M285026 不s再度失去準位，因此，晶圓與光罩於對位過程、後續輸送 過程上’需耗費不少時間在相關的定位或切換定位的動作上。 3 ·前述相_定位或城定位動作，若採人工手工的般運與置放 作為實施，容易產生不當應力與振動的情形，導致晶圓與光罩 受損。 4 .操作員於光罩進行定位的過程中，會多次與光罩接觸，也因此 使光罩的耐用度下降’甚封產生操制污縣罩的情形。 5 .當晶®與料_位完錢，仍f進行必要的輸送與搬運動 作，方能使與光罩進人曝絲輸送台巾進行曝光的動作， 而在輸送與搬運過程中（例如：各作業平台間之搬運），置放 或搬起的動作容易對晶圓與光罩產生垂向的衝擊力，該衝擊力 的產生同樣的有可能會造成晶圓與光軍間對位的偏移，或者對 晶圓與光罩造成損傷，並且造成操作員於移動晶圓與光罩時需 特別的緩慢，更而浪費了許多寶貴的時間。 【新型内容】 〔創作目的〕 本創作之創設目的在於解決先前技術中的麵問題，以使晶圓 與光罩於進油關曝光作鱗的產製效率提升，而又能具有更佳的 對位準確度。且在提升產製效率時又能有效降低晶元與光罩因固 定、搬運與輸送時造成的損壞、準位偏移的問題，並在設計上可避 免操作員與晶圓及光罩進行多次的直接接觸，以改善晶圓與光罩於 M285026 曝光過程中遭受人為污染與損傷。 〔本創作之技術手段〕 為了達到本創作之創設目的，創作人係提供關於「曝光對位裝 置」之新型技術，據赠善先前技術巾，晶_光罩於曝光過程中 所產生的種種問題。 技術手段1:創作人所提供之曝光對位裝置，係實施於晶圓曝 光系、、先之巾’以使aa圓與光罩於進行曝光前先由—吸盤完成準位固 定，俾利晶®與光罩於後續行經曝光桌平台以及曝錢輸送台之過 耘更為順暢；該曝光對位裝置係於一基座上設置： 一微調平台，其台面為可進行水平位移以及偏旋角度之調整 者，微調平台之台面上設有吸盤制溝與吸盤定位塊；—吸盤，擺 置於微調平台上方，吸盤底面設有定位槽與吸盤定位塊配合，吸盤 得受吸盤氣固溝之負壓吸引賴定於微調平台上，吸盤頂面佈覆有 夕個氣固孔用以吸覆晶圓之用；制孔之外圍環設有_於光罩氣固 /冓光罩氣固溝之外侧環設有一封止環，藉以於晶圓與光照對位完 成後’進-步對光罩提供負壓吸引的固定；一光罩架，位於吸盤上 方之相對水平位置，該光罩架具有光罩扣固元件以錢以吸持光罩 之吸持元件·’-光罩，具有邊框以供光罩扣固元件扣持；—影像擷 取單元’該影擷取單元具有絲鏡麵向設置並對應於光罩架之上 方，藉以精確的擷取晶圓與光罩間的對位晝面，並透過一顯示單元 將對位晝面放大呈現。 7 M285026 技術手段5 :由前述技術手段1所衍生，其中影像擷取單元之 顯示單元固設於基座上；使得顯示單元直接設置於曝光對位裝置 上，當曝光對位叙置需進行搬移或進行移轉生產線等動作時，顯示 單元可隨曝光對位錢-起飾，而不需進行鑛前後之拆卸與組 裝，以提升產業效率。 技術手段6 :由前述技術手段1所衍生，其中影擷取單元上設 有對焦升降單元使光學鏡頭得進行垂向位移之調整；讓影榻取單元 #與光罩及晶圓間保持最適當的擷取距離，俾利呈現之榻取影像更為 清楚（位於正確的焦距）；再配合各項定位與調整即可使每一晶圓定 位點都旎夠被確保在影擷取單元之有效運作範圍内。 【實施方式】 以下絲摘作之技射段，雜本財施之方式，並 配合圖式說明如後： _ 第-®所示係本創作曝紉位裝置之實施部位示意圖，圖中揭 不出，曝光對位裝置1〇係實施於晶圓曝光系統1〇 〇之中，其實 施之目的在於使晶圓工工與光罩工2進行曝光前先由—吸盤^完 成準位固定，俾利晶圓11與光罩12於後續行經曝光桌平台2〇 以及曝光機輸送台30之過程更為順暢。 、口 第二圖及第三圖所示，係本創作曝光對位裝置之立體分解_ 立體=圖，曝光對位裝置10之實施係於-基座i 〇!上設置Γ 一微調平台13，其台面13 1透過X轴調整知132 ]軸 M285026 調整翻13 3以及Z軸Θ偏轉叙；[3 4之設置而為可進行水平位移 以及偏旋角度之调整者，微調平台13之台面131上設有吸盤氣 固溝13 5與吸盤定位塊13 6 ; 一吸盤14 ,擺置於微調平台13上方，吸盤14底面設有定 位槽141與如述吸盤定位塊13 6配合，吸盤14得受吸盤氣固 溝13 5之負壓吸引而固定於微調平台上i 3 ;其次，吸盤i 3 6 頂面佈覆有多個氣固孔142用以吸覆晶圓工！之用；氣固孔丄4 2之外圍環设有-於光罩氣固溝14 3、光罩氣固溝；[4 3之外侧 環設有一封止環14 4 (請同時參閱第四圖所示）。再者，，吸盤工 4之造形可採讀菱料邊之設計，俾概揭光罩丨2 (邊框工2 1)於相關作業階段上能將四角隅露出，以方便抓取之用。 、晶圓11定位於吸盤i4上時並未含蓋光罩氣固溝143之區 3、，封止裒1 4 4之大出㊄度又能與光罩1 2間形成一立體區 門田日日圓1 1與光罩1 2間之對位完成後，即可透過光罩氣固溝 14 3將區間内之空氣抽出，而對光罩丨2提供負壓吸引的固定效 晛、> 又吸盤14上設有承載珠丄4 5，使光罩丄2與晶圓丄工在 二光、=的過&巾能保持固定的減距離，並使吸盤1 4受微調平 13:動時不會造成光罩12產生破壞性的摩擦。 一光罩架15，位於吸射4上方之相對水平位置，該光罩架 具有光罩扣固元件i 5 i以及用以吸持光罩工2之吸持元件1 〇 2， 光罩12，具有邊框工21以供光罩扣固元件丄5工扣持之 M285026 •用’邊框121之設置亦供操作員拿持之用，使操作員不會直接碰 觸光罩而防止人為污染的發生；據以使得邊框121除了具有保持 準確定位的效果外，断兼具避免光罩1 2敍污染及賴的作用； ·—影像摘取單元16 ’該影擷取單元16具有光學鏡頭χ 6工 (例如.放大率四倍的高解析鏡頭）垂向設置並對應於鮮架1 $之 上方，藉以精確的擷取晶圓！工與光罩工2間的對位晝面（由内設 之CCD進行影像擷取），並透過一固設於基座1 0 1上之顯示單元^ # 6 2 ^例如··八时高解析度液晶螢目）將對位畫面放大呈現，而影 擷取早兀1 6上設有對焦升降單元工6 3使光學綱工6丄得進行 垂向位移之5周整，讓影擷取單元工6與光罩工2及晶圓11間保持 •最適當的擷取距離，俾利呈現之齡影像更為清楚。在實施上'，影 像擷取早701 6可採雙光學鏡頭1 6 1 (搭喊CCD)、雙顯示單元 16 2來呈現對位的情形。 帛五圖〜第八圖所示，係本創作曝絲位裝置之作動示意圖， 馨請同時參閱前揭圖式之說明，以對本創作進行曝光對位的過程進行 了解’其分別包含下列動作的部驟： 7驟1將光單12放置到光罩架丄5上由扣固元件丄51對光罩 1 2進行扣持，當光罩架1 5上所微之_元件確認光 罩12到位後及透過吸持元件15 2對光罩12進行負壓 吸引的動作。〔第五騎揭〕 、 步驟2將晶圓11放置到吸盤14上靠齊晶相定位片146(可 參閱第四圖）後’由氣固孔142對晶圓11進行負壓吸 M285026 口據以直接採用晶圓之晶相切邊做定位。 ^驟3將已吸固晶圓1 1之吸盤14放置到微調平台13進行定 位（藉由前述定位槽141與定位塊13 6之配合）之後， 開啟微調平台13對吸盤14之負壓吸固。 步驟4光罩架15於確認吸持元件15 2對光罩12進行負壓吸 引的動作存在時，即將扣固元件i 5 i打開。 步驟5令光軍架15下降貼近吸盤14 (透過承載珠145使光 罩1 2與晶圓1 1保持一適當的作業距離）。〔第六圖所揭〕 /驟6操作員透過影擷取單元16可清楚的觀察到晶圓11與光 罩12的位偏情形，並透過X軸調整钮13 2用以調整水 平向之X軸位移、γ軸調整钮13 3用以調整水平向之γ 軸位移、Z轴<9偏轉鈕1 3 4用以調整水平向之偏轉（以 Z軸為中心而進行的偏轉調整），以使氣固於微調平台工3 上的吸盤14產生調整的效果，讓晶圓丄丄能與光罩12 進行對位的動作。 步驟7當晶圓“能與光罩12後，及啟動吸盤14上光罩氣固 溝14 3對光罩12之負墨吸引。 步驟8釋除光罩架15 (吸持請152)對光罩12之負壓吸 引。 ' y驟9將光罩架1 5向上提升上升。〔第七圖所揭〕 乂驟10釋除微調平台丄3對吸盤14負壓吸引，即完成曝光對位 裝置10之對位操作，此時吸盤工4上同時以負壓吸引氣 (g 12 M285026 固的方式承載晶圓11與光罩i2，並維持其間的對位結 果，俾利進行後續相關的操作，俾利晶圓丄丄與光罩工2 於後移置曝光桌平台2 0以及曝光機輸送台3 〇之過程更 為順暢。〔第八圖所揭〕 值知一提的是，本創作於實施時，微調平台丄3之台面丄31 係與曝光桌平Μ Q之台面、曝光機輸送台3 〇之台面為同一高 又、減ν及盤14上文定位之晶圓11與光罩12於輸送、移置、 搬運的過程產生垂向受力的情形，亦可縮減操作貞在輸送、移置、 搬運時所浪費的時間。 糟由上揭之實施，使縣次曝光時，光罩與吸盤的相對位置得 乂相同達醉麵位，可大幅的增加曝权精準度及並降倾位所 耗費的時間，以提令卫時驗、產業效率提升。 再者，本創作於光罩就位時可配合磁極及光纖感應器之運用， 而產生防呆的效果，以令光罩放人時可快速___相對位置。 、上之實明及圖式所示，係本創作較佳實施例者，並 非、、此侷限本創作’是Μ，舉凡與本創作之構造、裝置、特徵等近 似或相朗者，均闕本創作之創設目的及申請專職圍之内。 13 M285026 . 【圖式簡單說明】 第-圖：本創作曝光對位裝置之實施部位示意圖。 第二圖：本創作曝光對位裝置之立體分解圖。 第三圖：本創作曝光對位裝置之立體組合圖。· 第四圖：本創作吸盤之俯視示意圖。 第五圖〜第八圖：本創作曝絲位裝置之作動示意圖。 _ 【衫it件舰制】 10· 1 1 •曝光對位裝置 1〇1 •·••基座 丄丄· 1 Ο .....晶圓 12· •····光罩 丄3 · •••微調平台 131 • · · · ·台面 13 2 •· X轴調整紐 13 3 •· Υ軸調整鈕 13 4 • ζ軸0偏轉紐 13 5 ••吸盤氣固溝 13 6 Ί /1 1 ••吸盤定位塊 14· • · · · ·吸盤 丄41 • · · ·定位槽 14 2 • · · ·氣固孔 14 3 1 Λ ••光罩氣固溝 144 •···封止環 14 5 Ί CT •···承載珠 14 6 ••晶相定位片 1 5 · 1 Γ~ • · · ·光罩架 151 •光罩扣固元件 15 2 • · ·吸持元件 16· 衫像擁取單元 16 1 •··光學鏡頭 162 •··顯示單元 16 3 3 0 · •對焦升降單元 •曝光機輸送台 2 0· ••曝光桌平台M285026 does not lose the level again. Therefore, it takes a lot of time for the wafer and the mask to be in the alignment process and the subsequent conveying process in the related positioning or switching positioning action. 3 · The above-mentioned phase _ positioning or city positioning action, if manually carried and placed as an implementation, is prone to undue stress and vibration, resulting in damage to the wafer and the reticle. 4. During the positioning of the reticle, the operator will contact the reticle multiple times, thus reducing the durability of the reticle. 5. When the crystal and the material are finished, the necessary transportation and handling operations can be carried out to enable the exposure of the reticle into the wire feeding tablecloth during the conveying and handling process (for example: The handling between the work platforms), the placement or lifting action is likely to have a vertical impact on the wafer and the reticle, and the impact force may also cause a bias between the wafer and the light. Moving, or damage to the wafer and the reticle, and causing the operator to be particularly slow when moving the wafer and reticle, and wasting a lot of valuable time. [New Content] [Creation Purpose] The purpose of this creation is to solve the problems in the prior art, so that the production efficiency of the wafer and the mask can be improved by the exposure of the oil, and the pair can have a better pair. Bit accuracy. Moreover, when the production efficiency is improved, the problems of damage and displacement of the wafer and the mask due to fixation, handling and transportation can be effectively reduced, and the operator can avoid the operation of the wafer and the mask. The first direct contact to improve the wafer and mask exposed to M285026 exposure to human contamination and damage. [Technical means of this creation] In order to achieve the purpose of creation of this creation, the creator provides a new technology for the "exposure alignment device", which is based on the prior art towel, and the problems caused by the crystal mask in the exposure process. . Technical means 1: The exposure alignment device provided by the creator is implemented in the wafer exposure system, and the first towel is used to make the aa circle and the photomask are fixed by the suction cup before the exposure is performed. ® and the reticle are smoother on the subsequent exposure table platform and the exposure conveyor table; the exposure aligning device is arranged on a pedestal: a fine-tuning platform with a horizontal displacement and a tilt angle The adjuster, the surface of the fine-tuning platform is provided with a suction cup groove and a suction cup positioning block; the suction cup is placed above the fine adjustment platform, and the bottom surface of the suction cup is provided with a positioning groove and a suction cup positioning block, and the suction cup is negatively affected by the suction groove. The pressure is attracted to the fine-tuning platform, and the top surface of the suction cup is covered with a gas-solid hole for sucking the wafer; the outer ring of the hole is provided with a gas-tight/shield gas-tight groove. The outer ring is provided with a stop ring for providing a negative pressure suction fixing to the reticle after the wafer and the light alignment are completed; a reticle frame located at a relatively horizontal position above the suction cup, the reticle having Photomask fastening element with money to hold the mask Suction element · '- reticle with a frame for the reticle fastening element to be held; - image capture unit 'The image capture unit has a wire mirror facing surface and corresponds to the top of the reticle frame for precise The alignment surface between the wafer and the reticle is taken, and the alignment surface is enlarged by a display unit. 7 M285026 Technical means 5: Derived from the foregoing technical means 1, wherein the display unit of the image capturing unit is fixed on the base; so that the display unit is directly disposed on the exposure alignment device, and the exposure alignment needs to be moved when the exposure alignment is performed Or when moving the production line and other operations, the display unit can be aligned with the exposure - without the need to disassemble and assemble the mine before and after to improve the industrial efficiency. Technical means 6: Derived from the aforementioned technical means 1, wherein the focus extraction unit is provided with a focus lifting unit to adjust the vertical displacement of the optical lens; and the most suitable between the film and the wafer and the wafer is maintained. The distance of the drawing is more clear (at the correct focal length). With each positioning and adjustment, each wafer positioning point can be ensured to be effective in the image capturing unit. Within the scope of operation. [Embodiment] The following technique is used to extract the technical segment, the way of miscellaneous money, and the description of the figure as follows: _ The first -> shows the implementation part of the original exposure device, which is not shown in the figure. The exposure alignment device 1 is implemented in the wafer exposure system 1 , and the purpose of the implementation is to enable the wafer worker and the photomask 2 to be fixed by the suction cup ^ before exposure. The wafer 11 and the photomask 12 are smoother in the subsequent process of passing through the exposure table platform 2 and the exposure machine transport table 30. The second and third figures of the mouth are the three-dimensional decomposition of the creation of the alignment device _ stereo = map, the implementation of the exposure alignment device 10 is set on the pedestal i 〇! The table top 13 1 is adjusted by the X-axis adjustment 132] the axis M285026 adjusts the turn 13 3 and the Z-axis yaw deflection; [3 4 is set for the horizontal displacement and the adjustment of the yaw angle, and the table 131 of the fine adjustment platform 13 is finely adjusted. A suction cup gas-solid groove 13 5 and a suction cup positioning block 13 6 are provided; a suction cup 14 is placed on the fine adjustment platform 13 , and a bottom surface of the suction cup 14 is provided with a positioning groove 141 to cooperate with the suction cup positioning block 13 6 , and the suction cup 14 is subjected to the suction cup. The suction of the gas-solid groove 13 5 is fixed on the fine adjustment platform i 3 ; secondly, the top surface of the suction cup i 3 6 is covered with a plurality of gas-solid holes 142 for sucking the wafer worker! The outer ring of the gas-solid bore 丄 4 2 is provided with a gas-tight groove 14 3 and a gas-tight groove of the reticle; [4 3 has a retaining ring 14 4 on the outer side ring (please refer to the fourth figure at the same time) Shown). Moreover, the shape of the suction cup 4 can be read by the design of the diamond side, and the mask 丨 2 (framework 2 1) can expose the four corners at the relevant working stage for convenient grasping. When the wafer 11 is positioned on the suction cup i4, it does not cover the area 3 of the gas-tight groove 143 of the photomask, and the sealing 裒14 4 is five degrees larger, and can form a three-dimensional area with the reticle 12. After the alignment between the yen 1 1 and the mask 1 2 is completed, the air in the section can be extracted through the reticle gas-tight groove 14 3 to provide a fixed effect of the negative pressure suction on the mask 丨 2, > The suction cup 14 is provided with a bearing bead 45, so that the photomask 丄2 and the wafer are completed in a two-light, = over & towel can maintain a fixed distance reduction, and the suction cup 14 is fine-tuned 13: moving It does not cause damaging friction of the reticle 12. a reticle frame 15 located at a relatively horizontal position above the absorbing frame 4, the reticle holder having a reticle fastening component i 5 i and a holding member 1 〇 2 for holding the reticle 2, the reticle 12, M285026 with frameworker 21 for the reticle fastening element •5 work • The setting of the 'frame 121 is also for the operator to hold, so that the operator does not directly touch the reticle to prevent the occurrence of human pollution. Therefore, in addition to the effect of maintaining the accurate positioning, the frame 121 has the function of avoiding the pollution of the reticle and the smear; the image capturing unit 16 has the optical lens χ (For example, a high-resolution lens with a magnification of four times) is vertically set and corresponds to the top of the fresh frame 1 $, so as to accurately capture the wafer! The alignment surface between the worker and the reticle worker 2 (image capture by the built-in CCD), and through a display unit fixed on the pedestal 1 0 1 ^ 6 2 ^, for example, eight hours high The resolution LCD screen) will magnify the alignment screen, and the image will be taken as early as 16 6 with the focus lifting unit 6 3 so that the optical engineering 6 can be vertically displaced for 5 weeks. The unit worker 6 maintains the most appropriate distance between the reticle worker 2 and the wafer 11, and the image of the age of profit is more clear. In the implementation, the image captures the situation of the alignment of the early optical lens 1 6 1 (the CCD) and the dual display unit 16 2 . Figure 5 shows the schematic diagram of the operation of the exposed wire position device. Please also refer to the description of the previous figure to understand the process of exposure and alignment of the creation. Step: 7 Step 1 Place the light sheet 12 on the mask frame 5, and fasten the mask 1 2 by the fastening member 丄 51. When the mask frame 15 is slightly removed, the component confirmation mask 12 is in place. Thereafter, the operation of suctioning the photomask 12 by the suction member 15 2 is performed. [Fifth Riding], Step 2: Place the wafer 11 on the chuck 14 by the crystal phase positioning sheet 146 (refer to the fourth figure), and then vacuum-pow the wafer 11 by the gas-solid hole 142. Positioning is performed directly using the crystal phase trimming of the wafer. Step 3: Place the suction cup 14 of the absorbing wafer 1 1 on the fine adjustment platform 13 for positioning (by the cooperation of the positioning groove 141 and the positioning block 136), and then open the negative pressure platform 13 to absorb the suction of the suction cup 14 . In the step 4, when the mask holder 15 confirms that the suction member 15 2 performs the suction suction operation on the mask 12, the fastening member i 5 i is opened. Step 5 causes the light frame 15 to fall close to the suction cup 14 (the hood 1 and the wafer 11 are maintained at an appropriate working distance by the carrier beads 145). [Explanation of the sixth figure] / Step 6 The operator can clearly observe the positional deviation of the wafer 11 and the photomask 12 through the image capturing unit 16, and adjust the horizontal direction X through the X-axis adjustment button 13 2 . The shaft displacement, γ-axis adjustment knob 13 3 is used to adjust the horizontal γ-axis displacement, and the Z-axis <9 deflection knob 1 3 4 is used to adjust the horizontal deflection (the deflection adjustment centered on the Z-axis) to The suction cup 14 that solidifies the gas on the fine adjustment platform 3 produces an adjustment effect, allowing the wafer cassette to be aligned with the mask 12. Step 7: When the wafer "can be engaged with the reticle 12 and the absorbing mask 14 on the suction cup 14 to attract the negative ink of the reticle 12. Step 8 Release the reticle holder 15 (suck 152) to the light The negative pressure of the cover 12 is attracted. ' y step 9 raises the mask frame 15 upwards. [Seventh figure is disclosed] Step 10 releases the fine adjustment platform 丄 3 suction suction on the suction cup 14 to complete the exposure alignment device 10 alignment operation, at this time, the suction machine 4 simultaneously sucks the gas with a negative pressure (g 12 M285026 solid carrier mode carries the wafer 11 and the mask i2, and maintains the alignment result therebetween, and performs subsequent related operations,俾利丄丄 丄丄 and reticle 2 slid the exposure table platform 20 and the exposure machine conveyor 3 〇 process is smoother. [8th figure] The value is that the creation In implementation, the table top of the fine-tuning platform 丄3 is connected to the table top of the exposure table, the table top of the exposure machine, and the table top of the exposure machine table 3 are the same height, minus ν and the wafer 14 and the reticle 12 positioned above the disk 14 The process of conveying, displacing, and transporting produces vertical force, and can also reduce the time wasted by the operation, transportation, displacement, and handling. The implementation of the above-mentioned problems, when the county is exposed, the relative position of the mask and the suction cup is the same as the drunken position, which can greatly increase the accuracy of exposure and reduce the time spent on tilting. Time test, industrial efficiency improvement. Moreover, this creation can be used with the magnetic pole and the fiber sensor when the mask is in place, and the effect of the foolproof effect is obtained, so that the reticle can be quickly released when the hood is released. As shown in the above diagram, the preferred embodiment of the present invention is not, and this limitation of the creation is a slogan, and any similar or similar to the structure, device, and features of the creation, The purpose of this creation is to be created within the full scope of the application. 13 M285026 . [Simple description of the diagram] First: The schematic diagram of the implementation of the creation of the alignment device. The second picture: the exploded view of the creation of the alignment device The third picture: the three-dimensional combination of the creation of the alignment device. · The fourth picture: the top view of the creation of the suction cup. The fifth picture ~ the eighth picture: the schematic diagram of the action of the original exposure wire device. _ [shirt it Ship system] 10· 1 1 • Exposure Alignment device 1〇1 •·•• pedestal 丄丄· 1 Ο ..... Wafer 12······Photomask 丄3 · ••• Fine-tuning platform 131 • · · · · Countertop 13 2 • X-axis adjustment button 13 3 • Υ Axis adjustment button 13 4 • ζ Axis 0 deflection button 13 • • Suction cup gas-solid groove 13 6 Ί /1 1 ••Sucker positioning block 14· • · · · ·Sucker 丄41 • · · · Positioning groove 14 2 • · · · Gas-solid hole 14 3 1 Λ ••Photomask gas-solid groove 144 •··· Sealing ring 14 5 Ί CT •···bearing beads 14 6 •• Phase positioning sheet 1 5 · 1 Γ~ • · · · Mask holder 151 • Mask fastening element 15 2 • · · Holding element 16 · Shirt image capturing unit 16 1 •························· Unit 16 3 3 0 · • Focus Lifting Unit • Exposure Machine Conveyor 2 0· • Exposure Table Platform