214)内容室 (216)氣體容室 (2 1 8 )密封墊 (2 2 )外透明板 (2 4 )電路板 (2 6 )密封墊 (3 〇 )蒸發器 M286464 cn，最後冷媒（80)進入蒸發器（ 縮循環，利用壓縮機（5 〇 ) &成-個壓 亦O 夂低/皿冷媒（8 0 )來對發 光一極體（2 5 )進行吸熱與降、、w β ώ 興降/皿，可減低環境溫度變化 及通風效果不良對發光二極體 ,^ 、 〜〜警，甚至將發光二極體 (2 5 )的溫度維持在低於環境 衣兄，皿度以下，且能藉由降低 發光二極體（25)溫度，延長發弁- 一 、负發光一極體（25)壽命 並提高發光二極體（2 5)亮度。 【圖式簡單說明】 第一圖係為本創作之側面局部剖視圖。 第二圖係為本創作之立體外觀圖。 第三圖係為本創作之放大側面剖視圖。 第四圖係為舊有發光二極體燈具之側面剖視圖。 (2 0 )發光二極體模組 (2 1 1 )隔熱板 (213)外基座 (2 1 5 )穿孔 (2 17)熱氣旁通管 (2 1 9 )高反射物質 (2 3 )内透明板 (2 5 )發光二極體 (2 7 )密封塾 (4 0 )冷凝11 12 M286464 (50)壓縮機 （ (7 0 )低溫板 （ (7 2 )保溫板體 （ (9 0 )導熱基座 （ (9 2 )迴路熱管 （ 6 0 )膨脹閥 71)導熱板體 8 0 )冷媒 91)發光二極體 9 3 )散熱外罩[Main component symbol description] (1 0) heat dissipation cover (2 1) base (212) inner base (214) content room (216) gas chamber (2 1 8) gasket (2 2 ) outer transparent plate ( 2 4) Circuit board (2 6 ) gasket (3 〇) evaporator M286464 cn, and finally refrigerant (80) enters the evaporator (shrinking cycle, using compressor (5 〇) & into - pressure is also O 夂 low / The refrigerant (80) is used to absorb and lower the light-emitting diode (2 5), and the w β ώ is reduced/dish, which can reduce the environmental temperature change and the poor ventilation effect on the light-emitting diode, ^, ~~ Even maintaining the temperature of the light-emitting diode (25) below the ambient size, and lowering the temperature of the light-emitting diode (25), prolonging the hairpin--negative light-emitting body (25) Lifetime and increase the brightness of the light-emitting diode (2 5) [Simplified description of the drawing] The first picture is a partial cross-sectional view of the side of the creation. The second picture is the three-dimensional appearance of the creation. This is an enlarged side cross-sectional view of the creation. The fourth picture is a side cross-sectional view of the old light-emitting diode lamp. (2 0) LED module (2 1 1) Plate (213) outer base (2 1 5) perforated (2 17) hot gas bypass pipe (2 1 9) high reflective material (2 3 ) inner transparent plate (2 5 ) light emitting diode (2 7 ) sealed (4 0 ) Condensation 11 12 M286464 (50) Compressor ( (7 0 ) Cryogenic plate ( (7 2 ) Insulation plate body ( (9 0 ) Thermally conductive base ( (9 2 ) Loop heat pipe ( 60 ) Expansion valve 71 ) Thermally conductive plate 8 0 ) Refrigerant 91) Light-emitting diode 9 3 ) Heat-dissipating cover
1313